TB62261FTAG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB62261FTAG
PHASE-in controlled Bipolar Stepping Motor Driver
The TB62261FTAG is a two-phase bipolar stepping motor driver
using a PWM chopper. An interface is PHASE in control.
Fabricated with the BiCD process, rating is 40 V/1.5 A .
FTAG
Features
・BiCD process integrated monolithic IC.
・Capable of controlling 1 bipolar stepping motor.
・PWM controlled constant-current drive.
・Allows full, half, quarter step operation.
・Low on-resistance (High + Low side = 0.8 Ω (typ.)) MOSFET
output stage.
・High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
・Error detection (TSD/ISD) signal output function
・Built-in error detection circuits (Thermal shutdown (TSD), over-current
shutdown (ISD), and power-on reset (POR))
・Built-in VCC regulator for internal circuit use.
・Chopping frequency of a motor can be customized by external resistor
and capacitor.
・Package
TB62261FTAG: P-WQFN36-0606-0.50-002
P-WQFN36-0606-0.50-002
Weight: 0.10 g (typ.)
Note: Please be careful about thermal conditions during use.
©2015 TOSHIBA CORPORATION
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TB62261FTAG
Pin assignment (TB62261FTAG)
OUT_B2
OUT_B1
RS_B2
RS_B1
VM
NC
VCC
NC
NC
(Top View)
27 26 25 24 23 22 21 20 19
18 GND
NC 28
GND
29
17 OUT_B1-
VREF_B
30
16 OUT_B2-
VREF_A
31
OSCM
32
IN_A1
33
15 GND
TB62261FTAG
14 NC
13 GND
IN_A2 34
12 OUT_A2-
5
6
7
8
9
OUT_A2
4
OUT_A1
3
RS_A2
2
NC
IN_B1
1
RS_A1
10 GND
GND
PHASE_B 36
IN_B2
11
STANDBY
PHASE_A 35
OUT_A1-
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
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TB62261FTAG
TB62261FTAG Block diagram
IN_A1
IN_A2
Standby
Control
+
Phase/Step
Selector
+
Signal Decode
Logic
IN_B1
IN_B2
PHASE_A
PHASE_B
OSC-Clock
Converter
Motor
Oscillator
System
Oscillator
VCC
Regulator
VCC
VM
Power-on
Reset
Current
Level
Set
STANDBY
Current
Comp
OSCM
Current
Reference
Setting
Motor Control Logic
TSD
Predriver
VREF_A
VREF_B
Current
Comp
Predriver
RS_A
RS_B
ISD
GND
OUT_A
OUT_A-
OUT_B
OUT_B-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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TB62261FTAG
Notes
All the grounding wires of the TB62261FTAG must run on the solder mask on the PCB and be externally
terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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TB62261FTAG
Pin explanations
Pin No.
Pin Name
Function
1
IN_B1
Bch step resolution control 1
2
IN_B2
Bch step resolution control 2
3
STANDBY
4
GND
5
NC
6
RS_A1
(*)
Motor Ach current sense pin
7
RS_A2
(*)
Motor Ach current sense pin
8
OUT_A1
(*)
Motor Ach (+) output pin
9
OUT_A2
(*)
Motor Ach (+) output pin
10
GND
11
OUT_A1－(*)
12
OUT_A2－(*)
13
GND
14
NC
Standby set pin
Ground pin
Non-connection pin
Ground pin
Motor Ach (-) output pin
Motor Ach (-) output pin
Ground pin
Non-connection pin
15
GND
16
OUT_B2－(*)
Motor Bch (-) output pin
Ground pin
17
OUT_B1－(*)
Motor Bch (-) output pin
18
GND
19
OUT_B2(*)
Motor Bch (+) output pin
20
OUT_B1(*)
Motor Bch (+) output pin
21
RS_B2(*)
Motor Bch current sense pin
22
RS_B1(*)
Motor Bch current sense pin
23
VM
VM power supply pin
24
NC
Non-connection pin
25
VCC
26
NC
Non-connection pin
27
NC
Non-connection pin
28
NC
Non-connection pin
29
GND
30
VREF_B
Motor Bch current threshold set pin
31
VREF_A
Motor Ach current threshold set pin
32
OSCM
Internal Oscillator frequency set pin
33
IN_A1
Ach step resolution control 1
34
IN_A2
Ach step resolution control 2
35
PHASE_A
Ach phase set pin
36
PHASE_B
Bch phase set pin
Ground pin
Internal VCC regulator monitor pin
Ground pin
・Please do not run patterns under NC pins.
*: Please connect the pins with the same pin name, while using the TB62261FTAG.
Equivalent circuit
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TB62261FTAG
TB62261FTAG (QFN36)
6, 7
21, 22
1 kΩ
100 kΩ
1, 2, 3,
33, 34, 35, 36
8, 9
19, 20
11, 12
16, 17
GND
GND
25
1 kΩ
1 kΩ
32
GND
GND
500 Ω
30, 31
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Pin No
Pin name
1
IN_B1
2
IN_B2
3
STANDBY
6,7
RS_A
8,9
OUT_A+
11, 12
16, 17
OUT_A－
OUT_B－
19, 20
OUT_B＋
21, 22
RS_B
23
25
VM
VCC
30
VREF_B
31
VREF_A
32
OSCM
33
IN_A1
34
IN_A2
35
PHASE_A
36
PHASE_B
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TB62261FTAG
Function explanation (Stepping motor)
Motor output current (Iout): The flow from OUT+ to OUT- is plus current. The flow from OUT- to OUT+ is minus current.
Ach
Bch
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
Iout(A)
PHASE_B
IN_B1
IN_B2
Iout(B)
H
H
H
+100%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
Ach
Bch
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
Iout(A)
PHASE_B
IN_B1
IN_B2
Iout(B)
H
H
H
+100%
H
H
H
+100%
X
L
L
0%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
X
L
L
0%
X : Don't care
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TB62261FTAG
Ach
Bch
Input
Output
Input
Output
PHASE_A
IN_A1
IN_A2
Iout(A)
PHASE_B
IN_B1
IN_B2
Iout(B)
H
H
L
+71%
H
H
L
+71%
H
L
H
+38%
H
H
H
+100%
X
L
L
0%
H
H
H
+100%
L
L
H
-38%
H
H
H
+100%
L
H
L
-71%
H
H
L
+71%
L
H
H
-100%
H
L
H
+38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
L
L
H
-38%
L
H
L
-71%
L
H
L
-71%
L
L
H
-38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
H
L
H
+38%
L
H
H
-100%
H
H
L
+71%
L
H
L
-71%
H
H
H
+100%
L
L
H
-38%
H
H
H
+100%
X
L
L
0%
H
H
H
+100%
H
L
H
+38%
X : Don't care
Others
Pin Name
H
L
IN_A1, IN_A2
The current value of each ch is set up with 2
IN_B1, IN_B2
input 4 value.
Notes
Please refer to the above-mentioned current value
setting table.
PHASE_A
OUT+: H
OUT+: L
In PHASE=H, Charge current flows in the direction
PHASE_B
OUT-: L
OUT-: H
of OUT- from OUT+.
In STANDBY= L, an internal oscillating circuit and a
STANDBY
Standby release
Standby mode
motor output part are stopped. (The drive of a motor
cannot be performed.)
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TB62261FTAG
Current phasor (Full step resolution)
100%
D
A
CCW
Ach current [%]
CW
-100%
100%
0%
C
B
-100%
Bch current[%]
A
B
C
D
A
B
C
D
A
B
C
D
A
B
100%
Iout(A)
0%
-100%
100%
Iout(B)
0%
-100%
H
PHASE_A
IN_A1
IN_A2
PHASE_B
IN_B1
L
H
L
H
L
H
L
H
L
H
IN_B2
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Current phasor (Half step resolution)
G
100%
A
H
CCW
Ach current [%]
CW
F
B
-100%
0%
100%
C
E
-100% D
Bch current [%]
G
H
A
B
C
D
E
F
G
H
A
B
C
D
E
100%
Iout(A)
0%
-100%
100%
Iout(B)
0%
-100%
PHASE_A
IN_A1
H
L
H
L
IN_A2
H
L
H
PHASE_B
IN_B1
IN_B2
L
H
L
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Current phasor (Quarter step resolution)
N
O
P
100%
A
M
71%
Ach current [%]
L
CCW
38%
B
CW
0%
K
-100% -71%
-38%
38%
71% 100%
C
-38%
J
D
-71%
I
E
-100%
H
G
F
Bch current [%]
N O P A BCD E F G H I J K L MN O P A BCD E F G H I J K L MN O P A
Iout(A)
100%
71%
38%
0%
-38%
-71%
-100%
Iout(B)
100%
71%
38%
0%
-38%
-71%
-100%
H
PHASE_A
L
IN_A1
H
L
IN_A2
H
L
H
PHASE_B
L
IN_B1
H
L
IN_B2
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Mixed Decay Mode /Detecting zero point
fchop
CR pin
Internal CLK
waveform
DECAY MODE 1
Setting current
NF
37.5%
MIXED
DECAY
MODE
MDT
CHARGE MODE → NF: Reach setting current → SLOW MODE
→ MIXED DECAY TIMMING → FAST MODE → Monitoring current
→ (In case setting current > Outputting current) CHARGE MODE
Charge
Charge
Slow
Slow
RNF
Fast
Fast
Note
Iout = 0
Hi-Z
Note: When the motor current reaches the 0 A level, the output transistor will turn to “Hi-Z” status.
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TB62261FTAG
Output transistor function mode
VM
VM
RRS
VM
RRS
RSpin
RRS
RSpin
RSpin
U1
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
Load
L2
ON
PGND
L1
L2
ON
OFF
PGND
Charge mode
A current flows into the motor coil.
PGND
Fast mode
The energy of the motor coil
is fed back to the power
Slow mode
A current circulates around the
motor coil and this device.
Output transistor function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB62261FTAG
Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference
voltage (Vref), as follows:
Vref(V)
Iout(max) = Vref(gain) ×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example: In the case of a 100% setup
when Vref = 3.0 V, Torque = 100%, RS = 0.51 Ω, the motor constant current (Setting current value) will be
calculated as:
Iout = 3.0 V / 5.0 / 0.51 Ω= 1.18 A
Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM = 1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C = 270 pF , R1 = 3.6 kΩ => fOSCM = 1.6 MHz (Typ.))
fchop = fOSCM / 16
………fOSCM = 1.6 MHz => fchop = About 100 kHz
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become
large. It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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TB62261FTAG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
Motor power supply
VM
40
V
-
Motor output voltage
Vout
40
V
-
Motor output current
Iout
1.5
A
(Note 1)
Internal Logic power supply
VCC
6.0
V
When externally applied.
VIN(H)
6.0
V
-
VIN(L)
Vref
-0.4
5.0
V
V
-
Logic input voltage
Vref reference voltage
Power dissipation
WQFN36
PD
1.3
W
(Note 2)
Operating temperature
Topr
-20 to 85
°C
-
Storage temperature
Tstg
-55 to 150
°C
-
Junction temperature
Tj(max)
150
°C
-
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for
a standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions.
Note 2:
Device alone (Ta = 25°C)
When Ta exceeds 25°C, it is necessary to do the derating with 10.4 mW/°C.
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (MAX), will not exceed 120°C.
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB62261FTAG does not have overvoltage detection circuit. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
(For reference) PD-Ta graph
PD - Ta
Mounted to board
Device alone
Board condition
4 layer glass epoxy board
Cu thickness: 1 layer and 4 layer: 55μm, 2 layer and 3 layer: 35μm
Board size: 100 mm ×110 mm ×1.6 mm
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TB62261FTAG
Operation Ranges (Ta = -20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
Remarks
Motor power supply
VM
10
24
35
V
-
Motor output current
Iout
-
0.8
1.2
A
(Note 1)
Logic input voltage
VIN(H)
VIN(L)
2.0
0
-
5.5
0.8
V
V
Logic input High Level
Logic input Low Level
Phase input frequency
Chopper frequency
fPHASE
-
-
400
kHz
fchop(range)
40
70
150
kHz
-
Vref input voltage
Vref
GND
2.0
3.6
V
-
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
HIGH
VIN(H)
Logic input (Note)
2.0
-
5.5
V
LOW
VIN(L)
Logic input (Note)
0
-
0.8
V
VIN(HYS)
Logic input (Note)
100
-
300
mV
HIGH
IIN(H)
VIN(H) = 3.3 V
-
33
-
µA
LOW
IIN(L)
VIN(L) = 0 V
-
-
1
µA
-
2.5
3.5
mA
-
4.0
5.5
mA
-
5
7
mA
Logic input voltage
Logic input hysteresis voltage
Logic input current
Output pins = open
STANDBY = L
Output pins = open
STANDBY = H
Output pins = open
Full step resolution
IM1
Power consumption
IM2
IM3
High-side
IOH
VRS = VM = 40 V, Vout = 0 V
-
-
1
µA
Low-side
IOL
VRS = VM = Vout = 40 V
1
-
-
µA
Motor current channel differential
ΔIout1
Current differential between Ch
-5
0
5
%
Motor current setting accuracy
ΔIout2
Iout = 1.0 A
-5
0
5
%
RS pin current
IRS
VRS = VM = 24 V
0
-
27
µA
Ron(H+L)
Tj = 25°C, Forward direction
(High-side + Low-side)
-
0.8
1.2
Ω
Output leakage current
Motor output ON-resistance
(High-side + Low-side)
Note: VIN(H) is defined as the VIN voltage that causes the outputs (OUT_A, OUT_B) to change when a pin under
test is gradually raised from 0 V. VIN(L) is defined as the VIN voltage that causes the outputs (OUT_A, OUT_B) to
change when the pin is then gradually lowered from 5 V. The difference between VIN(H) and VIN(L) is defined as
the VIN(HYS).
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is
designed not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and
the VM voltage reaches the proper operating range.
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TB62261FTAG
Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
Iref
VREF = 2.0 V
-
0
1
μA
VCC voltage
VCC
ICC = 5.0 mA
4.75
5.0
5.25
V
VCC current
ICC
VCC = 5.0 V
-
2.5
5
mA
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
VREF = 2.0 V
1/5.2
1/5.0
1/4.8
-
TjTSD
-
145
160
175
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
-
7.0
8.0
9.0
V
ISD
-
2.1
3.0
4.0
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is
triggered, the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the
DMODE pins to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not
recommended to be used aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output
transistors. Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is
set to standby mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
Test condition
Min
Typ.
Max
fPHASE(min)
-
100
-
-
twp
-
50
-
-
twn
-
50
-
-
tr
-
150
200
250
Output transistor
tf
-
100
150
200
switching specific
tpLH(PHASE)
PHASE - Output
250
750
1200
tpHL(PHASE)
PHASE - Output
250
750
1200
Analog noise blanking time
AtBLK
VM = 24 V, Iout = 1.0 A
Analog tblank
450
700
950
ns
Oscillator reference
frequency
fOSCM
COSC = 270 pF, ROSC = 3.6 kΩ
1200
1600
2000
kHz
Chopping frequency
fchop
Output: Active(IOUT = 1.0 A),
fOSCM = 1600 kHz
-
100
-
kHz
Minimum PHASE pulse width
Unit
ns
ns
AC Electrical Specification Timing chart
1/fPHASE
twn
50%
50%
50%
twp
PHASE
tpHL(PHASE)
tpLH(PHASE)
90%
90%
50%
50%
OUT
10%
tf
tr
10%
Timing charts may be simplified for explanatory purpose.
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Example Application Circuits
The values shown in the following figure are typical values. For input conditions, see the Operating Ranges.
OUT_B2
RS_B2
VM
VCC
RS_B1
0.1 µF 0.51 Ω
100 µF
OUT_B1
24 V
0.1 µF
GND
0.1 µF
GND
OUT_B1-
GND
Vref_B
OUT_B2GND
Vref_A
3.6 kΩ
270 pF
GND
PHASE_A
OUT_A2
OUT_A1
0.51 Ω
RS_A2
RS_A1
PHASE_B
IN_B1
0V
5V
3.3 V
OUT_A1-
IN_A2
GND
0V
5V
3.3 V
STAND BY-
0V
5V
3.3 V
OUT_A2IN_A1
IN_B2
0V
5V
3.3 V
M
GND
OSCM
5V
5V
5V
3.3 V 3.3 V
3.3 V
0V
0V
0V
Note: I will recommend the addition of a capacitor if necessary. The GND wiring must become one point as much as
possible-earth.
The example of an applied circuit is for reference, and enough evaluation should be done before the
mass-production design.
Moreover, it is not the one to permit the use of the industrial property.
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Package Dimensions
P-WQFN36-0606-0.50-002
(unit: mm)
Weight: 0.10 g (typ.)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application
equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2)
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the
case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
(4)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing
IC breakdown. IC breakdown may cause injury, smoke or ignition.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback capacitor, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
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(BTL) connection-type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
thermal shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s
motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To
avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
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in this document, and related hardware, software and systems (collectively "Product") without notice.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
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