TB62710F

TB62710P/F/FN TOAHIBA Bi-CMOS Integrated Circuit Silicon Monolithic TB62710P,TB62710F,TB62710FN 8-Bit Constant-Current LED Driver for Cathode Common LED The TB62710P, TB62710F and TB62710FN are specifically designed for use as LED and LED display (cathode-common) Constant-current drivers. The constant-current output circuits can be set up using an external resistor (IOUT = −90 mA max). These ICs are monolithic integrated circuits have been designed using the Bi-CMOS process. The devices consist of an 8-bit shift register, a latch, an ANDgate and constant-current drivers. TB62710P FEATURES • Constant-current output: A single resistor can be used to set any output current in the range −5~−90 mA. • • • Maximum clock frequency: fCLK = 15 MHz (operating while connected in cascade, Topr = 25°C) 5-V CMOS compatible input Packages: P-type: DIP20-P-300-2.54A F-type: SSOP24-P-300-1.00 FN-type: SSOP20-P-225-0.65A • Constant-output-current accuracy: Output − GND Voltage ≥ 2.0 V (min) ≥ 1.5 V (min) Current accuracy between bits between ICs ±6% ±15% Output Current (max) −5~−90 mA −5~−40 mA TB62710F TB62710FN Weight DIP20-P-300-2.54A: 2.25 g (typ.) SSOP24-P-300-1.00: 0.33 g (typ.) SSOP20-P-225-0.65A: 0.10 g (typ.) 1 2006-06-14 TB62710P/F/FN Pin Assignment (top view) P- & FN-types GND SERIAL-IN CLOCK LATCH NC VCC OUT0 OUT1 OUT2 OUT3 VDD R-EXT SERIAL-OUT1 ENABLE SERIAL-OUT2 VCC OUT7 OUT6 OUT5 OUT4 GND SERIAL-IN CLOCK NC LATCH NC VCC NC OUT0 OUT1 OUT2 OUT3 F-type VDD R-EXT SERIAL-OUT1 ENABLE SERIAL-OUT2 NC VCC NC OUT7 OUT6 OUT5 OUT4 Block Diagram OUT0 OUT1 OUT7 R-EXT I-REG VCC VCC VCC ENABLE Q ST LATCH D CK SERIAL-OUT1 SERIAL-IN D CK Q D CK Q D CK Q Q SERIAL-OUT2 D ST Q D ST Q D CLOCK Truth Table CLOCK LATCH ENABLE L L L L H SERIAL-IN Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3 OUT0… OUT5 … OUT7 Dn … Dn − 5 … Dn − 7 No Change Dn + 2 … Dn − 3 … Dn − 5 Dn + 2 … Dn − 3 … Dn − 5 OFF SERIAL-OUT Dn − 7 Dn − 6 Dn − 5 Dn − 5 Dn − 5 H L H X X Note 1: OUT0~OUT7 = ON when Dn = “H”; OUT0~OUT7 = OFF when Dn = “L”. In order to ensure that the level of the power supply voltate is correct, an external resistor must be connected between R-EXT and GND. 2 2006-06-14 TB62710P/F/FN Timing Diagram n=1 CLOCK 0V 5V SERIAL-IN 0V 5V LATCH 0V 5V ENABLE 0V 2 3 4 5 6 7 8 5V OUT0 OFF OUT1 OFF ON OFF OUT6 OFF OUT7 OFF ON OFF 5V SERIAL-OUT1 0V 5V SERIAL-OUT2 0V Note 2: The latches circuit holds data by pulling the LATCH terminal Low. And, when LATCH terminal is a “H” level, latch circuit doesn’t hold data, and it passes from the input to the output. When ENABLE terminal is a “L” level, output terminal OUT0~ OUT7 respond to the data, and on & off does. And, when ENABLE terminal is a “H” level, it offs with the output terminal regardless of the data. 3 2006-06-14 TB62710P/F/FN Terminal Description Pin No. P/FN-Type 1 2 3 4 6, 15 7~14 F-Type 1 2 3 5 7, 18 9~16 GND SERIAL-IN CLOCK LATCH VCC OUT0~OUT7 GND terminal for control logic Input terminal for serial data for data shift register Input terminal for clock for data shift on rising edge Input terminal for data strobe When the LATCH input is driven High, data is latched. When it is pulled Low, data is hold. 0 V~17 V supply voltage terminal for LED Output terminals Input terminal for output enable. 17 21 ENABLE All outputs (OUT0~OUT7) are turned off, when the ENABLE terminal is driven High. And are turned on, when the terminal is driven Low. 16 18 19 20 5 20 22 23 24 4, 6, 8, 17, 19 SERIAL-OUT2 Output terminal for serial data input on SERIAL-IN terminal SERIAL-OUT1 Output terminal for serial data input on SERIAL-IN terminal R-EXT VDD NC Input terminal used to connect an external resistor. This regulated the output current. 5-V supply voltage terminal Not connected Pin Name Function Equivalent Circuits For Inputs and Outputs ENABLE terminal VDD R (UP) LATCH terminal VDD 300 k ENABLE LATCH GND GND R (DOWN) CLOCK, SERIAL-IN terminal VDD SERIAL-OUT1 and SERIAL-OUT2 terminals VDD CLOCK, SERIAL-IN 200 k SERIAL-OUT1, 2 GND GND 4 2006-06-14 TB62710P/F/FN Absolute Maximum Ratings (Topr = 25°C) Characteristic Supply voltage Supply voltage for LED Input voltage Output current Output voltage Clock frequency VCC terminal current P-type (when not mounted) Power Dissipation F-type (when not mounted) Symbol VDD VLED VIN IOUT VOUT fCLK IVCC Pd1 Rating 0~7.0 0~17.0 Unit V V V mA V MHz mA −0.4~VDD + 0.4 −90 −0.4~17 15 1440 1.47 0.59 0.83 Pd2 (Note 3) F-type (on PCB) FN-type (when not mounted) FN-type (on PCB) P-type (when not mounted) Thermal Resistance (Note 3) F-type (when not mounted) F-type (on PCB) FN-type (when not mounted) FN-type (on PCB) Operating Temperature Storage Temperature Topr Tstg Rth (j-a) 3 Rth (j-a) 1 Pd3 W 0.71 0.96 85 210 150 175 130 °C/W Rth (j-a) 2 −40~85 −55~150 °C °C Note 3: P-Type: Powes dissipation is derated by 12.5 mW/°C if device is mounted on PCB and ambient temperature is above 25°C. F-Type: Powes dissipation is derated by 6.7 mW/°C if device is mounted on PCB and ambient temperature is above 25°C. With device mounted on PCB of 60% Cu and of dimensions 50 mm × 50 mm × 1.6 mm FN-Type: Powes dissipation is derated by 7.7 mW/°C if device is mounted on PCB and ambient temperature is above 25°C. With device mounted on PCB of 40% Cu and of dimensions 50 mm × 50 mm × 1.6 mm 5 2006-06-14 TB62710P/F/FN Recommended Operating Conditions (Topr = −40°C ~85°C unless otherwise specified) Characteristic Supply voltage Symbol VDD VCC1 Supply voltage for LED VCC2 Output voltage VOUT IOUT Output current IOH IOL VIH Input voltage VIL LATCH pulse width CLOCK pulse width ENABLE pulse width Set-up time for DATA Hold time for DATA Clock frequency P-type Power Dissipation F-type FN-type twLAT twCLK twENA tsetup thold tCLK Pd1 Pd2 Pd3 Topr = 85°C VDD = 4.5~5.5 V VDD = 4.5~5.5 V VDD = 4.5~5.5 V VDD = 4.5~5.5 V VDD = 4.5~5.5 V VDD = 4.5~5.5 V, Cascade operation When not mounted On PCB VDD = 4.5~5.5 V Conditions Min 4.5 4 3.5 0 Typ. 5.0 Max 5.5 17 V 17 Unit V ⎯ VCC − VOUT > 2.0 V, = IOUT < −90 mA = VCC − VOUT > 1.5 V, = IOUT < −40 mA = VCC common DC1 circuit SERIAL-OUT1, 2 SERIAL-OUT1, 2 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ −17 −78 −1.0 1.0 VDD + 0.3 0.3 VDD V −5 ⎯ ⎯ 0.7 VDD mA V −0.3 100 50 1000 100 100 ⎯ ⎯ ⎯ ⎯ ⎯ 10.0 0.76 0.43 0.50 ns ns ns ns ns ns ⎯ ⎯ ⎯ ⎯ W 6 2006-06-14 TB62710P/F/FN Electrical Characteristics (Topr = 25°C, VDD = 5 V, VCC = 17 V unless otherwise specified) Characteristic Output leakage current Output voltage SERIAL-OUT 1, 2 Symbol ILEAK VOH VOL IOUT1 Output current (including current skewing) IOUT2 IOUT3 Current skew Supply voltage regulation Pull-up resistor Pull-down resistor Test circuit Conditions VCC = 17.0 V IOH = −1.0 mA IOL = 1.0 mA VCC = 4 V, R = 360 Ω VOUT = VCC − 2.0 V EXT VCC = 4 V, = 620 Ω R VOUT = VCC − 2.0 V EXT VCC = 3.5 V, R = 620 Ω VOUT = VCC − 1.5 V EXT Same as IOUT1, IOUT2 and IOUT3 Ta = −40~85°C REXT = 360 Ω Min Typ. Max Unit ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 4.6 ⎯ ⎯ ⎯ −73.0 −40.0 −38.0 ±1.5 1.5 300 200 0.6 7.5 −10 0.4 µA V ⎯ −83.9 −46.0 −43.7 ±6.0 5.0 600 400 1.2 10.0 −62.1 −34.0 −32.3 ⎯ ⎯ 150 100 mA ∆IOUT %/VDD Rin (Up) Rin (Down) IDD (OFF) IDD (ON) 1 % %/V kΩ kΩ ⎯ ⎯ All outputs = OFF DATA = ALL “H”, All outputs = ON (no load) DATA = ALL “H”, All outputs = ON (no load) DATA = ALL “L”, All outputs = OFF (no load) DATA = ALL “H”, All outputs = ON (no load) REXT = OPEN REXT = 360 Ω ⎯ ⎯ VDD Supply current IDD (ON) 2 ⎯ REXT = 620 Ω ⎯ 4.0 7.0 mA ICC (OFF) VCC ICC (ON) ⎯ REXT = 620 Ω ⎯ 0.5 1.0 ⎯ REXT = 360 Ω ⎯ 42.0 52.0 7 2006-06-14 TB62710P/F/FN Switching Characteristics (Topr = 25°C unless otherwise specifed) Characteristic CLK-OUTn Propagation delay time (“L” to “H”) LATCH -OUTn ENABLE -OUTn CLK-SOUTn CLK-OUTn Propagation delay time (“H” to “L”) LATCH -OUTn ENABLE -OUTn CLK-SOUTn Pulse width Set-up time LATCH /SIN/ CLOCK Hold time LATCH /SIN/ CLOCK DATA = “H” → “L” Rise time Slow clock (Note 4) Fall time (Note 4) Output rise time Output fall time thold DATA = “L” → “H” tsetup CLK LATCH twCLK twLAT tpHL tpLH Symbol Test circuit Conditions Min Typ. Max Unit ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Set the switching characteristics according to the result of measuring the voltage waveform. 0 30 ns VDD = 5.0 V, VCC = 17.0 V VOUT = VCC − 2.0 V VIH = VDD, VIL = GND REXT = 620 Ω CL = 10.5 pF tor: 10~90% tof: 90~10% tpLH: 50~10% tpHL: 50~90% ⎯ 200 450 ns ⎯ 20 70 ⎯ 60 180 ns ⎯ ⎯ ⎯ ⎯ 20 20 10 25 70 30 25 50 ns ns tr tf tor tof ⎯ ⎯ 25 250 ⎯ ⎯ 55 450 10 10 110 600 µs µs ns ns Note 4: If the device is connected in a cascade and tr/tf for the waveform is large, it may not be possible to achieve the timing required for data transfer. Please consider the timings carefully. 8 2006-06-14 TB62710P/F/FN Test Circuit DC Characteristic IDD ILED VDD ENABLE CLOCK IIL, IIH LATCH SERIAL-IN VCC OUT0 IOUT OUT7 SERIAL-OUT1, SERIAL-OUT2 GND VIL, VIH AC Characteristic VDD VCC OUT0 RL CL Function Generator VIH, VIL ENABLE CLOCK LATCH SERIAL-IN OUT7 RL CL SERIAL-OUT1, 2 GND Logic input waveform CL VDD = VIH = 5.0 V VIL = 0 V tr = tf = 10 ns (10% to 90%) 9 2006-06-14 TB62710P/F/FN Timing Waveforms 1. CLOCK, SERIAL OUTn tr 90% CLOCK 10% twCLK 50% 10% 50% 50% tr SERIAL-IN tsetup tof 90% OUTn tpHL tpLH 50% 10% 50% tor tpLH 90% 50% 10% tpHL SERIAL-OUT1 50% 50% tpLH tpHL SERIAL-OUT2 50% 50% 2. CLOCK, LATCH CLOCK 50% 50% twCLK SERIAL-IN tsetup LATCH 50% twLAT 50% 3. ENABLE – OUTn ENABLE 50% tpLH 50% tpHL ON 50% 50% OFF OUTn 10 2006-06-14 TB62710P/F/FN Reference Data (duty curves + package power dissipation) IOUT – Duty on PCB 80 70 60 Topr = 85°C, VCC − VOUT = 2.0 V Tj = 120°C 80 70 60 IOUT – Duty on PCB (mA) 40 (mA) IOUT 50 50 40 30 20 IOUT 30 20 TB62710FN 10 0 0 TB62710F TB62710P 20 40 60 80 100 TB62710FN 10 0 0 TB62710F TB62710P 20 40 Topr = 60°C, VCC − VOUT = 2.0 V Tj = 120°C 60 80 100 Duty (%) Duty (%) IOUT – Duty on PCB 80 70 P-type FREE AIR 60 1.5 2.0 Pd – Topr (mA) (W/IC) 50 40 1.0 F-type ON PCB IOUT 30 20 TB62710FN 10 0 0 TB62710F TB62710P 20 40 Topr = 25°C, VCC − VOUT = 2.0 V Tj = 120°C 60 80 100 Pd FN-type ON PCB 0.5 0 0 25 50 75 100 Duty (%) Topr (°C) IOUT – REXT 90 80 70 60 50 40 30 20 VDD = 5.0 V, Topr = −40°C 25°C IOUT (mA) = (1.26 ÷ REXT (Ω)) × 18 (mA) 85°C IOUT VCE = 2.0 V, 10 V CC = 17.0 V 0 100 500 1000 5000 10000 REXT (Ω ) 11 2006-06-14 TB62710P/F/FN The bottom figure shows an application circuit. For best results, this IC should be operated with VO = 2.0 V. VO (V) = VCC − VOUT = VCC − Vf (LED) − VCE1 When VCC is high and the Vf of the LED is low. VO is also high , the increase in power dissipation may in turn adversely affect the IC’s output current. In this case, reduce the voltage by connecting an external resistor. In this way the IC’s output current can be stabilized. VCC − Vf − VO (min) IOUT (max) × BIT number (max) R= It is looked for. it is also possible that the IC will operate in an unstable manner due to the inductance of the wiring. To counter this, it is recommended that the IC be situated as close as possible on the PCB to the LED module, and as far as possible from other ICs. Otherwise, there is the risk that the IC will malfunction. Application VDD n R VLED = 5~17 (V) SCAN VCC ENABLE CLOCK LATCH SERIAL-IN R-EXT GND VCC OUT0 OUT7 SERIAL-OUT1, SERIAL-OUT2 CPU VCC ENABLE CLOCK LATCH SERIAL-IN R-EXT GND VCC OUT0 VCE1 OUT7 SERIAL-OUT1, SERIAL-OUT2 VO = VCC − Vf (LED) − VCE1 For best results, operate at VO = 2.0 V 12 2006-06-14 TB62710P/F/FN Notes • Operation may become unstable due to the electromagnetic interference caused by the wiring and other phenomena. To counter this, it is recommended that the IC be situated as close as possible to the LED module. If overvoltage is caused by inductance between the LED and the output terminals, both the LED and the terminals may suffer damage as a result. There is only one GND terminal on this device when the inductance in the GND line and the resistor are large, the device may malfunction due to the GND noise when output switchings by the circuit board pattern and wiring. To achieve stable operation, it is necessary to connect a resistor between the REXT terminal and the GND line. Fluctuation in the output waveform is likely to occur when the GND line is unstable or when a capacitor (of more than 50 pF) is used. Therefore, take care when designing the circuit board pattern layout and the wiring from the controller. This application circuit is a reference example and is not guaranteed to work in all conditions. Be sure to check the operation of your circuits. This device does not include protection circuits for overvoltage, overcurrent or overtemperature. If protection is necessary, it must be incorporated into the control circuitry. The device is likely to be destroyed if a short-circuit occurs between either of the power supply pins and any of the output terminals when designing circuits, pay special attention to the positions of the output terminals and the power supply terminals (VDD and VLED), and to the design of the GND line. • • • • 13 2006-06-14 TB62710P/F/FN Package Dimensions W eight: 2.25 g (typ.) 14 2006-06-14 TB62710P/F/FN Package Dimensions W eight: 0.33 g (typ.) 15 2006-06-14 TB62710P/F/FN Package Dimensions W eight: 0.10 g (typ.) 16 2006-06-14 TB62710P/F/FN Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 17 2006-06-14 TB62710P/F/FN IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. (2) (3) (4) (5) Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. (2) 18 2006-06-14 TB62710P/F/FN RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 021023_D 060116EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 19 2006-06-14