TB6600FG
TOSHIBA BiCD Integrated Circuit
Silicon Monolithic
TB6600FG
PWM Chopper-Type bipolar
Stepping Motor Driver IC
The TB6600FG is a PWM chopper-type single-chip bipolar sinusoidal
micro-step stepping motor driver.
Forward and reverse rotation control is available with 2-phase,
1-2-phase, W1-2-phase, 2W1-2-phase, and 4W1-2-phase excitation
modes.
2-phase bipolar-type stepping motor can be driven by only clock signal
with low vibration and high efficiency.
TB6600FG
Features
•
Single-chip bipolar sinusoidal micro-step stepping motor driver
•
Ron (upper + lower) = 0.4 Ω (typ.)
•
Forward and reverse rotation control available
•
Selectable phase drive (1/1, 1/2, 1/4, 1/8, and 1/16 step)
•
Output withstand voltage: Vcc = 50 V
•
Output current: IOUT = 4.5 A (absolute maximum ratings, peak)
•
Packages:HQFP64-P-1010-0.50
•
Built-in input pull-down resistance: 100 kΩ (typ.),
•
Output monitor pins (ALERT): Maximum of IALERT = 1 mA
Weight:
HQFP64-P-1010-0.50 : 0.26g( typ.)
IOUT = 4.0 A (operating range, maximal value)
•
(only TQ terminal: 70 kΩ(typ.))
Output monitor pins (MO): Maximum of IMO = 1 mA
•
Equipped with reset and enable pins
•
Stand by function
•
Single power supply
•
Built-in thermal shutdown (TSD) circuit
•
Built-in under voltage lock out (UVLO) circuit
•
Built-in over-current detection (ISD) circuit(＊)
＊：Regarding ISD (over-current detection)：
Current that flows through output power MOSFETs are monitored individually. If the current exceeds
the over-current detection value in at least one of the eight output power MOSFETs, over-current is
detected and then L level is outputted as an ALERT signal. In this case, all output power MOSFETs
are turned off. However, always add a fuse in the power supply line because IC can be broken due to
the current being over absolute maximum ratings.
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TB6600FG
Pin Functions
Pin No.
I/O
Symbol
Functional Description
43
Output
ALERT
TSD / ISD monitor pin
45
―
SGND
Signal ground
47
Input
TQ
49
Input
Latch/Auto
Remark
Pull-up by external resistance
Torque (output current) setting input pin
Select a return type for TSD.
L: Latch, H: Automatic return
51
Input
Vref
Voltage input for 100% current level
53,54,55,56
Input
Vcc
Power supply
58
Input
M1
Excitation mode setting input pin
59
Input
M2
Excitation mode setting input pin
60
Input
M3
Excitation mode setting input pin
1,64
Output
OUT2B
3,4
―
NFB
6,7
Output
OUT1B
B channel output 1
8
―
PGNDB
Power ground
10,11
Output
OUT2A
13,14
―
NFA
16,17
Output
OUT1A
A channel output 1
20
―
PGNDA
Power ground
22
Input
ENABLE
Enable signal input pin
H: Enable, L: All outputs off
Reset signal input pin
L: Initial mode
B channel output 2
B channel output current detection pin
A channel output 2
A channel output current detection pin
23
Input
RESET
25,26,27,28
Input
Vcc
Power supply
30
Input
CLK
CLK pulse input pin
32
Input
CW/CCW
34
―
OSC
Resistor connection pin for internal
oscillation setting
36
Output
Vreg
Control side connection pin for power
capacitor
Connecting capacitor to
SGND
38
Output
MO
Electrical angle monitor pin
Pull-up by external resistance
Forward/reverse control pin
L: CW, H:CCW
NC pins : 2,5,9,12,15,18,19,21,24,29,31,33,35,37,39,40,41,42,44,46,48,50,52,57,61,62,63
Pins which have the same symbol should be connected each other outside the IC.
NC pins are excluded from applying ESD because they don’t connect to anything in the IC.
< Terminal circuits>
Input pins
(M1, M2, M3,CLK, CW/CCW,
ENABLE, RESET, Latch/Auto)
Input pins
(TQ)
VDD
10k Ω
10kΩ
100kΩ
70kΩ
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TB6600FG
(NC)
TQ
(NC)
SGND
(NC)
A LE RT
(NC)
(NC)
(NC)
(NC)
MO
(NC)
V re g
(NC)
OSC
(NC)
Pin Assignment
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Latch/Auto
49
32
CW/CCW
(NC)
50
31
(NC)
Vref
51
30
CLK
(NC)
52
29
(NC)
Vcc
53
28
Vcc
Vcc
54
27
Vcc
Vcc
55
26
Vcc
Vcc
56
25
Vcc
(NC)
57
24
(NC)
M1
58
23
RESET
M2
59
22
ENABLE
M3
60
21
(NC)
(NC)
61
20
PGNDA
(NC)
62
19
(NC)
(NC)
63
18
(NC)
OUT2B
64
17
OUT1A
TB6600FG
3
N FB
(NC)
OUT1 B
OUT1 B
10
11
12
13
14
15
16
OUT1 A
N FB
9
(NC)
(NC)
8
N FA
7
N FA
6
(NC)
5
OUT2 A
4
OUT2 A
3
(NC)
2
PGNDB
1
OUT2 B
(Top View)
2014-03-03
TB6600FG
Block Diagram
M1
58
Vreg
MO
36
38
ALERT
Vcc
43
25,26,27,28,53,54,55,56
OUT1A
Reg(5V)
16,17
Pre
M2
59
M3
60
CW/CCW
32
CLK
30
RESET
23
ENABLE
22
-drive
10,11
OUT2A
TSD / ISD / UVLO
13,14
Input
circuit
6,7
-drive
49
Vref
34
51
OSC
1/3
100%/30%
Current selector
circuit B
47
OUT1B
H-Bridge
driver B
1,64
OSC
NFA
Current selector
circuit A
Pre
Latch/Auto
H-Bridge
driver A
3,4
45
20
8
SGND
PGNDA
PGNDB
OUT2B
NFB
TQ
Setting of Vref
Input
TQ
Voltage ratio
L
30%
H
100%
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TB6600FG
Description of Functions
1. Excitation Settings
The excitation mode can be selected from the following eight modes using the M1, M2 and M3 inputs. New
excitation mode starts from the initial mode when M1, M2, or M3 inputs are shifted during motor operation.
In this case, output current waveform may not continue.
Input
Mode
(Excitation)
M1
M2
M3
L
L
L
L
L
H
L
H
L
L
H
H
H
L
L
1/4 (W1-2 phase excitation)
H
L
H
1/8 (2W1-2 phase excitation)
H
H
L
1/16 (4W1-2 phase excitation)
H
H
H
Standby mode
(Operation of the internal circuit is almost turned off.)
1/1 (2-phase excitation, full-step)
1/2A type (1-2 phase excitation A type)
( 0%, 71%, 100% )
1/2B type (1-2 phase excitation B type)
( 0%, 100% )
Standby mode
(Operation of the internal circuit is almost turned off.)
Note: To change the exciting mode by changing M1, M2, and M3, make sure not to set M1 = M2 = M3 = L or M1 = M2 =
M3 = H.
Standby mode
The operation mode moves to the standby mode under the condition M1 = M2 = M3 = L or M1 = M2 = M3
= H.
The power consumption is minimized by turning off all the operations except protecting operation.
In standby mode, output terminal MO is HZ.
Standby mode is released by changing the state of M1=M2=M3=L and M1=M2=M3=H to other state.
Input signal is not accepted for about 200 μs after releasing the standby mode.
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TB6600FG
2. Function
(1)To turn on the output, configure the ENABLE pin high. To turn off the output, configure the ENABLE
pin low.
(2) The output changes to the Initial mode shown in the table below when the ENABLE signal goes High
level and the RESET signal goes Low level. (In this mode, the status of the CLK and CW/CCW pins are
irrelevant.)
(3) As shown in the below figure of Example 1, when the ENABLE signal goes Low level, it sets an OFF on
the output. In this mode, the output changes to the initial mode when the RESET signal goes Low level.
Under this condition, the initial mode is output by setting the ENABLE signal High level. And the motor
operates from the initial mode by setting the RESET signal High level.
(Example 1)
（例1）
CLK
RESET
ENABLE
Internal
current set
内部電流設定
Output current(*)
出力電流(A相)
(phase A )
Z
(*: Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)
Input
CLK
Output mode
CW/CCW
RESET
ENABLE
L
H
H
CW
H
H
H
CCW
X
X
L
H
Initial mode
X
X
X
L
Z
6
Command of the standby has a higher priority
than ENABLE. Standby mode can be turned on
and off regardless of the state of ENABLE.
X:
Don’t Care
2014-03-03
TB6600FG
3. Initial Mode
When RESET is used, the phase currents are as follows.
Excitation Mode
Phase A Current
Phase B Current
1/1 (2-phase excitation, full-step)
100%
-100%
1/2A type (1-2 phase excitation A type) (0%, 71%, 100%)
100%
0%
100%
0%
1/4 (W1-2 phase excitation)
100%
0%
1/8 (2W1-2 phase excitation)
100%
0%
1/16 (4W1-2 phase excitation)
100%
0%
1/2B type (1-2 phase excitation B type) (0%, 100%)
Current direction is defined as follows.
OUT1A → OUT2A: Forward direction
OUT1B → OUT2B: Forward direction
4. 100% current settings (Current value)
100% current value is determined by Vref inputted from external part and the external resistance for
detecting output current. Vref is doubled 1/3 inside IC.
Io (100%) = (1/3 × Vref) ÷ RNF
The average current is lower than the calculated value because this IC has the method of peak current
detection.
Please use the IC under the conditions as follows;
0.11Ω ≤ RNF ≤ 0.5Ω, 0.3V ≤ Vref ≤ 1.95V
5.
OSC
Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC terminal.
Rosc should be from 30kΩ to 120kΩ. The relation of Rosc and fchop is shown in below table and figure. The
values of fchop of the below table are design guarantee values. They are not tested for pre-shipment.
Rosc(kΩ)
fchop(kHz)
Min
Typ.
Max
30
-
60
-
51
-
40
-
120
-
20
-
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TB6600FG
6. Decay Mode
It takes approximately five OSCM cycles for charging-discharging a current in PWM mode. The 40% fast
decay mode is created by inducing decay during the last two cycles in Fast Decay mode.
The ratio 40% of the fast decay mode is always fixed.
The relation between the master clock frequency (fMCLK), the OSCM frequency (fOSCM) and the PWM
frequency (fchop) is shown as follows:
fOSCM = 1/20 ×fMCLK
fchop = 1/100 ×fMCLK
When Rosc=51kΩ, the master clock=4MHz, OSCM=200kHz, the frequency of PWM(fchop)=40kHz.
6-1.
Current Waveform and Mixed Decay Mode settings
The period of PWM operation is equal to five periods of OSCM.
The ratio 40% of the fast decay mode is always fixed.
The “NF” refers to the point at which the output current reaches its predefined current level.
MDT means the point of MDT (MIXED DECAY TIMMING) in the below diagram.
fchop
OSCM
Internal
Waveform
Predefined Current Level
40%
fast
Decay
Mode
NF
MDT
Charge mode → NF: Predefined current level → Slow mode →
MDT(Mixed decay timing) → Fast mode → Current monitoring →
(When predefined current level ＞ Output current) Charge mode
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TB6600FG
6-2. Effect of Decay Mode
•
Increasing the current (sine wave)
Predefined
Current Level
Predefined
Current Level
Slow
Charge
•
Slow
Fast
Slow
Slow
Fast
Fast
Charge
Charge
Fast
Charge
Decreasing the current (In case the current is decreased to the predefined value in a short time because
it decays quickly.)
Predefined
Current Level
Slow
Charge
Slow
Fast
Fast
Charge
Predefined
Current Level
Slow
Slow
Fast
Charge
Fast
Charge
Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.
•
Decreasing the current (In case it takes a long time to decrease the current to the predefined value
because the current decays slowly.)
Predefined
Current Level
Slow
Slow
Fast
Fast
Charge
Slow
Fast
Slow
Predefined
Current Level
Charge
Fast
Charge
Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.
During Mixed Decay and Fast Decay modes, if the predefined current level is less than the output current at
the RNF (current monitoring point), the Charge mode in the next chopping cycle will disappear (though the
current control mode is briefly switched to Charge mode in actual operations for current sensing) and the
current is controlled in Slow and Fast Decay modes (mode switching from Slow Decay mode to Fast Decay
mode at the MDT point).
Note: The above figures are rough illustration of the output current. In actual current waveforms, transient response
curves can be observed.
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TB6600FG
6-3.
Current Waveforms in Mixed Decay Mode
fchop
fchop
OSCM
Internal
waveform
Predefined Current Level
IOUT
NF
Predefined
Current Level
NF
40%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING) points
•
When the NF points come after Mixed Decay Timing points
fchop
Switches to Fast mode after Charge mode
fchop
IOUT
MDT (MIXED DECAY TIMMING) points
Predefined
Current Level
NF
Predefined
Current Level
NF
40%
Fast
DECAY
MODE
CLK signal input
•
When the output current value > predefined current level in Mixed Decay mode
fchop
Predefined
Current
Level
fchop
fchop
NF
IOUT
NF
Predefined Current
Level
40%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING) points
CLK signal input
Even if the output current rises above the predefined current at the
RNF point, the current control mode is briefly switched to Charge
mode for current sensing.
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TB6600FG
Output Stage Transistor Operation Mode
Vcc
Vcc
U1
ON
Note
OUT1
U2
U1
OFF
OFF
Note
Load OUT2
OUT1
OFF
ON
ON
L1
L2
L1
Vcc
U2
U1
OFF
OFF
ON
L1
OFF
RNF
PGND
Charge Mode
L2
ON
RNF
PGND
ON
Note
OUT1 Load OUT2
Load OUT2
L2
RNF
U2
PGND
Slow Mode
Fast Mode
Output Stage Transistor Operation Functions
CLK
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: The above chart shows an example of when the current flows as indicated by the arrows in the above figures.
If the current flows in the opposite direction, refer to the following chart:
CLK
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
Upon transitions of above-mentioned functions, a dead time of about 300 ns (Design guarantee value) is inserted
respectively.
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TB6600FG
Thermal Shut-Down circuit (TSD)
(1) Automatic return
TSD = 160°C (typ.) (Note)
TSDhys = 70°C (typ.) (Note)
160°C (typ.) (Note)
Junction temperature (Chip temperature)
90°C (typ.) (Note)
Output state
ALERT output
Output on
Output off
Output on
H
L
Automatic return has a temperature hysteresis shown in the above figure.
In case of automatic return, the return timing is adjusted at charge start of fchop after the temperature falls to the
return temperature (90°C (typ.) in the above figure).
The return period after the temperature falls corresponds to one cycle to two cycles of fchop.
(2) Latch type
TSD = 160°C (typ.)
160°C (typ.)
(*)Output
current starts rising at the
timing of PWM frequency just after
ENABLE pin outputs high.
(Note)
(Note)
(*)
Junction temperature (Chip temperature)
Output state
ALERT output
Output on
Output off
Output on
H
L
ENABLE input
H
L
0.3ms or more when Rosc=51kΩ
The operation returns by programming the ENABLE as H → L → H shown in above figure or turning on power
supply and turning on UVLO function. In this time, term of L level of ENABLE should be 0.3ms or more.
To recover the operation, the junction temperature (the chip temperature) should be 90°C or less when ENABLE
input is switched from L to H level. Otherwise, the operation does not recover.
Note: Pre-shipment testing is not performed.
･State of internal IC when TSD circuit operates.
The states of the internal IC and outputs, while the shutdown circuit is operating, correspond to the state when
ENABLE is L.
The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to
rotate the motor from the initial state.
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TB6600FG
Latch/Auto is an input pin for determining the return method of TSD.
If Latch/Auto pin outputs low, TSD function returns by either of turning on power supply again or programming
the ENABLE as H → L → H.
If Latch/Auto pin outputs high, it returns automatically.
In standby mode, TSD function returns automatically regardless of the state of the Latch/Auto pin.
When power supply voltage Vcc is less than 8V, TSD function cannot operate regardless of the state of the
Latch/Auto pin.
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TB6600FG
ISD (Over current detection)
Current that flows through output power MOSFETs are monitored individually. If the current exceeds the
over-current detection value in at least one of the eight output power MOSFETs, over-current is detected
and then L level is outputted as an ALERT signal. In this case, all output power MOSFETs are turned off.
However, always add a fuse in the power supply line because IC can be broken due to the current being
over absolute maximum ratings.
Masking term of 1μs or more (typ. when Rosc=51kΩ) (Note) should be provided in order to protect detection
error by noise. ISD does not work during the masking term.
Over current detection value
ISD=6.5 A
(Note)
(*)Output
current starts rising at the
timing of PWM frequency just after
ENABLE pin outputs high.
(*)
6.5A (typ.)
DMOS
Power transistor current
Dead band
1μs or more(typ.)
Output state
ALERT output
Output on
Output off
Output on
H
L
ENABLE input
H
L
0.3ms or more when Rosc=51kΩ
The operation returns by programming the ENABLE as H → L → H shown in above figure or turning
on power supply and turning on UVLO function.
Note: Pre-shipment testing is not performed.
･State of internal IC when ISD circuit operates.
The states of the internal IC and outputs, while the over current detection circuit is operating, correspond to
the state when ENABLE is L.
The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to
rotate the motor from the initial state.
Return method of ISD
ISD function returns by either of turning on power supply again or programming the ENABLE as H → L →
H regardless of the state of the Latch/Auto pin.
In standby mode, ISD function cannot operate.
When power supply voltage Vcc is less than 8V, ISD function cannot operate.
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TB6600FG
Under Voltage Lock Out (UVLO) circuit
Outputs are shutoff by operating at 5.5 V (Typ.) of Vcc or less.
It has a hysteresis of 0.5 V (Typ.) and returns to output when Vcc reaches 6.0 V (Typ.). The following values are
design guarantee values.
･State of internal IC when UVLO circuit operates.
The states of the internal IC and outputs correspond to the state in the ENABLE mode and the initial mode at
the same time.
After a return, it can start from the initial mode.
When Vcc falls to around 5.5 V and UVLO operates, output turns off.
It recovers automatically from the initial mode when both Vcc rise to around 6.0 V or more. The following
values are design guarantee values.
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TB6600FG
ALERT output
ALERT terminal outputs low in detecting either TSD or ISD.
ALERT terminal is connected to power supply externally via pull-up resistance.
VALERT = 0.5 V (max) at 1 mA
TSD
ISD
Under TSD detection
Under ISD detection
Normal
Under ISD detection
Under TSD detection
Normal
Normal
Normal
ALERT
Low
Z
Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.
MO output
MO turns on at the predetermined state and output low.
MO terminal is connected to power supply externally via pull-up resistance.
VMO = 0.5 V (max) at 1 mA
State
MO
Initial
Low
Not initial
Z
Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.
(To pull-up resistance)
(To Vreg in the IC)
Voltage pull-up of MO and ALERT pins
･It is recommended to pull-up voltage to Vreg pin.
･In case of pull-up to except 5 V (for instance, 3.3 V etc.), it is recommended to use other power supply (ex. 3.3 V)
while Vcc output between the operation range. When Vcc decreases lower than the operation range and Vreg
decreases from 5 V to 0 V under the condition that other power supply is used to pull-up voltage, the current
continues to conduct from other power supply to the IC inside through the diode shown in the figure. Though this
phenomenon does not cause destruction and malfunction of the IC, please consider the set design not to continue
such a state for a long time.
･As for the pull-up resistance for MO and ALERT pins, please select large resistance enough for the conducting
current so as not to exceed the standard value of 1 mA.
Please use the resistance of 30 kΩ or more in case of applying 5 V, and 20 kΩ or more in case of applying 3.3 V.
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TB6600FG
Sequence and current level in each excitation mode
1/1-step Excitation Mode (M1: L, M2: L, M3: H, CW Mode)
CLK
MO
(%)
100
IA
0
−100
(%)
100
IB
0
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
1/1-step Excitation Mode (M1: L, M2: L, M3: H, CCW Mode)
CLK
MO
(%)
100
IA
0
−100
(%)
100
IB
0
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CW Mode)
CLK
MO
(%)
100
71
IA
0
−71
−100
(%)
100
71
IB
0
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CCW Mode)
CLK
MO
(%)
100
71
IA
0
−71
−100
(%)
100
71
IB
0
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CW Mode)
CLK
MO
(%)
100
IA
0
−100
(%)
100
IB
0
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CCW Mode)
CLK
MO
(%)
100
IA
0
−100
(%)
100
71
IB
0
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/4-step Excitation Mode (M1: H, M2: L, M3: L, CW Mode)
CLK
MO
(%)
100
92
71
38
IA
0
−38
−71
−92
−100
(%)
100
92
71
38
IB
0
−38
−71
−92
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
t16
t12
t13
t14
t15
t16
1/4-step Excitation Mode (M1: H, M2: L, M3: L, CCW Mode)
CLK
MO
(%)
100
92
71
38
IA
0
−38
−71
−92
−100
(%)
100
92
71
38
IB
0
−38
−71
−92
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
It operates from the initial state after the excitation mode is switched.
20
2014-03-03
TB6600FG
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)
CLK
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)
CLK
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/16-step Excitation Mode (M1: H, M2: H, M3: L, CW Mode)
CLK
MO
[%]
100
98
96
92
88
83
77
71
63
IA
56
47
IB
38
29
20
10
0
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/16-step Excitation Mode (M1: H, M2: H, M3: L, CCW Mode)
CLK
MO
[%]
100
98
96
92
88
83
77
71
63
IA
56
47
IB
38
29
20
10
0
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64
It operates from the initial state after the excitation mode is switched.
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2014-03-03
TB6600FG
Current level
2-phase, 1-2-phase, W1-2-phase, 2W1-2-phase, 4W1-2-phase excitation (unit: %)
Current level (1/16, 1/8, 1/4, 1/2, 1/1 )
1/16,
1/8, 1/4,
1/2, 1/1
θ16
θ15
θ14
θ13
θ12
θ11
θ10
θ9
θ8
θ7
θ6
θ5
θ4
θ3
θ2
θ1
θ0
Min.
Typ.
Max.
Unit
--95.5
94.1
91.7
88.4
84.2
79.1
73.3
66.7
59.4
51.6
43.1
34.3
25.0
15.5
5.8
---
100.0
99.5
98.1
95.7
92.4
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0.0
--100.0
100.0
99.7
96.4
92.2
87.1
81.3
74.7
67.4
59.6
51.1
42.3
33.0
23.5
13.8
---
％
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2014-03-03
TB6600FG
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Power supply voltage
Output current (per one phase)
Drain current (ALERT, MO)
Symbol
Rating
Unit
Vcc
50
V
4.5
A
1
mA
6
V
IO
(PEAK)
I (ALERT)
I (MO)
Input voltage
VIN
Power dissipation
PD
Operating temperature
Topr
-30 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
Note 1:
Ta = 25°C, with soldered leads.
Note 2:
Ta = 25°C, when mounted on a board
1.7 (Note 1)
4.2 (Note 2)
W
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the ratings may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
Please use the IC within the specified operating ranges.
Operating Range (Ta = −30 to 85°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Power supply voltage
Vcc
―
8.0
―
42
Output current
IOUT
―
―
―
4.0
A
VIN
―
0
―
5.5
V
Vref
―
0.3
―
1.95
V
Clock frequency in logical part
fCLK
―
―
―
200
kHz
Chopping frequency
fchop
20
40
60
kHz
Input voltage
Note:
See page 7.
Unit
V
Two Vcc terminals should be programmed the same voltage.
The maximum current of the operating range can not be necessarily conducted depending on various
conditions because output current is limited by the power dissipation PD.
Make sure to avoid using the IC in the condition that would cause the temperature to exceed Tj (avg.)
=107°C.
The power supply voltage of 42 V and the output current of 4.5 A are the maximum values of operating range.
Please design the circuit with enough derating within this range by considering the power supply variation, the
external resistance, and the electrical characteristics of the IC. In case of exceeding the power supply voltage
of 42 V and the output current of 4.5 A, the IC will not operate normally.
26
2014-03-03
TB6600FG
Electrical Characteristics (Ta = 25°C, Vcc = 24 V)
Characteristic
Symbol
High
Input voltage
VIN (H)
Low
VIN (L)
Input hysteresis voltage
M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto, TQ
Input current
Min
Typ.
Max
2.0
―
5.5
-0.2
―
0.8
―
400
―
―
50
75
TQ,
―
70
105
VIN = 5.0 V
IIN (L)
M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto, TQ
VIN = 0 V
―
―
1
Icc1
Output open,
RESET: H, ENABLE: H､
M1:L, M2:L, M3:H (1/1-step mode)
CLK:L
―
4.2
7
Icc2
Output open,
RESET: L, ENABLE: L
M1:L, M2:L, M3:H (1/1-step mode)
CLK:L
―
3.6
7
Vcc supply current
Unit
V
M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto
VIN = 5.0 V
VH
IIN (H)
Vref input
circuit
Test Condition
mV
μA
mA
Icc3
Standby mode (M1:L, M2:L, M3:L)
―
1.8
4
Current limit
voltage
VNF
Vref = 3.0 V(Note 1), TQ=H
0.9
1.0
1.1
V
Input current
IIN(Vref)
Vref = 3.0 V(Note 1)
―
―
1
μA
Divider ratio
Vref/VNF
Maximum current: 100%, TQ=H
―
3
―
―
CLK
2.2
―
―
μs
IOL = 1 mA
―
―
0.5
V
Minimum CLK pulse width
Output residual voltage
twCLKH
twCLKL
VOL MO
VOL ALERT
Internal constant voltage
Vreg
External capacitor = 0.1 μF
(in standby mode)
4.5
5.0
5.5
V
Chopping frequency
fchop
Rosc=51kΩ
28
40
52
kHz
Note 1: Though Vref of the test condition for pre-shipment is 3.0V, make sure to configure Vref within the operating
range which is written in page 26 in driving the motor.
Electrical Characteristics (Ta = 25°C, Vcc = 24 V)
Characteristic
Output ON resistor
Test Condition
Ron U + Ron L
Output transistor switching characteristics
Output leakage
current
Symbol
tr
VNF = 0 V, Output: Open
tf
Upper side
ILH
Lower side
ILL
IOUT = 4 A
Vcc = 50 V
27
Min
Typ.
Max
Unit
―
0.4
0.6
Ω
―
50
―
―
500
―
―
―
5
―
―
5
ns
μA
2014-03-03
TB6600FG
Timing Waveforms and Names
CLK
twCLKH
twCLKH
twCLKL
Figure 1 Timing Waveforms and Names
Vcc
90%
90%
OUT1A, OUT2A,
OUT1B, OUT2B
GND
10%
10%
tr
tf
Figure 2 Timing Waveforms and Names
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TB6600FG
Power Dissipation
TB6600FG
PD - Ta
(1) With soldered leads.
Power dissipation PD (W)
(2) When mounted on a board
Ambient temperature Ta (°C)
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TB6600FG
How to Turn on the Power
In applying Vcc or shutdown, ENABLE should be Low.
See Example 1(ENABLE = High → RESET = High) and Example 2(RESET = High → ENABLE = High) as
follows. In example 1, a motor can start driving from the initial mode.
[1]
[2]
CLK
: Current step proceeds to the next mode with respect to every rising edge of CLK.
ENABLE : It is in Hi-Z state in low level. It is output in high level.
RESET : It is in the initial mode (Phase A=100% and Phase B=0%) in low level.
(1)ENABLE=Low and RESET=Low: Hi-Z. Internal current setting is in initial mode.
(2)ENABLE=Low and RESET=High: Hi-Z. Internal current setting proceeds by internal counter.
(3)ENABLE=High and RESET=Low: Output in the initial mode (Phase A=100% and Phase B=0%).
(4)ENABLE=High and RESET=High: Output at the value which is determined by the internal counter.
(Example 1)
（例1）
CLK
RESET
ENABLE
Internal
current set
内部電流設定
Output current (*)
出力電流(A相)
(Phase A)
Z
(Example
（例2）2)
CLK
RESET
ENABLE
Internal current set
内部電流設定
Output current (*)
(Phase A)
出力電流(A相)
Z
(*：Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)
30
2014-03-03
TB6600FG
Application Circuit
0.1μF
0.1μF
Vreg
MO
ALERT
47μF
fuse
24V
Vcc
OUT1A
Reg (5V)
M1
Pre
M2
-drive
H-Bridge
driver A
M3
MCU
CW/CCW
OUT2A
Control
logic
NFA
TSD/ISD/UVLO
0.2Ω
CLK
Current selector
circuit A
RESET
24V
Pre
ENABLE
-drive
H-Bridge
driver B
OUT1B
Latch/Auto
TQ
Vref
OSC
OUT2B
100%/
30%
1/3
NFB
Current selector
circuit B
0.2Ω
OSC
51kΩ
SGND
31
PGNDA
PGNDB
2014-03-03
TB6600FG
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Capacitors for the power supply lines should be connected as close to the IC as possible.
Current detecting resistances (RNFA and RNFB) should be connected as close to the IC as possible.
Pay attention for wire layout of PCB not to allow GND line to have large common impedance.
External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this capacitor and
Vreg terminal and the wire between this capacitor and SGND not to be influenced by noise.
The IC may not operate normally when large common impedance is existed in GND line or the IC is easily
influenced by noise. For example, if the IC operates continuously for a long time under the circumstance of
large current and high voltage, the number of clock signals inputted to CLK terminal and that of steps of output
current waveform may not proportional. And so, the IC may not operate normally. To avoid this malfunction,
make sure to conduct Note.1 to Note.4 and evaluate the IC enough before using the IC.
Output current may be limited by excitation modes, ambient temperature or thermal performance conditions of
PCB and so on.
Make sure that the Junction temperature (Chip temperature) should not exceed Tjmax = 150°C, when you
design products. Do not use the IC under the condition that the Junction temperature (Chip temperature)
should not exceed Tjmax = 150°C, though the thermal shutdown circuit turns on under the abnormal
temperature condition.
Current that flows through output power MOSFETs are monitored individually. If the current exceeds the
over-current detection value in at least one of the eight output power MOSFETs, over-current is detected and
then L level is outputted as an ALERT signal. In this case, all output power MOSFETs are turned off. However,
always add a fuse in the power supply line because IC can be broken due to the current being over absolute
maximum ratings.
32
2014-03-03
TB6600FG
Package Dimensions
Weight: 0.26 g (typ.)
Note: The size of a backside heatsink is 5.5 mm × 5.5 mm.
33
2014-03-03
TB6600FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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2014-03-03
TB6600FG
Points to remember on handling of ICs
(1) Over current Detection Circuit
Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current detection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current detection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease
in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
(5) Short-circuiting between outputs, air contamination faults, faults due to improper grounding, short-circuiting
between contiguous pins
Utmost care is necessary in the design of the power supply lines, GND lines, and output lines since the IC may
be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,
or by short-circuiting between contiguous pins. They may destroy not only the IC but also peripheral parts and
may contribute to injuries for users. Over current may continue to flow in the IC because of this destruction
and cause smoke or ignition of the IC. Expect the volume of this over current and add an appropriate power
supply fuse in order to minimize the effects of the over current. Capacity of the fuse, fusing time, and the
inserting position in the circuit should be configured suitably.
35
2014-03-03
TB6600FG
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
36
2014-03-03
