TB62600FG

TB62600FG TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62600FG 64BIT SHIFT REGISTER / LATCH DRIVER The TB62600FG is specifically designed for 64bit Thermal Head drivers. And this IC is monolithic integrated circuits designed to be used together with Bi−CMOS (DMOS) integrated circuit. The devices consist of a 64bit shift register, dual 64bit latches, and 64 output DMOS structures. The suffix (G) appended to the part number represents a Lead(Pb)-Free product. FEATURE Built−in selection circuit : parallel−in parallel−out (8 × 8) or serial−in parallel−out (1 × 64) CMOS compatible inputs Open−drain DMOS outputs Low steady−state power consumption Built−in mono stable multi−viblator for head protection Package : QFP100−P−1420C Weight: 1.6 g (typ.) 1 2006-08-07 TB62600FG PIN CONNECTION (TOP VIEW) 2 2006-08-07 TB62600FG BLOCK DIAGRAM 3 2006-08-07 TB62600FG BLOCK DIAGRAM (8 × 8, 1 × 64 shift register) 4 2006-08-07 TB62600FG TIMING WAVEFORM 5 2006-08-07 TB62600FG TERMINAL DESCRIPTION PIN NAME CLOCK ENABLE RESET D0~D7 MMV−C/R MMV−OUT OUT0 ~ 63 SELECT S−OUT LATCH1 / LATCH2 VDD L−GND P−GND PIN No. 97 84 98 88~95 78 79 ― 83 96 86 / 85 81, 100 82, 99 ― FUNCTION Input Terminals for Shift register Clock. "L" : All Outputs "On". Pull−Down Input Terminal. "L" : Reset shift register and latch. Pull−Down Input Terminal. Input Terminals for Output Data. "H" : Output On, "L" : Output Off. CR Connection Terminal for CR Timer (MMV) Output Terminal for CR Timer (MMV) Output Terminals. These are Open Drain Outputs. Input Terminal for Input Mode Data. "H" : 8bit Parallel Input Mode, "L" : 1bit Serial Input Mode. Output Terminal for Serial Data "D63". Input Terminal for Latch. "H" : Data Throught, "L" : Data Latch. Supply Voltage Terminal for Control Logic. Ground Terminal for Control Logic Ground Terminal for Drivers. 10 Terminals. 6 2006-08-07 TB62600FG MMV OPERATION MMV Output of Q becomes "L" when the MMV / E voltage becomes less than Vref (L) after the first rising edge of Internal Clock. And becomes "H" when the MMV / E voltage above Vref (H) after re−changing of external capacitance connect to MMV / E. The external capacitance and resistor connect to MMV / E control MMV Output "ON" period. So Output Load is protected from burn−out. It's required enough discharging time (decided by Time period of Internal Clock) of external capacitance. (Refer to figure below) PULSE WIDTH OF MMV See Below 7 2006-08-07 TB62600FG ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Supply Voltage Output Drain−Source Voltage Output Current Input Current Input Voltage Power Dissipation Free Air (Note 1) PCB SYMBOL VDD VDS IDS IIN VIN PD Topr Tstg RATING −0.3~7.0 −0.4~30 130 ±5 −0.3~VDD ± 0.3 1.0 1.3 −40~85 −55~150 UNIT V V mA / ch mA V W °C °C Operating Temperature Storage Temperature Note 1: 60 × 60 × 1.6 mm Cu 24% Glass Epoxy PCB RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C, VSS = 0 V) CHARACTERISTIC Supply Voltage "H" LEVEL Input Voltage "L" LEVEL Output Drain−Source Voltage VIL VOUT Duty = 100% Output Current IOUT Duty = 80% Duty = 50% External Resistor External Capacitance Power Dissipation REXT CEXT PD ― ― ― All Output "L" Level ― ― SYMBOL VDD VIH CONDITION ― ― MIN 4.5 0.7 VDD 0 ― ― ― ― 200 100 ― TYP. 5 ― ― ― ― ― ― ― ― ― MAX 5.5 VDD 0.3 VDD 24 44 49 62 1000 4000 0.67 kΩ pF mW mA / ch V UNIT V V 8 2006-08-07 TB62600FG ELECTRICAL CHARACTERISTICS (Ta = −10~80°C, VDD = 4.5~5.5 V, VSS = 0 V, "H" = VIH, "L" =VIL) CHARACTERISTIC SYMBOL VDS1 Output Voltage "L" Level VDS1 VDS2 VDS2 "H" Level Output Current "L" Level Output Resistor Output Leakage Current Input Current "H" Level Input Voltage "L" Level Voltage Superviser Operating Voltage Supply Current VIL VVS IDD IDD1 Operating Supply Current IDD2 Input Pull−Up Resistor Input Pull−Down Resistor Internal Clock Frequency RVDD RVSS fint ― TEST CIR− CUIT ― ― ― ― ― ― ― ― ― ― ― ― ― ― TEST CONDITION IOUT = 40 mA, Ta = 25°C IOUT = 40 mA IOUT = 100 mA, Ta = 25°C IOUT = 100 mA S−OUT MMV−OUT Ta = 25°C VOUT = 30V, EN = "L", 1bit VOUT = 30V, EN = "L", 64bit VIN = VDD or VSS ― ― ― ― fCLK = 5MHz, Duty = 50% Data = 1 / 2 fCLK, OUTPUT off LATCH = "L", LATCH −Data = "L" fCLK = 1MHz, Duty = 50% Data=1 / 64 fCLK All OUTPUT open LATCH = "H", 1bit ON VDD = 5.0 V, Ta = 25°C VDD = 5.0 V, Ta = 25°C VDD = 5.0 V, Ta = 25°C MIN ― ― ― ― TYP. 0.16 ― 0.40 ― 0.2 0.2 4.00 ― ― ― ― ― ― ― MAX 0.32 0.48 0.80 1.20 0.5 UNIT V IOH IOL RON IOZ1 IOZ2 IIN VIH VOH = 4.6 V Ta =25°C VOH = 0.4 V Ta=25°C ― ― ― ― ― ― 0.7 VDD 0 2.0 ― mA 0.5 8.00 10 100 ±1 ― 0.3 VDD 4.0 300 V Ω µA µA V µA ― ― ― 5.0 mA ― ― 6.0 ― ― ― 150 150 400 300 300 800 600 600 ― kΩ kHz 9 2006-08-07 TB62600FG RECOMMENDED TIMING CONDITIONS (Ta = −40~85°C, VDD = 4.5~5.5 V, VSS = 0 V) CHARACTERISTIC Clock Pulse Width Enable Pulse Width Latch Pulse Width Clear Pulse Width Data Set up Time Data Hold Time SYMBOL tw CLK tw EN tw LAT TEST CONDITION ― ― ― ― ― ― MIN 50 0.5 50 80 37 50 TYP. ― ― ― ― 50 ― MAX ― ― ― ― ― ― UNIT ns µs ns ns ns ns tw CLR tsetup thold SWITCHING CHARACTERISTICS CHARACTERISTIC CLK− Outn (Ta = 25°C, VDD = 5 V, VOUT = 26 V, R1 = 650 Ω, CL = 15 pF) SYMBOL TEST CONDITION MMV−C / R = "L" MIN ― TYP. ― MAX 1000 UNIT R − Outn Propagation Delay Time (Low−to−High) LAT1 − Outn LAT2 − Outn EN− Outn CLK− Outn Propagation Delay Time (High−to−Low) LAT1 − Outn LAT2 − Outn EN− Outn tpLH MMV−C / R = "L" MMV−C / R = "L" MMV−C / R = "L" R = 750 kΩ, C = 2600 pF,Ta = 25°C MMV−C / R = "L" MMV−C / R = "L" ― ― ― ― ― ― ― ― ― ― ― ― ― ― 1000 1000 1000 2500 1000 1000 1000 ns tpHL MMV−C / R = "L" ns R = 750 kΩ, C = 2600 pF,Ta = 25°C tsetup (L) tsetup (D) thold (L) thold (D) tw CLK tw LATn ― ― ― ― ― ― ― ― ― ― ― 10 ― 1 ― 70 ― ― ― ― ― ― ― 200 200 15 200 3 2500 120 30 0 20 50 50 50 400 500 500 ― ― 5 ns ns ns ns ns ns ns Set Up Time CLK− LATn CLK−S−IN CLK− LATn CLK−S−IN ― ― ― ― ― ― ― ― OUTn OUTn Duty = 50% VDD (H) = 5 V, VDD (L) = 2 V R = 750 kΩ, C = 2600 pF,Ta = 25°C Hold Time Clock Pulse Width Latch Pulse Width Reset Pulse Width Enable Pulse Width Output Rise Time Output Fall Time Maximum Clock Frequency tw R tw EN tor tof fMAX tw VS tMMV Voltage Superviser Operating Pulse Width MMV Reset Time 10 2006-08-07 TB62600FG EQUIVALENT OF INPUTS AND OUTPUT CIRCUIT 1. CLOCK, SELECT 2. ENABLE, LATCH1, LATCH2 , RESET ,D0~7 3. OUTn 4. MMV−C / R 5. S−OUT, MMV−OUT PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC (VDD) and GND (L−GND, P−GND) line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 11 2006-08-07 TB62600FG PACKAGE DIMENSIONS QFP100−P−1420−0.65C Unit: mm W eight: 1.6 g (typ.) 12 2006-08-07 TB62600FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. (2) (3) (4) (5) 13 2006-08-07 TB62600FG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. (2) 14 2006-08-07 TB62600FG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 021023_D 060116EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 15 2006-08-07