TB62208FG
TOSHIBA BiCD Integrated Circuit
Silicon Monolithic
TB62208FG
BiCD Constant-Current Two-Phase Bipolar Stepping Motor Driver IC
The TB62208FG is a two-phase bipolar stepping motor
driver using a PWM chopper.
Fabricated with the BiCD process, the TB62208FG is rated
at 40 V/1.8 A.
The on-chip voltage regulator allows control of a stepping
motor with a single VM power supply.
HSOP28-P-0450-0.80
Features
• Bipolar stepping motor driver
Weight: 0.79 g (typ.)
• PWM constant-current drive
• Provides phase-A and phase-B enable inputs to allow 2-phase and 1-2-phase excitation.
• BiCD process: Uses DMOS FETs as output power transistors.
• High voltage and current: 40 V/1.8 A
• Thermal shutdown (TSD), over-current shutdown (ISD), and power-on-resets (PORs) for
VMR and VCCR
• Package:
Heat-sink Small Outline Package (HSOP28-P-0450-0.80)
© 2014 TOSHIBA Corporation
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2014-10-01
TB62208FG
22
PGND
VM
23
OUT_B
VCC
24
PGND
NC
25
NC
NC
26
OUT_B
Vref_B
27
NC
Vref_A
28
FIN&LOGIC GND
RS_B
OSCM
Block Diagram
21
20
19
18
17
16
15
Reg
～
Pre-driver
ISD
Comparator
TSD
Comparator
ISD
Control
PHASE_B
ENABLE_A
ENABLE_B
9
10
11
12
13
14
PGND
PHASE_A
FIN&LOGIC GND
8
OUT_A
NC
7
PGND
6
NC
5
OUT_A
4
NC
3
RS_A
2
STANDBY
1
NC
Pre-driver
In the block diagram, part of the functional blocks or constants may be omitted or simplified for explanatory purposes.
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2014-10-01
TB62208FG
Pin Function
Pin #
Pin Name
Function
1
NC
No-connect
2
NC
No-connect
3
PHASE_A
Phase-A motor output current direction selector
4
PHASE_B
Phase-B motor output current direction selector
5
ENABLE_A
Phase-A motor output enable SW
5V:OUTPUT ON / GND:OUTPUT OFF
6
ENABLE_B
Phase-B motor output enable SW
5V:OUTPUT ON / GND:OUTPUT OFF
7
STANDBY
Power-saving waiting mode SW pin with stopping OSCM and motor outputs
FIN
FIN&Logic GND
8
RS_A
9
NC
10
OUT_A
11
NC
12
PGND
Motor power ground
13
OUT_A
Negative phase-A motor output
14
PGND
Motor power ground
15
PGND
Motor power ground
16
OUT_B
Negative phase-B motor output
17
PGND
Motor power ground
18
NC
19
OUT_B
20
NC
21
RS_B
FIN
FIN&Logic GND
22
VM
Power supply
23
Vcc
Smoothing filter for internal 5V power supply
24
NC
No-connect
25
NC
No-connect
26
Vref_B
Tunes the current level for phase-B motor output
27
Vref_A
Tunes the current level for phase-A motor output
28
OSCM
Tunes frequency of oscillator for chopping
This fin is a heat sink which functions as logic GND.
This must be connected to GND line of board.
Power supply for the Phase-A motor output and sensing of the current
No-connect
Positive phase-A motor output
No-connect
No-connect
Positive phase-B motor output
No-connect
Power supply for the Phase-B motor output and sensing of the current
This fin is a heat sink which functions as logic GND.
This must be connected to GND line of board.
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2014-10-01
TB62208FG
Pin Interfaces
150 Ω
3
7
40 kΩ
6
27
23
60 kΩ
5
100 kΩ
4
26
FIN
FIN
8
21
1 kΩ
22
8 kΩ
500 Ω
28
3 kΩ
3 kΩ
10 13
FIN
19 16
12
14
17
15
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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2014-10-01
TB62208FG
Output Function Table
Pin name
STAND BY
Function
Power-saving waiting SW
“L” : disable the OSCM and
Outputs.The motor can
not be operated
PHASE
ENABLE
The determination pin of the
direction of motor current
“H” : Current flows into
OUT(-) from OUT(+)
OUT(+)
OUT(-)
OSC_M
The ON/FFF switch of
the output transistors
“L” :Output pins will be in a
high impedance state.
L
X
X
OFF
OFF
a halt
H
X
L
OFF
OFF
oscillation
H
H
H
H
L
oscillation
H
L
H
L
H
oscillation
State
X : Don't-care
Protection Features
(1)
Thermal shutdown (TSD)
The thermal shutdown circuit turns off all the outputs when the junction temperature (Tj) exceeds 150°C (typical).
The outputs retain the current states.
The TB62208FG exits TSD mode and resumes normal operation when the TB62208FG is rebooted or the
STANDBY pin is changed from High to Low and then to High.
(2)
Power-on-resets (PORs) for VMR and VCCR (VM and VCC voltage monitor)
The outputs are forced off until VM and VCC reach the rated voltages.
(3)
Overcurrent shutdown (ISD)
Each phase has an overcurrent shutdown circuit, which turns off the corresponding outputs when the output
current exceeds the shutdown trip threshold (above the maximum current rating: 2.0 A minimum).
The TB62208FG exits ISD mode and resumes normal operation when the STANDBY pin is changed from High
to Low and then to High.
This circuit provides protection against a short-circuit by temporarily disabling the device. Important notes on this
feature will be provided later.
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TB62208FG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Motor power supply
VM
40
V
Motor output voltage
Vout
40
V
Output current (Note 1)
IOUT
1.8
A
Logic input voltage
VIN
-0.5 to 6.0
V
Power dissipation (Note 2)
PD
1.3
W
Operating temperature
Topr
–20 to 85
°C
Storage temperature
Tstg
–55 to 150
°C
Junction temperature
Tj(max)
150
°C
Note 1: As a guide, the maximum output current should be kept below 1.0 A per phase. The maximum
output current may be further limited by thermal considerations, depending on ambient
temperature and board conditions.
Note 2: Stand-alone
Ta: Ambient temperature
Topr: Ambient temperature while the TB62208FG is active
T j:
Junction temperature while the TB62208FG is active. The maximum junction temperature is limited
by the thermal shutdown (TSD) circuitry.
It is advisable to keep the maximum current below a certain level so that the maximum junction
temperature, Tj(max), will not exceed 120°C.
Cautions on absolute maximum ratings:
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under
any circumstances. The TB62208FG does not have overvoltage protection. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings including supply voltages must always be followed. The section on the protection
features on page 8 should also be referred to.
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TB62208FG
Operating Ranges (Ta = 0 to 85°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Supply voltage for internal circuitry
VCC
Internally generated
4.5
5.0
5.5
V
Motor supply voltage
VM
－
10
24
38
V
IOUT
Ta = 25°C; Per phase
―
1.2
1.8
A
VIN(Ｈ)
Logic High level
2.0
3.3
5
V
VIN(Ｌ)
Logic Low level
GND
－
1.0
V
fPHASE
－
―
1.0
150
kHz
Chopper frequency
fchop
－
80
100
120
kHz
Vref reference voltage
Vref
－
GND
3.0
3.6
V
Voltage across the current-sensing
resistor pins
(Voltage across VM and RS)
VRS
0
±1.0
±1.5
V
Output current
Digital input voltage
Phase input frequency
Referenced to the VM pin
(Note)
Note: The maximum VRS voltage should not exceed the maximum rated voltage.
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TB62208FG
Electrical Characteristics 1 (Ta = 25°C, VM = 24 V, unless otherwise specified)
Characteristics
Input hysteresis voltage
Logic input current
Symbol
Test
Circuit
VIN (HIS)
DC
High
IIN (H)
Low
IIN (L)
DC
Test Condition
Min
Typ.
Max
Unit
mV
Logic input pins (Note)
100
200
300
Logic input pins; VIN = 5 V
35
50
75
Logic input pins; VIN = 0 V
－
－
1.0
－
2
3
－
3.5
5
－
5
７
－
－
１
μA
μA
Outputs open
IM1
Logic inputs: All Lows
Logic and outputs disabled
Outputs open; fPHASE =1 kHz
Supply current
IM2
(VM pin)
DC
Logic enabled;
All outputs disabled
mA
Outputs open; fPHASE = 4 kHz
Logic enabled
IM3
(2-phase excitation;
100-kHz chopping)
High-side
IOH
DC
VRS = VM = 40 V; VOUT = 0 V;
Digital inputs: All Lows
Low-side
IOL
DC
VRS = VM = VOUT = 40 V;
Digital inputs: all Lows
１
－
－
μA
Channel-to-channel current differential
∆IOUT1
DC
Channel-to-channel error
–5
0
5
%
Output current error relative to the
predetermined value
∆IOUT2
DC
IOUT = 1.0A
–5
0
5
%
IRS
DC
0
－
10
μA
RON (D-S)
DC
－
1.2
1.5
Ω
Output leakage current
RS pin current
Drain-source ON-resistance of the
output transistors
(upper and lower sum)
Note :
VRS =VM= 24 V
STANDBY = L
IOUT = 1.0 A, Tj = 25°C
VIN(L→H) is defined as the VIN voltage that causes the outputs (pins 10 and 11) to change when a pin under
test is gradually raised from 0 V. VIN(H→L) is defined as the VIN voltage that causes the outputs (pins 10 and
11) to change when the pin is then gradually lowered.
The difference between VIN(L→H) and VIN(H→L) is defined as the input hysteresis.
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2014-10-01
TB62208FG
Electrical Characteristics 2 (Ta = 25°C, VM = 24 V, unless otherwise specified)
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Vref input voltage range
Vref
DC
VM = 24 V, STANDBY = H,
outputs enabled, PHASE =
1 kHz
GND
3.0
5.0
V
Vref input current
Iref
DC
20
35
50
μA
Vref (GAIN)
DC
STANDBY = H, output
enabled, Vref = 2.0 V
1/4.8
1/5.0
1/5.2
-
TjTSD
DC
VM = 24 V
140
155
170
°C
VM recovery voltage
VMR
DC
STANDBY = H
7.0
8.0
9.0
V
Overcurrent trip threshold
(Note 2)
ISD
―
2.0
3.0
4.0
A
Characteristics
Vref decay rate
TSD threshold (Note 1)
STANDBY = H
output enabled, Vref = 3.0 V
－
Note 1: Thermal shutdown (TSD) circuitry
When the junction temperature of the device has reached the threshold, the TSD circuitry is tripped, causing the
internal reset circuitry to turn off the output transistors.
The TSD circuitry is tripped at a temperature between 140°C (min) and 160°C (max). Once tripped, the TSD
circuitry keeps the output transistors off until STANDBY is deasserted High.
Note 2: Overcurrent shutdown (ISD) circuitry
When the output current has reached the threshold, the ISD circuitry is tripped, causing the internal reset circuitry
to turn off the output transistors.
To prevent the ISD circuitry from being tripped due to switching noise, it has a masking time of four CR oscilator
cycles. Once triped, it takes a maximum of four cycles to exit ISD mode and resume normal operation.
The ISD circuitry remains active until the STANDBY pin is changed from Low to High again.
The TB62208FG remains in Standby mode while in ISD mode.
Back-EMF
・
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current
recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above
the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must
be fully verified that there is no risk that the TB62208FG or other components will be damaged or fail due to the motor
back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
・The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output
short-circuit.
・If the device is used beyond the specified operating ranges, these circuits may not operate properly; then the device may be
damaged due to an output short-circuit.
・The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists
for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by
external hardware.
IC Mounting
Do not insert devices in the wrong orientation or incorrectly. Otherwise, it may cause the device breakdown,
damage and/or deterioration.
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TB62208FG
AC Electrical Characteristics (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Phase frequency
Minimum phase pulse width
Output transistor switching
characteristics
Blanking time for current spike
prevention
CR oscillation reference frequency
Chopper frequency range
Predefined chopper frequency
ISD masking time
ISD on-time
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
fPHASE
AC
OSC = 1600 kHz
–
–
400
kHz
tPHASE
AC
100
–
–
twp
AC
50
–
–
twn
AC
50
–
–
tr
―
150
200
250
tf
―
100
150
200
tpLH(P)MAX
―
500
850
1200
tpHL(P)MAX
―
500
850
1200
tpLH(P)MIN
―
250
600
950
tpHL(P)MIN
―
250
600
950
tpLH(O)
―
300
600
900
tpHL(O)
―
350
650
950
tBLANK
―
IOUT = 1.0 A
200
300
500
ns
fCR
―
Cosc = 270 pF, Rosc = 3.6 kΩ
1200
1600
2000
kHz
fchop(RANGE)
―
40
100
150
kHz
fchop
―
–
100
–
kHz
tISD(Mask)
AC
–
4
–
tISD
AC
4
–
8
－
－
PHASE to OUT
ns
ns
CR(OSC) to OUT
VM = 24 V, outputs enabled,
(IOUT = 1.0 A)
Outputs enabled
(IOUT = 1.0 A),
CR = 1600 kHz
The number of CR-CLK pulses
after ISD threshold is exceeded
due to an output short-circuit to
powerline or ground
-
OSC_M frequency can be calculated by the following approximate formula.
Please give as a reference of frequency adjustment.
f OSCM =
1
0.6 × C × ( R1 + 500)
………C, R1 : The external constant for OSCM
(C=270pF, R1=3.6kΩ on an application circuit diagram)
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2014-10-01
TB62208FG
Current Waveform in Mixed Decay Mode
For constant-current control, Mixed-Decay mode starts out in Fast-Decay mode for 37.5% of the whole period and
then is followed by Slow-Decay mode for the remainder of the period.
fchop
Internal
CR CLK
Decay Mode 1
Predefined
Current Level
NF
37.5%
Mixed
Decay
Mode
MDT
CHARGE Mode → NF: Predefined current level → Slow Decay
Mode → Mixed Decay Timing → Fast Decay Mode → Charge
Mode
Current Waveform in MIXED DECAY Mode
fchop
fchop
Internal
CR CLK
IOUT
Predefined
Current Level
Predefined Current Level
NF
NF
37.5%
Mixed
Decay
Mode
MDT (Mixed Decay Timing) Point: 37.5%
Timing charts may be simplified for explanatory purposes.
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TB62208FG
● Waveforms of Internal CR CLK and Output Signals (2-Phase Excitation Mode)
Timing charts may be simplified for explanatory purposes.
37.5% Mixed Decay Mode
fchop
fchop
fchop
Predefined
Current Level
IOUT
0
MDT
Predefined
Current Level
NF
NF
PHASE Input
The CR-CLK counter is reset here.
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TB62208FG
● Output Transistor Operating Modes
VM
VM
RRS
VM
RRS
RS Pin
RRS
RS Pin
U1
RS Pin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
Load
L2
ON
PGND
L1
L2
ON
OFF
PGND
Charge Mode
A current flows into
the motor coil.
PGND
Slow Decay mode
A current circulates
around the motor coil
and this device.
Fast Decay mode
The energy of the
motor coil is fed back
to the power supply.
Output Transistor Operating Modes
CLK
U1
U2
L1
L2
Charge
ON
OFF
OFF
ON
Slow Decay
OFF
OFF
ON
ON
Fast Decay
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the above figures. If the current
flows in the opposite direction, refer to the following table.
CLK
U1
U2
L1
L2
Charge
OFF
ON
ON
OFF
Slow Decay
OFF
OFF
ON
ON
Fast Decay
ON
OFF
OFF
ON
The TB62208FG switches among Charge, Slow Decay and Fast Decay modes automatically for constant-current control.
The equivalent circuit diagrams are simplified or some parts of them may be omitted for explanatory purposes.
Calculation of the Predefined Output Current
For PWM constant-current control, the TB62208FG uses a clock generated by the CR oscillator. The peak output
current can be set via the current-sensing resistor (RRS) and the reference voltage (Vref), as follows:
I out = Vref / 5 ÷ RRS (Ω)
where, 1/5 is the Vref decay rate, Vref(GAIN). For the value of Vref(GAIN), see the Electrical Characteristics table.
For example, when Vref = 3 V, to generate an output current (IOUT) of 0.8 A, RRS is calculated as:
RRs = (Vref / 5) ÷ I out = (3 / 5) ÷ 0.8 = 0.75 Ω. (≥ 0.5 W)
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TB62208FG
IC Power Consumption
The power consumed by the TB62208FG is approximately the sum of the following two: 1) the power consumed by
the output transistors, and 2) the power consumed by the digital logic and pre-drivers.
The power consumed by the output transistors is calculated, using the RON(D–S) value of 1.5 Ω.
Whether in Charge, Fast Decay or Slow Decay mode, two of the four transistors comprising each H-bridge
contribute to its power consumption at a given time.
Thus the power consumed by each H-bridge is given by:
P(out) = IOUT (A) × VDS (V) = 2 × IOUT2 × RON ............................................... (1)
In two-phase excitation mode (in which two phases have a phase difference of 90°), the average power
consumption in the output transistors is calculated as follows:
RON = 1.50 Ω (@1.0 A)
IOUT (Peak: max) = 1.0 A
VM = 24 V
P(out) = 2 × 1.02 (A) × 1.50 (Ω) = 3.0 (W)......................................................... (2)
The power consumption in the IM domain is calculated separately for normal operation and standby modes:
Normal operation mode:
Standby mode:
I(IM3) = 5.0 mA (typ.)
I(IM1) = 2.0 mA (typ.)
The current consumed in the digital logic portion of the TB62208FG is indicated as IMx. The digital logic operates
off a voltage regulator that is internally connected to the VM power supply. It consists of the digital logic connected
to VM (24 V) and the network affected by the switching of the output transistors. The total power consumed by IMx
can be estimated as:
P(IM) = 24 (V) × 0.005 (A) = 0.12 (W) ............................................................. (3)
Hence, the total power consumption of the TB62208FG is:
P = P(out) + P(IM) = 3.12 (W)
The standby power consumption is given by:
P(Standby) = 24 (V) × 0.002 (A) = 0.048 (W)
Board design should be fully verified, taking thermal dissipation into consideration.
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TB62208FG
● Test Points for AC Specifications
t wp
t wn
90%
t phase
Phase
50%
10%
tpLH
VM
90%
50%
90%
tpHL
50%
10%
10%
GND
tr
tf
Figure 1図1Timing
Waveforms and Symbols
タイミング波形と名称
Timing charts may be simplified for explanatory purposes.
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TB62208FG
● Oscillator Charge Delay
OSC Fast Delay
OSC Charge Delay
H
OSC (CR)
L
tchop
H
Output
Voltage A
50%
L
H
Output
Voltage A
50%
50%
L
Predefined
Current Level
Output
Current
L
Charge
Figure 2
Slow
Fast
Mixed Decay Timing Waveforms
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TB62208FG
Phase Sequences
Two-Phase Excitation Mode
In two-phase excitation mode, the ENABLE input is held at logic High (except when the motor is off).
Phase B
Phase A
100
[%]
Phase B
①
②
③
④
①
②
③
0
Phase A
−100
Step
2-Phase Excitation Mode
150
①
②
100
50
Phase_B
0
-150
-100
-50
0
50
100
150
-50
③
-100
④
-150
Phase_A
Note:The two-phase excitation mode is susceptible to significant load variations incurred by the motor back-EMF.
In Slow Decay mode, a current swell caused by the motor back-EMF might not be cut down.
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TB62208FG
1-2-Phase Excitation Mode
ENABLE_B
ENABLE_A
Phase B
Phase A
100
[%]
Phase B
Phase A
①
②
③
④
⑤
⑥
⑦
⑧
①
②
③
④
0
−100
Step
1-2-Phase Excitation Mode
150
④
③
②
100
50
Phase_B
⑤
-150
-100
①
0
0
-50
50
100
150
-50
⑥
-100
⑦
⑧
-150
Phase_A
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TB62208FG
Overcurrent Shutdown (ISD) Circuitry
ISD Masking Time and ISD On-Time
CR Oscillation
(Chopper Waveform)
(Masking Time)
tISD(Mask)
MIN Disabled (Reset State) MAX
MIN
MAX
ISD On-Time
Chopping cycle
An overcurrent starts to flow into the output
The overcurrent shutdown (ISD) circuitry has a masking time to prevent current spikes during Irr and switching from
erroneously tripping the ISD circuitry. The masking time is a function of the chopper frequency obtained by CR:
masking time = 4 × CR_frequency
The minimum and maximum times taken to turn off the output transistors since an overcurrent flows into them are:
Min: 4 × CR_frequency
Max: 8 × CR_frequency
It should be noted that these values assume a case in which an overcurrent condition is detected in an ideal manner. The
ISD circuitry might not work, depending on the control timing of the output transistors.
Therefore, a protection fuse must always be added to the VM power supply as a safety precaution. The optimal fuse
capacitance varies with usage conditions, and one that does not adversely affect the motor operation or exceed the power
dissipation rating of the TB62208FG should be selected.
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TB62208FG
PD – Ta (Package Power Dissipation)
When mounted on a specialized board (140 mm × 70 mm × 1.6 mm: 38°C/W: typ.)
1.71
85
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TB62208FG
Application Circuit
The values shown in the following figure are typical values. For input conditions, see the “Operating Conditions” tables.
VM
100μF
3.6kΩ
+
0.62Ω
0.1μF
Vref
0.1μF
270pF
28 27 26 25 24 23 22
FIN
21 20 19 18 17 16 15
M
Note:
6
7
FIN
8
9
10 11 12 13 14
Standby
5
Enable_B
4
Enable_A
3
Phase_B
2
Phase_A
1
0.62Ω
Bypass capacitors should be added as necessary.
It is recommended to use a single ground plane for the entire board whenever possible, and an efficient grounding
method should be considered for heat dissipation.
In cases where mode setting pins are controlled via switches, either pull-down or pull-up resistors should be
added to them to avoid floating states.
For a description of the input values, see the “Output Function Table.”
The above application circuit example is presented only as a guide and should be fully evaluated prior to
production. Also, no intellectual property right is ceded in any way whatsoever in regard to its use.
The external components in the above diagram are used to test the electrical characteristics of the device; it is not
guaranteed that no system malfunction or failure will not occur.
Careful attention should be paid to the layout of the output, VDD (VM) and GND traces to avoid short-circuits
across output pins or to the power supply or ground. If such a short-circuit occurs, the TB62208FG may be
permanently damaged. Also, if the device is installed in a wrong orientation, a high voltage might be applied to
components with lower voltage ratings, causing them to be damaged. The TB62208FG does not have an
overvoltage protection circuit. Thus, if a voltage exceeding the rated maximum voltage is applied, the
TB62208FG will be damaged; it should be ensured that it is used within the specified operating conditions.
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Package Outline Dimensions
HSOP28-P-0450-0.80
Unit: mm
Weight: 0.79 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush current
at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
(1)
Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under
all circumstances. If the Over current protection circuits operate against the over current, clear the over
current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the over current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over current continues to flow for a long
time after operation, the IC may generate heat resulting in breakdown.
(2)
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(4)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum
ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this
document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to
property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the
Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,
including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and
conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product
will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited
to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any
other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains,
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A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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