TA7774P_07

TA7774P/PG/F/FG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA7774P/PG, TA7774F/FG, TA7774FAG Stepping Motor Driver IC The TA7774P/PG and TA7774F/FG/FAG are two-phase bipolar stepping motor driver ICs designed especially for 3.5- or 5.25-inch FDD head actuator drives. The ICs have a dual-bridge driver supporting the bipolar driving of induced loads, a power-saving circuit, and a standby circuit. They are ideal for achieving reduced set size and lower power consumption. TA7774P/PG Features One-chip two-phase bipolar stepping motor driver Power saving operation is available. Standby operation is available. Current consumption ≤ 115 μA Built-in punch-through current restriction circuit for system reliability and noise suppression TTL-compatible inputs INA, INB, and PS pins High driving ability TA7774P/PG/F/FG : IO(START) 350 mA (MAX): VS1 ENABLE : IO(HOLD) 100 mA (MAX): VS2 ENABLE TA7774FAG : IO(START) 100 mA (MAX): VS1 ENABLE : IO(HOLD) 50 mA (MAX): VS2 ENABLE Typical PKG DIP16 pin, HSOP16 pin, and SSOP16 pin GND pin = heatsink SSOP16-P-225-1.00A TA7774FAG TA7774F/FG TA7774PG/FG-FAG: The TA7774PG/FG/FAG is a lead-free (Pb-free) product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *number of times = once *use of R-type flux Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) SSOP16-P-225-1.00A: 0.14 g (typ.) 1 2007-6-4 TA7774P/PG/F/FG Block Diagram TA7774P/PG/F/FG/FAG Note: Pins 2, 7, 12, and 13 of the TA7774F/FG are all NC; the heat fin is connected to GND. Pin Description Pin No. 1 / (1) 2 / (3) 3 / (4) 4 / (F) 5 / (F) 6 / (5) 7 / (6) 8 / (8) 9 / (9) 10 / (10) 11 / (11) Symbol VS2 A VCC IN A GND GND IN B PS VS2 B VS1 B φB φB Functional Description Low-voltage power supply terminal Power voltage supply terminal for control A-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 GND terminal GND terminal B-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 Power saving signal input terminal Standby signal input terminal, Truth Table 2 High-voltage power supply terminal Output B Output B GND terminal GND terminal Output Α Output A High-voltage power supply terminal. 12 / (F) 13 / (F) 14 / (14) 15 / (15) 16 / (16) GND GND φΑ φA VS1 A ( ): TA7774F/FG 2 2007-6-4 TA7774P/PG/F/FG Truth Table 1 Input Output PS L L H H IN L H L H φ L H L H φ H L H L Enable VS1 Enable VS1 Enable VS2 (power saving) Enable VS2 (power saving) Truth Table 2 VS2 B L H Power off (standby) Operation Note: Apply 5 V to VS2A as a supply terminal. 3 2007-6-4 TA7774P/PG/F/FG Output Circuit Input Circuit IN A, IN B Input Circuit VS2 A or VS2 B TA7774P/PG/F/FG/FAG Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit VCC Supply voltage VS1 VS2 TA7774P/PG TA7774F/FG Output current TA7774FAG IO (PEAK) IO (START) IO (HOLD) IO (PEAK) IO (START) IO (HOLD) Input voltage TA7774P/PG Power dissipation TA7774F/FG TA7774FAG Operating temperature Storage temperature Topr Tstg PD VIN 7.0 17.0 ≤VCC V Note 1: IC only Note 2: This value is obtained if mounting is on a 50 × 50 × 0.8 mm PCB, 60% or more of which is occupied by copper. ±400 ±350 ±100 ±200 ±100 ±50 ≤VCC mA V Note 3: This value is obtained if mounting is on a 60 × 30 × 1.6 mm PCB, 50% or more of which is occupied by copper. Note 4: This value is obtained if mounting is on a 50 × 50 × 1.6 mm PCB, 40% or more of which is occupied by copper. 1.4 (Note 1) 2.7 (Note 2) 1.4 (Note 3) 0.78 (Note 4) −30 to 75 −55 to 150 °C °C W 4 2007-6-4 TA7774P/PG/F/FG Electrical Characteristics (Unless otherwise specified, Ta = 25°C, VCC = 5 V, VS1 = 12 V, VS2A = 5 V) Characteristic Symbol Test Cir− cuit Test Condition Min Typ. Max Unit ICC1 Supply current ICC2 ICC3 VIN H VIN L Input voltage VPS H VPS L VS2 BH VS2 BL Input current IIN IPS VSAT 1H1 VSAT 1H2 TA7774P/PG TA7774F/FG VSAT 2H1 VSAT 2H2 VSAT L1 VSAT L2 Output saturation voltage VSAT L3 VSAT 1H1 VSAT 1H2 VSAT 2H1 TA7774FAG VSAT 2H2 VSAT L1 VSAT L2 VSAT L3 Diode forward voltage VF U VF L tpLH tpHL VCC (opr.) 4 2 2 2 1 ― 1 PS: H, VS2B: H PS: L, VS2B: H VS2B: L Pin 3, 6 Tj = 25°C VS2B: H Pin 7 ― ― 70 2.0 GND 2.0 GND 3.5 GND ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― 4.5 9 8.5 90 ― ― ― ― ― ― 2.6 2.6 0.9 1.2 1.6 1.8 0.03 0.15 0.35 0.9 1.0 1.6 1.7 0.03 0.15 0.2 1.5 1.0 7 2 5.0 14 13 115 VCC 0.8 VCC 0.8 VCC 0.4 30 30 ― 1.5 ― 2.1 ― ― 0.6 ― 1.3 ― 2.0 ― ― 0.4 ― ― ― ― 5.5 mA μA V Tj = 25°C Pin 8 Pin 3, 6 Tj = 25°C, VS2B: H VIN / PS (2 V): sink current Pin 7 PS: L, VS2B: H IOUT = 100 mA IOUT = 400 mA IOUT = 20 mA IOUT = 100 mA IOUT = 20 mA VS2B: H IOUT = 100 mA IOUT = 400 mA PS: L, VS2B: H IOUT = 100 mA IOUT = 200 mA IOUT = 20 mA IOUT = 50 mA IOUT = 20 mA VS2B: H IOUT = 100 mA IOUT = 200 mA IF = 350 mA μA 2 3 PS: H, VS2B: H V 3 PS: H, VS2B: H V Delay time Operating voltage ― ― IN − φ VCC = ST μs V Recommended operating voltage VS1 (opr.) 12 V ± 10% VS2A (opr.) 5 V ± 10% Operating voltage restriction VS1 ≥ VS2A 5 2007-6-4 TA7774P/PG/F/FG Test Circuit 1 ICC1, ICC2, ICC3, IIN A, IIN B, IPS Item SW1 SW 2 SW 3 SW 4 ICC1 ICC2 b b b a ― ― b b b ― a ― a b ― ― ― a a a b a a a TA7774P/PG/F/FG/FAG ICC3 IIN A IIN B IPS TA7774P/PG/F/FG/FAG 6 2007-6-4 TA7774P/PG/F/FG Test Circuit 2 VSAT 1H1, VSAT 1H2, VSAT L2, VSAT L3 Note: Adjust RL to correspond to IL. SW1 SW 2 SW 3 SW 4 SW 5 IL (mA) Item a VSAT 1H1 b ― ― a VSAT 1H2 b ― ― a VSAT L2 b ― ― a VSAT L3 b ― ― ― ― a b ― ― a b ― ― a b ― ― a b b ― b b TA7774P/PG/F/FG/FAG a b d c a b d c b a c d b a c d b 400 b 100 a 400 a 100 7 2007-6-4 TA7774P/PG/F/FG Test Circuit 3 VSAT 2H1, VSAT 2H2, VSAT L1 Note: Adjust RL to correspond to IL. SW1 SW 2 SW 3 SW 4 SW 5 IL (mA) Item a VSAT 2H1 b ― ― a VSAT 2H2 b ― ― a VSAT L1 b ― ― ― ― a b ― ― a b ― ― a b a a a TA7774P/PG/F/FG/FAG a b c d a b c d b a c d b 20 a 100 a 20 8 2007-6-4 TA7774P/PG/F/FG Test Circuit 4 VF U, VF L Measuring Method ITEM SW1 a VF U b c d a VF L e b c d e SW 2 Timing Chart (two-phase excitation) TA7774P/PG/F/FG/FAG 9 2007-6-4 TA7774P/PG/F/FG TA7774P/PG TA7774F/FG Mounting on a PCB of 50 x 50 x 0.8 mm, 60% or more of which is occupied by copper Mounting on a PCB of 50 x 50 x 0.8 mm, 50% or more of which is occupied by copper Power Dissipation Power Dissipation No heatsink No heatsink Ambient Temperature Ambient Temperature TA7774FAG Thermal resistance Rth(j-a)=160°C/W Power Dissipation PD (W) Mounting on a PCB of 50 x 50 x 1.6 mm, 40% or more of which is occupied by copper Ambient Temperature Ta (°C) 10 2007-6-4 TA7774P/PG/F/FG Application Circuit TA7774P/PG/F/FG/FAG TA7774P/PG/F/FG/FAG Note 1: Connect the VS2A pin to the lower supply voltage (5 V). Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 11 2007-6-4 TA7774P/PG/F/FG Package Dimensions DIP16−P−300−2.54A Unit: mm Weight: 1.11 g (typ.) 12 2007-6-4 TA7774P/PG/F/FG Package Dimensions HSOP16−P−300−1.00 Unit: mm Weight: 0.50 g (typ.) 13 2007-6-4 TA7774P/PG/F/FG SSOP16−P−225−1.00A Unit: mm Weight: 0.14 g (typ.) 14 2007-6-4 TA7774P/PG/F/FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 2. Equivalent Circuits 3. Timing Charts 4. Application Circuits 5. Test Circuits IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 15 2007-6-4 TA7774P/PG/F/FG Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 16 2007-6-4 TA7774P/PG/F/FG RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 021023_D 070122EBA_R6 • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 17 2007-6-4