TA7368PG

TA7368PG/FG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA7368PG,TA7368FG Audio Power Amplifier TA7368PG The TA7368PG and TA7368FG are suitable for the audio power amplifier of portable cassette tape recorder and radio. Features • • • Very few external parts (only three capacitors) Low quiescent current: ICCQ = 6.6mA (typ.) (VCC = 6V) Output power TA7368PG : Pout = 720mW (typ.) (VCC = 6V, RL = 4Ω, THD = 10%) TA7368PG / FG : Pout = 450mW (typ.) (VCC = 6V, RL = 8Ω, THD = 10%) • • Voltage gain: GV = 40dB (typ.) Operating supply voltage range: VCC = 2~10V (Ta = 25°C) TA7368FG Block Diagram 2/5 Weight SIP9−P−2.54A : 0.92g (typ.) SSOP10−P−225−1.00 : 0.09g (typ.) VCC RIPPLE 9/2 + Vin 1/4 + − RIPPLE FILTER 7/10 + − Pout RL 3/6 + 4/7 NF PHASE 5/8 6/9 PRE-GND PW-GND / : TA7368PG / TA7368FG 1 2006-04-28 TA7368PG/FG Precaution For Use And Application 1. Input stage The input stage of power amplifier (equivalent circuit) is comprised of a PNP differential pair (Q2 and Q3) preceded by a PNP emitter follower (Q1) which allows DC referencing of the source signal to ground. This eliminated the need for an input coupling capacitor. However, in case the brush noise of volume becomes a problem, provide serially a coupling capacitor to the input side. 2. Adjustment of voltage gain The voltage gain is fixed at GV≒40dB by the resistors (R4 and R5) in IC, however, its reduction is possible through adding Rf as shown in Figure 2. In this case, the voltage gain is obtained by the following equation. R + R4 + Rf G V = 20log 5 R4 + Rf 1/4 27k Ω / : TA7368PG / TA7368FG 9/2 FROM PIN 7 / 10 Q2 Q3 R5 R4 Q1 Q4 R1 5/8 D1 3/6 Fig.1 IN Vin 1/4 It is recommended to use this IC with the voltage gain of GV = 28dB or over. 3. Ripple rejection ratio Adding CRIP, to ripple terminal 2 as shown in Figure 3, the ripple rejection ratio is improved from −25dΒ typ. to −45dΒ typ. 4. Power dissipation Care should be taken to use this IC below maximum power dissipation. Because it may over absolute maximum rating depending on operating condition. • TA7368PG PD = 900mW (Ta = 25°C) • TA7368FG PD = 400mW (Ta = 25°C) NF Rf + 3/6 R4 90Ω Fig.2 + − R5 10Ω RIPPLE 2/5 CRIP + Fig.3 5. Phase−compensation Small temperature coefficient and excellent frequency characteristic is needed by capacitors below. • Oscillation preventing capacitors for power amplifier output • Bypass capacitor for ripple filter • Capacitor between VCC and GND 2 2006-04-28 TA7368PG/FG Absolute Maximum Ratings (Ta = 25°C) Characteristic Supply voltage Power dissipation Operating temperature Storage temperature TA7368PG TA7368FG Symbol VCC PD (Note) Rating 14 900 400 Unit V mW °C °C Topr Tstg −25～75 −55～150 (Note) Derated above Ta = 25°C in the proportion of 7.2mW / °C for TA7368PG and of 3.2mW / °C for TA7368FG. Electrical Characteristics For TA7368PG Test Circuit (Unless otherwise specified, VCC = 6V, f = 1kHz, Rg = 600Ω, RL = 4Ω, Ta = 25°C) Characteristic Symbol Test Condition VCC = 3V, Vin = 0 Quiescent current ICCQ — VCC = 6V, Vin = 0 VCC = 9V, Vin = 0 VCC = 3V ,RL = 4Ω, THD = 10% VCC = 6V, RL = 4Ω, THD = 10% Output power Pout — VCC = 6V, RL = 8Ω, THD = 10% VCC = 9V, RL = 8Ω, THD = 10% VCC = 9V, RL = 16Ω, THD = 10% Total harmonic distortion Voltage gain Output noise voltage Ripple rejection ratio Input resistance THD GV Vno RR RIN — — — — — Pout = 100mW Vin = 0.5mVrms Rg = 10kΩ, BPF = 20Hz~20kHz fr = 100Hz, Vr = 0.3Vrms Without CRIP — Min. — — — — 500 300 800 450 — 37 — — — Typ. 5.5 6.6 7.5 120 720 450 1100 610 0.3 40 0.2 25 27 Max. — 15 18 — — — — — 1.0 43 0.5 — — % dB mVrms dB kΩ mW mA Unit Terminal Voltage For TA7368PG Typical Terminal Voltage at no Signal With Test Circuit. (VCC = 6V, Ta = 25°C) Terminal no. DC voltage (V) 1 0 2 2.40 3 0.62 4 0.64 5 0 6 0 7 2.61 8 NC [Unit: V] 9 6.0 3 2006-04-28 TA7368PG/FG Electrical Characteristic For TA7368FG Test Circuit (unless otherwise specified, VCC = 6V, f = 1kHz, Rg = 600Ω, RL = 8Ω, Ta = 25°C) Characteristic Symbol Test Condition VCC = 3V, Vin = 0 Quiescent current ICCQ — VCC = 6V, Vin = 0 VCC = 9V, Vin = 0 VCC = 3V, RL = 4Ω, THD = 10% Output power Pout — VCC = 6V, RL = 8Ω, THD = 10% VCC = 9V, RL = 16Ω, THD = 10% Total harmonic distortion Voltage gain Output noise voltage Ripple rejection ratio Input resistance THD GV Vno RR RIN — — — — — Pout = 100mW Vin = 0.5mVrms Rg = 10kΩ, BPF = 20Hz~20kHz fr = 100Hz, Vr = 0.3Vrms, Without CRIP — Min. — — — — 300 450 — 37 — — — Typ. 5.5 6.6 7.5 120 450 610 0.3 40 0.2 25 27 Max. — 15 18 — — — 1.0 43 0.5 — — % dB mVrms dB kΩ mW mA Unit Terminal Voltage For TA7368FG Typical Terminal Voltage at no Signal with Test Circuit. (VCC = 6V, Ta = 25°C) Terminal no. DC voltage (V) 1 NC 2 6.0 3 NC 4 0 5 2.40 6 0.62 7 0.64 8 0 9 0 [Unit: V] 10 2.61 4 2006-04-28 TA7368PG/FG Test Circuit TA7368PG 100µF 2 RIPPLE FILTER RIPPLE VCC + 9 Vin 1 27kΩ + − 10k Ω 470µF 7 + − Pout 90Ω RL 3 4 NF PHASE 5 6 100µF + PRE-GND PW-GND ※ Pin(8): Non-connection TA7368FG 100µF 5 RIPPLE FILTER RIPPLE VCC + 2 Vin 4 27kΩ + − 10kΩ 470µF 10 + − Pout 90Ω RL 6 7 NF PHASE 8 9 100µF + PRE-GND PW-GND ※ Pin(1), (3): Non-connection 5 2006-04-28 TA7368PG/FG THD – POUT(1) 30 f = 1kHz 30 f = 1kHz RL = 8 Ω 10 Ta = 25 °C 5 3 RL = 4 Ω 10 Ta = 25 °C 5 3 THD – POUT(2) (%) VCC = 3V THD 6 THD (%) Total Harmonic Distortion Total Harmonic Distortion VCC = 3V 6 9 1 0.5 0.3 1 0.5 0.3 0.1 0.003 0.01 0.03 0.1 0.3 1 3 0.1 0.003 0.01 0.03 0.1 0.3 1 3 Output Power Pout (W) Output Power Pout (W) THD – POUT(3) 20 VCC = 6 V 20 VCC = 6 V Ta = 25 °C 5 3 10 f = 1kHz 10 RL = 4 Ω THD – POUT(4) (%) 5 3 RL = 32 Ω 16 8 4 THD THD (%) Ta = 25 °C f = 100Hz Total Harmonic Distortion Total Harmonic Distortion 1 0.5 0.3 1 0.5 0.3 10kHz 1kHz 0.1 0.05 0.03 0.003 0.01 0.03 0.1 0.3 1 3 0.1 0.05 0.03 0.003 0.01 0.03 0.1 0.3 1 3 Output Power Pout (W) Output Power Pout (W) THD – POUT(5) 20 VCC = 6 V Ta = 25 °C 5 3 f = 100Hz 1 0.5 0.3 1kHz 0.1 0.003 0.01 0.03 0.1 0.3 1 3 10kHz 80 70 10 RL = 8 Ω GV – f VCC = 6 V RL = 4 Ω Vin = 1mVrms (%) (dB) GV Voltage Gain 60 50 40 30 20 10 0 0.03 0.1 0.3 1 3 Total Harmonic Distortion THD 10 30 100 Output Power Pout (W) Frequency f (kHz) 6 2006-04-28 TA7368PG/FG RR – fr 0 1 -10 -20 -30 -40 -50 -60 -70 -80 0.05 0.1 POUT, THD, ICCQ – Ta POUT THD (dB) Output Power Pout (W) Total Harmonic Distortion THD (%) RR Rg = 10kΩ CRIP = 100µF Rg = 600Ω, Without CRIP Rg = 600Ω, CRIP = 100µF 0.3 0.1 ICCQ 0.05 0.03 VCC = 6 V PL = 4 Ω Pout : THD = 10 % THD : Pout = 100mW 0.01 -20 0 20 40 60 80 10 VCC = 6 V Vr = 0.3 Vrms RL = 4 Ω Ta = 25 °C 0.3 1 3 10 30 100 5 3 1 Ripple frequency fr (kHz) Ambient Temperature Ta (°C) ICCQ, V7 – VCC 10 1.0 PD – POUT(1) VCC = 6 V f = 1kHz Ta = 25 °C 0.8 Quiescent Current ICCQ (mA) Quiescent Output Voltage V7 (DC) (V) Power Dissipation PD 8 (W) ICCQ 6 V7 0.6 THD = 1% 10% 4 0.4 RL = 4Ω 8Ω 2 0.2 0 0 2 4 6 8 10 12 14 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Supply Voltage VCC (V) Output Power Pout (W) PD – POUT(2) (W) 1.0 VCC = 9 V f = 1kHz Ta = 25 °C 0.8 RL = 8Ω THD = 1% 10% 1.0 f = 1kHz Ta = 25 °C PD MAX – VCC (W) PD MAX PD 0.8 RL = 4Ω 8 16 Power Dissipation 0.6 0.6 32 0.4 16Ω Maximum Power Dissipation 0.4 0.2 0.2 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 0 2 4 6 8 10 12 14 Output Power Pout (W) Supply Volatage VCC (V) 7 2006-04-28 QUIESCENT CURRENT ICCQ Rg = 10kΩ Without CRIP 0.5 Ripple Rejection Ratio (mA) TA7368PG/FG PD – Ta 1.2 ※ F + PCB (W) 1.0 TA7368PG θj − T = 210°C / W 0.8 ※ F + PCB Power Dissipation 0.6 0.4 0.2 TA7368FG ※ F+PCB By being mounted on certain PCB's, flat packages increase the heat dissipating efficiency. Data shown on the left is resulted from the measurement on the PCB recommended by TOSHIBA. (θj−Τ : Thermal resistance) PD 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta (°C) Printed Circuit Board Material: Phenol resin Thickness of copper leaf: 35µm Plate thickness: 1.6mm 8 2006-04-28 TA7368PG/FG Package Dimensions Weight: 0.92g (typ.) 9 2006-04-28 TA7368PG/FG Package Dimensions Weight: 0.09g (typ.) 10 2006-04-28 TA7368PG/FG • Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. • If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition. • Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. • Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. • Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. • Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. • Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. • Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. 11 2006-04-28 TA7368PG/FG RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 021023_D 060116EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux 12 2006-04-28