TB62215AFG/FTG/FNG/HQ
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB62215AFG, TB62215AFTG
TB62215AFNG, TB62215AHQ
CLOCK-in controlled Bipolar Stepping Motor Driver
The TB62215A is a two-phase bipolar stepping motor driver
using a PWM chopper. The clock in decoder is built in.
Fabricated with the BiCD process, rating is 40 V/3.0 A .
FG
Features
・BiCD process integrated monolithic IC.
・Capable of controlling 1 bipolar stepping motor.
・PWM controlled constant-current drive.Allows full, half, quarter
step operation.
・Low on-resistance (High + Low side=0.6Ω(typ.)) MOSFET
output stage.
・High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
・Built-in error detection circuits (Thermal shutdown (TSD), over-current
shutdown (ISD), and power-on reset (POR))
・Built-in VCC regulator for internal circuit use.
・Chopping frequency of a motor can be customized by external resistance
and capacitor.
・Multi package lineup
TB62215AFG: HSOP28-P-0450-0.80
TB62215AFTG: QFN48-P-0707-0.50
TB62215AFNG: HTSSOP48-P-300-0.50
TB62215AHQ: HZIP25-P-1.00F
HSOP28-P-0450-0.80
Weight 0.79g (Typ.)
FTG
QFN48-P-0707-0.50
Weight 0.14g(Typ.)
FNG
Note) Please be careful about thermal conditions during use.
HTSSOP48-P-300-0.50
Weight 0.20g (Typ.)
HQ
HZIP25-P-1.00F
Weight 7.6g (Typ.)
©2015 TOSHIBA CORPORATION
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TB62215AFG/FTG/FNG/HQ
Pin assignment (TB62215A)
(Top View)
CW/CCW
MO
DMODE1
DMODE2
CLK
ENABLE
1
2
3
4
5
6
RESET
7
OSCM
VREFA
VREFB
NC
NC
VCC
28
27
26
25
24
23
22
FIN(GND)
VM
FIN(GND)
FG
RSA
NC
OUTA+
NC
GND
OUTAGND
8
9
21
20
19
18
17
16
15
10
11
12
13
14
RSB
NC
OUTB+
NC
GND
OUTBGND
Please mount the FIN of the HSOP package to the GND area of the PCB.
NC
OUTB+
OUTB+
NC
RSB
RSB
NC
VM
NC
VCC
NC
NC
(Top View)
36 35 34 33 32 31 30 29 28 27 26 25
NC
37
24 NC
NC
38
23 NC
NC
39
22 GND
GND
40
21 OUTB-
VREFB
41
20 OUTB-
VREFA
42
OSCM
43
18 GND
CW/CCW
44
17 OUTA-
MO
45
16 OUTA-
DMODE1
46
15 GND
DMODE2
47
14 NC
NC
48
13 NC
FTG
4
5
6
7
8
9 10 11 12
CLK
ENABLE
RESET
GND
NC
RSA
RSA
NC
NC
3
OUTA+
2
OUTA+
1
NC
19 GND
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
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TB62215AFG/FTG/FNG/HQ
(Top View)
OSCM
NC
CW/CCW
MO
DMODE1
NC
DMODE2
CLK
ENABLE
RESET
GND
NC
RSA
RSA
NC
OUTA+
OUTA+
NC
NC
GND
NC
OUTAOUTAGND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
FNG
24
VREFA
VREFB
GND
NC
NC
NC
NC
VCC
NC
VM
NC
NC
RSB
RSB
NC
OUTB+
OUTB+
NC
NC
GND
NC
OUTBOUTBGND
MO
DMODE2
ENABLE
GND
OUTA+
OUTA-
OUTB-
OUTB+
NC
NC
VCC
VREF
Please mount the exposed pad of the HTSSOP package to the GND area of the PCB.
2
4
6
8
10
12
14
16
18
20
22
24
RSA
17
19
21
3
23
25
OSCM
RESET
15
GND
CLK
13
NC
DMODE1
11
VM
9
RSB
7
GND
5
GND
3
GND
1
CW/CCW
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TB62215AFG/FTG/FNG/HQ
TB62215A Block diagram
Standby
Control
+
Step
Resolution
Selector
DMODE1
DMODE2
OSC-Clock
Converter
Motor
Oscillator
System
Oscillator
VCC
Regulator
OSCM
VCC
VM
Power-on
Reset
Signal
Decode
Logic
CW/CCW
CLK
Current
Level
Set
RESET
ENABLE
Current
Reference
Setting
VREFA
VREFB
MO
Angle monitor
Motor Control Logic
Current
Comp
Predriver
TSD
Current
Comp
Predriver
RSA
RSB
ISD
GND
OUTA+
OUTA-
OUTB+
OUTB-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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Notes
All the grounding wires of the TB62215A must run on the solder mask on the PCB and be externally terminated at
only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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Pin explanations
TB62215AFG (HSOP28)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
CW/CCW
2
MO
Electric angle monitor pin
3
DMODE1
Step resolution set pin no.1
4
DMODE2
5
CLK
6
ENABLE
7
RESET
8
RSA
9
NC
10
OUTA+
11
NC
Motor rotation direction set pin
Step resolution set pin no.2
CLK signal input pin
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Motor Ach current sense pin
Non-connection pin
Motor Ach (+) output pin
Non-connection pin
Ground pin
12
GND
13
OUTA-
14
GND
Ground pin
15
GND
Ground pin
16
OUTB-
17
GND
18
NC
19
OUTB+
Motor Ach (-) output pin
Motor Bch (-) output pin
Ground pin
Non-connection pin
Motor Bch (+) output pin
Non-connection pin
20
NC
21
RSB
Motor Bch current sense pin
22
VM
Motor power supply pin
23
VCC
24
NC
Non-connection pin
25
NC
Non-connection pin
26
VREFB
Motor Bch output set pin
27
VREFA
Motor Ach output set pin
28
OSCM
Oscillating circuit frequency for chopping set pin
Internal VCC regulator monitor pin
Please do not run patterns under NC pins.
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Pin explanations
TB62215AFTG (QFN48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
NC
Non-connection pin
2
CLK
CLK signal input pin
3
ENABLE
4
RESET
5
GND
6
NC
7
RSA(*)
Motor Ach current sense pin
8
RSA(*)
Motor Ach current sense pin
9
NC
10
OUTA+(*)
Motor Ach (+) output pin
11
OUTA+(*)
Motor Ach (+) output pin
12
NC
Non-connection pin
13
NC
Non-connection pin
14
NC
Non-connection pin
15
GND
16
OUTA-(*)
Motor Ach (-) output pin
17
OUTA-(*)
Motor Ach (-) output pin
18
GND
Ground pin
19
GND
Ground pin
20
OUTB-(*)
Motor Bch (-) output pin
21
OUTB-(*)
Motor Bch (-) output pin
22
GND
23
NC
Non-connection pin
24
NC
Non-connection pin
25
NC
Non-connection pin
26
OUTB+(*)
Motor Bch (+) output pin
27
OUTB+(*)
Motor Bch (+) output pin
28
NC
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Ground pin
Non-connection pin
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Pin No.29 – 48
Pin No.
Pin Name
Function
29
RSB(*)
Motor Bch current sense pin
30
RSB(*)
Motor Bch current sense pin
31
NC
Non-connection pin
32
VM
Motor power supply pin
33
NC
Non-connection pin
34
VCC
35
NC
Non-connection pin
36
NC
Non-connection pin
37
NC
Non-connection pin
38
NC
Non-connection pin
39
NC
Non-connection pin
Internal VCC regulator monitor pin
Ground pin
40
GND
41
VREFB
Motor Bch output set pin
42
VREFA
Motor Ach output set pin
43
OSCM
Oscillating circuit frequency for chopping set pin
44
CW/CCW
45
MO
Electric angle monitor pin
46
DMODE1
Step resolution set pin no.1
47
DMODE2
Step resolution set pin no.2
48
NC
Motor rotation direction set pin
Non-connection pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB62215A.
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Pin explanations
TB62215AFNG (HTSSOP48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
OSCM
2
NC
3
CW/CCW
4
MO
Electric angle monitor pin
5
DMODE1
Step resolution set pin no.1
6
NC
7
DMODE2
Oscillating circuit frequency for chopping set pin
Non-connection pin
Motor rotation direction set pin
Non-connection pin
Step resolution set pin no.2
8
CLK
9
ENABLE
CLK signal input pin
10
RESET
11
GND
12
NC
13
RSA(*)
Motor Ach current sense pin
14
RSA(*)
Motor Ach current sense pin
15
NC
16
OUTA+(*)
Motor Ach (+) output pin
17
OUTA+(*)
Motor Ach (+) output pin
18
NC
Non-connection pin
19
NC
Non-connection pin
20
GND
21
NC
22
OUTA-(*)
Motor Ach (-) output pin
23
OUTA-(*)
Motor Ach (-) output pin
24
GND
Ground pin
25
GND
Ground pin
26
OUTB-(*)
Motor Bch (-) output pin
27
OUTB-(*)
Motor Bch (-) output pin
28
NC
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Non-connection pin
Non-connection pin
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Pin No.29 – 48
Pin No.
Pin Name
Function
29
GND
30
NC
Non-connection pin
31
NC
Non-connection pin
32
OUTB+(*)
Motor Bch (+) output pin
33
OUTB+(*)
Motor Bch (+) output pin
34
NC
35
RSB(*)
Motor Bch current sense pin
36
RSB(*)
Motor Bch current sense pin
37
NC
Non-connection pin
38
NC
Non-connection pin
39
VM
Motor power supply pin
40
NC
Non-connection pin
41
VCC
42
NC
Non-connection pin
43
NC
Non-connection pin
44
NC
Non-connection pin
45
NC
Non-connection pin
Ground pin
Non-connection pin
Internal VCC regulator monitor pin
Ground pin
46
GND
47
VREFB
Motor Bch output set pin
48
VREFA
Motor Ach output set pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB62215A.
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Pin explanations
TB62215AHQ (HZIP25)
Pin No.
Pin Name
1
CW/CCW
2
MO
Electric angle monitor pin
3
DMODE1
Step resolution set pin no.1
4
DMODE2
Step resolution set pin no.2
5
CLK
6
ENABLE
7
RESET
8
GND
Ground pin
9
RSA
Motor Ach current sense pin
10
OUTA+
11
GND
12
OUTA-
13
GND
14
OUTB-
15
GND
16
OUTB+
17
RSB
18
NC
Non-connection pin
19
VM
Motor power supply pin
20
NC
Non-connection pin
21
NC
Non-connection pin
22
VCC
Internal VCC regulator monitor pin
23
GND
Ground pin
24
VREF
Motor output set pin
25
OSCM
Oscillating circuit frequency for chopping set pin
機能
Motor rotation direction set pin
CLK signal input pin
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Motor Ach (+) output pin
Ground pin
Motor Ach (-) output pin
Ground pin
Motor Bch (-) output pin
Ground pin
Motor Bch (+) output pin
Motor Bch current sense pin
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TB62215AFG/FTG/FNG/HQ
INPUT/OUTPUT equivalent circuit (TB62215A)
DMODE1
DMODE2
CLK
ENABLE
RESET
CW/CCW
IN/OUT signal
Equivalent circuit
Digital Input (VIH/VIL)
VIH: 2.0V(min) to 5.5V(max)
VIL : 0V(min) to 0.8V(max)
GND
Logic
Output
Pin
Digital Output (VOH/VOL)
MO
150Ω
Logic
Input
Pin
100kΩ
Pin name
VOH: 2.0V(min) to 5.5V(max)
VOL: 0V(min) to 0.8V(max)
(Pull-up resistor :10k to 100kΩ)
GND
VCC
VCC
VREFA
VREFB
VCC voltage range
4.75V(min) to 5.0V(typ.) to 5.25V(max)
1kΩ
VREF
VREF voltage range
0V to 3.6V
GND
1kΩ
OSCM frequency setting range
0.64MHz(min)
to
1.6MHz(typ.)
2.4MHz(max)
500Ω
OSCM
OSCM
to
GND
RS
OUTA+
OUTAOUTB+
OUTBRSA
RSB
VM power supply voltage range
10V(min) to 38V(max)
OUT+
OUTPUT pin voltage
10V(min) to 38V(max)
OUT-
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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Function explanation (Stepping motor)
1.CLK Function
Each up-edge of the CLK signal will shift the motor’s electrical angle per step.
CLK input
Function
↑
Shifts the electrical angle per step.
↓
(State of the electrical angle does not change.)
2. ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. This pin serves to select if the motor is
stopped in Off (High impedance) mode or activated. Please set the ENABLE pin to ‘L’ during VM power-on and
power-off sequence.
ENABLE input
Function
H
Output stage=‘ON’ (Normal operation mode)
L
Output stage=’OFF’ (High impedance mode)
3. CW/CCW function and the output pin function (Output logic at the time of a charge start)
The CW/CCW pin controls the rotation direction of the motor. When set to ‘Clockwise’, the current of OUTA is output
first, with a phase difference of 90 deg. When set to ‘Counter clockwise”, the current of OUTB is output first with a
phase difference of 90 deg.
CW/CCW input
OUT (+)
OUT (-)
H : Clockwise
operation(CW)
H
L
L : Counter clockwise
operation(CCW)
L
H
4. Step resolution select function
DMODE1
DMODE2
Function
L
L
Standby mode
(the OSCM is disabled and the output stage is set to ‘OFF’ status)
L
H
Full step resolution
H
L
Half step resolution
H
H
Quarter step resolution
When switching the DMODE1,2; setting the RESET signal to Low (will set the electrical angle to the
initial status:MO=Low), is recommended.
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Step resolution setting and initial angle
[Full step resolution]
CLK
MO
H
L
H
L
+100%
IOUT(A) 0%
-100%
+100%
IOUT(B) 0%
-100%
CCW
CW
[Half step resolution ]
CLK
MO
H
L
H
L
+100%
IOUT(A) 0%
-100%
+100%
IOUT(B) 0%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
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[Quarter step resolution]
H
CLK
L
H
MO
L
+100%
+71%
+38%
IOUT(A) 0%
-38%
-71%
-100%
+100%
+71%
+38%
IOUT(B) 0%
-38%
-71%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
Step setting and current percentage
Current
±100%
±71%
±38%
0%
Full
Half
○
○○○
Quarter
○○○
○
○
○
○
5. RESET function
RESET Input
Function
H
Sets the electrical angle to the initial condition.
L
Normal operation mode
The current for each channel (while RESET is applied) is shown in the table below. MO will show ‘L’ at this time.
Step resolution setting
Ach current setting
Bch current setting
Default electrical angle
Full step
100%
100%
45°
Half step
100%
100%
45°
Quarter step
71%
71%
45°
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6. Decay function
Mixed Decay Mode
fchop
CR pin
Internal CLK
waveform
DECAY MODE 1
Setting current
NF
37.5%
MIXED
DECAY
MODE
MDT
CHARGE MODE → NF: Reach setting current → SLOW MODE
→ MIXED DECAY TIMMING → FAST MODE → Monitoring current
→ (In case setting current > Outputting current) CHARGE MODE
Charge
RNF
Fast
Slow
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7．Output transistor function mode
VM
VM
RRS
VM
RRS
RRS
RSpin
RSpin
U1
RSpin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
Load
L2
ON
PGND
L1
L2
ON
OFF
PGND
Charge mode
A current flows into the motor coil.
PGND
Fast mode
The energy of the motor coil
is fed back to the power
Slow mode
A current circulates around the
motor coil and this device.
Output transistor function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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8．Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Peak current) can be set via the current-sensing resistor (RS) and the reference voltage
(Vref), as follows:
Vref(V)
IOUT(max) = Vref(gain) ×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example : In the case of a 100% setup
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Peak current) will be
calculated as:
IOUT = 3.0V / 5.0 / 0.51Ω= 1.18 A
9. Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM = 1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C = 270 pF, R1 = 3.6 kΩ => fOSCM = 1.6 MHz (Typ.))
fchop = fOSCM / 16
………fOSCM = 1.6 MHz => fchop = About 100 kHz
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become large.
It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
Motor power supply
Motor output voltage
Motor output current
Internal Logic power supply
VM
Vout
IOUT
VCC
VIN(H)
VIN(L)
VMO
IMO
PD
PD
PD
PD
TOPR
TSTR
Tj(max)
40
40
3.0
6.0
6.0
-0.4
6.0
30
1.3
1.3
1.15
3.2
-20 to 85
-55 to 150
150
V
V
A
V
V
V
V
mA
W
W
W
W
°C
°C
°C
Note1
When externally applied.
Note2
Note2
Note2
Note2
-
Logic input voltage
MO output voltage
MO Inflow current
QFN48
HTSSOP48
Power
dissipation
HSOP28
HZIP25
Operating temperature
Storage temperature
Junction temperature
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a
standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions. ( It will depend on the heat
generation.)
Note 2:
Device alone (Ta =25°C)
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (max), will not exceed 120°C.
Caution）Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB62215A does not have overvoltage detection circuit. Therefore, the device is damaged if a
voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
Operation Ranges (Ta=-20 to 85°C)
Symbol
Min
Typ.
Max
Unit
Motor power supply
VM
10
24
38
V
Motor output current
IOUT
-
1.8
3.0
A
Note1
VIN(H)
2.0
-
5.5
V
Logic input High Level
VIN(L)
0
-
0.8
V
Logic input Low Level
MO output pin voltage
VMO
-
3.3
5.0
V
Clock input frequency
fCLK
-
-
100
kHz
Chopper frequency
fchop(range)
40
100
150
kHz
Vref input voltage
Vref
GND
2.0
3.6
V
Characteristics
Logic input voltage
Remarks
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
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Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
HIGH
LOW
Logic input hysteresis voltage
HIGH
Logic input current
LOW
MO output pin voltage
LOW
VIN(H)
VIN(L)
VIN(HYS)
IIN(H)
IIN(L)
VOL(MO)
Logic input pin (Note)
Logic input pin (Note)
Logic input pin (Note)
Logic input voltage=5V
Logic input voltage=0V
IOL=24mA, output=Low
Output pins=open
Standby mode
Output pins=open
Standby release, ENABLE=Low
Output pins=open
Full step resolution
2.0
0
100
35
-
50
0.2
5.5
0.8
300
75
1
0.5
V
V
mV
µA
µA
V
-
2.0
3.0
mA
-
3.5
5.0
mA
-
5.0
7.0
mA
VRS=VM=40V,Vout=0V
-
-
1
µA
Logic input voltage
IM1
Power consumption
IM2
IM3
output leakage current
High-side
Low-side
Motor current channel differential
Motor current setting accuracy
RS pin current
Motor output ON-resistance
(High-side+Low-side)
IOH
IOL
VRS=VM=Vout=40V
1
-
-
µA
ΔIOUT1
Current differential between Ch
-5
0
5
%
ΔIOUT2
IRS
IOUT=1.5A
VRS=VM=24V
Tj=25°C, Forward direction
(High-side+Low-side)
-5
0
0
-
5
10
%
µA
-
0.6
0.8
Ω
Ron(H+L)
Note: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is
gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA, OUTB) to change
when the pin is then gradually lowered from 5 V. The difference between VIN (H) and VIN (L) is defined as the VIN
(HYS).
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed
not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM
voltage reaches the proper operating range.
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Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
Iref
Vref=2.0V
-
0
1
μA
VCC voltage
VCC
ICC=5.0mA
4.75
5.0
5.25
V
VCC current
ICC
VCC=5.0V
-
2.5
5
mA
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
Vref=2.0V
1/5.2
1/5.0
1/4.8
－
TjTSD
－
140
150
170
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
－
7.0
8.0
9.0
V
ISD
－
3.0
4.0
5.0
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered,
the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins
to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used
aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors.
In order to avoid malfunction due to the switching, IC have a dead time. Once the ISD circuit is triggered, the device keeps
the output off until power-on reset (POR), is reasserted or the device is set to standby mode by DMODE pins. For fail-safe, please insert
a fuse to avoid secondary trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB62215A or other components will
be damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Inside filter of CLK input minimum
High width
tCLK(H)
The CLK(H) minimum pulse
width
300
-
-
ns
Inside filter of CLK input minimum
Low width
tCLK(L)
The CLK(L) minimum pulse
width
250
-
-
ns
tr
-
0.15
0.20
0.25
μs
Output transistor
tf
-
0.10
0.15
0.20
μs
switching specific
tpLH(CLK)
CLK-Output
-
1000
-
ns
tpHL(CLK)
CLK-Output
-
1500
-
ns
300
400
500
ns
VM=24V,IOUT=1.5A
Analog noise blanking time
AtBLK
Oscillator reference frequency
fOSCM
COSC=270pF, ROSC=3.6kΩ
1200
1600
2000
kHz
Chopping frequency
fchop
Output:Active(IOUT =1.5 A),
fOSC = 1600 kHz
-
100
-
kHz
Analog tblank
AC Electrical Specification Timing chart
1/fCLK
tCLK(L)
50%
50%
50%
tCLK(H)
CLK
tpHL(CLK)
tpLH(CLK)
90%
90%
50%
50%
OUT
10%
tf
tr
10%
Timing charts may be simplified for explanatory purpose.
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Package Dimensions
(unit :mm)
HSOP28-P-0450-0.80
Specific figure of pins
Weight: 0.79g (typ.)
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QFN48-P-0707-0.50
(unit :mm)
Weight: 0.14g (typ.)
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HTSSOP48-P-300-0.50
(unit :mm)
Weight: 0.20g (typ.)
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HZIP25-P-1.00F
(unit :mm)
Weight: 7.6g (typ.)
Note：The tightening torque for the mounting bracket should be controlled between 0.4N・m to 0.6N・m.
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Notes on Contents
1.Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2.Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3.Timing Charts
Timing charts may be simplified for explanatory purposes.
4.Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5.Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
(2)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing IC
breakdown. IC breakdown may cause injury, smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection-type IC that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,
the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this
problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in
this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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