TB6608FNG
TOSHIBA Bi−CD Integrated Circuit Silicon Monolithic
TB6608FNG
Stepping Motor Driver IC
The TB6608FNG is a PWM constant-current type stepping
motor driver IC designed for sinusoidal-input micro-step control of
stepping motors.
The TB6608FNG can be used in applications that require
2-phase, 1-2-phase, W1-2-phase and 2W1-2 phase excitation
modes. The TB6608FNG is capable of forward and reverse driving
of a 2-phase bipolar stepping motor using only a clock signal.
Features
•
•
Weight: 0.09 g (typ.)
Motor power supply voltage: VM = 15 V (max)
Control power supply voltage: VCC = 2.7 to 6 V
•
Output current: Iout ≤ 0.8 A (max)
•
Output ON-resistance: Ron = 1.5 Ω (upper and lower sum@VM = 5 V)
•
Decoder that enables microstep control with the clock signal
•
Selectable phase excitation modes (2, 1-2, W1-2 and 2W1-2)
•
Internal pull-down resistors on inputs: 200 kΩ (typ.)
•
Output monitor pin ( MO )
•
Thermal shutdown (TSD) and undervoltage lockout (UVLO) circuits
•
Small surface-mount package (SSOP20: 0.65 mm lead pitch)
•
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure
that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an
ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels.
•
Do not insert devices in the wrong orientation or incorrectly. Otherwise, it may cause the device breakdown,
damage and/or deterioration.
© 2014 TOSHIBA Corporation
1
2014-10-01
TB6608FNG
Block Diagram
GND
STBY
VCC
MO
15
2
1
16
STANBY
UVLO
2V
Predriver
H-bridge
A
M1 4
CK 20
RESET 14
11 AO2
PWM
timer
M2 5
CW/CCW 7
13 AO1
Decoder for
microstep
control
12 RFA
2
1-2
W1-2
2W1-2
phase
TSD
ENABLE 19
6 VM
DCY 18
Pre-
B.G
driver
Vref
2 switches
0.125 V, 0.5 V
TQ 17
H-bridge
B
10 BO1
8 BO2
PWM
timer
9 RFB
OSC 3
OSC
Vref Voltage Setting
Input
Vref
TQ
L
0.125 V
H
0.5 V
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2014-10-01
TB6608FNG
Pin Function
Pin No.
Symbol
1
VCC
2
Functional Description
Remarks
Power supply pin for logic block
VCC (opr) = 2.7 to 5.5 V
STBY
Standby input
See the Input Signals and Operating Modes table.
3
OSC
Connection pin for an external capacitor
used for internal oscillation
4
M1
Excitation mode setting input 1
See the Excitation Mode Settings table.
5
M2
Excitation mode setting input 2
See the Excitation Mode Settings table.
6
VM
Power supply pin for output
VM (opr) = 2.5 to 13.5 V
7
CW/CCW
Rotation direction select input
See the Input Signals and Operating Modes table.
8
BO2
B-phase output 2
Connect BO2 to a motor coil pin.
9
RFB
Connection pin for a B-phase output
current detection resistor
10
BO1
B-phase output 1
Connect BO1 to a motor coil pin.
11
AO2
A-phase output 2
Connect AO2 to a motor coil pin.
12
RFA
Connection pin for an A-phase output
current detection resistor
13
AO1
A-phase output 1
Connect AO1 to a motor coil pin.
14
RESET
Reset input
See the Input Signal and Operating Modes table.
15
GND
Ground
16
MO
Monitor output
Initial state: MO = Low (open drain, pulled up by an
external resistor)
17
TQ
Vref setting input
See the Vref Voltage Setting table.
18
DCY
Decay setting input
See the Fast-Decay Time Inserted During the Current
Decay Period table.
19
ENABLE
Enable input
See the Input Signal and Operating Modes table.
20
CK
Clock input
Pin Assignment
VCC
1
20
CK
STBY
2
19
ENABLE
OSC
3
18
DCY
M1
4
17
TQ
M2
5
16
MO
VM
6
15
GND
CW/CCW
7
14
RESET
BO2
8
13
AO1
RFB
9
12
RFA
BO1
10
11
AO2
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2014-10-01
TB6608FNG
Input Signals and Operation Modes
Inputs
CK
Operating Mode
CW/CCW
RESET
ENABLE
STBY
L
H
H
H
CW
H
H
H
H
CCW
X
X
L
H
H
Initial mode
X
X
X
L
H
Enable Wait mode (Outputs: high impedance)
X
X
X
X
L
Standby mode (Outputs: high impedance)
X: Don’t Care
Excitation Mode Settings
Inputs
Excitation Mode
M1
M2
L
L
2-phase
H
L
1-2-phase
L
H
W1-2-phase
H
H
2W1-2-phase
Initial A- and B-Phase Currents
(This table also applies to the currents on exit from standby mode.)
Excitation Mode
A-Phase Current
B-Phase Current
2-phase
100%
−100%
1-2-phase
100%
0%
W1-2-phase
100%
0%
2W1-2-phase
100%
0%
In this specification, the direction of current flows from AO1 to AO2 and from BO1 to BO2 are defined as the
forward direction.
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TB6608FNG
2-Phase Excitation (M1: L, M2: L, CW Mode)
IA
IB
2-Phase Excitation (M1: L, M2: L, CCW Mode)
CK
CK
MO
MO
(%)
100
(%)
100
0
IA
−100
−100
(%)
100
(%)
100
0
IB
−100
t1
t2
t3
t4
t5
t6
t7
t0
1-2-Phase Excitation (M1: H, M2: L, CW Mode)
IB
0
−100
t0
IA
0
t1
t2
t3
t4
t5
t6
t7
1-2-Phase Excitation (M1: H, M2: L, CCW Mode)
CK
CK
MO
MO
(%)
100
71
(%)
100
71
0
IA
0
−71
−100
−71
−100
(%)
100
71
(%)
100
71
0
IB
−71
−100
0
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
t0
5
t1
t2
t3
t4
t5
t6
t7
t8
2014-10-01
TB6608FNG
W1-2-Phase Excitation (M1: L, M2: H, CW Mode)
CK
MO
(%)
100
92
71
38
IA
0
−38
−71
−92
−100
(%)
100
92
71
38
IB
0
−38
−71
−92
−100
t0
t1
t2
t3
t4
t5
t6
t7
6
t8
t9
t10
t11
t12
t13
t14
t15
t16
2014-10-01
TB6608FNG
W1-2-Phase Excitation (M1: L, M2: H, CCW Mode)
CK
MO
(%)
100
92
71
38
IA
0
−38
−71
−92
−100
(%)
100
92
71
38
IB
0
−38
−71
−92
−100
t0
t1
t2
t3
t4
t5
t6
t7
7
t8
t9
t10
t11
t12
t13
t14
t15
t16
2014-10-01
TB6608FNG
2W1-2-Phase Excitation (M1: H, M2: H, CW Mode)
CK
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
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TB6608FNG
2W1-2-Phase Excitation (M1: H, M2: H, CCW Mode)
CK
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
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TB6608FNG
Output Current Vector Locus (Normalizing a single step to 90 degrees)
(Only when in 2-phase
excitation mode)
100
98
92
83
71
56
IA (%)
38
Solid line: Ideal value
Broken line: Calculated value
20
0
θ8 θ7 θ6 θ5 θ4 θ3 θ2 θ1
0
20
38
56
71
83
92 98 100
IB (%)
θ
Rotation Angle
Vector Length
Ideal
Calculated
Ideal
θ0
0.00°
0.00°
100
100.00
θ1
11.25°
11.53°
100
100.02
θ2
22.50°
22.44°
100
99.54
θ3
33.75°
34.01°
100
100.12
θ4
45.00°
45.00°
100
100.41
141.42
θ5
56.25°
55.99°
100
100.12
θ6
67.50°
67.56°
100
99.54
θ7
78.75°
78.47°
100
100.02
θ8
90.00°
90.00°
100
100.00
Calculated
1-2-/W1-2-/2W1-2-phase
10
2-phase
2014-10-01
TB6608FNG
Relationship between the ENABLE Input and the Phase Current and MO Outputs
Example 1: 1-2-phase excitation (M1: H, M2: L)
Setting the ENABLE signal Low disables only the output signals. On the other hand, internal logic functions
continue to operate in accordance with the CK signal.
Therefore, when the ENABLE signal goes High again, the output current generation is restarted as if phases
proceeded with the CK signal.
CK
ENABLE
RESET
MO
Phase current
(AO1, AO2)
(%)
100
71
0
−71
−100
t0
t1
t2
t3
OFF
t7
t8
t9
t10
t11
t12
Example 2: 2W1-2-phase excitation (M1: H, M2: H)
CK
ENABLE
RESET
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
OFF
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11
11
t23 t24 t25 t26 t27 t28 t29 t30 t31 t32 t33 t34
2014-10-01
TB6608FNG
Relationship between the RESET Input and the Phase Current and MO Outputs
Example 1: 1-2-phase excitation (M1: H, M2: L)
Setting the RESET signal Low causes the outputs to be put in the Initial state and the MO output to be
Low. (Initial state: A-channel output current is at its peak (100%).) When the RESET signal goes High again,
the output current generation is resumed at the next rising edge of the CK signal with the state following the
Initial state. If RESET goes High when CK is already High, the output current generation is resumed
immediately without waiting for the next rising edge of CK with the state following the Initial state.
CK
ENABLE
RESET
MO
(%)
100
71
Phase current
(AO1, AO2)
0
−71
−100
t0
t1
t2
t3
t2
t3
t4
t5
t6
t7
t8
Example 2: 2W1−2 phase excitation (M1: H, M2: H)
CK
ENABLE
RESET
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11
t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19
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TB6608FNG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VCC
6
V
VM
15
V
Iout(AO),
Iout(BO)
0.8
A
IMO
1
mA
Withstand voltage of MO
VMO
VCC
V
Input voltage
VIN
−0.2 to VCC + 0.2
V
Power dissipation
PD
Operating temperature
Topr
−20 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Power supply voltage
Output current
0.71 (Note 1)
0.96 (Note 2)
W
Note 1: IC only
Note 2: Mounted on a glass epoxy board (50 × 50 × 1.6 mm, Cu 40%)
Recommended Operating Conditions (Ta = −20 to 85°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Control power supply voltage
VCC (opr)
2.7
3.3
5.5
V
Motor power supply voltage
VM (opr)
2.5
5
13.5
V
Output current
IOUT
2.5 V ≤ VM ≤ 4.8 V
0.35
A
Output current
IOUT
4.8 V < VM ≤ 13.5 V
0.6
A
Input voltage
VIN
VCC
V
Clock frequency
fck
1
10
kHz
OSC frequency
fosc
80
460
780
kHz
fchop
20
115
195
kHz
Chopping frequency
Functional Descriptions
The oscillation frequency of a triangular wave fosc can be calculated as follows:
fosc =
=
I
2 × ∆Vosc × Cosc
101 µA
2 × (1.1 V − 0.6 V) × Cosc
= 1.1 × 10−4 ×
1
Cosc
(Since this is an approximation formula, the calculation result may differ
from the actual value.)
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TB6608FNG
Chopper Control
Turning on the power (chop on) causes a current to flow into the coils. Once the VRF voltage reaches Vref, it is
detected by the comparator and the power is turned off (chop off).
The off timer/counter counts the number of falling edges of the internal CK signal, which is derived from the OSC
signal, and generates the motor-driving PWM signal based on the turn-off time of four CK cycles.
OSC
Internal CK
Off timer counter
Generate PWM
Upper limit:
Vref/RNF
Coil current
chop on
off
on
off
on
off
on
The upper limit of the current across the motor coil (i.e., the peak current in each excitation mode), I (Limit), can
be calculated as follows:
I (Limit) = Vref/RNF
Vref equals to 0.125 V when TQ is Low, while it equals to 0.5 V when TQ is High.
RNF is the value of resistors used for output current detection. One of those resistors is connected between RFA
and GND, and the other is connected between RFB and GND.
Timing chart may be simplified for the sake of brevity.
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2014-10-01
TB6608FNG
PWM Control
In PWM mode, the motor operating mode changes between CW/CCW and short brake alternately.
To eliminate shoot-through current that flows from supply to ground due to the simultaneous conduction of
high-side and low-side transistors in the bridge output, a dead time of 200 ns (design target value) is generated in
the IC when transistors switch from on to off (t2), or vice versa (t4).
This permits a synchronous rectification PWM operation without controlling the dead time externally.
VM
OUT1
M
VM
OUT2
OUT1
t1
M
VM
OUT2
OUT1
t2 = 200 ns (typ.)
M
OUT2
t3
VM
OUT1
M
VM
OUT2
OUT1
t4 = 200 ns (typ.)
M
OUT2
t5
VM
t1
t5
Output voltage waveform
(OUT1)
t3
GND
t2
t4
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TB6608FNG
1. Constant-Current Chopping
When VRF reaches the predefined Vref voltage, the constant-current regulator enters Discharge mode.
After four cycles of CK, an internal clock generated by OSC, the regulator moves from Discharge mode to
Charge mode.
VRF
Vref
OSC
Internal CK
Vref
VRF
Discharge
Charge
Discharge
Charge
Discharge
GND
Vref
Iout
Charge
Discharge
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2014-10-01
TB6608FNG
2. Changing the Predefined Current to the Lower Value
During deceleration, the regulator enters fast-decay mode immediately after the end of the current decay
slope of slow-decay mode. The distortion of the current waveform can be reduced by the regenerative current
from a coil that flows back to the power supply. Two CK cycles later, the regulator exits fast decay mode and
enters Charge mode. (The fast-decay time, which is specified herein as two CK cycles, varies depending on
the mode setting. A detailed description of the mode setting is provided in the Current Decay Mode section.)
When VRF reaches the reference voltage (Vref), the regulator enters Discharge mode. Four CK cycles later,
the regulator exits Discharge mode and enters Charge mode. If VRF > Vref when it enters Charge mode,
however, it then reenters Discharge mode. Four CK cycles later, VRF is again compared against Vref. If
VRF < Vref, the regulator remains in Charge mode until VRF reaches Vref.
OSC
Internal CK
Vref
VRF
GND
Charge
Discharge
Discharge
Charge
Charge
Vref
Iout
Charge
Slow decay
Charge
Slow decay
Charge
Fast decay
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TB6608FNG
In fast-decay mode, the regenerative current from a coil flows back to the power supply as shown below.
VM
OUT1
M
VM
OUT2
OUT1
(Slow decay mode)
M
OUT2
(Fast decay mode)
3. Changing the Predefined Current to the Higher Value
Even when the Vref voltage is increased, the regulator remains in Discharge mode for four CK cycles and
then enters Charge mode. During acceleration, the current decays only in slow-decay mode.
OSC
Internal CK
VRF
Vref
Discharge
Charge
Discharge
Discharge
Charge
Discharge
GND
Vref
Iout
Charge
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TB6608FNG
Setting the Current Decay Mode
Table
Fast-Decay Time Inserted During the Current Decay Period
(, which is expressed as the number of CK cycles (an actual value may not exactly equal to the specified value).)
2W1-2-Phase
Input
Predefined
Current
DCY
%
W1-2-Phase
Number of CK
Cycles
TQ = H
TQ = L
100
L
%
1-2-Phase
Number of CK
Cycles
TQ = H
TQ = L
100
98
0
0
92
0
0
83
0
0
71
0
0
56
0
0
38
0
0
20
0
0
0
0
0
100
H
Predefined
Current
2
1
92
2
1
83
2
1
71
2
1
56
4
2
38
4
2
20
4
2
0
0
0
%
Number of CK
Cycles
TQ = H
TQ = L
71
0
0
0
0
0
71
4
2
0
0
0
100
92
0
0
71
0
0
38
0
0
0
0
0
100
98
Predefined
Current
100
92
2
1
71
4
2
38
4
2
0
0
0
If no distortion can be observed in the output current waveform, the DCY pin should be kept High. The distortion
reduction depends on the motor characteristics. If any distortion can be observed, the DCY pin should be kept Low.
Also, it should be ensured that the DCY input is set High only when the coil of a motor has an inductance of 1.5 mH
or higher where fosc is no less than 100 kHz.
Thermal Shutdown (TSD) Circuit
The TB6608FNG includes a thermal shutdown circuit, which turns the output transistors off when the junction
temperature (Tj) exceeds 160°C (typ.).
The output transistors are automatically turned on when Tj cools past the shutdown threshold, which is lowered
by a hysteresis of 40°C.
TSD = 160°C (design target value)
∆TSD = 40°C (design target value)
* In thermal shutdown mode, the internal circuitry and outputs assume the same states as in Enable Wait mode.
Upon exit from thermal shutdown mode, they revert to those states which they assume when taken out of
Enable Wait mode.
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2014-10-01
TB6608FNG
Undervoltage Lockout (UVLO) Circuit
The TB6608FNG includes an undervoltage lockout circuit, which puts the output transistors in the
high-impedance state when VCC decreases to 2.0 V (typ.) or lower.
The output transistors are automatically turned on when VCC increases past the lockout threshold, which is
raised to 2.03 V by a hysteresis of 0.03 V.
Even when UVLO circuit is tripped, internal circuitry continues to operate in accordance with the CK input like
when ENABLE is set Low. Thus, after the TB6608FNG exits the UVLO mode, the RESET signal should be asserted
for putting the TB6608FNG in the Initial state if necessary.
Electrical Characteristics
(Unless otherwise specified, Ta = 25°C, VCC = 3.3 V, VM = 5 V, RNF = 2 Ω, COSC = 220 pF.)
Characteristics
Symbol
Test
Circuit
Min
Typ.
Max
Unit
2
VCC +
0.2
V
−0.2
0.8
V
2.8
VCC +
0.2
V
−0.2
0.8
V
VCC ×
0.6
VCC +
0.2
V
−0.2
VCC ×
0.15
V
CW/CCW, CK, RESET, ENABLE, M1, M2
200
mV
VIN = 3.0 V
5
15
25
µA
VIN = GND
1
µA
ICC1
Outputs: Open, ENABLE: H, RESET: H
4
6
mA
ICC2
ENABLE: L
4
6
mA
Standby mode
5
10
µA
Outputs: Open, ENABLE: H, RESET: H
1
2
mA
IM2
ENABLE: L
0.5
1.0
mA
IM3
Standby mode
1
µA
TQ: L, 2-phase excitation
0.1
0.125
0.15
TQ: H, 2-phase excitation
0.445
0.5
0.555
−11
11
%
VIN (H) (1)
1
VIN (L) (1)
VIN (H) (2)
Input voltage
1
VIN (L) (2)
Test Condition
CW/CCW, CK, RESET, ENABLE, M1, M2
(@ VCC = 3.3 V)
CW/CCW, CK, RESET, ENABLE, M1, M2
(@ VCC = 5.5 V)
VIN (H) (3)
1
STBY, TQ, DCY
VIN (L) (3)
Input hysteresis voltage
VH
IINH
Input current
IINL
Dynamic supply current
Comparator reference
voltage
Channel-to-channel
voltage differential
Undervoltage lockout
threshold at VCC
ICC3
IM1
VRFA (1),
VRFB (1)
VRFA (2),
VRFB (2)
∆VO
1
2
3
V
B/A, TQ: L
Lower
threshold
UVLD (Design target value)
2.0
V
Upper
threshold
UVLC (Design target value)
2.03
V
0.5
V
300
460
620
kHz
MO output voltage
VMO
IMO = 1 mA
OSC frequency
fOSC
COSC = 220 pF
This table shows which inputs are TTL-compatible and which ones are CMOS-compatible. This also shows
whether they are provided with hysteresis.
Input Pins
CW/CCW, CK, RESET, ENABLE, M1, M2
STBY, TQ, DCY
Input Level
Hysteresis
TTL
Yes
CMOS
No
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2014-10-01
TB6608FNG
Output Block
Characteristics
Symbol
Test
Circuit
VSAT (U + L)
4
Min
Typ.
Max
IOUT = 0.2 A
0.3
0.4
IOUT = 0.6 A
0.9
1.2
1
1.2
1
1.2
θ=0
100
θ = 1/8
92
98
101
2W1-2-phase W1-2-phase
excitation
excitation
θ = 2/8
86
92
98
2W1-2-phase
excitation
77
83
89
65
71
77
Output saturation voltage
VF U
Diode forward voltage
VF L
5
A-/B-phase chopping current (Note)
2W1-2-phase W1-2-phase 1-2-phase
excitation
excitation
excitation
2W1-2-phase
excitation
2W1-2-phase W1-2-phase 1-2-phase
excitation
excitation
excitation
2W1-2-phase
excitation
Test Condition
IOUT = 0.6 A
θ = 3/8
Vector
3
θ = 4/8
TQ: L
RNF = 2 Ω
COSC = 220 pF
θ = 5/8
50
56
62
2W1-2-phase W1-2-phase
excitation
excitation
θ = 6/8
32
38
44
2W1-2-phase
excitation
θ = 7/8
14
20
26
100
0.5
0.5
5
5
5
5
1
0.5
1
1
2-phase excitation
tr
@ load: 5 mH, 50 Ω
tf
tpLH
Output transistor switching characteristics
(Design target value)
tpHL
tpLH
CK to Output
7
RESET to Output
tpHL
tpLH
ENABLE to Output
tpHL
Output leakage current
Upper
IOH
Lower
IOL
6
VM = 13 V
Unit
V
V
%
µs
ms
µA
Note: Relative to the peak current at θ = 0.
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Test Circuit 1: VIN (H), VIN (L), IINH, IINL
VCC
VCC = 3.3 V
VM
VM = 5 V
MO
CK
AO1
RESET
ENABLE
STBY
M1
TB6608FNG
CW/CCW
M2
AO2
BO1
BO2
RFA
RFB
Oscilloscope
2Ω
2Ω
DCY
TQ
OSC
IINL A
VIN (L)
GND
A IINH
VIN (H)
Test Circuit 2: ICC, IM
ICC
VCC = 3.3 V
IM
VCC
VM
A
VM = 5 V
MO
CK
AO1
CW/CCW
RESET
ENABLE
STBY
M1
TB6608FNG
A
M2
AO2
BO1
BO2
RFA
RFB
2Ω
2Ω
DCY
TQ
OSC
GND
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Test Circuit 3: VRFA, VRFB
VCC
VCC = 3.3 V
VM
VM = 5 V
MO
CK
STBY
M1
M2
AO2
BO1
5 mH
/50 Ω
ENABLE
TB6608FNG
RESET
5 mH
/50 Ω
AO1
CW/CCW
BO2
RFA
RFB
2Ω
TQ
V
V
GND
220 pF
3.3 V
OSC
2Ω
DCY
Test Circuit 4: VSAT (UL)
VCC
VCC = 3.3 V
VM
VM = 5 V
MO
CK
AO1
RESET
ENABLE
STBY
M1
TB6608FNG
CW/CCW
M2
AO2
BO1
BO2
V
V
RFA
RFB
DCY
TQ
OSC
3.3 V
GND
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Test Circuit 5: VF U, VF L
VCC
VM
MO
V
CK
AO1
RESET
ENABLE
STBY
M1
TB6608FNG
CW/CCW
M2
AO2
BO1
BO2
RFA
RFB
DCY
TQ
OSC
GND
Test Circuit 6: IO H, IO L
VCC
A
13 V
MO
CK
AO1
CW/CCW
RESET
ENABLE
STBY
M1
TB6608FNG
M2
AO2
BO1
BO2
RFA
RFB
DCY
A
13 V
VCC = 3.3 V
VM
TQ
OSC
GND
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AC Electrical Characteristics, Test Circuit 7: CK (OSC) and Output Voltage
CLOCK
(OSC)
50%
tCLOCK
(tOSC)
50%
tCLOCK
(tOSC)
VM
90%
Output voltage
90%
50%
50%
10%
10%
tr
GND
tpLH
tf
tpHL
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47 µF
VM
0.1 µF
VCC
47 µF
VCC = 3.3 V
0.1 µF
Application Circuit Example
VM = 5 V
MO
CW/CCW
CPU
I/O
Reset
Enable
Standby
CK
CW/CCW
RESET
ENABLE
STBY
H/L
M1
H/L
M2
H/L
DCY
H/L
TQ
Stepping
Motor
AO2
BO1
BO2
RFA
RFB
2Ω
2Ω
GND
220 pF
OSC
AO1
TB6608FNG
Clock
Note 1: Capacitors for the power supply lines should be connected as close to the IC as possible.
Note 2: The STBY pin must be set Low upon powering on and off the device. Otherwise, a large current might
abruptly flow through the output pins.
Also, at the power-on, VM must be applied after applying VCC. At the power-off, VCC must be turned off after
turning off VM.
Usage Considerations
A large current might abruptly flow through the IC in case of a short-circuit across its outputs, a short-circuit to
power supply or a short-circuit to ground, leading to a damage of the IC. Also, the IC or peripheral parts may be
permanently damaged or emit smoke or fire resulting in injury especially if a power supply pin (VCC, VM) or an
output pin (AO1, AO2, BO1, BO2) is short-circuited to adjacent or any other pins.
These possibilities should be fully considered in the design of the output, VCC, VM and ground lines.
Install this IC correctly. If not, (e.g., installing it in the wrong position,) the IC may be damaged permanently.
Fuses should be connected to the power supply lines.
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Package Dimensions
Weight: 0.09 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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Points to Remember on Handling of ICs
(1)
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(2)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any
time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(3)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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