TB62213AHQ
BiCD Integrated Circuit Silicon Monolithic
TB62213AHQ
PHASE-in controlled Bipolar Stepping Motor Driver IC
The TB62213AHQ is a two-phase bipolar stepping motor driver using
a PWM chopper. Fabricated with the BiCD process, the TB62213AHQ
is rated at 40 V/3.0 A . The on-chip voltage regulator allows control of
a stepping motor with a single VM power supply.
HZIP25-P-1.00F
Weight:7.6g(Typ.)
Features
•
Capable of controlling 1 bipolar stepping motor.
•
BiCD process integrated monolithic IC.
•
PWM controlled constant-current drive.
•
Allows Full Step, Half Step and 1/4 Step excitations.
•
Output stage low on resistance by a BiCD process
•
High voltage and current (For specification, please refer to absolute maximum ratings and operating ranges)
•
Built-in error detection circuits
•
Built-in VCC regulator for internal circuit use. Therefore it's possible to operate only by a VM power supply.
•
Chopping frequency of a motor can be customized by external resistance and capacitor.
(Thermal shutdown (TSD),over-current shutdown (ISD), and power-on reset (POR))
High-speed Chopping by more than 100 kHz is possible.
•
Packages: HZIP25-P-1.00F
Note) Please be careful about thermal conditions during use.
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TB62213AHQ
VCC
VREF
22
24
5
7
9
©2015 TOSHIBA CORPORATION
11
2
13
15
17
19
21
23
GND
3
GND
1
25
OSCM
NC
20
NC
NC
18
VM
OUT_B+
16
RS_B
OUT_B14
GND
OUT_A12
GND
OUT_A+
10
RS_A
GND
8
STANDBY
IN_B2
6
IN_B1
PHASE_B
4
PHASE_A
2
IN_A1
IN_A2
Pin
Pin Assignment
Assignment(Top View)
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TB62213AHQ
Block Diagram
IN_A1
VMR Detect
IN_A2
PHASE_A
Step Decoder
IN_B1
(Input Logic)
VCC Voltage
Regulator
IN_B2
VCC
Chopper OSC
PHASE_B
STANDBY
OSCM
OSC
Current Level Set
VREF
Torque Control
2bit D/A
(Angle Control)
CR-CLK
Converter
Current Feedback (×2)
VM
RS
VRS1
RS COMP1
VRS2
RS COMP2
Output Control
(Mixed Decay Control)
ISD
STANDBY
Output
(H-Bridge×2)
VM
TSD
VMR
Detect
Detection Circuit
Stepping Motor
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
Note
All the grounding wires of this product must run on the solder within the mask of the PCM. It must also be
externally terminated at a single point. Also, the grounding method should be considered for efficient heat
dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the IC may be permanently
damaged.Also, the utmost care should be taken for pattern designing and implementation of the IC since it has
power supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are
wired incorrectly, an operation error may occur or this IC may be destroyed.
The logic input pins must be correctly wired, too. Otherwise, the IC may be damaged owing to a current running
through the IC that is larger than the specified current.
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TB62213AHQ
Pin Function
Pin No.
Pin name
Function
1
IN_A1
Motor Ach excitation control input
2
IN_A2
Motor Ach excitation control input
3
PHASE_A
Current direction signal input for motor Ach
4
PHASE_B
Current direction signal input for motor Bch
5
IN_B1
Motor Bch excitation control input
6
IN_B2
Motor Bch excitation control input
7
STANDBY
8
GND
Ground pin
9
RS_A
Motor Ach current sense pin
10
OUT_A+
11
GND
12
OUT_A-
13
GND
14
OUT_B-
15
GND
16
OUT_B+
17
RS_B
18
NC
Non-connection pin
19
VM
Motor power supply pin
20
NC
Non-connection pin
21
NC
Non-connection pin
22
VCC
Internal VCC regulator monitor pin
23
GND
Ground pin
24
VREF
Motor output set pin
25
OSCM
Oscillating circuit frequency for chopping set pin
All-function-initializing and Low power dissipation mode
Motor Ach (+) output pin
Ground pin
Motor Ach (-) output pin
Ground pin
Motor Bch (-) output pin
Ground pin
Motor Bch (+) output pin
Motor Bch current sense pin
･Please use the pin of NC with Open.
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TB62213AHQ
Operation explanation
IOUT: The current that flows OUT_A+(OUT_B+) to OUT_A-(OUT_B-) is defined plus current. The current that flows
OUT_A-(OUT_B-) to OUT_A+(OUT_B+) is defined minus current.
PHASE
A
PHASE B
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
IOUT(A)
PHASE_B
IN_B1
IN_B2
IOUT(B)
H
H
H
100%
H
H
H
100%
L
H
H
-100%
H
H
H
100%
L
H
H
-100%
L
H
H
-100%
H
H
H
100%
L
H
H
-100%
Please make IN_A1, IN_A2, IN_B1, and IN_B2 Low when you turn on the power supply.
PHASE
A
PHASE B
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
IOUT(A)
PHASE_B
IN_B1
IN_B2
IOUT(B)
H
H
H
100%
H
H
H
100%
X
L
L
0%
H
H
H
100%
L
H
H
-100%
H
H
H
100%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
H
H
H
100%
L
H
H
-100%
H
H
H
100%
X
L
L
0%
X: Don't care
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TB62213AHQ
PHASE
A
PHASE B
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
IOUT(A)
PHASE_B
IN_B1
IN_B2
IOUT(B)
H
H
L
71%
H
H
L
71%
H
L
H
38%
H
H
H
100%
X
L
L
0%
H
H
H
100%
L
L
H
-38%
H
H
H
100%
L
H
L
-71%
H
H
L
71%
L
H
H
-100%
H
L
H
38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
L
L
H
-38%
L
H
L
-71%
L
H
L
-71%
L
L
H
-38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
H
L
H
38%
L
H
H
-100%
H
H
L
71%
L
H
L
-71%
H
H
H
100%
L
L
H
-38%
H
H
H
100%
X
L
L
0%
H
H
H
100%
H
L
H
38%
X: Don't care
Other Functions
Pin Name
H
L
IN_A1
IN_A2
IN_B1
IN_B2
Outputs enabled
Outputs disabled
PHASE_A
PHASE_B
OUT_A+(OUT_B+): H
OUT_A-(OUT_B-): H
STANDBY
Normal operation mode
Standby mode
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Notes
When IN_A1(IN_B1), IN_A2(IN_B2) are deasserted Low, its
outputs assume the high-impedance state, regardless of the
state of that phase.
When PHASE_X is High, a current normally flows from
OUT_A+(OUT_B+) to OUT_A -(OUT_B-).
When STANDBY is Low, both the oscillator and output drivers
are disabled. Cannot drive a motor.
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TB62213AHQ
Protection Features
(1)
Thermal shutdown (TSD)
The thermal shutdown circuit turns off all the outputs when the junction temperature (Tj) exceeds 150°C
(typ.). The outputs retain the current states.
The TB62213AHQ exits TSD mode and resumes normal operation when the TB62213AHQ is rebooted or
both the STANDBY pin are switched to ‘H’ → ‘L’ → ‘H’.
(2) POR for VMR and VCCR (Power-ON-resets: VM and VCC voltage monitor)
The outputs are forced off until VM and VCC reach the rated voltages.
(3)
Overcurrent shutdown (ISD)
Each phase has an overcurrent shutdown circuit, which turns off the corresponding outputs when the
output current exceeds the shutdown trip threshold (above the maximum current rating: 3.0 A minimum).
The TB62213AHQ exits ISD mode and resumes normal operation when the TB62213AHQ is rebooted or
both the STANDBY pin are switched to ‘H’ → ‘L’ → ‘H’.
This circuit provides protection against a short circuit by temporarily disabling the device. Important notes
on this feature will be provided later.
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TB62213AHQ
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Motor power supply
VM
40
V
Motor output voltage
VOUT
40
V
Motor output current(Note1)
IOUT
3.0
A
Logic input voltage
VIN
6.0
V
VREF reference voltage
VREF
5.0
V
Power dissipation (Note 2)
PD
3.5
W
Operating temperature
Topr
−20 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Junction temperature
Tj
150
°C
Note 1: The absolute maximum rating is 3.0A.
Note 2:
Stand-alone (Ta = 25°C)
o
o
When Ta exceeds 25 C, it is necessary to do the derating with 28 mW/ C.
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry.
.
About Absolute Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB62213AHQ does not have overvoltage protection. Therefore, the device is damaged if
a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
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TB62213AHQ
Operating Ranges (Note1)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Motor power supply
VM
-
10.0
24.0
38.0
V
Motor output current
IOUT
Ta = 25°C, Per phase
-
1.8
2.4
A
VIN(H)
Logic high level
2.0
3.3
5.5
V
VIN(L)
Logic low level
GND
-
0.8
V
Logic input voltage
PHASE signal input
frequency(Note2)
fPHASE
-
1.0
-
400
kHz
Chopper frequency
fchop
-
40
100
150
kHz
VREFreference voltage
VREF
-
GND
-
3.6
V
Note 1: Please have and use the margin for the absolute maximum rating.
Note 2: There is no problem in the condition of 500ns or less at the risetime of the CLK signal even if a frequency less
than it is input though the lower bound of the frequency of the input of the signal of the CLK input is assumed
to be 1kHz.
Please note that repeated input of the signal by chattering can be generated when standing up of the signal
becomes duller.
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TB62213AHQ
Electrical Characteristics 1 (Ta = 25°C, VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Logic input voltage
Input hysteresis voltage
Logic input
current
VIL
VIN(HIS)
Min
Typ.
Max
2.0
3.3
5.5
GND
-
0.8
Logic input pins (Note1)
100
200
300
Logic input pins
High
IIN(H)
Logic input pins, VIN = 5 V
35
50
75
Low
IIN(L)
Logic input pins, VIN = 0 V
-
-
1
IM1
Outputs: open, non-operation
STANDBY = Low
-
2.0
3.0
IM2
Outputs: open, non-operation
STANDBY = High
fPHASE=1kHz
-
3.5
5.0
IM3
Outputs: open, two-phase excitation
STANDBY = High
fPHASE=4kHz, fchop=100kHz
-
5.0
7.0
IOH
VRS = VM = 40V, VOUT = 0V
IN_A1=IN_A2=IN_B1=IN_B2=Low
-
-
1
IOL
VRS = VM = VOUT = 40V
IN_A1=IN_A2=IN_B1=IN_B2=Low
1
-
-
Power consumption
Output leakage
current
VIH
Test Condition
High-side
Low-side
Unit
V
mV
µA
mA
µA
Chanel-to-channel
current differential
∆IOUT1
IOUT = 2.0A
−5
0
+5
%
Output current error
relative to the
predetermined value
∆IOUT2
IOUT = 2.0A
−5
0
+5
%
RS pin current
IRS
VRS = VM = 24V
STANDBY = Low
IN_A1=IN_A2=IN_B1=IN_B2=Low
0
-
10
µA
-
0.6
0.8
Ω
Step0
-
0
-
%
Step1
33
38
43
%
Step2
66
71
76
%
Step3
-
100
-
%
Drain-source
ON-resistance of the
output transistors (upper
and lower sum)
Chopping current
RON (D-S) IOUT = 2.0 A, Tj = 25°C
Phase
Note: VIN (L → H) is defined as the VIN voltage that causes the outputs to change when a pin under test is gradually
raised from 0 V. V IN (H → L) is defined as the V IN voltage that causes the outputs to change when the pin is then
gradually lowered.
The difference between V IN (L → H) and V IN (H → L) is defined as the input hysteresis.
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TB62213AHQ
Electrical Characteristics 2 (Ta = 25°C, VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Supply voltage for internal circuitry
VCC
4.75
5.00
5.25
V
Supply current for internal circuitry
ICC
-
2.5
5.0
mA
VREF input voltage range
VREF
STANDBY = H,
fPHASE = 1 kHz
GND
-
3.6
V
VREF input current
IREF
Output: non-operation
Vref = 3.0 V
-
0
1.0
µA
VREF decay rate
VREF(GAIN)
1/4.8
1/5.0
1/5.2
-
TSD threshold (Note 1)
TjTSD
-
140
150
170
°C
VM recovery voltage
VMR
STANDBY = H
7.0
8.0
9.0
V
Overcurrent trip threshold (Note 2)
ISD
-
3.0
4.0
5.0
A
ICC = 5.0 mA
-
Vref = 2.0 V
Note 1: Thermal shutdown (TSD) circuitry
When the junction temperature of the device reaches the threshold, the TSD circuitry is tripped, causing the
internal reset circuitry to turn off the output transistors.
The TSD circuitry is tripped at a temperature between 140°C (min) and 170°C (max). Once tripped, the TSD
circuitry keeps the output transistors off until both the STANDBY pin are switched to Low or the TB62213AHQ
is rebooted. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to
be used aggressively.
Note 2: Overcurrent shutdown (ISD) circuitry
When the output current reaches the threshold, the ISD circuitry is tripped, causing the internal reset circuitry
to turn off the output transistors (OSCM is stopped.).
To prevent the ISD circuitry from being tripped owing to switching noise, it has a masking time of four OSCM
cycles. Once tripped, it takes a maximum of four OSCM cycles to exit ISD mode and resume normal
operation.
The ISD circuitry remains active until both the STANDBY pin are switched to Low or the TB62213AHQ is
rebooted.
The TB62213AHQ remains in Standby mode while in ISD mode.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply owing to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB62213AHQ or other components will be
damaged or fail owing to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
•
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as
an output short circuit; they do not necessarily guarantee complete IC safety.
•
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the
device may be damaged owing to an output short circuit.
•
The ISD circuit is only intended to provide temporary protection against an output short circuit. If such a
condition persists for a long time, the device may be damaged owing to overstress. Overcurrent conditions must
be removed immediately by external hardware.
IC Mounting
Do not insert devices in the wrong orientation or incorrectly. Otherwise, it may cause device breakdown, damage
and/or deterioration.
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TB62213AHQ
AC Electrical Characteristics (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω )
Symbol
Characteristics
Min
Typ.
Max
Unit
1.0
-
400
kHz
100
-
-
50
-
-
50
-
-
150
200
250
100
150
200
tpLH (P) MAX
500
850
1200
tpHL (P) MAX
500
850
1200
250
600
950
250
600
950
Phase frequency
fPHASE
Test Condition
fOSCM = 1600 kHz
tPHASE
Minimum phase pulse width
twp
fOSCM = 1600 kHz
twn
tr
-
tf
Output transistor switching
characteristics
ns
tpLH (P) MIN
ns
PHASE to OUT
tpHL (P) MIN
Blanking time for current spike
prevention
tBLANK
IOUT = 1.0 A
300
400
500
ns
OSC oscillation reference
frequency
fOSCM
C = 270 pF, R1 = 3.6 kΩ
1200
1600
2000
kHz
40
100
150
kHz
-
100
-
kHz
-
4
-
Outputs enabled active
fchop (RANGE) I
OUT = 1.0 A
Chopper frequency range
fchop
Predefined chopper frequency
ISD masking time
tISD (Mask)
ISD on-time
tISD
Outputs enabled active
IOUT = 1.0 A
fOSCM = 1600 kHz
This time will be the number of CLK OSCM.
After ISD threshold is exceeded owing to an
output short circuit to power or ground
-
-
8
Note: There is no problem in the condition of 500ns or less at the risetime of the CLK signal even if a frequency less
than it is input though the lower bound of the frequency of the input of the signal of the CLK input is assumed
to be 1kHz. Please note that repeated input of the signal by chattering can be generated when standing up of
the signal becomes duller.
twp
twn
90%
PHASE
90%
tPHASE
50%
50%
10%
10%
tpLH
tpHL
VM
90%
Output voltage
90%
50%
50%
10%
10%
GND
tr
tf
Figure 1: Timing Charts of Output Transistors Switching
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TB62213AHQ
Output transistor function mode
VM
VM
RRS
VM
RRS
RSpin
RRS
RSpin
U1
RSpin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
Load
L2
ON
GND
L1
L2
ON
OFF
GND
Charge mode
A current flows into the motor coil.
GND
Slow mode
A current circulates around the
motor coil and this device.
Fast mode
The energy of the motor coil
is fed back to the power
Output transistor function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
SLOW
OFF
ON
ON
OFF
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB62213AHQ
Calculation of the Predefined Output Current
For PWM constant-current control, the TB62213AHQ uses a clock generated by the OSCM oscillator circuit. The
peak output current can be set via the current-sensing resistor (RRS) and the reference voltage (VREF), as follows:
IOUT = VREF/5/RRS(Ω)
where, 1/5 is the VREF decay rate, VREF(GAIN). For the value of VREF(GAIN), see the Electrical Characteristics table.
For example, when VREF = 3 V and IOUT = 1.8 A. Necessary RRS is 0.33 Ω(≥ 1.1 W).
Calculation of the OSCM oscillation frequency (chopper reference frequency)
OSCM oscillation frequency (fOSCM) and chopper frequency (fchop) are computable in the following expressions.
fOSCM=1/[0.56×{C×(R1+500)}]
………C,R1: External constant for OSCM (C=270pF , R1=3.6k Ω )
fchop = fOSCM / 16
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TB62213AHQ
Phase Sequences
Full step resolution
100
Bch current [%]
D
A
-100
100
0
C
B
-100
Ach current[%]
A
B
C
D
A
B
C
D
A
B
C
D
A
B
100%
IOUT(A)
0%
-100%
100%
IOUT(B)
0%
-100%
PHASE_A
H
L
IN_A1
H
L
IN_A2
H
L
PHASE_B
IN_B1
H
L
H
L
IN_B2
H
L
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62213AHQ
Half Step Excitation
Bch current [%]
C
100
A
B
D
H
-100
0
100
G
E
F
-100
Ach current[%]
G
H
A
B
C
D
E
F
G
H
A
B
C
D
E
100%
IOUT(A)
0%
-100%
100%
IOUT(B)
0%
-100%
PHASE_A
IN_A1
H
L
H
L
IN_A2
H
L
H
PHASE_B
IN_B1
L
H
L
IN_B2
H
L
Timing charts may be simplified for explanatory purpose.
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TB62213AHQ
1/4 Step Excitation
Step3 Step2 Step1 Step0 Step1 Step2 Step3
D
C
B
100
E
Step3
A
Step2
71
Bch current [%]
F
Step1
38
P
0
G
-100
-71
Step0
-38
38
71
100
O
-38
H
Step1
N
-71
I
Step2
M
-100
J
Step3
K
L
Ach current[%]
N O P A BCD E F G H I J K L MN O P A BCD E F G H I J K L MN O P A
IOUT_A
100%
71%
38%
0%
-38%
-71%
-100%
IOUT_B
100%
71%
38%
0%
-38%
-71%
-100%
H
PHASE_A
L
IN_A1
H
L
IN_A2
H
L
H
PHASE_B
L
IN_B1
H
L
IN_B2
H
L
Timing charts may be simplified for explanatory purpose.
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Application Circuit Example
TB62213AHQ
The values shown in the following figure are typical values. For input conditions, see Operating Ranges.
2
6
4
1
3
8
5
7
10
9
12
11
14
13
16
15
18
17
20
19
22
21
24
23
25
3.6KΩ
270pF
0.22Ω
5V
5V
5V
5V
5V
5V
5V
0.22Ω
0
0
0
0
0
0
0.1μF
0
0.1μF
100μF
VREF
0.1μF
M
VM
Note: Bypass capacitors should be added as necessary.
It is recommended to use a single ground plane for the entire board whenever possible, and a grounding
method should be considered for efficient heat dissipation.
In cases where mode setting pins are controlled via switches, either pull-down or pull-up resistors should be
added to them to avoid floating states.
For a description of the input values, see the output function tables.
The above application circuit example is presented only as a guide and should be fully evaluated prior to
production. Also, no intellectual property right is ceded in any way whatsoever in regard to its use.
The external components in the above diagram are used to test the electrical characteristics of the device: it is
not guaranteed that no system malfunction or failure will occur.
Careful attention should be paid to the layout of the output, VDD (VM) and GND traces to avoid short-circuits across output pins or to the
power supply or ground. If such a short-circuit occurs, the TB62213AHQ may be permanently damaged. Also, if the device is installed
in a wrong orientation, a high voltage might be applied to components with lower voltage ratings, causing them to be damaged. The
TB62213AHQ does not have an overvoltage protection circuit. Thus, if a voltage exceeding the rated maximum voltage is applied, the
TB62213AHQ will be damaged; it should be ensured that it is used within the specified operating conditions.
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TB62213AHQ
Package Dimensions
Unit: mm
HZIP25-P-1.00F
Weight:7.6g(typ.)
Note) The tightening torque for the mounting bracket should be controlled between 0.4N•m to 0.6N•m.
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required at the mass production design stage. Toshiba does not grant any license to any industrial property rights by
providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
over-current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the
effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury,
smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of
power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute
maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result
in injury by explosion or combustion. In addition, do not use any device that has been inserted incorrectly.
Please take extra care when selecting external components (such as power amps and regulators) or external devices
(for instance, speakers). When large amounts of leak current occurs from capacitors, the DC output level may
increase. If the output is connected to devices such as speakers with low resist voltage, overcurrent or IC failure may
cause smoke or ignition. (The over-current may cause smoke or ignition from the IC itself.) In particular, please pay
attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker
directly.
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Points to remember on handling of ICs
Over current detection circuit
Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current detection circuits operate against the over current, clear the over current status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on
the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may
generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
thermal shutdown circuit to not operate properly or IC breakdown before operation.
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat
is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs
generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the
effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power
supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take
the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the
information in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software
and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human
life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs
including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a)
the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the
data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor
Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF
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Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical
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Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR
DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND
REGULATIONS.
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