TB6614FNG,C,EL

TB6614FNG Toshiba Bi-CD Integrated Circuit Silicon Monolithic TB6614FNG Driver IC for DC motor TB6614FNG is a driver IC for DC motor with output transistor in LDMOS structure with low ON-resister. Two input signals, IN1 and IN2, can choose one of four modes such as CW, CCW, short brake, and stop mode. Features • Supply Voltage ; VM = 15 V (Max.) • Output Current ; Iout = 1.2 A(avg) Weight: 0.07 g (Typ.) /3.2 A (Peak of continuous pulse) • Output Low-On Resistor ; 0.3 Ω (Upper＋Lower Typ. @Vcc = VM = 5 V) • Standby (Power save) system • CW / CCW / Shortbrake / Stop function modes • Direct-PWM input terminal included • Built-in thermal shut down circuit (TSD), low voltage detection circuit (UVD), And over current detection circuit (ISD) • Small surface mounting package SSOP16 (0.65 mm pitch) * This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. 1 2013-04-04 TB6614FNG Block Diagram Vcc STB 16 PWM 15 NC 14 PGND 13 O2 12 O2 11 VM 10 9 7 8 UVD TSD H-SW Logic ISD 1 GND 2 IN1 3 H-SW 4 IN2 NC 5 6 PGND O1 O1 VM Pin Functions Pin No. Pin name I/O 1 GND － 2 IN1 3 IN2 4 NC － Non-connected 5 PGND － Power 6 O1 7 O1 O Output 1 8 VM 9 VM 10 O2 11 O2 12 PGND － Power GND 13 NC － Non-connected 14 PWM 15 STBY 16 Vcc I － O I － Description Small signal GND Control signal input 1 Control signal input 2 GND Motor power supply Motor power supply Remarks Small signal GND With 200 kΩ pull-down R Motor GND VM = 2.5 V to 13.5 V Output 2 PWM signal input Stand by signal input Small signal power supply 2 Motor GND With 200 kΩ pull-down R Vcc = 2.7 V to 5.5 V 2013-04-04 TB6614FNG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Remarks VM 15 Vcc 6 Input voltage VIN -0.2 to 6 V IN1,IN2,PWM,STBY Output voltage Vout -0.2 to 15 V O1,O2 Iout 1.2 Iout (pulse) 3.2 A tw = 20 ms(pulse), Duty ≤ 20%、*note Supply voltage Output current Iout (peak) V 4.5 tw = 50 ms、single pulse, *note 0.78 Power dissipation PD Operating temperature Topr -20 to 85 °C Storage temperature Tstg -55 to 150 °C 50 × 50 × 1.6 mm Cu 40% in PCB mounting W 0.5 IC only (θj-a = 250 °C/W) *Note: not guaranteed by testing Operating Range (Ta = -20 to 85°C) Characteristics Symbol Min Typ. Max Unit Vcc 2.7 3 5.5 V VM 2.5 5 13.5 V 1 Supply voltage Output current Iout Switching frequency fPWM － － － － 0.5 － － 400 A kHz Remarks VM ≥ 4.5 V 2.5 V ≤ VM < 4.5 V PWM efficiency ≥ 90% PD-Ta graph (for reference) PD – Ta 1.2 (1) PCB mounted PCB 50 × 30 × 1.6 mm Cu area over 40% 1.0 (2) θj-a (IC only) = 250°C/W (1) PD (W) 0.8 0.6 0.4 (2) 0.2 0 0 50 100 Ambient temperature / Ta 150 200 (°C) 3 2013-04-04 TB6614FNG Function table Input STBY IN1 IN2 H H H L H H H L H L L － － Output PWM O1 O2 Mode － L L Brake H L H CW(CCW) L L L Brake H H L CCW(CW) L L L Brake H － OFF(Hi-Z) OFF(Hi-Z) Stop L － OFF(Hi-Z) OFF(Hi-Z) Standby (－：Don’t care) IN2, PWM, STBY 入Input 力 端pin 子 ;: IN1, IN1,IN2,PWM,STBY Output pin; : O1, O2 出 力端子 O1,O2 Vcc VM Input O1 O2 200kΩ Internal circuit GND PGND 4 2013-04-04 TB6614FNG H-SW Operating Description ・To prevent penetrating current, dead time t2 and t4(Typ.=80ns) is provided in switching to each mode in the IC. VM OUT1 M VM OUT1 OUT2 OUT2 M GND OUT1 GND t2 t3 VM M OUT2 M GND t1 OUT1 VM VM OUT2 OUT1 M GND OUT2 GND t4 t5 VM t1 t5 OUT1 Voltage wave t3 GND t2 t4 5 2013-04-04 TB6614FNG Electrical Characteristics (unless otherwise specified, Ta = 25°C, Vcc = 3 V, VM = 5 V) Characteristics Symbol Icc Supply current Icc(STB) IM(STB) Test Condition STBY=Vcc STBY=0V Min Typ. Max Unit － 1.5 2.5 mA － － 1 － － 1 μA Control input VIH 2 － Vcc+0.2 voltage VIL -0.2 － 0.8 Control input IIH VIN=3V 10 15 22 current IIL VIN=0V － － 1 μA Standby input VIH(STB) 2 － Vcc+0.2 voltage VIL(STB) -0.2 － 0.8 Standby input IIH(STB) VIN=3V 10 15 22 current IIL(STB) VIN=0V － － 1 Output on-resistance Ron Io=1A,Vcc=VM=5V － 0.3 0.45 Output leakage IL(U) VM=Vout=15V － － 1 current IL(L) VM=15V,Vout=0V -1 － － － 0.9 1.1 － 0.9 1.1 Regenerative diode VF Low voltage Recovering voltage shutdown operating temperature Thermal shutdown hysteresis Over current detecting current VF(L) UVLD detecting voltage Thermal VF(U) IF=1A － Vcc detection UVLC circuit － － TSD － ΔTSD － ISD 6 2.0 2.2 175 20 5 V V μA Ω μA V － V － － － － °C A 2013-04-04 TB6614FNG Typical Application Diagram 2.7V to 5.5V 3V VM Note 1 Note 1 2.5V to 13.5V VDD MCU GND VCC PWM PORT1 PWM PORT2 IN1 PORT3 IN2 PORT4 STBY VM O1 M TB6614FNG O2 Note 2 PGND GND Note 3 Note 1: Capacitors for noise absorption of Vcc and VM power supplies should be connected as close as possible to the IC. Note 2: Add a resistor for charge current limitation, if use the capacitor between the motor terminals to avoid noise. Note 3: Avoid common impedance between GND and PGND as possible. Others: Design with extra care for Vcc, VM, GND, PGND lines as there is a possibility of IC destruction from short between output pins, power supply to output pin, ground to output pin, or adjacent pins. Use fuse or current confine device for the application safety, when current beyond Absolute Maximum Rating would generate through IC. 7 2013-04-04 TB6614FNG Package Dimensions Weight: 0.07 g (typ.) 8 2013-04-04 TB6614FNG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 9 2013-04-04 TB6614FNG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 10 2013-04-04 TB6614FNG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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