TB6617FNG
Toshiba Bi-CD Integrated Circuit Silicon Monolithic
TB6617FNG
H-Bridge driver IC
TB6617FNG is a H-bridge driver IC with output transistor in
LDMOS structure with low ON-resister.
TB6617FNG includes selectable 4 modes, CW, CCW, short
brake, and stop mode
Features
•
Supply Voltage ; VM = 50 V (Max.)
•
Output Current ; Iout = 1.2 A (avg)/2 A (peak)
•
Output Low-On Resistor ; 1.4 Ω
Weight: 0.07 g (typ.)
(Upper+Lower Typ. @Vcc = VM = 5 V)
•
Available for fPWM ≤ 350 kHz
•
Stand-by (Power save) function
•
CW/CCW/Short Brake/Stop Function modes
•
Built-in thermal shut down (TSD) circuit,
over current detection (ISD) circuit, Vcc low voltage detection circuit (UVD)
•
Small surface mounting package SSOP16(0.65 mm pitch)
This product contains week pins for ESD so pay attention for treating it.
Week pins ; 8pin and 9pin
The following conditions apply to solderability:
About solderability, following conditions were confirmed
(1)Use of Sn-37Pb solder Bath
·solder bath temperature: 230℃
·dipping time: 5 seconds
·the number of times: once
·use of R-type flux
(2)Use of Sn-3.0Ag-0.5Cu solder Bath
·solder bath temperature: 245℃
·dipping time: 5 seconds
·the number of times: once
·use of R-type flux
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TB6617FNG
Block Diagram
Block or circuit in the diagram is just for explanation the function, so could be simplified in some case.
Also the diagram does not mean the agreement for the license of industry ownership right
Vcc
STB
MOD
16
15
14
NC PGND
O2
O2
VM
13
11
10
9
12
UVD
TSD
Control
Logic
H-SW
ISD
* H-SW = H-bridge
1
GND
2
PWM
3
IN1
4
5
IN2 PGND
6
7
8
O1
O1
VM
Pin Functions
No.
Name
I/O
1
GND
-
2
PWM
Function
Remarks
Ground
PWM signal input
I
3
IN1
4
IN2
5
PGND
6
O1
7
O1
8
VM
9
VM
10
O2
11
O2
12
PGND
-
Power ground
13
NC
-
Non connected
14
MOD
15
STB
16
Vcc
200 kΩ pull-down R included
IN1 signal input
IN2 signal input
-
Power ground
O
Output 1
-
Motor supply voltage
O
Output 2
I
-
Motor supply voltage system ground
VM = 4.5 V to 45 V
Motor supply voltage system ground
Control mode signal input
Stand-by signal input
Supply voltage
200 kΩ pull-down R included
2.7 V to 5.5 V
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TB6617FNG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
VM
50
Vcc
6
Input voltage
VIN
-0.2 to 6
V
IN1, IN2, PWM, STB, MOD
Output voltage
Vout
-0.2 to 50
V
O1, O2 pin
Iout
1.2
Iout (peak)
2
Supply voltage
Output current
V
A
0.5
Power dissipation
PD
W
Operation temperature
Topr
-20 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
0.78
tw = 20 ms pulse, Duty ≤ 20%
IC only
mounted on PCB Cu ≥ 40%, 50 × 50 t = 1.6(mm)
The Absolute Maximum Ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment.
Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
Operating Range(Ta=-20°C to 85°C)
Characteristics
Supply voltage
Symbol
Min
Typ
Max
Unit
Vcc
2.7
3
5.5
V
VM
4.5
24
45
V
Output current
Iout
-
-
1
A
Switching Frequency
fPWM
-
-
350
kHz
For reference ; PD-Ta characteristic
PD – Ta
1.2
(1) on PCB
50 × 30 × 1.6 mm
Cu area is over 40%
1.0
(2) θj-a(IC only) = 250°C/W
(1)
PD
(W)
0.8
0.6
0.4
(2)
0.2
0
0
50
100
Ta
150
180
(°C)
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TB6617FNG
Electrical Characteristics (unless otherwise specified, Ta = 25°C, Vcc = 3 V, VM = 24 V)
Characteristics
Supply current
Symbol
Test Condition
Min
Typ.
Max
Unit
Icc
STBY = Vcc
-
1.2
1.6
mA
Icc(STB)
IM(STB)
Control input voltage
Control input current
Stand-by input voltage
Stand-by input current
Output R-on
Output leak current
Regenerative diode VF
Low voltage detect voltage
Recovering voltage
Over
current
detection
Detect current
VIL
-
-
Vcc+0.2
-0.2
-
0.4
10
15
20
-
-
1
VIH(STB)
VIL(STB)
-
2
-
Vcc+0.2
-0.2
-
0.4
IIH(STB)
VIN = 3 V
10
15
20
IIL(STB)
VIN = 0 V
-
-
1
Ron(U+L)
Io = 1 A, Vcc = VM = 5 V
-
1.4
2
VM = Vout = 50 V
-
-
1
IL(L)
VM = 50 V, Vout = 0 V
-1
-
-
-
1.0
1.1
-
0.9
1
VF(U)
VF(L)
IF = 1 A
UVLD
Vcc detection
-
2.0
-
UVLC
(Design target)
-
2.2
-
-
3.3
-
-
4.2
-
ISDH
(Design target)
ISDH
tON(STB)
tpLH
tpHL
STBY = L→H (Design target)
(Design target)
TSD
4
μA
V
μA
μA
V
V
A
-
10
-
μs
-
10
-
ms
μs
-
20
-
-
100
-
-
75
-
-
170
-
-
20
-
(Design target)
ΔTSD
V
Ω
IL(U)
ISDM
Thermal shutdown
2
μA
VIN = 0 V
Response time
detect temperature
1
1
VIN = 3 V
Holding time
Thermal shutdown
-
-
IIL
Vcc = VM = 5 V
Output dead time
-
-
IIH
ISDL
Output start response time
hysteresis
VIH
STBY = 0 V
ns
°C
2011-02-10
TB6617FNG
Input / Output Equivalent Circuit
,MOD
Input
; IN1,
PWM, STBY, MOD
入
力端
子 ; IN2,
IN1,IN2,PWM,STBY
Output
O1,
O2
出 力 端;子
; O1,O2
Vcc
VM
Input
O1 O2
200kΩ
Internal
circuit
GND
PGND
Truth Value Table (-: don’t care)
Input
Output
STB
O1
O2
MODE
IN1
IN2
PWM
MOD
-
-
-
-
L
OFF
OFF
L
L
H
L
H
OFF
OFF
Stop
H
L
H
L
H
H
L
CW/CCW
Standby
L
H
H
L
H
L
H
CCW/CW
H
H
H
L
H
L
L
Short brake
-
-
L
L
H
L
L
Short brake
H
-
H
H
H
H
L
CW/CCW
L
-
H
H
H
L
H
CCW/CW
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TB6617FNG
H-bridge Function
・To prevent penetrating current, dead time t2 and t4 (Typ.=100 ns) is provided in switching to each mode in the IC.
VM
OUT1
M
VM
OUT1
OUT2
OUT2
M
GND
OUT1
M
OUT2
GND
GND
t2
t1
t3
VM
OUT1
VM
VM
OUT2
M
OUT1
M
GND
OUT2
GND
t4
t5
VM
t1
t5
OUT1
Voltage wave
t3
GND
t2
t4
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TB6617FNG
Application Circuit Example
2.7V to 5.5V
3V
VM
Note1
Note1
4.5V to 45V
VDD
MCU
GND
VCC
PWM
PORT1
PWM
PORT2
IN1
PORT3
IN2
PORT4
MOD
PORT5
STBY
VM
O1
M
TB6617FNG
O2
Note2
PGND
GND
Note 3
Note1:
Capacitors for noise absorption around Vcc or VM system should be connected as close as possible to the IC.
Note 2: Add a resistor for charge current limitation, if use the capacitor between the motor terminals to avoid noise.
Note 3: Avoid common impedance between GND and PGND as possible.
Note 4:
Design with extra care for Vcc, VM, GND, PGND lines as there is a possibility of IC destruction from short
between output pins, power supply to output pin, ground to output pin, or adjacent pins.
Other:
Use fuse or current confine device for the application safety, when current beyond Absolute Maximum Rating
would generate through IC.
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TB6617FNG
Package Dimensions
Weight : 0.07 g (typ.)
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TB6617FNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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TB6617FNG
Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease
in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
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TB6617FNG
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
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TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
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equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
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noncompliance with applicable laws and regulations.
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