TB67H420FTG
Toshiba BiCD process integrated circuit silicon monolithic
TB67H420FTG
Brushed DC Motor driver with Dual H-bridge mode
The TB67H420FTG is a brushed DC motor driver with sense
resistor less current control. The internal H-bridge can be
controlled independently, as a two brushed DC motor driver
or a single stepping motor driver using the dual H-bridge
mode.
Fabricated with the BiCD process, the TB67H420FTG is
rated at 50 V, 9.0 A
P-VQFN48-0707-0.50-004
Weight 0.14 g (typ.)
Features
• Supporting large current (9.0 A) and high voltage (50 V) brushed DC motor operation.
• Capable of driving two brushed DC motors using dual H-Bridge mode.
• Capable of driving one stepping motor using dual H-bridge mode.
• Built-in sense resistor less current control. (ACDS: Advanced Current Detection System)
• Low Rds (on) MOSFETs (High side+ Low side=0.33 Ω (typ.))
• Error detection features (Thermal shutdown (TSD), Over current detection (ISD), Power-on-reset (POR),
and Motor load open detection (OPD))
• Error detection signal output (Error Output)
• Internal VCC (5 V) regulator enables the driver to be operated with a single power supply (VM).
• Adjustable constant current PWM frequency using external components.
• Small package with thermal pad. (QFN48: 7.0 mm x 7.0 mm)
Note: Please consider the heat condition when using the TB67H420FTG.
©2017-2020
Toshiba Electronic Devices & Storage Corporation
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TB67H420FTG
NC
VMB
VMB
GND
NC
GND
VREFB
VREFA
VCC
VCC
OSCM
NC
Pin assignment
36 35 34 33 32 31 30 29 28 27 26 25
NC
37
24 OUTB+
NC
38
23 OUTB+
PWMA
39
22 RSBGND
PWMB
40
21 RSBGND
INA1
41
20 OUTB-
INA2
42
INB1
43
INB2
44
17 OUTA-
NC
45
16 RSAGND
NC
46
15 RSAGND
LO1
47
14 OUTA+
LO2
48
13 OUTA+
TB67H420FTG
(Top View)
19 OUTB-
4
5
6
7
8
9 10 11 12
HBMODE
NC
NC
NC
NC
NC
GND
NC
NC
3
VMA
2
VMA
1
TBLKAB
18 OUTA-
Note: Please solder the corner pad and the bottom thermal pad of the QFN package, to the GND pattern of the PCB.
Note: Pin names in the above figure are in the state when HBMODE is low level.
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TB67H420FTG
Pin description
Pin No.
Pin name
1
TBLKAB
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
HBMODE
HBMODE=High
Pin function
Noise filter setting pin for constant
current circuit
H-bridge drive mode setting pin
NC
Non connection
GND
NC
Ground pin
Non connection
VM
Motor power supply pin
NC
Non connection
OUT+
Motor output (+) pin for H-bridge
RSGND
Power ground pin for H-bridge
OUT+
Motor output (+) pin for H-bridge
OUT-
Motor output (-) pin for H-bridge
RSGND
Power ground pin for H-bridge
OUT-
Motor output (-) pin for H-bridge
NC
Non connection
VM
Motor power supply pin
NC
Non connection
GND
Ground pin
VREF
Current threshold reference pin for
H-bridge
31
32
33
34
VCC
35
OSCM
Pin No.
Pin name
1
TBLKAB
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
HBMODE
HBMODE=Low
Pin function
Noise filter setting pin for constant
current circuit
H-bridge drive mode setting pin
NC
Non connection
GND
NC
Ground pin
Non connection
VMA
Motor power supply pin (Ach)
NC
Non connection
OUTA+
Motor output (+) pin for H-bridge (Ach)
RSAGND
Power ground pin for H-bridge (Ach)
OUTA-
Motor output (-) pin for H-bridge (Ach)
OUTB-
Motor output (-) pin for H-bridge (Bch)
RSBGND
Power ground pin for H-bridge (Bch)
OUTB+
Motor output (+) pin for H-bridge (Bch)
NC
Non connection
VMB
Motor power supply pin (Bch)
NC
Non connection
GND
Ground pin
31
VREFB
32
VREFA
33
34
VCC
35
OSCM
Internal regulator voltage monitor
pin
Internal oscillator frequency setting
pin
Current threshold reference pin for
H-bridge (Bch)
Current threshold reference pin for
H-bridge (Ach)
Internal regulator voltage monitor pin
Internal oscillator frequency setting pin
36
36
37
NC
Non connection
37
NC
Non connection
38
38
39
PWMA
Short brake pin for H-bridge
39
PWMA
Short brake pin for H-bridge (Ach)
40
PWMB
(Note1)
40
PWMB
Short brake pin for H-bridge (Bch)
41
INA1
H-bridge control pin No.1
41
INA1
H-bridge (Ach) control pin No.1
42
INA2
H-bridge control pin No.2
42
INA2
H-bridge (Ach) control pin No.2
43
INB1
(Note1)
43
INB1
H-bridge (Bch) control pin No.1
44
INB2
(Note1)
44
INB2
H-bridge (Bch) control pin No.2
45
45
NC
Non connection
NC
Non connection
46
46
47
LO1
Error flag output pin No.1
47
LO1
Error flag output pin No.1
48
LO2
Error flag output pin No.2
48
LO2
Error flag output pin No.2
Note: Please do not connect any PCB pattern to the NC pins.
Note: For pins with the same pin name; connect the pins together at the nearest point of the driver.
Note: Some pin names are written differently depending on the state of HBMODE. Hereafter, they are unified in the state
when HBMODE is low level.
Note1: When HBMODE pin is set to high level, signal input is invalid (Don’t care).
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TB67H420FTG
Block diagram
38
Motor Oscillator
System
Oscillator
33
29
28
27
26
25
24
Clock
Control
VREFB
40
23
COMP
22
21
Pre Driver B
20
ISDB DET
43
Error Control
H-Bridge control
Logic-in Buffer
42
30
31
VM-VCC
Regulator
39
41
32
RSB Comparator
37
34
35
H-Bridge B Control
36
OPDB DET
19
OPDA DET
18
Thermal Detection
ISDA DET
44
17
COMP
VREFA
47
16
RSA Comparator
H-Bridge A Control
Error Flag
45
46
Pre Driver A
15
14
IN-BUFF
48
1
2
13
3
4
5
7
6
8
9
10
11
12
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purpose.
Note: All the grounding wires of the TB67H420FTG should run on the solder mask on the PCB and be externally terminated
at only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or
to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins
(VMA, VMB, RSAGND, RSBGND, OUTA, OUTB line, and GND) through which a particularly large current may run. If these
pins are wired incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mountings.
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TB67H420FTG
Input-Output equivalent circuit 1
Pin name
TBLKAB
HBMODE
PWMA
PWMB
INA1
INA2
INB1
INB2
Input-Output signal
Input-Output equivalent circuit
Logic input pin
1 kΩ
Logic input pin voltage
GND ≤ VIN(L) ≤ 0.8 V
100 kΩ
2.0 V ≤ VIN(H) ≤ 5.5 V
GND
(10 kΩ to 100 kΩ) VCC
Logic output pin
Logic output pin
LO1
0 V ≤ VOL ≤ 0.5 V
LO2
4.75 V ≤ VOH ≤ 5.25 V
VCC
1 kΩ
OSCM
OSCM frequency range
OSCM
500 Ω
0.64 MHz ≤ fOSCM ≤ 2.4 MHz
The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
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TB67H420FTG
Input-Output equivalent circuit 2
Pin name
Input-Output signal
Input-Output equivalent circuit
VCC
1 kΩ
VREFA
VCC
VCC voltage range
4.75 V ≤ VCC ≤ 5.25 V
VREFA
VREF input voltage range
GND ≤ VREF ≤ 4.0 V
VCC
1 kΩ
VREFB
VREFB
VMA
VMA
VMB
OUTA+
OUTA+
OUTA-
VM operation voltage range
10 V ≤ VM ≤ 47 V
OUTAVMB
RSAGND
OUTB+
Output pin voltage range
10 V ≤ VM ≤ 47 V
OUTB-
OUTB-
OUTB+
RSAGND
RSBGND
RSBGND
The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
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TB67H420FTG
◆Motor control functions
1. TBLKAB function
Blanking time (Digital tblank) is provided and controlled by TBLKAB pin for the constant-current detection circuit to avoid
error judgment of varistor recovery current. This blanking time is based on the OSCM signal and provided at the charge
start timing.
TBLKAB
Function
High
Digital tblank=fOSCM x 6 clk
Low
Digital tblank=fOSCM x 4 clk
Blanking time in the constant current PWM drive
The TB67H420FTG has blanking times shown below to take measures for the spike current generated in motor operation
and for the external noise.
(2)
(1)
NFth
Charge
Fast
Slow
fchop
Timing charts may be simplified for explanatory purposes.
(1) Digital tblank (to avoid detecting the inrush current during Decay->Charge switching): Configured by TBLKAB
(2) Analog tblank (to avoid detecting spike noises near NF threshold (NFth)): Fixed value of 0.35 μs (typ.)
* Blanking time and values mentioned above is a designed value, and is not guaranteed.
Correlation between control signals and digital tblank
The digital tblank is intended to avoid inrush current detection. The TB67H420FTG not only can be controlled by constant
current PWM, but also by direct PWM; with IN control signals. Therefore, the digital tblank is set at each IN switch timing;
shown with gray in the timing chart below.
IN1
IN2
IOUT
Timing charts may be simplified for explanatory purposes.
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TB67H420FTG
2. HBMODE function
Driving mode of the motor output is set by HBMODE.
HBMODE
Function
High
Single H-bridge mode (Two H-bridges are controlled in parallel.)
(connect to VCC )
Low
Dual H-bridge mode (Two H-bridges are controlled individually.)
(connect to GND)
HBMODE=High (Single H-bridge mode)
VMA
OUTA+
VMB
OUTB+
OUTA-
OUTB-
M
RSBGND
RSAGND
Note: When using the single H-bridge mode, the impedance on the board should be balanced. Also, the power supplies for
H-bridges (VMA and VMB), output pins (OUTA+ and OUTA-, OUTB+ and OUTB-), and RSGND pins (RSAGND and
RSBGND) should be connected to each other.
Note: The logic input level of HBMODE cannot be switched during operation. The input level is determined during startup
sequence, and will be fixated internally, to avoid any incoming noise. Therefore, setting the HBMODE to high,
connect to the VCC and to low, connect to the GND by PCB pattern.
Note: Control pins are different depending on the HBMODE setting. For details, please refer to the section ‘3. IN1, IN2, and
PWM functions’.
Note: The internal circuits are designed to avoid EMF or leakage current; when the logic signal is applied while the VM is
not. Please consider the control signal timing before supplying the VM.
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TB67H420FTG
HBMODE=Low (Dual H-bridge mode)
VMA
OUTA+
VMB
OUTB+
OUTA-
M
RSAGND
OUTB-
M
RSBGND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. IN1, IN2, and PWM functions
H-bridges are controlled by IN1, IN2, and PWM pins. When HBMODE is set to high, both H-bridges are controlled by INA1,
INA2, and PWMA pins; the INB1, INB2, and PWMB pins will be invalid (Don’t care). When HBMODE is set to low, H-bridge
(Ach) is controlled by INA1, INA2, and PWMA pins, and H-bridge (Bch) is controlled by INB1, INB2, and PWMB pins.
H-bridge (Ach) function
PWMA
INA1
Low
High
Low
High
Low
High
Low
High
INA2
Low
Low
High
High
Low
Low
High
High
OUTA+
Hi-Z
OUTAHi-Z
Drive mode
(Note)
Low
Low
Short brake
Hi-Z
High
Low
Low
Hi-Z
Low
High
Low
STOP (OFF)
CW (Forward rotation)
CCW(Reverse rotation)
Short brake
H-bridge (Bch) function
PWMB
INB1
INB2
OUTB+
OUTB-
Drive mode
Low
High
Low
High
Low
High
Low
High
Low
Low
High
High
Low
Low
High
High
Hi-Z
Hi-Z
(Note)
Low
Low
Short brake
Hi-Z
High
Low
Low
Hi-Z
Low
High
Low
STOP (OFF)
CW (Forward rotation)
CCW(Reverse rotation)
Short brake
Low
High
Low
High
Note: When INA1, INA2, and PWMA are set to low, H-bridge (Ach) will be Hi-Z. When INB1, INB2, and PWMB are set to
low, H-bridge (Bch) will be Hi-Z. The standby mode is only enabled when all 6 logic inputs (INA1, INA2, PWMA, INB1,
INB2, and PWMB) are set to low. (When HBMODE pin is set to high, the standby mode will be enabled by setting all
3 inputs, INA1, INA2, and PWMA, to low.)
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TB67H420FTG
4. LO1, LO2 (Error Output: error detect flag output) function
The LO1 and LO2 are signals that are flagged when the error state is detected. Both pins are open drain outputs, therefore
must be pulled up to VCC with a pull up resistor in the range of 10 k to 100 kΩ. During normal operation, the internal CMOS
will be OFF and the pins will show VCC when pulled up, or high-impedance when left open. If any of the error functions
(thermal shutdown (TSD), over current detection (ISD), or motor load open (OPD)) are detected, the internal CMOS will turn
on and show low level as mentioned in the table below.
Once the error status is released by reasserting the VM or using the standby mode, LO1 and LO2 will show “normal
operation” status. (Leave the pins open if you wish not to use this function.)
LO1
LO2
Function
VCC(Hi-Z)
VCC(Hi-Z)
Normal status (Normal operation)
VCC(Hi-Z)
Low
Detected motor load open (OPD)
Low
VCC(Hi-Z)
Detected over current (ISD)
Low
Low
Detected over thermal (TSD)
(10 k to 100 kΩ)
VCC
LO1, LO2
Once the error detection operates, internal
CMOS of both or either LO1 or LO2 will turn
on. (Pin voltage will show low level.)
During normal operation, the internal CMOS
of LO1 and LO2 will be turned off. (The pin
level will show high level (pull-up voltage of
VCC).
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
5. OSCM (internal oscillator) function
OSCM is used to adjust the internal oscillator frequency for constant current PWM control. The values of the resistor and
the capacitor connected to OSCM will set the internal oscillator frequency. Use the VCC to connect the ROSC to OSCM pin,
and do not connect to any other external power source. Also, to use the “internal fixed value”, leave the ROSC open, and
short the OSCM to GND. When using the “internal fixed value” OSCM, remember not to apply any control signals for 20 μs
after applying VM, or recovering from standby mode. (During this 20 μs, the TB67H420FTG will determine if the OSCM
should function with the “internal fixed value” mode.) The “internal fixed value” OSCM frequency and PWM chopping
frequency will be set to fOSCM ≈ 0.92 MHz, fchop ≈ 57 kHz.
OSCM
(ROSC)
VCC
When using the internal ‘fixed value OSCM
frequency’, leave the ROSC open, and
connect the OSCM to GND.
(COSC)
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Note: The oscillator frequency will be set by resistor (ROSC) and capacitor (COSC). When adjusting the frequency, set the
COSC to 270 pF, and change the value of the ROSC resistor. For details, please refer to the following descriptions.
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TB67H420FTG
OSCM oscillator frequency (chopping frequency) calculation
OSCM oscillator frequency can be calculated by using the external component values (ROSC[kΩ] and COSC[pF]), and the
formula shown below. (This is only effective when the COSC is set to 270 pF.)
fOSCM[MHz] = 4.0 x ROSC(-0.8)
COSC and ROSC are external components required to set the oscillator frequency. To adjust the oscillator frequency, use
270 pF for COSC and change the value of ROSC.
The correlation between the PWM chopping frequency (fchop) and the OSCM oscillator frequency (fOSCM) is as shown
below.
fchop = fOSCM / 16
For normal operation, setting the frequency in the range of 50 kHz to 70 kHz and adjust by usage conditions if needed.
When the chopping frequency is set to high, the current ripple becomes smaller, which leads to a higher reproducibility of a
waveform. However, the chopping frequency per unit time is increased and so the gate loss and the switching loss of the
integrated MOSFET become larger, which leads to an additional heat generation. On the other hand, when the chopping
frequency is set to low, the current ripple becomes be larger but the heat generation is reduced. Please set the frequency
according to the usage conditions and environment.
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TB67H420FTG
6. Mixed Decay + ACDS (sense-resistor less PWM) control
Mixed Decay
The TB67H420FTG applies the Mixed Decay architecture which monitors the motor current during constant current PWM
control. The basic sequence of the Mixed Decay is shown below.
fchop (=1/16 fOSCM)
NFth
fOSCM
IOUT
ADMDth
Charge
Fast Decay
(fchop × 37.5%, fOSCM × 6 clk)
Slow Decay
Mixed (Fast + Slow) Decay
Timing charts may be simplified for explanatory purposes.
Constant current PWM cycle is a loop of Charge -> Fast Decay -> Slow Decay -> Charge -> ··· to keep the peak current
below the NF threshold (NFth). The chopping frequency (fchop) is a period of 16 counts per cycle of OSCM oscillator
frequency (fOSCM). The sequence of Charge, Fast Decay, and Slow Decay is basically switched within this fchop cycle.
First, the motor current flows in (Charge) until it reaches the constant current threshold (NFth), which is set by VREF. Once
the motor current reaches the constant current threshold (NFth), the motor current is circulated back to the power supply.
(Fast Decay).
Fast Decay period continues for fOSCM × 6 clk (fchop × 37.5%), then switched to gradual discharge (Slow DecayI) for the
rest of the fchop cycle.
If the motor current reaches NFth and the time left within that fchop cycle is less than fOSCM × 6 clk (fchop × 37.5%), the
Fast Decay will continue for the rest of the fchop cycle.
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TB67H420FTG
Motor output MOSFET operation mode (Mixed Decay)
VM
OUT+
VM
VM
OUT+
OUT-
OUT-
RSGND
OUT+
OUT-
RSGND
Charge
RSGND
Fast Decay
Slow Decay
* The TB67H420FTG has a 400ns (design value) dead time to avoid any flow-through current during switching.
The equivalent circuits may be simplified or omitted for explanatory purposes.
Constant current threshold calculation (for each H-bridge)
The constant current PWM threshold can be set by applying voltage to the VREF pin.
IOUT=VREF × 2.25 (HBMODE=High: single H-bridge mode)
IOUT=VREF × 1.125 (HBMODE=Low: dual H-bridge mode)
Example: When current ratio is 100%, VREF voltage is 2.0 V, and HBMODE pin is set to high level, the constant current
PWM threshold is calculated as follows.
IOUT = 2.0 × 2.25 = 4.5 A
Mixed Decay current waveform
・ When the next current setting is higher than the previous step
fchop
fchop
fchop
fchop
NF
NF
NFth
Fast
Fast
Charge
NF
Slow
NF
NFth
Fast
Fast
Charge
Charge
Charge
Slow
Slow
Slow
Timing charts may be simplified for explanatory purposes.
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TB67H420FTG
・ When the Charge period continues beyond 1 fchop cycle
fchop
fchop
fchop
fchop
NF
NFth
Fast
Slow
Charge
NF
NF
NFth
Charge sequence continues until
the motor current reaches the NF
threshold (NFth).
Fast
Fast
Charge
Charge
Slow
Slow
Timing charts may be simplified for explanatory purposes.
・ When the next current setting is lower than the previous step
fchop
NFth
fchop
NF
The current is charged for a short period of time to determine
if the current is above or below the NF threshold (NFth).
Since the motor current level is higher than the NFth, the
operation is switched to Fast Decay.
NF
Fast
Fast
NF
Charge
Charge
Slow
fchop
fchop
Slow Charge
NFth
Fast
NF
Slow
Charge
Fast
Slow
Timing charts may be simplified for explanatory purposes.
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TB67H420FTG
Absolute maximum ratings (Ta = 25°C)
Symbol
Characteristics
Rating
Unit
Remarks
VM
50
V
―
VOUT
50
V
―
IOUT(SHB)
9.0
A
(Note1)
Motor output current
IOUT(DHB)
4.5
A
(Note2)
Internal Logic power supply
VCC
6.0
V
―
VIN(H)
6.0
V
―
Logic input voltage
VIN(L)
-0.4
V
―
LO output voltage
VLO
6.0
V
―
LO Inflow current
ILO
6.0
mA
―
Power dissipation
PD
1.3
W
(Note3)
Operating temperature
Topr
-20 to 85
°C
―
Storage temperature
Tstg
-55 to 150
°C
―
Junction temperature
Tj(max)
150
°C
―
Note1: When HBMODE is set to high. Please make sure that the peak current level of each H-bridge is kept under 4.5 A at
all times. Also, calculate the generating heat under the usage condition, and set the maximum current with a
reasonable margin. The motor current may be limited depending on ambient temperature and PCB layouts (heat
conditions).
Note2: When HBMODE is set to low. Please make sure that the current level of each H-bridge is kept under 4.5 A at all
times. Also, calculate the generating heat under the usage condition, and set the maximum current with a
reasonable margin. The motor current may be limited depending on ambient temperature and PCB layouts (heat
conditions).
Note3: Device alone (Ta =25°C)
Motor power supply
Motor output voltage
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. Tj (max) is limited by the thermal shutdown (TSD) threshold.
Please set the usage conditions so that the peak Tj is kept under 120°C for indication.
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion. The value of even one parameter of the absolute
maximum ratings should not be exceeded under any circumstances. All voltage ratings, including supply voltages, must
always be followed. Other notes and considerations described in the datasheet should also be referred to.
Operation ranges (Ta=-20 to 85°C)
Characteristics
Motor power supply
Motor output current
Symbol
Min
Typ.
Max
Unit
Remarks
VM
10
24
47
V
―
IOUT(SHB)
―
4.5
9.0
A
HBMODE=High (Note1)
IOUT(DHB)
―
2.25
4.5
A
HBMODE=Low (Note2)
LO output pin voltage
VLO
―
3.3
VCC
V
―
Chopping frequency
fchop(range)
40
70
150
kHz
―
VREF input voltage
VREF
GND
2.0
4.0
V
―
Note1: When HBMODE is set to high. Please make sure that the peak current level of each H-bridge is kept under 4.5 A at
all times. Also, calculate the generating heat under the usage condition, and set the maximum current with a
reasonable margin. The motor current may be limited depending on ambient temperature and PCB layouts (heat
conditions).
Note2: When HBMODE is set to low. Please make sure that the current level of each H-bridge is kept under 4.5 A at all
times. Also, calculate the generating heat under the usage condition, and set the maximum current with a
reasonable margin. The motor current may be limited depending on ambient temperature and PCB layouts (heat
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TB67H420FTG
conditions).
Electrical characteristics 1 (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Logic input voltage
Logic input hysteresis voltage
Logic input current
LO output pin voltage
Current consumption
Symbol
Test condition
Min
Typ.
Max
Unit
VIN(H)
VIN(L)
VIN(HYS)
IIN(H)
IIN(L)
VOL(LO)
IM1
High level (Note)
Low level (Note)
Hysteresis voltage
Input voltage =3.3 V
Input voltage =0 V
IOL=5 mA LO=Low
Standby mode
OUT: OPEN,
INA1, INA2, INB1, and INB2: Low,
Standby mode: Release
OUT: OPEN,
Standby mode: Release
2.0
0
0.1
―
―
―
―
―
―
―
33
―
0.2
2
5.5
0.8
0.3
―
1
0.5
―
V
V
V
µA
µA
V
mA
3
5
7
mA
4
6
8
mA
VM=50 V, VOUT=0 V
―
―
1
µA
IM2
IM3
Output leakage current
High-side
IOH
VM=VOUT=50 V
1
―
―
µA
Current differential between
Motor current channel differential
ΔIout1
-5
0
5
%
channels
Motor current setting differential
ΔIout2
Iout=2.25 A, HBMODE=Low
-5
0
5
%
Motor output ON-resistance
Tj=25°C, Forward direction (High
Ron(H+L)
―
0.33
0.45
Ω
( High-side + Low-side)
+ Low side)
Note: VIN(H) is defined as the VIN voltage that causes the outputs (OUTA+, OUTA-, OUTB+ and OUTB-) to change when a
pin under test is gradually raised from 0 V. VIN(L) is defined as the VIN voltage that causes the outputs (OUTA+,
OUTA-, OUTB+ and OUTB-) to change when the pin is then gradually lowered. The difference between VIN(H) and
VIN(L) is defined as the VIN(HYS).
Low-side
IOL
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Electrical characteristics 2 (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
VREF input current
IREF
VREF=2.0 V
―
0
1
μA
VCC voltage
VCC
ICC=5.0 mA
4.75
5.0
5.25
V
VCC current
ICC
VCC=5.0 V
―
2.5
5.0
mA
VREF gain
VREF(gain)
―
1.125
―
A/V
Thermal shutdown (TSD) threshold (Note1)
TjTSD
―
145
160
175
°C
VMPOR(H)
POR release
6.5
7.5
8.5
V
VMPOR(L)
POR detect
6.0
7.0
8.0
V
ISD
―
5.0
6.0
7.0
A
VM power-on-reset threshold
Over current detection (ISD) threshold (Note2)
VREF=2.0 V,
HBMODE=Low
Note1: Thermal shutdown (TSD)
When the TB67H420FTG detects an over temperature, the internal circuit turns off the output MOSFETs. Noise filter is built
in to avoid TSD misdetection, which may be triggered by external noise. Reassert the VM power supply or use the standby
mode to restart the device. The TSD is triggered when the device is over heated irregularly. Make sure not to use the TSD
function aggressively.
Note2: Over current detection (ISD)
When the TB67H420FTG detects an over current, the internal circuits turns off the output MOSFETs. Noise filter is built in to
avoid ISD misdetection, which may be triggered by external noise. Reassert the VM power supply or use the standby mode
to restart the device. The ISD is triggered when the motor current is over rated irregularly. Make sure not to use the ISD
function aggressively.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current
recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above
the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be
fully verified that there is no risk that the TB67H420FTG or other components will be damaged or fail due to the motor
back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output
short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be
damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists
for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by
external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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TB67H420FTG
AC electrical characteristics (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Minimum logic ‘High’ pulse width
tw(H)
Logic input signal
500
―
―
ns
Minimum logic ‘Low’ pulse width
tw(L)
Logic input signal
500
―
―
ns
tr
―
60
110
160
ns
tf
―
60
110
160
ns
tpLH
IN1, IN2, and PWM to OUT
―
500
―
ns
tpHL
IN1, IN2, and PWM to OUT
―
500
―
ns
ΔfOSCM1
COSC=270 pF, ROSC=5.1 kΩ
-15
―
+15
%
-20
―
+20
%
―
67
―
kHz
―
57
―
kHz
Output MOSFET switching
specifications
OSCM oscillator accuracy
COSC: GND short
ΔfOSCM2
ROSC: Open
COSC=270 pF, ROSC=5.1 kΩ
fchop1
PWM chopping frequency
COSC: GND short
fchop2
ROSC: Open
AC characteristics timing chart
tw(H)
tw(L)
VIN(H)
VIN(L)
Logic input signal
tpHL
tr
90%
50%
10%
Motor output voltage
tf
tpLH
The timing chart may be simplified for explanatory purpose.
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Application circuit example
The application circuits shown in this document are provided for reference purposes only, and are not guaranteed for mass
production.
Component values (for reference)
Symbol
CVM1
CVM2
RVF1, RVF2
CVCC
ROSC
COSC
RLO1, RLO2
Component
Electrolytic capacitor
Ceramic capacitor
Resistor
Ceramic capacitor
Resistor
Ceramic capacitor
Resistor
Reference constant number
100 μF (CVM1 ≥ 10 μF)
(0.1 μF)
(10 kΩ ≤ RVF1+RVF2 ≤ 50 kΩ) when using a voltage divider
0.1 μF
5.1 kΩ (1.8 kΩ to 8.2 kΩ)
270 pF
10 kΩ (10 kΩ to 100 kΩ)
Values mentioned in the table above are for reference only. They are not necessary limited and can be adjusted per each
usage condition.
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Package dimensions
Unit: mm
P-VQFN48-0707-0.50-004
Weight 0.14 g (typ.)
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Notes on Contents
1.
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3.
Timing Charts
Timing charts may be simplified for explanatory purposes.
4.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required at the mass production design stage. Any license to any industrial property rights is not granted by provision
of these application circuit examples.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
over-current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load,
causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of
the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and
insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent
device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative
current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of
power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute
maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion. In addition, do not use any device that has been inserted incorrectly.
(5) Please take extra care when selecting external components (such as power amps and regulators) or external devices
(for instance, speakers). When large amounts of leak current occur from capacitors, the DC output level may increase.
If the output is connected to devices such as speakers with low resist voltage, overcurrent or IC failure may cause
smoke or ignition. (The over-current may cause smoke or ignition from the IC itself.) In particular, please pay attention
when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.
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TB67H420FTG
Points to remember on handling of ICs
Over current detection circuit
Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances.
If the Over current detection circuits operate against the over current, clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over
current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of
use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat
resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate
against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
thermal shutdown circuit to not operate properly or IC breakdown before operation.
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is
appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate
heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC
characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation
with peripheral components.
Back-EMF
When a motor reverses the rotation in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the
effect of back-EMF into consideration in system design.
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