TB6561NG
TOSHIBA Bi-CMOS Integrated Circuit
Silicon Monolithic
TB6561NG
Dual Full-Bridge Driver IC for DC Motors
The TB6561NG is a dual bridge driver IC for DC brush motor
that contains MOS transistors in an output stage.
By using low ON-resistance MOS transistors and PWM current
control circuitry, the driver achieves high efficiency.
Features
•
Power supply voltage: 40 V (max)
•
Output current: 1.5 A (max)
•
Low ON-resistance: 1.5 Ω (upper and lower transistors/typ.)
•
Direct PWM current control system
•
Power-saving function
•
Forward/reverse/short brake/stop modes
•
Over-current protection: ILIM = 2.5 A (typ.)
•
Thermal shutdown
•
Package: SDIP-24-Ｐ-300-1.78
Weight: 1.62 g (typ.)
The following conditions apply to solderability:
About solderability, following conditions were confirmed
(1)Use of Sn-37Pb solder Bath
·solder bath temperature: 230℃
·dipping time: 5 seconds
·the number of times: once
·use of R-type flux
(2)Use of Sn-3.0Ag-0.5Cu solder Bath
·solder bath temperature: 245℃
·dipping time: 5 seconds
·the number of times: once
·use of R-type flux
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Block Diagram
Some of the functional blocks, circuits and constants in the block diagram may be omitted or simplified for explanatory
purposes.
S-GND
Vreg
SB
VCC
OUT2A
VCC
24
2
3
23
11
7
OUT1A OUT2B
8
14
VCC OUT1B S-GND
18
17
13
5V
Over-current
detection circuit
Control logic
1
S-GND
5
6
4
20
IN1A IN2A PWMA
19
21
IN1B IN2B PWMB
22
10
CLD P-GNDA
15
12
P-GNDB
S-GND
N.C.: 9 pin, 16 pin
Pin Assignment
S-GND
1
24
S-GND
Vreg
2
23
VCC
SB
3
22
CLD
PWMA
4
21
PWMB
IN1A
5
20
IN1B
IN2A
6
19
IN2B
VCC
7
18
VCC
OUT1A
8
17
OUT1B
N.C.
9
16
N.C.
P-GNDA
10
15
P-GNDB
OUT2A
11
14
OUT2B
S-GND
12
13
S-GND
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TB6561NG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Power supply voltage
VCC
40
V
Output voltage
VO
Output current
IO (Peak)
1.5 (Note 2)
Input voltage
VIN
−0.3 to 5.5
Power dissipation
PD
Operating temperature
Topr
−20 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
40 (Note 1)
2.5 (Note 3)
V
A
V
W
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be
exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably
altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other
equipment. Applications using the device should be designed so that no absolute maximum rating will ever be
exceeded under any operating condition.
Note 1: Please use output voltage within the above absolute maximum rating, 40 V, in which includes back-EMF
voltage.
Note 2: The output current may be subject to the duty cycle, ambient temperature and heatsink. Ensure that the
junction temperature does not exceed 150°C (max).
Note 3: When mounted on a board (50 mm × 50 mm × 1.6 mm, Cu area: 50 %)
Operating Range (Ta = 25°C)
Characteristics
Power supply voltage
Symbol
Rating
Unit
VCC
10 to 36
V
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TB6561NG
Pin Description
Pin No.
Symbol
Function Description
1
S-GND
Signal ground
⎯
2
Vreg
5-V output pin
Connect a capacitor (0.1μF) between this
pin and S-GND pin.
3
SB
Standby pin
High: Start, Low: Standby; internal
pull-down resistor of 100 kΩ (typ.).
4
PWMA
Rotation direction control pin (chA)
Apply a 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
5
IN1A
Input pin 1 (chA)
Apply a 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
6
IN2A
Input pin 2 (chA)
Apply a 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
7
VCC
Power supply voltage input pin for motor drive (chA)
VCC (opr) = 10 V to 36 V
8
OUT1A
Output pin 1 (chA)
Connect to a motor coil pin.
9
N.C.
10
P-GNDA
Power ground for chA output
11
OUT2A
Output pin 2 (chA)
12
S-GND
Signal ground
⎯
13
S-GND
Signal ground
⎯
14
OUT2B
Output pin 2 (chB)
15
P-GNDB
Power ground for chB output
16
N.C.
17
OUT1B
18
⎯
Remarks
⎯
⎯
Connect to a motor coil pin.
Connect to a motor coil pin.
⎯
⎯
⎯
Output pin 1 (chB)
Connect to a motor coil pin.
VCC
Power supply voltage input pin for motor drive (chB)
VCC (opr) = 10 V to 36 V
19
IN2B
Input pin used to set output current level (chB) 2
Input 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
20
IN1B
Input pin used to set output current level (chB) 1
Input 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
21
PWMB
Rotation direction control pin (chB)
Input 0-V/5-V signal; internal pull-down
resistor of 100 kΩ (typ.).
22
CLD
Output signal pin of current limiter detection
23
VCC
Power supply voltage input pin
24
S-GND
⎯
VCC (opr) = 10 V to 36 V
⎯
Signal ground
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Electrical Characteristics (VCC = 24 V, Ta = 25°C)
Characteristics
Symbol
Test
Circuit
ICC1
ICC2
Supply current
ICC3
⎯
ICC4
Input voltage
Control
circuit
Hysteresis voltage
Input current
VINH
VINL
VIN (HYS)
IINH
VPWMH
Min
Typ.
Max
Stop mode
⎯
5.5
10
Forward/Reverse mode
⎯
5.0
9
Short brake mode
⎯
5.5
10
⎯
⎯
1.5
3
⎯
5.5
⎯
−0.2
⎯
0.8
(Design target only)
⎯
0.4
⎯
VIN = 5 V
30
50
75
VIN = 0 V
⎯
⎯
5
⎯
2.3
⎯
5.5
⎯
−0.2
⎯
0.8
(Design target only)
⎯
0.4
⎯
VPWM = 5 V
30
50
75
VPWM = 0 V
⎯
⎯
5
Duty: 50 %
⎯
⎯
100
kHz
⎯
2.0
⎯
⎯
μs
⎯
2.3
⎯
5.5
⎯
−0.2
⎯
0.8
0.4
⎯
⎯
VPWML
Hysteresis voltage
PWM input
circuit
Input current
VPWM (HYS)
IPWMH
⎯
⎯
IPWML
PWM frequency
Minimum clock pulse
width
Input voltage
fPWM
⎯
tw(PWM)
VINSH
⎯
VINSL
Standby
circuit
Hysteresis voltage
Input current
VIN (HYS)
IINSH
⎯
⎯
IINSL
Output ON resistance
Output leakage current
Diode forward voltage
Internal reference voltage
Output signal of current limiter
detection
Offset time for current limiter
Thermal shutdown circuit operating
temperature
Ron (U+L)
IL (U)
IL (L)
VF (U)
VF (L)
⎯
⎯
⎯
mA
2.3
⎯
⎯
Unit
⎯
Standby mode
IINL
Input voltage
Test Condition
(Design target only)
VIN = 5 V
30
50
75
VIN = 0 V
⎯
⎯
5
IO = 0.2 A
⎯
1.5
2.0
IO = 1.5 A
⎯
1.5
2.0
VCC = 40 V
⎯
⎯
10
VCC = 40 V
⎯
⎯
10
IO = 1.5 A
⎯
1.3
2.0
IO = 1.5 A
⎯
1.3
2.0
Ireg = 1 mA
4.75
5
5.25
4.25
⎯
Vreg
⎯
⎯
0.5
V
μA
V
μA
V
μA
Ω
μA
V
Vreg
⎯
VCLDH
⎯
VCLDL
⎯
ISD (OFF)
⎯
(Design target only)
⎯
50
⎯
μs
TSD
⎯
(Design target only)
⎯
160
⎯
°C
IO = 50 μA
5
V
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TB6561NG
Input/Output Function
Input
Output
IN1
IN2
SB
H
H
H
L
H
H
H
L
H
L
L
H
H/L
H/L
L
PWM
OUT1
OUT2
Mode
L
L
Short brake
H
L
H
CW/CCW
L
L
L
Short brake
H
H
L
CCW/CW
L
L
L
Short brake
H
OFF
(High-impedance)
Stop
OFF
(High-impedance)
Standby
H
L
L
H
L
Current Limiter Detection Circuit (CLD)
The CLD pin outputs the states of the current limiter and thermal shutdown circuits. If the current limiter
for either channel A or B or the thermal shutdown circuit (shared for both channels) operates, the CLD pin
state changes from low (normal state) to high.
The CLD circuit supports automatic recovery; its output returns to low once the current decreases to a
value below the limit or once the thermal shutdown state is released.
Mode
CLD Output
Under TSD operation and
current detection
H
Normal
L
＜When current limiter operated＞
ILIM
Output current
0
10 μs
(typ.)
Not detected
OFF time
OFF time
50 μs
(typ.)
50 μs
(typ.)
10 μs
(typ.)
H
CLD output
L
160℃(typ.)
Chip temperature
120℃(typ.)
TSD
H
CLD output
L
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TB6561NG
•
PWM control function
Applying a PWM signal of 0/5 V to the PWM pin allows motor speed control.
The IC enters CW (CCW) mode and short brake mode alternately in PWM current control.
To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in
the output stage, a dead time is internally generated for 500 ns (target spec) when switching the upper
and lower transistors.
Therefore, synchronous rectification for high efficiency in PWM current control can be achieved without
an off-time that is generated via an external input.
Even when toggling between CW and CCW modes, and CW (CCW) and short brake modes, the off-time
is not required due to the internally generated dead time.
VCC
OUT1
VCC
M
OUT1
VCC
M
OUT1
P-GND
M
P-GND
P-GND
PWM ON → OFF
t2 = 500 ns (typ.)
PWM ON
t1
PWM OFF
t3
VCC
VCC
OUT1
OUT1
M
M
P-GND
P-GND
PWM OFF → ON
t4 = 500 ns (typ.)
PWM ON
t5
VCC
t1
t5
Output voltage
waveform
(OUT1)
t3
P-GND
t2
t4
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TB6561NG
1. Thermal Shutdown Circuit (TSD)
The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 160°C (typ.),
the output transistors are turned off.
After 50 μs (typ.), the output transistors are turned on automatically.
The IC has 40°C of temperature hysteresis.
TSD = 160°C (target spec)
ΔTSD = 40°C (target spec)
2. Overcurrent Protection Circuit (ISD)
The IC incorporates an overcurrent protection circuit to detect voltage that flows through the output
transistors. The overcurrent threshold is 2.5 A (typ.).
Currents that flow through the output transistors are monitored individually. If overcurrent is detected in
at least one of the transistors, all transistors are turned off.
The IC incorporates a timer to count 50 μs (typ.) for which the transistors are off. After 50 μs, they are
turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent false
detection due to glitch, the circuit turns off the transistors only when current that exceeds the overcurrent
threshold flows for 10 μs or longer.
ILIM
Output current
0
50 μs
(typ.)
10 μs
(typ.)
50 μs
(typ.)
10 μs
(typ.)
Not detected
The over-current threshold is a target spec. It varies in a range from approximately 1.5 A to 3.5 A.
•
These protection features are provided to temporarily avoid abnormal conditions such as output short circuits
and are not guaranteed to prevent the IC from being damaged.
• These features do not operate outside the guaranteed operating ranges and the IC may be permanently
damaged in case of output short circuits.
• The overcurrent protection is only provided to protect the IC from temporary short circuits. If a short-circuit
condition persists for a long time, it may cause excessive stress and damage to the IC. The protection system
should be configured so that any overcurrent condition will be eliminated as soon as possible.
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TB6561NG
PD – Ta
4
PD MAX (W)
① Single unit Rth(j-a) = 90°C/W
② At substrate installation
50 mm × 50 mm × 1.6 mm
Copper foil area 70%
3
POWER DISSIPATION
②
2
①
1
0
0
25
50
75
100
AMBIENT TEMPERATURE
125
Ta
2.0
VCE(sat)
(V)
2.0
1.5
SATURATION VOLTAGE
(V)
VCE(sat)
(°C)
OUTPUT LOWER SIDE Iout – VCE(sat)
OUTPUT UPPER SIDE Iout – VCE(sat)
SATURATION VOLTAGE
150
1.0
0.5
0
0
0.25
0.50
0.75
1.00
OUTPUT CURRENT Iout
1.25
1.50
(A)
1.5
1.0
0.5
0
0
0.25
0.50
0.75
1.00
OUTPUT CURRENT Iout
9
1.25
1.50
(A)
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TB6561NG
Application Circuit
(Note 1)
VDD
C1
C2
(Note 5)
2
Vreg
(Note 3)
23
VCC
7
24 V
(Note 2)
5V
18
VCC VCC
PORT1
3 SB
OUT1A 8
PORT2
4 PWMA
OUT2A 11
PORT3
5 IN1A
PORT4
6 IN2A
PORT5
21 PWMB
PORT6
20 IN1B
PORT7
19 IN2B
Motor
P-GNDA 10
(Note 4)
TB6561NG
OUT1B 17
Motor
OUT2B 14
P-GNDB 15
GND
CLD
S-GND
22
1, 12, 13, 24
(Note 4)
Microcontroller
Note 1: A power supply capacitor should be connected between VCC and P-GND as close as possible to the IC.
Note 2: C2 should be connected as close as possible to S-GND.
Note 3: When the power is turned on, set SB for low (standby mode) or IN1 and IN2 for low (stop mode).
Note 4: Avoid connecting the resistor to detect the motor current. If necessary, connect the resistor to VCC line.
Note 5: VCC (7 pin, 18 pin, and 23 pin) should be shorted externally.
Caution for using
•
Utmost care is necessary in the design of the output, VCC, and GND lines since the IC may be destroyed by
short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting
between contiguous pins.
•
The IC may be destroyed when mounted in the wrong orientation. Thus, please mount it with great care.
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TB6561NG
Package Dimensions
Weight: 1.62 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
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TB6561NG
Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect
ICs under all circumstances. If the Over current protection circuits operate against the over current,
clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before
operation. In addition, depending on the method of use and usage conditions, if over current
continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
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in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
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LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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