SSM6J50TU
TOSHIBA Field Effect Transistor
Silicon P Channel MOS Type (U-MOSⅢ)
SSM6J50TU
○ High Current Switching Applications
Unit: mm
•
Compact package suitable for high-density mounting
•
Low on-resistance:
Ron = 205mΩ (max) (@VGS = -2.0 V)
Ron = 100mΩ (max) (@VGS = -2.5 V)
Ron =
64mΩ (max) (@VGS = -4.5 V)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-Source voltage
VDS
-20
V
Gate-Source voltage
VGSS
±10
V
DC
ID
-2.5
Pulse
IDP
-5
PD
(Note 1)
500
mW
Channel temperature
Tch
150
°C
JEDEC
-
Storage temperature range
Tstg
−55 to 150
°C
JEITA
-
Drain current
Drain power dissipation
Note:
A
1,2,5,6 : Drain
3
: Gate
4
: Source
TOSHIBA
2-2T1D
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
Weight: 7 mg (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on FR4 board.
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )
Marking
6
Equivalent Circuit
5
4
6
5
4
3
1
2
3
KPB
1
2
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, be sure that the environment is
protected against electrostatic discharge. Operators should wear anti-static clothing, and containers and other objects
that come into direct contact with devices should be made of anti-static materials.
Start of commercial production
2003-11
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SSM6J50TU
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Gate leakage current
Drain-Source breakdown voltage
Drain cut-off current
Max
Unit
μA
⎯
⎯
±10
V (BR) DSS
ID = −10 mA, VGS = 0
-20
⎯
⎯
V (BR) DSX
ID = −10 mA, VGS = +10 V
-10
⎯
⎯
⏐Yfs⏐
Drain-Source on-resistance
Typ.
VGS = ±8 V, VDS = 0
Vth
Forward transfer admittance
Min
IGSS
IDSS
Gate threshold voltage
Test Condition
RDS (ON)
VDS = −20 V, VGS = 0
VDS = −10 V, ID = −0.2 mA
V
⎯
⎯
−10
μA
−0.5
⎯
−1.2
V
S
VDS = −10 V, ID = −1.5 A
(Note2)
3.1
6.2
⎯
ID = −1.5 A, VGS = −4.5 V
(Note2)
⎯
49
64
ID = −1.5 A, VGS = −2.5 V
(Note2)
⎯
73
100
ID = −1.5 A, VGS = −2.0 V
(Note2)
⎯
105
205
mΩ
Input capacitance
Ciss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯
800
⎯
pF
Reverse transfer capacitance
Crss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯
120
⎯
pF
Output capacitance
Coss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯
160
⎯
pF
Switching time
Turn-on time
ton
VDD = −10 V, ID = −1.5 A,
⎯
15
⎯
Turn-off time
toff
VGS = 0 to −5 V, RG = 4.7 Ω
⎯
51
⎯
ns
Note2: Pulse test
Switching Time Test Circuit
(a) Test Circuit
(b) VIN
ID
0
out
10%
90%
−5 V
in
−5 V
0V
VDS (ON)
90%
RG
10 μs
VDD
(c) VOUT
VDD = -10 V
RG = 4.7 Ω
Duty ≤ 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
VDD
10%
tr
ton
tf
toff
Precaution
Vth can be expressed as the voltage between gate and source when the low operating current value is ID=-200 μA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth.
(The relationship can be established as follows: VGS (off) < Vth < VGS (on))
Be sure to take this into consideration when using the device.
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SSM6J50TU
ID-VDS
-5
-2.5
-10
-10 Common Source
-1.8
VDS=-3V
Ta=25°C
Common Source
Ta=25°C
Drain current ID (A)
Drain current ID (A)
-2.0
-3.0
-6.0
-4
ID-VGS
-3
-1.6
-2
-1
0
Ta=100°C
-1
25°C
-55°C
-0.1
VGS=-1.4V
0
-0.2
-0.4
-0.6
-0.8
-
-1.0
-0.5
0
Drain-Source voltage VDS(V)
VDS-VGS
-2.0
Drain-Source voltage VDS(V)
1000
VGS=-2.0V
100
-2.5
-4.5
Common Source
Ta=25°C
-0.3
-1
-3
Common Source
Ta=25°C
-1.6
-1.2
-0.8
-1.5
-0.4
ID=-2.5A
-0.75
0
10
-0.1
-2.5
-2
Gate-Source voltage VGS(V)
RDS(ON)-ID
Drain-Source on-resistance
RDS(ON) （ｍΩ）
-1.5
-1
0
-10
Drain current ID (A)
-2
-4
-6
-8
-10
Gate-Source voltage VGS(V)
Vth-Ta
RDS(ON)-Ta
160
-2
Gate threshold voltage Vth(V)
Drain-Source on-resistance
RDS(ON) （ｍΩ）
VGS=-2.0V
120
VGS=-2.5V
80
VGS=-4.5V
40
Common
Source
ID=-1.5A
Ta=25°C
0
-1.6
-1.2
-0.8
-0.4
Common Source
VDS=-10V
ID=-200μA
Ta=25°C
0
-80
-40
0
40
80
120
160
-80
Ambient temperature Ta(°C)
-40
0
40
80
120
160
Ambient temperature Ta(°C)
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SSM6J50TU
C-VDS
|Yfs|-ID
10000
Capacitance C (pF)
Common Source
VDS=-10V
Ta=25°C
10
|Yfs|(S)
Ta=-55°C
100°C
25°C
1
1000
Ciss
Coss
100
Crss
Common Source
f=1MHz
VGS=0V
Ta=25°C
0.1
-0.1
-0.3
-1
-3
10
-0.1
-10
-0.3
-1
-3
-10
-30
-100
Drain-Source voltage VDS(V)
Drain current ID (A)
IDR-VDS
-10
-10
Drain reverse current IDR (A)
Forward transfer admittance
100
-5.0
-1.0
-3.0
VGS=0V
-3.0
-1.0
-0.3
Common Source
Ta=25°C
- 0.1
0
0.2
0.4
0.6
0.8
Drain-Source voltage VDS(V)
1
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SSM6J50TU
rth – tw
Transient thermal impedance
rth (°C /W)
1000
Single Pulse
Mounted on FR4 board
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )
100
10
1
0.001
0.01
0.1
1
10
Pulse width
tw
100
1000
(s)
Safe operating area
-100
Mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 t
2
Cu pad: 645 mm )
-30
PD – Ta
1.2
Mounted on FR4 board
1 ms*
ID max (Continuous)
-1
Drain power dissipation
ID
10 ms*
10s*
DC operation
-0.3
Ta = 25°C
-0.1
*:Single nonrepetive Pulse
-0.03
Ta = 25°C
-0.01
-0.1
with increase in temperature.
-0.3
-1
-3
Drain-Source voltage
t = 10 s
0.8
0.6
DC
0.4
0.2
0
0
Curves must be derated linearly
(25.4 mm × 25.4 mm × 1.6 t,
2
Cu Pad: 645 mm )
1
PD
(A)
ID max (pulsed) *
-3
Drain current
(W)
-10
50
Ambient temperature
-10
VDS
-30
150
100
Ta
(°C)
-100
(V)
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SSM6J50TU
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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