TA8492P_06

TA8492P/PG TOSHIBA Bipolar Linear Integrated Circuit TA8492P/PG Three-Phase Full-Wave Brushless DC Motor Driver IC The TA8492P/PG is a three-phase, full-wave, supply voltage-control motor driver IC. Features • • • • Output current: IO (max) = 1.5 A Supply voltage control motor driver CW/CCW/STOP function Operating voltage range: VCC (opr.) = 7~18 V VS (opr.) = 0~18 V Weight: 1.11 g (typ.) Block Diagram 3ST 3 VCC 14 16 V S FRC Ha + TSD 7 6 11 10 9 8 4, 5, 12, 13 GND Matrix 2 La 15 L b 1 Lc − Ha + Hb − Hb + Hc − Hc The TA8492PG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds * number of times = once *use of R-type flux 1 2006-3-2 TA8492P/PG Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol Lc La 3ST GND GND − Ha + Ha − Hc + Hc − Hb + Hb Function c-phase drive output pin a-phase drive output pin Switching CW/CCW/Stop ⎯ ⎯ a-phase negative hall signal input pin a-phase positive hall signal input pin c-phase negative hall signal input pin c-phase positive hall signal input pin b-phase negative hall signal input pin b-phase positive hall signal input pin ⎯ ⎯ Supply voltage pin for control circuits b-phase drive output pin Supply voltage pin for output circuit GND GND VCC Lb VS Functions FRS Ha 1 1 Forward 1 0 0 0 1 1 1 Reverse 0 0 0 1 1 1 Stop 0 0 0 1 1 0 0 1 1 1 1 0 0 0 1 0 1 1 1 0 0 High Impedance L L M H M L M H H Hall Input Hb 0 0 1 1 1 0 0 0 1 Hc 1 0 0 0 1 1 1 0 0 La L L M H H M H H M Output Lb H M L L M H L M H Lc M H H M L L M L L 2 2006-3-2 TA8492P/PG Absolute Maximum Ratings (Ta = 25°C) Characteristic Supply voltage Output current Power dissipation Operating temperature Storage temperature Symbol VS VCC IO PD Topr Tstg Rating 20 20 1.5 1.4 (Note 1) W 2.7 (Note 2) −30~85 −55~150 °C °C Unit V V A Note 1: Not mounted on the PCB Note 2: Mounted on a PCB (PCB area, 50 × 50 × 0.8 mm; cu area, over 60%) Electrical Characteristics (Ta = 25°C, VCC = VS = 12 V) Characteristic Symbol ICC-1 Supply current ICC-2 ICC-3 Upper Output saturation voltage Lower Upper Output leak current Lower Input sensitivity Hall amp. Common-mode input voltage range Stop CW/CCW control operation voltage CW CCW Thermal shutdown operating temperature VSAT (U) VSAT (L) IL (U) IL (L) VH VCMRH VSTP VFW VRV TSD ⎯ 6 2 3 4 5 6 7 1 Test Circuit Test Condition VCC = 12 V, 3ST: GND, VS: Open VCC = 18 V, 3ST: GND, VS: Open Stop (3ST = VCC) IO = 1 A (source current) IO = 1 A (sink current) V S = 20 V V S = 20 V ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 20 2 VCC − 0.4 2.5 0 ⎯ Typ. 5.0 6.0 2.5 1.35 0.4 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 160 Max 7.0 9.0 4 1.7 V 0.6 50 50 400 VCC − 3.5 VCC 6.5 0.4 ⎯ °C V mVp-p V µA mA Unit 3 2006-3-2 TA8492P/PG Functional Description • Hall amp. circuit Ha + Ha − The Hall amp is a high-gain amp. The input sensitivity is 20 mVp-p (min). Make sure that the input amplitude does not exceed 400 mVp-p. The common-mode voltage VCMRH 2.0 to VCC − 3.5 V. Ha Ha − + 20 mVp-p~400 mVp-p • CW/CCW/Stop control circuit 3ST In Reverse mode, the control input (3ST) voltage range is VRV = 0 to 0.4 V. However, keep the voltage as close to the IC GND as possible (see the application circuit diagram). Similarly, in Stop mode, keep the voltage as close to the IC VCC as possible. In Forward mode, Toshiba recommends that the input voltage be VCC/2. • Output circuit VS La La (Upper) (Lower) The output circuit uses voltage control where the upper and lower output transistors are saturated and the output current is controlled by the VS voltage. To reduce switching noise, connect a snubber capacitor to the output circuit. • Thermal shutdown circuit The circuit turns off output when Tj = 160°C (typ.) (according to design specification) 4 2006-3-2 TA8492P/PG Handling Precautions CW/CCW/Stop control circuit a) At 3ST input, because the input voltage ranges for VRV (Reverse mode) and VSTP (Stop mode) are narrow, make sure no impedance is caused between the IC VCC and GND pins. Do not connect an input resistor to the 3ST pin as this will cause voltage offset. b) When controlling the rotation direction using 3ST input, switch the direction from Reverse to Stop mode or vice versa with VS = 0 V; otherwise punch-through current may be generated at output. Hall amp. circuit A Hall IC input amplitude of over 400 mVp-p causes an output function error. Make sure the amplitude is within the specified range. Output circuit Particular care is necessary in the design of the output, VS, VCC and GND lines since the IC may be destroyed due to short circuits between output air contamination faults, or faults caused by improper grounding External Parts Symbol C1 C2 C3 R1 Function Power supply line oscillation prevention Power supply line oscillation prevention Output noise reduction Hall bias Recommended Value 4.7 µF 4.7 µF 4.7 µF ⎯ Remarks ⎯ ⎯ (Note 3) (Note 4) Note 3: Set an appropriate value depending on the motor and use conditions. Set an appropriate value so that the Hall IC output common-mode input voltage and amplitude fall within the specified ranges in the Electrical Characteristics table. Note 4: Be sure to set this bias so that the Hall element output amplitude and common-mode input voltage fall within the ranges specified in the table of electrical characteristics. 5 2006-3-2 TA8492P/PG Test circuit 1. ICC1, ICC2, ICC3 VCC 4.7 µF VHb + VHc + 4.7 µF 15 Lb 14 VCC 13 GND 12 GND 11 Hb + 16 VS 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 V3ST GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VHa + • • • ICC1: Input VHa , VHb , VHc (6.01 V/5.99 V). VCC = 12 V/V3ST = GND ICC2: Input VHa , VHb , VHc (6.01 V/5.99 V). VCC = 18 V/V3ST = GND ICC3: Input VHa , VHb , VHc (6.01 V/5.99 V). VCC = 12 V/V3ST = VCC + + + + + + + + + 2. VSAT (U) 12 V IO = 1.0 A 12 V VHb + VHc + 4.7 µF V 16 VS 15 Lb 4.7 µF 14 VCC 13 GND 12 GND 11 Hb + 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VHa + • VSAT (U): Input VHa , VHb , VHc (6.01 V/5.99 V), check that the output function is at High level, then measure phases a, b, and c. + + + 6V 6V 6 2006-3-2 TA8492P/PG 3. VSAT (L) IO = 1.0 A 12 V 12 V VHb + VHc + 4.7 µF V 16 VS 15 Lb 14 4.7 µF 13 GND 12 GND 11 Hb VCC + 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VHa + • VSAT (L): Input VHa , VHb , VHc (6.01 V/5.99 V) and check that the output function is “L”. (a-phase, b-phase, c-phase) + + + 4. IL (U) 18 V A 4.7 µF 16 VS 15 Lb 14 VCC 13 GND 12 GND 11 Hb + 12 V VHb + VHc + 4.7 µF 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VCC VHa + • IL (U): Check that the output function is high impedance at 3ST = VCC. (a-phase, b-phase, c-phase) 6V 6V 7 2006-3-2 TA8492P/PG 5. IL (L) 12 V V 4.7 µF 16 VS 15 Lb 14 VCC 13 GND 12 GND 11 Hb + 12 V VHb + VHc + 4.7 µF 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VCC VHa + • IL (L): Check that the output function is high impedance at 3ST = VCC. (a-phase, b-phase, c-phase) 6. VH, VSTP, VFW, VRV 12 V 12 V VHb + VHc + 4.7 µF V 16 VS 15 Lb 14 4.7 µF 13 GND 12 GND 11 Hb VCC + 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 V3ST GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − VHa + • • • VH: Input VHa , VHb , VHc (6.01 V/5.99 V) and check the output function. (a-phase, b-phase, c-phase) AT V3ST = GND. + + + + + + VSTP: When V3ST is 8.5 V, input VHa , VHb , VHc (6.01 V/5.99 V), fix the output function, then check that the output function is at high impedance. VFW: Input VHa , VHb , VHc (6.01 V/5.99 V) and check that the output function is forward mode. AT V3ST = 2.5 V/6.5 V. + + + 6V 6V 8 2006-3-2 TA8492P/PG • VRV: Input VHa , VHb , VHc (6.01 V/5.99 V) and check that the output function is reverse mode. AT V3ST = 0.4 V. + + + 7. VCMRH 12 V 12 V 4.7 µF 4.7 µF 16 VS 15 Lb 14 VCC 13 GND 12 GND 11 Hb + 10 Hb − 9 Hc + Lc 1 La 2 3ST 3 GND 4 GND 5 Ha 6 − Ha 7 + Hc 8 − A • VCMRH: Measure the ICMRH gap between VCMRH = 2 V and 8.5 V. VCMRH ICMRH 9 2006-3-2 TA8492P/PG Application Circuit 12 V C1 3ST 3 14 VCC 16 FRC R1 Ha Ha Hb + − + VCC VS C2 12 V TSD 7 6 11 Matrix 2 15 1 La Lb Lc C3 − Hb 10 + Hc 9 − Hc 8 R1 4, 5, 12, 13 GND Note: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 10 2006-3-2 TA8492P/PG Package Dimensions Weight: 1.11 g (typ.) 11 2006-3-2 TA8492P/PG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 2. Equivalent Circuits 3. Timing Charts 4. Application Circuits 5. Test Circuits IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 12 2006-3-2 TA8492P/PG Points to remember on handling of ICs (1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 13 2006-3-2 TA8492P/PG 14 2006-3-2