TB67H303HG
TOSHIBA BiCD Integrated Circuit
Silicon Monolithic
TB67H303HG
Full Bridge Driver IC for DC motor
TB67H303HG
The TB67H303HG is a full bridge driver IC for DC motor
adopting MOS in output transistor.
High-power and high-efficient drive is possible by adopting
DMOS output driver with low-ON resistance and PWM drive.
Features
•
Full bridge driver IC for DC motor
•
Ron (upper + lower) = 0.2Ω (typ.)
•
CW/CCW/Short brake/Stop functions
•
Standby function
•
PWM control (Direct PWM or Constant-current PWM drive)
•
Output withstand voltage : Vcc = 50 V
•
Output current
•
Package
HZIP25-P-1.00F
Weight
HZIP25-P-1.00F: 7.7g (typ.)
: IOUT = 10.0 A (Absolute maximum ratings, peak)
IOUT =8.0 A (operating range, maximum value)
: HZIP25-P-1.00F
•
Built-in input pull-down resistance
: 100 kΩ (typ.)
•
Output monitor pin (monitor for TSD/ISD)
: ALERT1 pin (IALERT1 (max) = 1 mA)
•
Output monitor pin (monitor for UVLO)
: ALERT2 pin (IALERT2 (max) = 1 mA)
•
Single power supply
•
Built-in thermal shutdown (TSD) circuit
•
Built-in under voltage lock out (UVLO) circuit
•
Built-in over-current detection (ISD) circuit
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TB67H303HG
Pin Functions
Pin No.
I/O
Symbol
Functional Description
1
Output
ALERT1
2
―
SGND
3
Input
SELECT
Select pin for constant-current PWM or
direct PWM
4
―
(TEST1)
Shipping inspection pin
5
Input
Vref
Voltage input for 100% current level
6
Input
Vcc
Power supply
7
Input
STBY
8
Input
IN1
Control input pin 1
9
Input
IN2
Control input pin 2
10
Output
OUT2B
11
―
RSB
12
Output
OUT1B
Bch output 1
13
―
PGNDB
Power GND
14
Output
OUT2A
Ach output 2
TSD / ISD monitor pin
Remark
Pull-up by external resistance
Signal ground
Standby pin
Connect to SGND
H; Start, L; Standby
Bch output 2
Bch output current detection
15
―
RSA
16
Output
OUT1A
17
―
PGNDA
18
―
(TEST2)
Shipping inspection pin
Connect to SGND
19
―
(TEST3)
Shipping inspection pin
Connect to SGND
20
Input
Vcc
21
―
(TEST4)
22
Input
PWM
PWM signal input pin
23
―
OSC
Resistor connection pin for internal
oscillation setting
24
Output
Vreg
Control side connection pin for power
capacitor
Connecting capacitor to SGND
25
Output
ALERT2
UVLO monitor pin
Pull-up by external resistance
Ach output current detection
Ach output 1
Power GND
Power supply
Shipping inspection pin
Connect to SGND
(TEST1), (TEST2), (TEST3) and (TEST4): Shipping inspection pins. They must be connected to SGND.
Input pins
(IN1, IN2, PWM, STBY, SELECT)
VDD
100 Ω
100kΩ
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Block Diagram
Vreg
24
SELECT
3
Vcc
ALERT1 ALERT2
1
25
6, 20
Reg(5V)
16
STBY
7
IN1
8
IN2
9
PWM
22
Pre
-drive
H-Bridge
driver A
14
Input
circuit
TSD / ISD / UVLO
15
12
Pre
OSC
Vref
23
5
-drive
OSC
OUT2A
RSA
OUT1B
H-Bridge
driver B
10
1/3
11
3
OUT1A
2
17
13
SGND
PGNDA
PGNDB
OUT2B
RSB
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TB67H303HG
Functions
I/O functions
SELECT = L (Direct PWM mode)
Input
STBY
IN1
Output
IN2
H
H
H
H
L
H
H
H
L
H
L
L
L
H/L
H/L
PWM
OUT1
OUT2
Mode
L
L
Short brake
H
L
H
CW/CCW
L
L
L
Short brake
H
H
L
CCW/CW
L
L
L
Short brake
H
L
H
L
H
L
OFF
(Hi-Z)
Stop
OFF
(Hi-Z)
Standby
SELECT = H (Constant-current PWM mode)
Input
Output
STBY
IN1
IN2
H
H
H
H
L
H
H
H
PWM
OUT1
OUT2
Mode
L
L
Short brake
H
L
H
Constant-current PWM, CW
(OUT2→OUT1)
L
L
L
Short brake
H
H
L
Constant-current PWM, CCW
(OUT1→OUT2)
L
L
L
Short brake
H
L
L
H
L
L
L
H/L
H/L
H
L
H
L
OFF
(Hi-Z)
Stop
OFF
(Hi-Z)
Standby
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Selection of direct PWM and constant-current PWM
SELECT = L: operating direct PWM, SELECT = H: operating constant-current PWM
(1) In case of direct PWM:
・RSA and RSB should be connected to PGND each.
・Vref should be connected to SGND.
(2) In case of constant-current PWM:
・Connect RSA and RSB and then connect to the current detection resistance (RNF).
・Configuration of output current is as follows;
Io = (1/3 × Vref) ÷ RNF
This system adopts peak current detection. Average current is lower than setting current.
Set RNF and Vref as follows; 0.055Ω ≤ RNF ≤ 0.25Ω, 0.3V ≤ Vref ≤ 1.95V
Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC terminal.
Rosc should be from 30kΩ to 120kΩ. The relation of Rosc and fchop is shown in below table and figure. The
values of fchop of the below table are design guarantee values. They are not tested for pre-shipment.
Rosc(kΩ)
fchop(kHz)
Min
Typ.
Max
30
-
60
-
51
-
40
-
120
-
20
-
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TB67H303HG
Direct PWM Control
The motor rotation speed is controllable by the PWM input sent through the PWM pin.
It is also possible to control the motor rotation speed by sending in the PWM signal through not the PWM
pin but the IN1 and IN2 pins.
When the motor drive is controlled by the PWM input, the TB67H303HG repeats operating in Normal
Operation mode and Short Brake mode alternately.
For preventing the shoot-through current in the output circuit caused by the upper and lower power
transistors being turned on simultaneously, the dead time is internally generated at the time the upper
and lower power transistors switches between on and off.
This eliminates the need of inserting Off time externally; thus the PWM control with synchronous
rectification is enabled.
Note that inserting Off time externally is not required on operation mode changes between CW and CCW,
CW and Short Brake, and CCW and Short Brake because of the dead time generated internally.
Vcc
OUT1
Vcc
M
OUT1
Vcc
M
OUT1
GND
M
GND
PWM ON
t1
GND
PWM ON → OFF
t2
PWM OFF
t3
Vcc
OUT1
Vcc
M
OUT1
M
GND
GND
PWM OFF → ON
t4
PWM ON
t5
Vcc
Output voltage
waveform
(OUT1)
t5
t1
t3
RSGND
t4
t2
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TB67H303HG
Constant-current PWM control
Constant-current PWM control mode is set when SELECT=H.
The TB67H303HG uses a peak current detection technique to keep the output current constant by
applying constant voltage through the Vref pin.
The ratio 40% of the fast decay mode is always fixed.
Charge-discharge cycles of PWM drive corresponds to 5 cycles of OSCM. The current is decreasing in the
last two OSC cycles; the fast decay mode.
The relation between the master clock frequency (fMCLK), the OSCM frequency (fOSCM) and the PWM
frequency (fchop) is shown as follows:
fOSCM = 1/20 ×fMCLK
fchop = 1/100 ×fMCLK
When Rosc=51kΩ, the master clock=4MHz, OSCM=200kHz, the frequency of PWM(fchop)=40kHz.
NF: Point where output current reaches the setting current.
MDT in the below figure indicates the point of MIXED DECAY TIMMING.
fchop
OSCM
Internal
Waveform
Setting current
40%
fast
Decay
Mode
NF
MDT
CHARGE MODE → NF: Reach setting current → SLOW MODE → MIXED
DECAY TIMMING → FAST MODE → Current monitor →
(Setting current > Output current) CHARGE MODE
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Current waveform when setting current is changed by changing Vref in the constant-current
PWM control mode
fchop
fchop
OSCM
internal
waveform
Setting current
IOUT
NF
Setting current
NF
40%
Fast
DECAY
MODE
Change point of Vref
•
MDT (MIXED DECAY TIMMING)
MIXED DECAY TIMMING ⇒ NF point
Move to FAST mode after CHARGE
fchop
fchop
Setting current
IOUT
NF
MDT (MIXED DECAY TIMMING)
NF
Setting current
40%
Fast
DECAY
MODE
Change point
of Vref
•
Output current of MIXED DECAY MODE > Setting current
fchop
fchop
fchop
Setting current
NF
IOUT
NF
Setting current
40%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING)
Change point of Vref
It is charged instantaneously to confirm the current though output current is larger than setting current.
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TB67H303HG
Thermal Shut-Down circuit (TSD)
Latch return
TSD = 160°C (typ.)
(Note)
(1)When recovery signal is inputted after the temperature falls lower than recovery temperature (90°C (typ.) in the
below figure (Note)).
160°C (typ.)
Junction temperature (Chip temperature)
90°C (typ.)
Output state
Output off
Output on
Output on
0.2ms
ALERT1 output
H
L
STBY input
H
L
*: Time of about 1.6 ms or
more is necessary.
Corresponding to 40 dividing frequency of fOSC
0.010 ms (typ.), 0.1 ms (max)
The operation returns by programming the STBY as H → L → H shown in above figure or turning on
power supply and turning on UVLO function.
(2)When recovery signal is inputted before the temperature falls lower than the recovery temperature (90°C(typ.) in
below figure (Note)).
160°C (typ.)
Junction temperature (Chip temperature)
90°C (typ.)
Output state
ALERT1 output
Output on
Output off
H
L
H
STBY input
L
If STBY is programmed H → L → H shown in the above figure before the temperature falls lower
than the recovery temperature (90°C(typ.) in the above figure (Note)), the operation does not return.
Note: Pre-shipment testing is not performed.
STBY = L: TSD is not enabled.
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ISD (Over current detection)
Current that flows through output power MOSFETs are monitored individually. If over-current is detected
in at least one of the eight output power MOSFETs, all output power MOSFETs are turned off. Masking
term of 1μs or more (typ. when Rosc=51kΩ) (Note) should be provided in order to protect detection error by
noise. ISD does not work during the masking term. The operation is not returned automatically. It is
latched. This function is released by programming STBY H→L→H.
ISD = 6.5 A
(Note)
Latch return
6.5A (typ.)
DMOS
Power transistor current
Dead band
1μs(typ.)
Output state
Output on
Output off
Output on
0.2ms
ALERT1 output
H
L
STBY input
H
L
*: Time of about 1.6 ms or
more is necessary.
Corresponding to 40 dividing frequency of fOSC
0.010 ms (typ.), 0.1 ms (max)
The operation returns by programming STBY H→L→H shown in the above figure or powering on the
supply again to drive UVLO.
Note: Pre-shipment testing is not performed.
STBY = L: ISD is not enabled.
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ALERT output
(1) ALERT 1 (Pin No. 1)
ALERT 1 terminal outputs in detecting either TSD or ISD.
ALERT 1 terminal is connected to power supply externally via pull-up resistance. Spec. is shown below.
VALERT = 0.5V (max) at 1mA
TSD
ISD
ALERT 1
Under TSD detection
Under ISD detection
Normal
Under ISD detection
Under TSD detection
Normal
Normal
Normal
Low
Z
Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
The voltage of 5 V is recommended to be provided by connecting the external pull-up resistance to Vreg
pin.
(2) ALERT 2 (Pin No. 25)
ALERT 2 terminal outputs in detecting UVLO.
ALERT 2 terminal is connected to power supply externally via pull-up resistance. Spec. is shown below.
VALERT = 0.5V (max) at 1mA
UVLO
ALERT 2
Under UVLO detection
Low
Normal
Z
When Vcc falls to 6.0V (typ.) and UVLO is enabled, output turns off and ALERT 2 outputs low. In case
Vcc falls below 6.0V (typ.), ALERT 2 outputs Hi-Z (High impedance).
The operation returns from Standby mode when Vcc rises 6.5V (typ.) or more.
Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
The voltage of 5 V is recommended to be provided by connecting the external pull-up resistance to Vreg
(To pull-up resistance)
pin.
(To Vreg in the IC)
Voltage pull-up of ALERT 1 and ALERT 2 pins
･It is recommended to pull-up the voltage to Vreg pin.
･In case of pulling up the voltage of except 5 V (for instance, 3.3 V etc.), it is recommended to use other power
supply (ex. 3.3 V) while Vcc outputs within the operation range. When Vcc decreases lower than the operation
range and Vreg decreases from 5 V to 0 V under the condition that other power supply is used to pull-up voltage,
the current continues to conduct from other power supply to the IC inside through the diode shown in the figure.
Though this phenomenon does not cause destruction and malfunction of the IC, please consider the set design not
to continue such a state for a long time.
･As for the pull-up resistance for ALERT 1 and ALERT 2 pins, please select large resistance enough for the
conducting current so as not to exceed the standard value of 1 mA.
Please use the resistance of 30 kΩ or more in case of applying 5 V, and 20 kΩ or more in case of applying 3.3 V.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Vcc
50
V
IO (PEAK)
10.0 (Note 1)
A
1
mA
6
V
Power supply voltage
Output current
Drain current (ALERT1, ALERT2)
I (ALERT1)
I (ALERT2)
Input voltage
VIN
Power dissipation
PD
Operating temperature
Topr
−30 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
3.2 (Note 2)
40 (Note 3)
W
Note 1: Absolute Maximum Rating of output current per one channel is 5A, therefore, that of a parallel connection of
two outputs on the outside of the IC is 10A.
Make sure that two outputs are connected in parallel on the outside of the IC and that one pair should be
OUT1A and OUT1B and the other should be OUT2A and OUT2B.
Pay attention to wiring of the output terminals because there may be danger of current exceeding the
absolute maximum rating 5A per 1 channel because of consentrating current at only one channel if there is a
great lack of balance in the wiring length and so on between A phase side and B phase side about the
parallel connection wiring of the output terminals on the outside of the IC.
Note 2: Ta = 25°C, No heat sink
Note 3: Ta = 25°C, with infinite heat sink
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these absolute maximum ratings.
Exceeding the absolute maximum ratings may cause the device breakdown, damage or deterioration, and may
result injury by explosion or combustion.
Please use the IC within the specified operating ranges.
Operating Range (Ta = −30 to 85°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Power supply voltage
Vcc
―
8.0
―
42
V
Output current
IOUT
―
―
―
8.0
A
VIN
―
0
―
5.5
V
Vref
―
0.3
―
1.95
V
―
―
100
kHz
20
40
60
kHz
Input voltage
PWM frequency
(Input in direct PWM drive)
Chopping frequency
fPWM
fchop
duty50%
IN1, IN2, PWM
In constant-current PWM mode
Refer to page 5.
Note: Same voltage should be applied to two Vcc pins.
The maximum current of the operating range can not be necessarily conducted depending on various conditions
because output current is limited by the power dissipation PD.
Make sure to avoid using the IC in the condition that would cause the temperature to exceed Tj (avg.) =
107°C.
The power supply voltage of 42 V and the output current of 8 A* are the upper limits of the operating range.
Therefore, make sure to have enough margins within these operating ranges (derating design) by considering
the power supply variation, the external resistance, and the electrical characteristics of the IC. If either of the
voltage or current exceeds the upper limits of the operating range, the IC may not operate normally.
*8 A: 4 A per one phase. Two phases are connected in parallel.
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TB67H303HG
Electrical Characteristics (Ta = 25°C, Vcc = 24V)
Characteristic
Input voltage
Symbol
High
VIN (H)
Low
VIN (L)
Input hysteresis voltage
IN1, IN2, PWM, STBY, SELECT
VH
Min
Typ.
Max
2.0
―
5.5
−0.2
―
0.8
―
400
―
Unit
V
mV
IIN (H)
VIN = 5.0 V
―
50
75
IIN (L)
VIN = 0 V
―
―
1
Icc1
Stop mode
―
3.2
7
Icc2
CW/CCW mode
―
3.2
7
Icc3
Short brake mode
―
3.2
7
Icc4
Standby mode
―
1.9
4
Current limit
voltage
VNF
Vref = 3.0V (Note 1)
0.9
1.0
1.1
V
Input current
IIN(Vref)
Vref = 3.0V (Note 1)
―
―
1
μA
Divider ratio
Vref/VNF
Maximum current: 100%
―
3
―
―
IN1, IN2, PWM
5.0
―
―
μs
IOL = 1 mA
―
―
0.5
V
4.5
5.0
5.5
V
28
40
52
kHz
Input current
Vcc supply current
Vref input
circuit
Test Condition
twPWMH
Minimum pulse width
twPWML
Output residual voltage in
logic part
VOL ALERT1
Internal constant voltage
Vreg
VOL ALERT2
Chopping frequency
fchop
(Constant-current PWM)
Standby mode,
External capacitor C = 0.1μF
Rosc = 51kΩ
μA
mA
Note 1: Though Vref of the test condition for pre-shipment is 3.0V, make sure to configure Vref within the operating
range which is written in page 12 in driving the motor.
Electrical Characteristics (Ta = 25°C, Vcc = 24V)
Characteristic
OUT pin
Symbol
Output ON resistor
(Note1)
(Note2)
Output transistor switching characteristics
(Note1)
Output leakage current
(Note1)
Note 1:
Note 2:
Test Condition
Min
Typ.
Max
Unit
Ω
Ron U +Ron L
IOUT = 4 A
―
0.4
0.6
tr
VNF = 0 V,
―
50
―
tf
Output Open
―
500
―
―
―
5
―
―
5
Upper side
ILH
Lower side
ILL
VCC = 50 V
ns
μA
The value is indicated per 1ch because pre-shipment testing is performed per 1ch.
In using, typical value is 0.2Ω because two output pins are connected in parallel.
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TB67H303HG
Measurement waveform
IN1, IN2,
PWM
twPWMＨ
twPWMＨ
twPWMＬ
Figure 1 Timing Waveforms and Names
VCC
90%
90%
OUT1A, OUT2A,
OUT1B, OUT2B
GND
10%
10%
tr
tf
Figure 2 Timing Waveforms and Names
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Power dissipation
TB67H303HG
PD
Power dissipation PD
(W)
80
– Ta
Infinite heat sink
Rθj-c = 1°C/W
②
HEAT SINK (RθHS = 3.5°C/W)
Rθj-c + RθHS = 4.5°C/W
①
60
③
IC only
Rθj-a = 39°C/W
①
40
②
20
③
0
0
25
50
75
Ambient temperature
15
100
125
150
Ta (°C)
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TB67H303HG
Application circuit
(1) Direct PWM
0.1μF
0.1μF
Vreg
ALERT1
47μF
+
－
ALERT2
Fuse
24V
Vcc
SELECT
Reg(5V)
OUT1A
STBY
Pre
MCU
IN1
-drive
H-Bridge
driver A
OUT2A
IN2
PWM
Input
circuit
RSA
TSD / ISD / UVLO
OUT1B
Pre
-drive
H-Bridge
driver B
OSC
OUT2B
OSC
51kΩ
RSB
Vref
1/3
SGND
PGNDA
PGNDB
・Set SELECT “L” in direct PWM drive.
・RSA should be connected to PGNDA. RSB should be connected to PGNDB.
・Vref should be connected to SGND.
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TB67H303HG
Note 1: Generally, some ICs are highly sensitive to electrostatic discharge. When handling them, ensure that the
environment is protected against electrostatic discharge.
Note 2: Two outputs are connected in parallel on the outside of the IC.
Make sure that two outputs are connected in parallel on the outside of the IC and that one pair should be
OUT1A and OUT1B and the other should be OUT2A and OUT2B.
Pay attention to wiring of the output terminals because there may be danger of current exceeding the absolute
maximum rating 5A per 1 channel because of consentrating current at only one channel if there is a great lack
of balance in the wiring length and so on between A phase side and B phase side about the parallel connection
wiring of the output terminals on the outside of the IC.
Note 3: Capacitors for the power supply lines should be connected as close to the IC as possible.
Note 4: Pay attention for wire layout of PCB not to allow GND line to have large common impedance.
Note 5: External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this capacitor and
Vreg terminal and the wire between this capacitor and SGND not to be influenced by noise.
Note 6: The IC may not operate normally when large common impedance is existed in GND line or the IC is easily
influenced by noise. For example, if the IC operates continuously for a long time under the circumstance of
large current and high voltage, the output according to the input control signal may be different from the I/O
function table of this document. And so, the IC may not operate normally. To avoid this malfunction, make sure
to conduct Note.2 to Note.5 and evaluate the IC enough before using the IC.
Note 7: As for a brush motor, the noise, which is generated from the brushes in the motor during the motor rotation,
influences on the IC operation. For example, it may cause a malfunction of the ISD circuit and then finally the
IC may not work normally. In this case, connect a capacitor between the motor terminals in order to reduce the
noise.
The appropriate value of the capacitor depends on the magnitude of the noise and the inductance of the motor
coil. Please determine the value according to each actual equipment and condition. The connecting position of
the capacitor should be conformed because the effect of the capacitor is different depending on the position of
the capacitor which is near the IC or the motor.
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(2) Constant-current PWM
0.1μF
0.1μF
Vreg
ALERT1
47μF
+
－
ALERT2
24V
Fuse
Vcc
SELECT
Reg(5V)
OUT1A
STBY
MCU
Pre
IN1
-drive
H-Bridge
driver A
OUT2A
IN2
PWM
Input
circuit
TSD / ISD / UVLO
RSA
OUT1B
Pre
-drive
H-Bridge
driver B
RNF
OSC
OUT2B
OSC
51kΩ
RSB
Vref
1/3
0.3V to 1.95V
SGND
PGNDA
PGNDB
・Set SELECT “H” in constant-current PWM drive.
・Connect RSA and RSB and then connect to the current detection resistance (RNF) shown in above figure.
・Output current is set as follows;
Io = (1/3 × Vref) ÷ RNF
RNF: 0.055Ω ≤ RNF ≤ 0.25Ω, Vref: 0.3V ≤ Vref ≤ 1.95V
Current detection resistance (RNF) should be layout to have same distance from RSA pin and RSB pin and
connected as close to them as possible.
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Note 1: Generally, some ICs are highly sensitive to electrostatic discharge. When handling them, ensure that the
environment is protected against electrostatic discharge.
Note 2: Two outputs are connected in parallel on the outside of the IC.
Make sure that two outputs are connected in parallel on the outside of the IC and that one pair should be
OUT1A and OUT1B and the other should be OUT2A and OUT2B.
Pay attention to wiring of the output terminals because there may be danger of current exceeding the absolute
maximum rating 5A per 1 channel because of consentrating current at only one channel if there is a great lack
of balance in the wiring length and so on between A phase side and B phase side about the parallel connection
wiring of the output terminals on the outside of the IC.
Note 3: Capacitors for the power supply lines should be connected as close to the IC as possible.
Note 4: Current detection resistance (RNF) should be connected as close as the IC as possible.
Note 5: Pay attention for wire layout of PCB not to allow GND line to have large common impedance.
Note 6: External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this capacitor and Vreg
terminal and the wire between this capacitor and SGND not to be influenced by noise.
Note 7: The IC may not operate normally when large common impedance is existed in GND line or the IC is easily
influenced by noise. For example, if the IC operates continuously for a long time under the circumstance of large
current and high voltage, the output according to the input control signal may be different from the I/O function
table of this document. And so, the IC may not operate normally. To avoid this malfunction, make sure to conduct
Note.2 to Note.6 and evaluate the IC enough before using the IC.
Note 8: As for a brush motor, the noise, which is generated from the brushes in the motor during the motor rotation,
influences on the IC operation. For example, it may cause a malfunction of the ISD circuit and then finally the IC
may not work normally. In this case, connect a capacitor between the motor terminals in order to reduce the
noise.
The appropriate value of the capacitor depends on the magnitude of the noise and the inductance of the motor
coil. Please determine the value according to each actual equipment and condition. The connecting position of
the capacitor should be conformed because the effect of the capacitor is different depending on the position of
the capacitor which is near the IC or the motor.
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Package Dimensions
Weight: 7.7 g (typ.)
Unit: mm
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current protection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease
in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
(5) Short-circuiting between outputs, air contamination faults, faults due to improper grounding, short-circuiting
between contiguous pins
Utmost care is necessary in the design of the power supply lines, GND lines, and output lines since the IC may
be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,
or by short-circuiting between contiguous pins. They may destroy not only the IC but also peripheral parts and
may contribute to injuries for users. Over current may continue to flow in the IC because of this destruction
and cause smoke or ignition of the IC. Expect the volume of this over current and add an appropriate power
supply fuse in order to minimize the effects of the over current. Capacity of the fuse, fusing time, and the
inserting position in the circuit should be configured suitably.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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