TA31145FNG

TA31145FNG TA31145FNG The TA31145FNG package is Pb-Free. 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG TA31145FNG Notice for Pb free product  About solderability, following conditions were confirmed  Solderability  (1) Use of Sn-36Pb solder bath    ・solder bath temperature = 230℃    ・dipping time = 5seconds    ・the number of times = once    ・use of R-type flux  (2) Use of Sn-3.0Ag-0.5Cu solder bath    ・solder bath temperature = 245℃    ・dipping time = 5seconds    ・the number of times = once    ・use of R-type flux 2004-09-01