TB2909FNG
BiCMOS Linear Integrated Circuit Silicon Monolithic
TB2909FNG
Maximum Power 5 W SEPP × 1ch Audio Power Amp IC
1.
Description
The TB2909FNG is a power IC with built-in one-channel SEPP
amplifier for sound output applications such as audios and vehicle
approach warning devices.
It includes a standby switch, mute function, and various
protection features for audios.
2.
P-HTSSOP16-0505-0.65-001
Applications
Power IC for sound output applications
3.
Weight: 0.062 g (typ.)
Features
• Built-in various mute functions (for low voltage mute and standby-off mute)
• Built-in standby switch (pin7)
• Built-in mute switch (pin6)
• Built-in various protection circuits(thermal shutdown, over-voltage protection, output short and load short
protection)
• Built-in thermal detection (pin9)
• Built-in over-voltage detection (pin10)
• Built-in output short detection (pin11)
• Built-in load short detection (pin11)
• Built-in speaker open detection (pin12)
Table1 Typical Characteristics (Note1)
Condition
Typ.
Unit
VCC = 16 V Max Power
5
W
VCC = 12 V Max Power
3
W
THD = 10%
2
W
0.08
%
50
μVrms
Output power (POUT MAX)
Total harmonic distortion (THD)
POUT = 0.125 W
(VOUT = 1 Vrms)
Output noise voltage (VNO)
DIN_AUDIO, Rg = 620 Ω
Operating Supply voltage range (VCC)
Note1: Typical test conditions VCC = 12 V, f = 1 kHz, RL = 8 Ω, GV = 20
dB, Ta = 25°C; unless otherwise specified
Rg: signal source resistance
© 2014-2021
Toshiba Electronic Devices & Storage Corporation
1
RL = 8 Ω
6 to 16
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TB2909FNG
R2
IN
AMP
OUT
8 Test
15
Monitor
7 Stby
VP
14
Play
R3
PW-GND1
6 Mute
C3
Mute
R
C5
16
RL = 8 Ω
C1 R1
4
13
C4
3 Ripple
Speaker Open
12
Short
11
Over Voltage
10
Thermal
9
2 NC
5 Pre-GND
PW-GND2
Diag1
Diag2
Diag3
Diag4
Vcc
1
4.
C7
C6
+B
Block Diagram
Note2: Some of the functional blocks, circuits or constants in the block diagram may have been omitted or simplified for
clarity.
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5.
Pin Configuration and Function Descriptions
Pin Configuration (top view)
Vcc
1
16
OUT
NC
2
15
Monitor
Ripple
3
14
PW-GND1
IN
4
13
PW-GND2
Pre-GND
5
12
Diag1
Mute
6
11
Diag2
Stby
7
10
Diag3
Test
8
9
Diag4
Pin Function Description
Pin
number
Symbol
1
Vcc
VCC-IN
Supply voltage pin
2
NC
—
NC pin
3
Ripple
—
Ripple voltage pin
4
IN
IN
Input pin
5
Pre-GND
—
Signal ground pin
6
Mute
VMUTE-IN
Mute voltage input pin
7
Stby
VSB-IN
Standby voltage input pin
8
Test
IN
Test pin
9
Diag4
OUT
Thermal detection pin
I/O
Description
10
Diag3
OUT
Over-voltage detection pin
11
Diag2
OUT
Output short and load short detection pin
12
Diag1
OUT
Speaker open detection pin
13
PW-GND2
—
Ground pin 2 for output
14
PW-GND1
—
Ground pin 1 for output
15
Monitor
IN
Speaker monitor pin
16
OUT
OUT
Output pin
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6.
Functional Description
R2
AMP
16
OUT
8 Test
15
Monitor
7 Stby
VP
14
Play
R3
PW-GND1
6 Mute
C3
Mute
R
C5
C1 R1
IN
RL = 8 Ω
4
13
C4
3 Ripple
Speaker Open
12
Short
11
Over Voltage
10
Thermal
9
2 NC
5 Pre-GND
PW-GND2
Diag1
Diag2
Diag3
Diag4
Vcc
1
C7
C6
+B
External Component Specification (Recommended circuit)
Effect (Note3)
Component
Name
Recommended
Value
Pin
Purpose
C1
4.7 μF
IN
C3
1 μF
Mute
C4
4.7 μF (Note4)
Ripple
Ripple filter
Turn on/off time is short
Turn on/off time is long
C5
1000 μF
OUT
To eliminate DC
Cut-off frequency becomes higher
Cut-off frequency becomes lower
C6
470 μF
Vcc
Ripple filter
Filter for power supply hum and ripple
Vcc
To provide sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
—
C7
0.1 μF
Lower than Recommended Value
Higher than Recommended Value
To eliminate DC
Cut-off frequency becomes higher
Cut-off frequency becomes lower
To reduce pop noise
High pop noise
Duration until mute function is
turned off is short.
Low pop noise
Duration until mute function is
turned off is long.
R1
2 kΩ
IN
Setting of gain
R2
20 kΩ
IN, OUT
Setting of gain
—
R3
47 kΩ
Mute
To reduce pop noise
High pop noise
Duration until mute function is
turned off is short.
R
1 kΩ
OUT
To reduce pop noise
High pop noise
Current consumption becomes
larger
Low pop noise
Duration until mute function is
turned off is long.
Low pop noise
Current consumption becomes
smaller
Note3: When the not recommended value is used, please examine it enough by system evaluation.
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Note4: Please examine C4 constants more than 4.7 μF in consideration of POP sound.
Setting of Gain
This product can adjust the voltage gain (GV) of built-in amplifier with a setting of R1 and R2.
The voltage gain is determined by R1 and R2 as below expression.
It becomes GV = 20 dB (typ.) when it is setting the R1 = 2 kΩ and R2 = 20 kΩ.
R2
GV (dB) = 20 × log10
R1
Setting of Cut-off frequency
The lower cut-off frequency of this product is determined by C1, R1 and C5, RL.
It is calculated by the below expression.
Lower cut-off frequency (Hz) fcl fcl =
Standby Switch (Pin7)
1
2π ×C1 × R1
The power supply can be turned on or off via Stby
pin. The power supply current is about 0.01 μA
(typ.) in the standby state.
and fcl =
ON
Power
1
2π ×C5 ×RL
VSB
7
Stby
OFF
to Bias
Table 2 Standby Control voltage (VSB)
Standby
Power
VSB (V)
ON
OFF
0 to 0.8
OFF
ON
2.4 to VCC
Figure 1 Standby Switch Circuit
As benefit of the standby switch, it is possible that the switch between a battery and Vcc pin changes from a
high-current switch to a low-current switch.
And VCC can be directly turned on or off by a microcomputer, and a switching relay can be omitted.
Relay
High-current-rated switch
Battery
Battery
VCC
Signal from
microcomputer
VCC
– Conventional Method –
Signal from microcomputer
Low-current-rated switch
Battery
Stby
Battery
Stby
VCC
VCC
– Using the Standby Switch –
Figure 2 Standby Switch
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Mute Switch (Pin6)
The mute function is enabled by setting pin 6 (mute voltage input pin) to Low. R3 and C3 connected to the
mute pin determine the time constant of the mute function. The time constant affects pop noise generated
when power and the mute function are turned on or off. Thus, when the value of R3 and C3 change, they
should be determined with an enough consideration.
Moreover, this pin is designed on the control voltage of 5 V. If controlling in other voltage, the constant of R3
should be determined as shown below.
For example, when the control voltage (Vm) is changed from 5 V to 3.3 V, the value of R3 should be:
3.3 V
5 V
× 47 kΩ = 31 kΩ
ATTMUTE - V
VP
VMUTE
Vm
R3
C3
6
Mute
Mute ON/OFF
control
Mute attenuation ATTMUTE (dB)
20
0
−20
−40
−60
−80
−100
−120
0
0.5
1
1.5
2
2.5
3
Mute pin voltage VMUTE (V)
Figure 3 Mute Function
Figure 4 Mute Attenuation ATTMUTE (dB) - VMUTE (V)
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Speaker Open Detection (Pin12)
Speaker open can be detected with Diag1 pin using Test pin.
At startup, the speaker open detection mode is set by applying the voltage 2.4 V or more to Test pin. Then
the Monitor pin connected between the speaker and capacitor C5 sends the measuring current to the
speaker. In this time, the speaker open detection is judged by detecting the generated voltage in the IC. (the
threshold of RL is 80 Ω (typ.) or more)
In case of speaker open detection, NPN transistor (Q1) is turned on and the Diag1 pin outputs to low.
At the speaker open detection, from applying the voltage 2.4 V or more to Test pin till Diag1 pin outputs to
low, it takes 100 ms (typ.). After diagnostication, please set the Test pin to “Low”.
In case of diagnostic at the time of the standby-off, please use it in the condition of no inputting or Mute-on.
Since the current capability of the collector current of Q1 is about 1 mA, please use the pull-up resistor equal
or more than 4.7 kΩ when Diag1 pin is pulled up at 5 V.
IN
OUT
16
4
Microcomputer
VT Test
8
Monitor
C5
VMonitor
15
Diag1 VDiag1
12
Q1
C4
1000 μF
VP
8Ω
VRip Ripple
3
Bias circuit
Figure 5 Speaker open detection
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When a speaker is not connected
(Speaker open)
The waveform of Diag1 pin
When a speaker is connected
VCC
Stby pin
(pin7)
Ripple pin
(pin3)
VSB
t
0
VRip
t
0
VP
Mute pin
(pin6)
VMUTE
t
0
Test pin
(pin8)
VT
t
0
Monitor pin
VMonitor
(pin15)
100 ms
(typ.)
100 ms
(typ.)
100 ms
(typ.)
t
0
VP
Diag1 pin
(pin12)
Speaker open
detection
(Note5)
Speaker open
detection
(Note5)
Speaker open
detection
VDiag1
t
0
Figure6 Speaker Open Detection Sequence
Stby pin
Test pin
Condition
0
0
Standby on
0
1
Standby on and speaker open detection
1
0
Standby off
1
1
Standby off and speaker open detection (Note5)
Note5: In case of diagnostic at standby-off, please use it in the condition of no inputting or mute on state.
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Output Short / Load Short Detection (Pin11)
The Output short and the load short can be detected with Diag2 pin when the protection circuit operates.
When the output short is detected, NPN transistor (Q2) is turned on and the Diag2 pin outputs to low.
(Refer to figure 7)
The output short is detected immediately when the decoupling capacitor is shorted.
When the load short is detected, NPN transistor (Q2) repeats turning on and off in response to the output
signal. (Refer to Figure 8)
Since the current capability of the collector current of Q2 is set to about 1 mA, please use the pull-up resistor
more than 4.7 kΩ when the Diag2 pin is pulled up at 5 V.
VP
Microcomputer
Output short
occurs
Diag2
Output short/
load short
detector
Q2
Output short
disappears
Load short
occurs
VP
Diag2 pin
(pin11)
VDiag2
11
Load short
disappears
VP
Diag2 pin
VDiag2
(pin11)
0
VDiag2
0
t
20 μs (min)
Under normal Under detecting Under normal
output short
operating
operating
Under normal Under detecting Under normal
operating
operating
load short
Figure 7 Output Short Detection
Figure 8 Load Short Detection
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Over-voltage Detection (Pin10)
The Over-voltage can be detected with Diag3 pin.
When the over-voltage is detected, NPN transistor (Q3) is turned on and the Diag3 pin outputs to low. (Refer
to figure 9)
When the power supply voltage is 22 V (typ.) or more, the over-voltage detection is operated. The releasing
voltage of the over-voltage detection has hysteresis. After detecting the over-voltage, the over-voltage
detection is released when the power supply voltage is 18 V (typ.) or less.
The current capability of the collector current of Q3 is set to about 1 mA, please use the pull-up resistor
more than 4.7 kΩ when the Diag3 pin is pulled up at 5 V.
VP
Diag3
Microcomputer
Over-voltage
detection
Q3
11
Over-voltag Over-vol
e
tage
disappears occurs
VDiag3
VP
Diag3 pin
(pin10) VDiag3
0
図 9 Over-Voltage Detection
t
18 V
(typ.)
22 V
(typ.)
Note6: The over-voltage detection does not recommend that this IC be used above the power supply voltage of absolute
maximum ratings (16 V). Please use 16 V or less.
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Thermal Detection (Pin9)
The thermal detection can be detected with Diag4 pin.
When the thermal detection is detected, the output level is reduced. If the junction temperature increased,
the output level is more reduced ((1) in Figure 10). Even if the output level is reduced, the junction
temperature increased, mute function is enabled (thermal mute). Even if mute function is enabled, the
junction temperature increased continuously, the output transistors are OFF (thermal shutdown).
When the junction temperature increases, NPN transistor (Q4) is turned on and the Diag4 pin outputs to
low. (Refer to figure 10)
When the junction temperature is 165°C (typ.) or more, the thermal detection is operated.
The current capability of the collector current of Q4 is set to about 1 mA, please use the pull-up resistor 4.7
kΩ or more when the Diag4 pin is pulled up at 5 V.
VP
Diag4
Thermal
detection
Microcomputer
Q4
Output level is
reduced.
Under normal operation
11
VDiag4
Under thermal mute
operation
Under thermal
shutdown
(1)
OUT pin
(pin16)
t
0
Thermal detection
VP
Diag4 pin
VDiag4
(pin9)
Tj
0
VP
Diag2 pin
(pin11)
VDiag2
0
Tj
150°C
165°C (typ.)
175°C
185°C (typ.)
Figure 10 Thermal detection
Note7: The thermal detection does not recommend that this IC be used above the junction temperature of absolute
maximum ratings (150°C). Please use 150°C or less.
Note8: If the junction temperature is 185°C (typ.) or more, Diag4 and Daig2 pins become “Low”.
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Mute Function
This product has two internal mute functions: low voltage mute, and standby-off mute.
6.10.1 Low Voltage Mute
The Low-voltage mute is the function which operates automatically by the internal circuit of IC when the
supply voltage (VCC) become 5.5 V or lower.
The releasing voltage of the over-voltage detection has hysteresis. After the low voltage mute operates, the
low voltage mute is released when the power supply voltage (VCC) is 5.7 V (typ.) or more.
6.10.2 Standby-off Mute
The standby-off mute is the function which operates automatically by the internal circuit of IC after the
standby voltage input pin is set to “High” until the Ripple pin voltage (VRip) becomes about VCC / 2 + 1.75 V.
The standby-off mute operates automatically regardless of the state of the mute control voltage.
VCC
Stby pin
(pin 7)
VSB
t
0
VP
Mute control
voltage
Vm
t
0
VP
Mute pin
(pin 6)
VMUTE
t
0
The standby mute operates until VRip
becomes about Vcc / 2 + 1.75 V.
VCC / 2 + 1.75
Ripple pin
(pin 3)
VRip
t
0
The time until sound output:
500 ms (max)
OUT pin
(pin 16)
VCC / 2
t
0
Figure 11 Sequence at Standby-off
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6.10.3 Mute-off sequence after standby-off
Figure 12 shows the sequence which the mute is turned off by changing the Mute control voltage (Vm)
from 0 to VP after standby-off.
After standby-off, if the mute is turned off before charging C5 is finished, the pop noise occurs. As a
countermeasure of pop noise, please set “Mute-off” with sufficient margin in considering a enough charge
time after the output DC bias voltage becomes stable.
Standby-off
VCC
Stby pin
(pin 7)
VSB
t
0
During standby-off, set “Mute-off” after the output
DC bias voltage becomes stable
VP
Mute control
voltage
Vm
t
0
VP
Mute pin
(pin 6)
VMUTE
t
0
VCC / 2+1.75
Ripple pin
(pin 3)
VRip
t
0
OUT pin
(pin 16)
VCC / 2
t
0
Figure 12 Mute-off Sequence After Standby-off
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Protection Functions
This product has internal protection circuits such as thermal shut down, over-voltage protection, output
short protection, and load short protection.
(1)
Thermal shut down
It operates when the junction temperature is 165°C or more. (Note9)
If the junction temperature falls, it will return automatically.
When it operates, it is protected in the following order.
1. An attenuation of an output starts first and the amount of attenuation also increases according
to a temperature rising.
2. All outputs become in a mute state, when temperature continues rising in spite of output
attenuation.
3. Output bias is turned off, when a temperature rise continues in spite of all outputs in a mute
state.
(2)
Over-voltage (Note10)
It operates when a power supply voltage is operating range (22 V) or more to VCC pin.
If voltage falls, it will return automatically.
When it operates, output bias is turned off.
(3)
Output short, and load short
It operates when each output pin is irregular connection.
If irregular connection is canceled, it will return automatically.
When it operates, output bias is turned off.
Note9: This function does not recommend that this IC be used above the junction temperature of absolute maximum
ratings (150°C). Please use 150°C or less.
Note10: This function does not recommend that this IC be used above the power supply voltage of absolute maximum
ratings (16 V). Please use 16 V or less.
Note11: This function operates in standy-on.
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7.
Absolute Maximum Ratings
(Ta = 25°C unless otherwise specified)
Characteristics
Condition
Symbol
Rating
Unit
max 0.2 s
VCC (surge)
40
V
Supply voltage (DC)
—
VCC (DC)
25
V
Supply voltage (operation)
—
VCC (opr)
16
V
Output current (peak)
—
IO (peak)
2.5
A
(Note12)
PD
3.3
W
Operating temperature range
—
Topr
−40 to 110
°C
Storage temperature
—
Tstg
−55 to 150
°C
Junction temperature
—
Tj
150
°C
Supply voltage (surge)
Power dissipation
Note12: Ta = 25°C, Package thermal resistance θj-a = 37.6°C/W
Note13: The maximum rating is the rating that should never be exceeded, even for a shortest of moments. If the maximum
rating is exceeded, it could result in damage and/or deterioration of the IC as well as other devices beside the IC.
Regardless of the operating conditions, please design so that the maximum rating is never exceeded.
Note14: Please use within the specified operating range.
Power Dissipation
Power Dissipation PD (max) (W)
PD (max) - Ta
Ambient Temperature Ta (°C)
•
•
Package thermal resistance θj-a = 37.6°C/W
Condition
board material: FR-4
Board area: 114.3 × 76.2 mm, t = 1.6 mm
1-layer (surface layer) Cu-are: 45 × 70 mm, Cu-surface: 12%, Cu-thickness: 70 μm
2-layer (inner layer) Cu-are: 74 × 74 mm, Cu-surface: 100%, Cu-thickness: 35 μm
16-Thermal via connected to 1-layer and 2-layer.
Connect to the back of package e-pad and Cu of 1-layer by solder.
Note15: This package thermal resistance is the evaluation result at board included in chip, package and substrate, the
power dissipation is calculated from thermal resistance. Regarning to using this product, please use the low
resistance board and give a margin to the power dissipation.
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8.
Operating Ranges
Characteristics
Supply voltage
9.
Symbol
Condition
Min
Typ.
Max
Unit
VCC
RL = 8 Ω
6
—
16
V
Electrical Characteristics
VCC = 12 V, f = 1 kHz, RL = 8 Ω, GV = 20 dB, Ta = 25°C unless otherwise specified
Symbol
Test
Circuit
ICCQ
—
POUT MAX1
Min
Typ.
Max
Unite
VIN = 0 V
—
7
—
mA
—
max POWER
—
3
—
POUT
—
THD = 10%
—
2
—
POUT MAX2
—
VCC = 16 V, max POWER
—
5
—
THD
—
Pout = 0.125 W (VOUT = 1 Vrms)
Filter = 400 Hz to 30 kHz
—
0.08
—
%
Voltage gain
GV
—
VOUT = 0.775 Vrms
Setting input resistance (±1%)
19
20
21
dB
Output noise voltage
VNO
—
Rg = 0 Ω, DIN_AUDIO
—
50
—
μVrms
Ripple rejection ration
R.R.
—
fRIP = 100 Hz, Rg = 620 Ω
VRIP = 0.775 Vrms (Note16)
—
50
—
dB
ISB
—
Standby-on
—
0.01
9
μA
VSB H
—
Standby: OFF(Note17)
2.4
—
VCC
VSB L
—
Standby: ON
0
—
0.8
VMUTE H
—
MUTE: OFF(Note17)
2.4
—
VCC
VMUTE L
—
0
—
0.8
VT H
—
Test: ON(Note17)
2.4
—
VCC
VT L
—
Test: OFF
0
—
0.8
ATTMUTE
—
VOUT = 0.775 Vrms → Mute: ON
DIN_AUDIO
—
85
—
dB
Px-Sat
(x = 9 to 12)
—
Rpull-up = 10 kΩ, +VSB= 5.0 V
When detect (pin Low)
—
100
500
mV
Characteristics
Quiescent supply current
Output power
Total harmonic distortion
Standby current
Standby control voltage
Mute pin voltage
Test control voltage
Mute attenuation
Test Condition
MUTE: ON
W
V
Diag1 to Diag4 pin
Saturation voltage in operation of
each detection
Note16: fRIP: Ripple frequency
VRIP: Ripple signal voltage (AC fluctuations in the power supply)
Note17: VSB H, VMUTE H, and VT H should be used 16 V or less.
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10. Test Circuit
R2
IN
AMP
OUT
8 Test
15
Monitor
7 Stby
VP
14
Play
R3
PW-GND1
6 Mute
C3
Mute
R
C5
16
RL = 8 Ω
C1 R1
4
13
C4
3 Ripple
Speaker Open
12
Short
11
Over Voltage
10
Thermal
9
2 NC
5 Pre-GND
PW-GND2
Diag1
Diag2
Diag3
Diag4
Vcc
1
C7
C6
+B
Components in the test circuits are only used to obtain and confirm the device characteristics.
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11. Characteristic Chart
Total Harmonic Distortion vs. Output Power
THD - POUT
THD - POUT
VCC = 12 V
GV = 20dB
GV = 20dB
RL = 8 Ω
RL = 8 Ω
f = 1 kHz
Filter
Filter
100 Hz: to 30 kHz
400 Hz to 30kHz
1 kHz: 400 Hz to 30 kHz
Total harmonic distortion THD (%)
20 kHz: 400 Hz to
20 kHz
10 kHz
100 Hz
6V
12V
16V
f = 1 kHz
Output power POUT (W)
Output power POUT (W)
Figure 8 Total Harmonic Distortion of
Each Frequency
Figure 9 Total Harmonic Distortion by
Power Supply Voltage
Various Frequency Characteristics
THD - f
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
10 kHz: 400 Hz to
RL = 8 Ω
POUT = 0.125 W
Filter nothing
16 V
12 V
6V
Frequency f (kHz)
Figure 10 Frequency Characteristics of Total Harmonic Distortion
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ATTMUTE - f
GV - f
VCC = 12 V
Voltage gain GV (dB)
Mute attenuation ATTMUTE (dB)
RL = 8 Ω
VCC = 12 V
RL = 8 Ω
VOUT = 0.775 Vrms
DIN_AUDIO
VOUT = 0.775 Vrms
Frequency f (kHz)
Frequency f (kHz)
Figure 11 Frequency Characteristics of Voltage Gain
R.R. - f
Ripple rejection rate R.R. (dB)
VCC = 12 V
RL = 8 Ω
VRIP = 0.775 Vrms (0dB)
Rg = 620 Ω
Ripple Frequency fRIP (kHz)
Figure 12 Frequency Characteristics of
Output Power Characteristics to Input Voltage
POUT - VIN
Output power POUT (W)
10 kHz
f = 20 kHz
1 kHz
100 Hz
VCC = 12 V
RL = 8 Ω
Filter nothing
Input voltage VIN (rms) (V)
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Power Dissipation vs. Output Power
PD - POUT (RL = 8 Ω)
f = 1 kHz
RL = 8 Ω
Power dissipation PD (W)
16 V
12 V
6.0 V
Output power POUT (W)
Other Characteristic
ICCQ - VCC
Quiescent Current ICCQ (mA)
VIN = 0 V
RL = ∞
Supply voltage VCC (V)
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12. Package Dimensions
Package: P-HTSSOP16-0505-0.65-001
Unit: mm
Weight: 0.062 g (typ.)
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13. 1ch Power Amp IC Evaluation Board Diagram
This dimension is the pattern layer “RP-2024Z” for 1ch power IC evaluation board using
P-HTSSOP16-0505-0.65-001. This product evaluates below board.
1-layer: (surface layer) Cu-area: 57 × 57 mm, Cu-surface: about 20%, Cu-thickness: 35 μm
2-layer: (inner layer) Cu-area: 57 × 57 mm, Cu-surface: about 80%, Cu-thickness: 70 μm
3-layer: (inner layer) Cu-area: 57 × 57 mm, Cu-surface: about 80%, Cu-thickness: 70 μm
4-layer: (solder layer) Cu-area: 57 × 57 mm, Cu-surface: about 20%, Cu-thickness: 35 μm
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Component side (1-layer)
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GND layer (2-layer)
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VCC layer (3-layer)
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Solder side (4-layer)
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Notes on Contents
(1) Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
(2) Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
(3) Timing Charts
Timing charts may be simplified for explanatory purposes.
(4) Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Providing these application circuit examples does not grant a license for industrial property rights.
(5) Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
(6) Characteristic Chart
This data is provided for reference only. Thorough evaluation and testing should be implemented when designing
your application's mass production design.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design
to prevent device malfunction or breakdown caused by the current resulting from the inrush current at
power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown
may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current protection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
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