TB67H410FTG , TB67H410NG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB67H410FTG, TB67H410NG
PWM Chopper-Type Brushed DC Motor driver
The TB67H410 is brushed DC motor driver of a PWM chopper-type.
The TB67H410 is a dual channel H-SW driver which can control
two brushed DC motors. Moreover, the parallel control function (La
rge mode) of an output part is built in, and 1ch high current drive is
also possible.Fabricated with the BiCD process, the TB67H410 is
maximum rated at 50V,2.5A(2ch)/5.0A(1ch).
FTG
P-WQFN48-0707-0.50-003
Features
・Monolithic motor driver using BiCD process.
・Capable of controlling two brushed DC motor.
・2 drive modes (PWM controlled constant-current/ direct PWM)
・4 operation modes (Clock-wise/Counter clock-wise/Brake/Stop(Off))
・Low on-resistance output stage (High side+Low side:0.8Ω(typ.))
・High voltage and current (for specification, please refer to absolute
maximum ratings and operating ranges.)
・Built-in error detection circuits (Thermal shutdown(TSD), over-current
detection (ISD), and power-on reset (POR).
・Built-in regulator allows the TB67H410 to function with a single VM
power supply.
・Able to customize PWM (internal chopping) frequency by external
components.
・Multi package lineup.
TB67H410FTG: P-WQFN48-0707-0.50-003
TB67H410NG: P-SDIP24-0723-1.78-001
Weight: 0.10g (typ.)
NG
P-SDIP24-0723-1.78-001
Weight: 1.3g (typ.)
Note: Please be careful about the thermal conditions during use.
©2014 Toshiba Corporation
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TB67H410FTG , TB67H410NG
Pin assignment
NC
OUTB+
OUTB+
NC
RSB
RSB
NC
VM
NC
VCC
NC
Type（Top View）
NC
FTG
36 35 34 33 32 31 30 29 28 27 26 25
22 GND
GND
40
21 OUTB-
VREF
41
20 OUTB-
HBMODE
42
19 GND
OSCM
43
18 GND
INA1
44
17 OUTA-
INA2
45
16 OUTA-
PWMA
46
15 GND
PWMB
47
14 NC
NC
48
13 NC
5
6
7
8
9 10 11 12
NC
4
OUTA+
3
OUTA+
2
NC
1
RSA
39
RSA
NC
NC
23 NC
GND
38
TBLKAB
NC
INB2
24 NC
INB1
37
NC
NC
Note: Please connect the corner pad and the exposed pad to the PCB ground pattern when using the QFN package.
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NG Type（Top View）
GND
1
24
GND
OUTB-
2
23
OUTA-
GND
3
22
GND
OUTB+
4
21
OUTA+
RSB
5
20
RSA
GND
6
19
GND
VM
7
18
TBLKAB
VCC
8
17
INB2
VREF
9
16
INB1
HBMODE
10
15
PWMB
OSCM
11
14
PWMA
INA1
12
13
INA2
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TB67H410 Block Diagram
INA1
INA2
Standby
Control
+
Blank time
Selector
+
H-Bridge
Mode select
+
Signal Decode
Logic
INB1
INB2
PWMA
PWMB
TBLKAB
Motor
Oscillator
System
Oscillator
VCC
Regulator
Current
Level
Set
Current
Reference
Setting
Motor Control Logic
Predriver
TSD
OSCM
VCC
VM
Power-on
Reset
HBMODE
Current
Comp
OSC-Clock
Converter
VREF
Current
Comp
Predriver
RSA
ISD
RSB
GND
* Please note that in the block diagram, functional blocks or constants may be omitted or simplified for explanatory
purposes.
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Notes:
All the grounding wires of the TB67H410 must run on the solder within the mask of the PCM. It must also be
externally terminated at a single point. Also, the grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output
pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current.
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Pin functions
TB67H410FTG (WQFN48)
Pin No.1-28
Pin No.
Pin name
Function
1
NC
2
INB1
Not connected
Bridge B operation mode set pin 1
3
INB2
Bridge B operation mode set pin 2
4
TBLKAB
5
GND
6
NC
7
RSA(*)
Bridge A sense output
8
RSA(*)
Bridge A sense output
Bridge A and B Digital tBLK setting
Ground pin
Not connected
9
NC
10
OUTA+(*)
Not connected
Bridge A + output
11
OUTA+(*)
Bridge A + output
12
NC
Not connected
13
NC
Not connected
14
NC
Not connected
15
GND
16
OUTA-(*)
Bridge A - output
17
OUTA-(*)
Bridge A - output
18
GND
Ground pin
19
GND
Ground pin
20
OUTB-(*)
Bridge B - output
21
OUTB-(*)
Bridge B - output
22
GND
23
NC
Not connected
24
NC
Not connected
25
NC
Not connected
26
OUTB+(*)
Bridge B + output
27
OUTB+(*)
Bridge B + output
28
NC
Ground pin
Ground pin
Not connected
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Pin No.29-48
Pin No.
Pin name
Function
29
RSB(*)
Bridge B sense output
30
RSB(*)
Bridge B sense output
31
NC
Not connected
32
VM
Motor Voltage supply
33
NC
Not connected
34
VCC
35
NC
Not connected
36
NC
Not connected
37
NC
Not connected
38
NC
Not connected
39
NC
Not connected
40
GND
Ground pin
41
VREF
Current customize for Bridge A and B
42
HBMODE
H-Bridge operation mode set
43
OSCM
Oscillator frequency set pin
44
INA1
Bridge A operation mode set pin 1
45
INA2
Bridge A operation mode set pin 2
46
PWMA
Bridge A short brake input
47
PWMB
Bridge B short brake input
48
NC
Internal regulator voltage monitor
Not connected
・Please do not connect any pattern to the NC pin.
・* : Please connect the pins with the same names, at the nearest point of the device.
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Pin explanation
TB67H410NG (SDIP24)
Pin No.1-24
Pin No.
Pin name
Function
1
GND
2
OUTB-
3
GND
4
OUTB+
5
RSB
Bridge B sense output
6
GND
Ground pin
7
VM
8
VCC
Ground pin
Bridge B - output
Ground pin
Bridge B + output
Motor Voltage supply
Internal regulator voltage monitor
9
VREF
10
HBMODE
H-Bridge operation mode set
11
OSCM
Oscillator frequency set pin
12
INA1
Bridge A operation mode set pin 1
13
INA2
Bridge A operation mode set pin 2
14
PWMA
Bridge A short brake input
15
PWMB
Bridge B short brake input
16
INB1
Bridge B operation mode set pin 1
17
INB2
Bridge B operation mode set pin 2
18
TBLKAB
19
GND
Ground pin
20
RSA
Bridge A sense output
21
OUTA+
22
GND
23
OUTA-
24
GND
Current customize for Bridge A and B
Bridge A and B Digital tBLK setting
Bridge A + output
Ground pin
Bridge A - output
Ground pin
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Equivalent circuit (TB67H410)
INA1
INA2
PWMA
INB1
INB2
PWMB
TBLKAB
HBMODE
Input/Output signal
Logic
Equivalent circuit
1kΩ
Logic
Input
input (VIH/VIL)
100kΩ
Pin name
VIH: 2.0V(min) to 5.5V(max)
VIL : 0V(min) to 0.8V(max)
GND
VCC
VCC
VCC regulator specification
4.75V(min) to 5.0V(typ.) to 5.25V(max)
VREF
VREF voltage range
0V to 4.0V
1kΩ
VREF
GND
OSCM setup frequency
0.64MHz(min)
to
1.12MHz(typ.)
2.4MHz(max)
500Ω
OSCM
1kΩ
OSCM
to
GND
RS
OUTA+
OUTAOUTB+
OUTBRSA
RSB
VM operation range
10V(min) to 47V(max)
OUT+
OUTPUT pin voltage range
10V(min) to 47V(max)
OUT-
GND
Please note that in the equivalent input circuit, functional blocks or constants may be omitted or simplified for
explanatory purposes.
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Function mode (Brushed DC Motor Mode)
Logic input function table
(1) INA1, INA2
These pins set the drive mode for Bridge A
PWMA
L
H
L
INPUT
H
L
H
L
H
INA1
INA2
OUTA+
OUTA-
Function
L
L
OFF
(Hi-Z)
OFF
(Hi-Z)
STANDBY MODE (*)
L
H
L
L
L
H
H
L
L
L
H
L
CW (Clock-wise)
H
H
L
L
Short brake
INB1
INB2
OUTB+
OUTB-
Function
L
L
OFF
(Hi-Z)
OFF
(Hi-Z)
STANDBY MODE (*)
L
H
L
L
Short brake
L
H
CCW (Counter
clock-wise)
H
L
H
H
STOP(OFF)
Short brake
CCW (Counter
clock-wise)
Short brake
(2) INB1, INB2
These pins set the drive mode for Bridge B
PWMB
L
H
L
INPUT
H
L
H
L
H
STOP(OFF)
L
L
Short brake
H
L
CW (Clock-wise)
L
L
Short brake
*Note: The standby mode is only enabled when all 6 logic input pins (INA1,INA2,PWMA,INB1,
INB2,PWMB) are set to Low level. If either of the 6pins are set to High level, the standby mode
will be canceled.
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(3) TBLKAB
This pin will set the noise rejection time.
TBLKAB
TBLK noise rejection time
L
Digital tBLK = fOSCM×4clk
H
Digital tBLK = fOSCM×6clk
Synchuronous delay
IN1/IN2
OSCM
TBLK
Count
Digital tBLK
signal
(TBLKAB=L)
Digital tBLK
signal
(TBLKAB=H)
0
1
2
3
4
5
6
Digital tBLK
Digital tBLK
Please note that the timing charts or constants may be omitted or simplified for explanatory purposes.
The Digital tBLK is used to avoid error judgment of varistor recovery current that occurs in charge drive mode when
H-bridges are used with DC motors. The Digital tBLK time can be controlled with TBLKAB pin.
By setting Digital tBLK, direct PWM control and constant-current control is possible, but the motor current will rise
above the predefined current level (NF) while digital tBLK is active.
Besides Digital tBLK, Analog tBLK(400ns typ.) settled by an internal constant of IC is also attached.
● Digital tBLK timing for Brushed DC Motor
IN1
IN2
Iout
Digital tBLK
The Digital tBLK is inserted at the beginning of each charge period of the constant current chopping, and also when
either the INA1/A2/B1/B2 is switched.
Timing charts may be simplified for explanatory purpose.
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(4) HBMODE
This pin sets the H-Bridge operation mode.
Pin name
Function
Input
Setting
HBMODE
H-Bridge
operation
setting
Low
Small mode
High
Large mode
Note: When using the Large mode, please make sure that the impedance between A channel and B channel is
balanced. Also, make sure that the output pins (OUTA+ and OUTA-, OUTB+ and OUTB-), RS pins (RSA and RSB) are
connected to each other when using the Large mode.
Note: Please set the HBMODE to Low or High with the PCB pattern. (Do not change the logic input level during
operation.)
Note: When the HB_MODE pin is set to High level, the motor control will be controlled by the Ach inputs
(INA1,INA2,PWMA). The Bch inputs will be invalid. (When using the TB67H410 in Large mode, setting the
INB1,INB2,PWMB to Low level is preferred.) TBLKAB pin is effective in both Small/Large mode(HBMODE=L/H).
H-Bridge connection example
●2 Small DC motor operation setting example (HBMODE=L)
H-Bridge A
VM
H-Bridge B
RRS
OUTA＋
VM
RRS
OUTA-
OUTB＋
OUTBMotor
Motor
2 Small DC Motor operation
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● 1 Large DC motor operation setting example (HBMODE=H)
VM
H-Bridge A
RRS
OUTA＋
H-Bridge B
OUTB＋
OUTA-
OUTB-
Motor
1 Large DC Motor operation
Please note that in the equivalent input circuit, functional blocks or constants may be omitted or simplified for
explanatory purposes.
DC Small mode->H-Bridge A and B will operate separately (for two brushed DC motor operation)
DC Large mode->H-Bridge A and B will operate as a single H-Bridge. (for one brushed DC motor operation)
*When the HBMODE is set to High level, the pin function will be as follows.
Pin
HBMODE=H(Large mode)
INA1
INL1
INA2
INL2
PWMA
PWML
PWMB
INB1
INB2
TBLKAB
RSA
RSB
OUTA+
OUTAOUTB+
OUTB－
Don’t care
(Motor will be
Controlled by INL1,INL2,PWML pins)
TBLKL
RSL
OUTL＋
OUTL－
Note: Please connect the “RSA and RSB”, “OUTA+ and OUTA-“, and “OUTB+ and OUTB-“ when using the Large
mode operation.
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About motor control (constant current control)
About the current waveform of Mixed Decay Mode, and a setting
In the case of constant current control, the rate of Mixed Decay Mode which determines current Ripple is fixed to 37.5%.
fchop
Internal
OSC
IOUT
MDT
NF detect
Setting
current value
37.5% Mixed Decay Mode
Charge Mode → NF detect → Slow Mode → MixedDecay
Timing → Fast Mode → Charge Mode
6clk / 16clk
= 37.5% fchop
fchop 1 cycle：16clk
Mixed Decay Mode current waveform
fchop
fchop
Internal
OSC
37.5% Mixed Decay Mode
Setting
current value
NF detect
NF detect
IOUT
MDT (Mixed Decay Timing): 37.5% fixed
Timing charts may be simplified for explanatory purposes.
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Current Waveform in Mixed (Slow + Fast) Decay Mode
•
When a current value increases (Mixed-Decay point is fixed to 37.5%)
fchop
fchop
fchop
fchop
Internal OSC
Setting
current value
Setting
current value
•
NF
NF
Slow
Charge
Fast
Charge
NF
NF
Slow
Fast
Slow
Charge
Fast
Charge
Slow
Fast
When a current value decreases (Mixed-Decay point is fixed to 37.5%)
fchop
fchop
fchop
fchop
Internal OSC
Setting
current value
NF
Slow
Charge
The IC enters Charge mode for a moment at which
the internal RS comparator compares the values.
The IC immediately enters Slow-Decay mode
because of the current value exceeding the
predefined current level.
NF
Fast
ChargeSlow
Fast
Setting
current value
NF
Charge
Slow
Fast
NF
Charge
NF
Slow
Fast
Charge
The Charge period starts as the internal oscillator clock starts counting. When the output current reaches the
predefined current level, the internal RS comparator detects the predefined current level (NF); as a result, the IC
enters Slow-Decay mode.
The TB67H410 transits from Slow-Decay mode to Fast-Decay mode at the point 37.5% of a PWM frequency (one
chopping frequency) remains in a whole PWM frequency period (on the rising edge of the 11th clock of the OSCM
clock).
When the OSCM pin clock counter clocks 16 times, the Fast-Decay mode ends; and at the same time, the counter
is reset, which brings the TB67H410 into Charge mode again.
Note: These figures are intended for illustrative purposes only. If designed more realistically, they would show transient
response curves.
Timing charts may be simplified for explanatory purposes.
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Output Transistor Operation Mode
VM
VM
RRS
VM
RRS
RSpin
U1
RRS
RSpin
RSpin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
L2
L1
ON
PGND
Load
ON
OFF
PGND
Charge mode
A current flows into the motor coil.
L2
PGND
Fast mode
The energy of the motor coil
is fed back to the power
Slow mode
A current circulates around the
motor coil and this device.
Output Transistor Operational Function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: The parameters shown in the table above are examples when the current flows in the directions shown in the figures above.
For the current flowing in the reverse direction, the parameters change as shown in the table below.
MODE
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Setting current value) can be set via the current-sensing resistor (RRS) and the reference
voltage (Vref), as follows:
Vref(V)
Iout(max) = Vref(gain) ×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example : In the case of a 100% setup
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Setting current value) will be
calculated as:
Iout = 3.0V / 5.0 / 0.51Ω= 1.18 A
Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM=1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C=270pF , R1=5.1kΩ => About fOSCM= 1.12MHz(Typ.))
fchop = fOSCM / 16
………fOSCM=1.12MHz => fchop =About 70kHz(typ.)
If chopping frequency is raised, Ripple of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Ripple of current may become
large. It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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Absolute maximum ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Note
Motor power supply
Motor output voltage
VM
Vout
50
50
V
V
Iout_(S)
2.5
A
Iout_(L)
5.0
A
VCC
6.0
V
VIN(H)
VIN(L)
Vref
6.0
-0.4
GND∼4.2
1.3
1.78
-20∼85
-55∼150
150
V
V
V
(Small mode)
Note 1
(Large mode)
Note 1
When externally
applied.
-
W
Note2
°C
°C
°C
-
Motor output current
VCC voltage
Logic input voltage
Vref input voltage
FTG
NG
Operating temperature
Storage temperature
Junction temperature
Power dissipation
PD
TOPR
TSTR
Tj(max)
Note 1: While in use, please make sure to take the heat generation matter into consideration, and use below 70% of
the absolute maximum ratings (Iout(S)≤1.75 A, Iout(L)≤3.5A) as a reference. Operating conditions (such as
surrounding temperature or board conditions) may limit the operating current. (Depends on the heat conditions.)
Note 2: The value in the state where it is not mounted on the board. When Ta exceeds 25°C, FTG type is necessary to
do the derating with 10.4mW/°C ,and NG type is necessary to do the derating with 14.2mW/°C.
Ta: Ambient temperature.
Topr: Operating ambient temperature.
Tj: Operating junction temperature. The maximum junction temperature is limited by the thermal shutdown.
Use the maximum junction temperature (Tj) at 120°C or less. The maximum current cannot be used under certain
thermal conditions.
Caution）Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or
combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The
TB67H410 does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated
maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations described later
should also be referred to.
Operating Ranges (Ta=-20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
VM power supply
VM
10
24
47
V
Iout(S)
-
1.0
2.5
A
Small mode
Iout(L)
-
2.0
5.0
A
Large mode
VIN(H)
2.0
-
5.5
V
Logic [High] level
Motor output current
Logic input voltage
Note
VIN(L)
GND
-
0.8
V
Logic [Low] level
Logic input frequency
fLOGIC
-
-
400
kHz
IN1,IN2,PWM
PWM signal frequency
fchop(range)
40
70
150
kHz
Vref input voltage
Vref
GND
2.0
4.0
V
Note: The actual maximum current may be limited by the operating environment (operating conditions such operating
duration, or by the surrounding temperature or board heat dissipation). Determine a realistic maximum current by
calculating the heat generated under the operating environment.
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Electrical Specifications 1 (Ta=25°C, VM=24V, unless specified otherwise)
Characteristics
High
Low
Logic input hysteresis voltage
High
Logic input current
Low
Logic input voltage
Symbol
Note
Min
Typ.
Max
Unit
VIN(H)
VIN(L)
VIN(HYS)
IIN(H)
IIN(L)
Logic input pins(Note)
Logic input pins(Note)
Logic input pins(Note)
Logic input pins:3.3V
Logic input pins:0V
Output:OPEN,
Standby mode
Output:OPEN, PWM=H,
IN1, IN2=Low
Output:OPEN
VRS=VM=50V,Vout=0V
2
0
100
-
33
-
5.5
0.8
300
1
V
V
mV
µA
µA
-
2
3.5
mA
-
3.5
5.5
mA
-
5.5
-
7
1
mA
µA
IM1
Power consumption
Output leakage current
IM2
High
Low
Output current channel differential
Output current accuracy
RS pin current
Drain-source ON-resistance
(High side + low side)
IM3
IOH
IOL
VRS=VM=Vout=50V
1
-
-
µA
ΔIout1
ΔIout2
IRS
Bridge A,B differential
Iout=1.5A
VRS=VM=24V
Tj=25°C, Forward direction
High side+Low side
Small mode
-5
-5
0
0
0
-
5
5
10
%
%
µA
-
0.8
0.9
Ω
Ron(H+L)
Note: VIN(L) is defined as the VIN voltage that causes the outputs (OUTA+, OUTA-, OUTB+ and OUTB-) to change
when a pin under test is gradually raised from 0 V. VIN(H) is defined as the VIN voltage that causes the outputs
(OUTA+, OUTA-, OUTB+ and OUTB-) to change when the pin is then gradually lowered.
The difference between VIN(H) and VIN(L) is defined as the VIN(HYS).
Note: The internal circuits are designed to avoid miss-function or leakage current; when the logic signal is applied
while the VM voltage is not supplied. But for fail-safe, please control the power supply and logic signal timing
correctly.
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Electrical Specifications 2 (Ta=25°C, VM=24V, unless specified otherwise)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Vref input current
Iref
Vref=2.0V
-
0
1
μA
Internal regulator voltage
VCC
ICC=5.0mA
4.75
5.0
5.25
V
Internal regulator current
ICC
VCC=5.0V
-
2.5
5
mA
Vref gain rate
Vref(gain)
Vref=2.0V
1/5.2
1/5.0
1/4.8
－
TSD threshold (Note1)
TjTSD
-
145
160
175
°C
VM power on reset voltage
VMR
-
7.0
8.0
9.0
V
Over current threshold (Note2)
ISD
-
2.6
3.0
4.0
A
Note 1:
Thermal shutdown (TSD) circuit
When the junction temperature of the device reaches the TSD threshold, the TSD circuit is triggered; the
internal reset circuit then turns off the output transistors. Once the TSD circuit is triggered, the device will be set
to standby mode, and can be cleared by reasserting the VM power source, or setting to standby mode
(INA1,INA2,INB1,INB2,PWMA,PWMB=All Low). The TSD circuit is a backup function to detect a thermal error,
therefore is not recommended to be used aggressively.
Note 2:
Over-current shutdown (ISD) circuit
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then
turns off the output transistors.Once the ISD circuit is triggered, the device will be set to standby mode, and
can be cleared by reasserting the VM power source, or setting to standby mode
(INA1,INA2,INB1,INB2,PWMA,PWMB=All Low).
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise
above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB67H410 or other components will be damaged
or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
•
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as
an output short-circuit; they do not necessarily guarantee the complete IC safety.
•
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
•
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
Minimum phase pulse width
Output transistor switching
characteristics
Analog blanking time
Note
Min
Typ.
Max
-
Unit
fLOGIC(min)
-
100
-
twp
-
50
-
-
twn
-
50
-
-
tr
-
30
80
130
tf
-
40
90
140
tpLH(LOGIC)
IN1,IN2,PWM - OUT
250
-
1200
tpHL(LOGIC)
IN1,IN2,PWM - OUT
250
-
1200
250
400
550
ns
VM=24V,Iout=1.5A
AtBLK
Analog tBLK
ns
ns
DtBLK(L)
TBLKAB:L, fOSCM=1120kHz
-
3.6
-
μs
DtBLK(H)
TBLKAB:H, fOSCM=1120kHz
-
5.4
-
μs
OSCM oscillation frequency
accuracy
⊿fOSCM
COSC= 270 pF, ROSC =5.1 kΩ
-15
-
+15
%
OSC oscillation reference
frequency
fOSCM
COSC= 270 pF, ROSC =5.1 kΩ
952
1120
1288
kHz
Chopping frequency
fchop
Output: Active(Iout=1.5 A),
fOSCM = 1120 kHz
-
70
-
kHz
Digital blanking time
Timing chart
1/fLOGIC
twn
50%
50%
50%
twp
【LOGIC】
tpHL(LOGIC)
tpLH(LOGIC)
90%
90%
50%
50%
【OUT】
10%
tf
tr
10%
Timing charts may be simplified for explanatory purpose.
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Package Dimensions
P-WQFN48-0707-0.50-003
Weight:
Unit : mm
0.10g（Typ.）
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P-SDIP24-0723-1.78-001
Weight:
Unit : mm
1.3g（Typ.）
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required at the mass production design stage. Toshiba does not grant any license to any industrial property rights by
providing these examples of application circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
over-current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the
effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the
negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or
ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of
power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute
maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result
in injury by explosion or combustion. In addition, do not use any device that has been inserted incorrectly.
Please take extra care when selecting external components (such as power amps and regulators) or external devices
(for instance, speakers). When large amounts of leak current occurs from capacitors, the DC output level may increase.
If the output is connected to devices such as speakers with low resist voltage, overcurrent or IC failure may cause
smoke or ignition. (The over-current may cause smoke or ignition from the IC itself.) In particular, please pay
attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker
directly.
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Points to remember on handling of ICs
Over current detection circuit
Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current detection circuits operate against the over current, clear the over current status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the
method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may
generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
thermal shutdown circuit to not operate properly or IC breakdown before operation.
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is
appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs
generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the
effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power
supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take
the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the
information in this document, and related hardware, software and systems (collectively "Product") without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software
and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life,
bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including
the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest
versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and
application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook"
and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all
aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of
this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this
document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS'
PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF
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PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use
includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment,
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LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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