TB67S101AFG/FTG/FNG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB67S101AFG, TB67S101AFTG, TB67S101AFNG
PHASE-in controlled Bipolar Stepping Motor Driver
FG
The TB67S101A is a two-phase bipolar stepping motor driver
using a PWM chopper. An interface is PHASE in control.
Fabricated with the BiCD process, rating is 50 V/4.0 A .
Features
HSOP28-P-0450-0.80
・BiCD process integrated monolithic IC.
・Capable of controlling 1 bipolar stepping motor.
・PWM controlled constant-current drive.
・Allows full, half, quarter step operation.
・Low on-resistance (High + Low side=0.49Ω(typ)) MOSFET
output stage.
・High efficiency motor current control mechanism (Advanced
Dynamic Mixed Decay)
・High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
・Built-in error detection circuits (Thermal shutdown (TSD),
over-current shutdown (ISD), and power-on reset (POR))
・Built-in VCC regulator for internal circuit use.
・Chopping frequency of a motor can be customized
by external resistance and condenser.
・Multi package lineup
TB67S101AFG: HSOP28-P-450-0.80
TB67S101AFTG: P-WQFN48-0707-0.50-003
TB67S101AFNG: HTSSOP48-P-300-0.50
Weight 0.79g (Typ.)
FTG
P-WQFN48-0707-0.50-003
Weight 0.10g (Typ.)
FNG
HTSSOP48-P-300-0.50
Weight 0.21g (typ.)
Note) Please be careful about thermal conditions during use.
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TB67S101AFG/FTG/FNG
1. Pin assignment (TB67S101A)
(Top View)
INA1
INA2
PHASEA
PHASEB
INB1
INB2
1
2
3
4
5
6
STANDBY
7
OSCM
VREFA
VREFB
NC
NC
VCC
28
27
26
25
24
23
22
VM
FIN(GND)
FG
FIN(GND)
RSA
NC
OUTA＋
NC
GND
OUTA－
GND
8
9
21
20
19
18
17
10
11
12
13
14
RSB
NC
OUTB＋
NC
GND
OUTB－
GND
16
15
Please mount the FIN of the HSOP package to the GND area of the PCB.
NC
OUTB＋
OUTB＋
NC
RSB
RSB
NC
VM
NC
VCC
NC
NC
(Top View)
36 35 34 33 32 31 30 29 28 27 26 25
NC
37
24 NC
NC
38
23 NC
NC
39
22 GND
GND
40
21 OUTB－
VREFB
41
20 OUTB－
VREFA
42
19 GND
OSCM
43
INA1
44
17 OUTA－
INA2
45
16 OUTA－
PHASEA
46
15 GND
PHASEB
47
14 NC
NC
48
13 NC
NC
9 10 11 12
OUTA＋
8
OUTA＋
7
NC
6
RSA
INB2
5
NC
INB1
4
RSA
3
18 GND
GND
2
STANDBY
1
NC
FTG
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
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TB67S101AFG/FTG/FNG
(Top View)
OSCM
NC
INA1
INA2
PHASEA
NC
PHASEB
INB1
INB2
STANDBY
GND
NC
RSA
RSA
NC
OUTA＋
OUTA＋
NC
NC
GND
NC
OUTA－
OUTA－
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
FNG
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VREFA
VREFB
GND
NC
NC
NC
NC
VCC
NC
VM
NC
NC
RSB
RSB
NC
OUTB+
OUTB+
NC
NC
GND
NC
OUTB－
OUTB－
GND
Please mount the exposed pad of the HTSSOP package to the GND area of the PCB.
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TB67S101AFG/FTG/FNG
2. TB67S101A Block diagram
INA1
INA2
Standby
Control
+
Phase/Step
Selector
+
Signal Decode
Logic
INB1
INB2
PHASEA
PHASEB
Motor
Oscillator
System
Oscillator
VCC
Regulator
Current
Level
Set
Current
Reference
Setting
Motor Control Logic
Predriver
TSD
OSCM
VCC
VM
Power-on
Reset
STANDBY
Current
Comp
OSC-Clock
Converter
VREFA
VREFB
Current
Comp
Predriver
RSA
RSB
ISD
GND
OUTA+
OUTA-
OUTB+
OUTB-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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TB67S101AFG/FTG/FNG
Application Notes
All the grounding wires of the TB67S101A must run on the solder mask on the PCB and be externally terminated
at only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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TB67S101AFG/FTG/FNG
3. Pin explanations
TB67S101AFG (HSOP28)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
INA1
Motor Ach excitation control input 1
2
INA2
Motor Ach excitation control input 2
3
PHASEA
Current direction signal input for motor Ach
4
PHASEB
Current direction signal input for motor Bch
5
INB1
Motor Bch excitation control input 1
Motor Bch excitation control input 2
6
INB2
7
STANDBY
8
RSA
9
NC
10
OUTA+
11
NC
12
GND
13
OUTA－
14
GND
Ground pin
15
GND
Ground pin
16
OUTB－
17
GND
18
NC
19
OUTB＋
20
NC
21
RSB
Motor Bch current sense pin
22
VM
Motor power supply pin
23
VCC
24
NC
Non-connection pin
25
NC
Non-connection pin
26
VREFB
Motor Bch output set pin
27
VREFA
Motor Ach output set pin
28
OSCM
Oscillating circuit frequency for chopping set pin
All-function-initializing and Low power dissipation mode
Motor Ach current sense pin
Non-connection pin
Motor Ach (+) output pin
Non-connection pin
Ground pin
Motor Ach (-) output pin
Motor Bch (-) output pin
Ground pin
Non-connection pin
Motor Bch (+) output pin
Non-connection pin
Internal VCC regulator monitor pin
Please do not run patterns under NC pins.
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3. Pin explanations
TB67S101AFTG (QFN48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
NC
2
INB1
3
INB2
4
STANDBY
5
GND
6
NC
7
RSA(*)
Motor Ach current sense pin
8
RSA(*)
Motor Ach current sense pin
9
NC
10
OUTA＋(*)
Motor Ach (+) output pin
11
OUTA＋(*)
Motor Ach (+) output pin
12
NC
Non-connection pin
13
NC
Non-connection pin
14
NC
Non-connection pin
15
GND
16
OUTA－(*)
Motor Ach (-) output pin
17
OUTA－(*)
Motor Ach (-) output pin
18
GND
Ground pin
19
GND
Ground pin
20
OUTB－(*)
Motor Bch (-) output pin
21
OUTB－(*)
Motor Bch (-) output pin
22
GND
23
NC
Non-connection pin
24
NC
Non-connection pin
25
NC
Non-connection pin
26
OUTB＋(*)
Motor Bch (+) output pin
27
OUTB＋(*)
Motor Bch (+) output pin
28
NC
Non-connection pin
Motor Bch excitation control input 1
Motor Bch excitation control input 2
All-function-initializing and Low power dissipation mode
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Ground pin
Non-connection pin
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Pin No.29 – 48
Pin No.
Pin Name
Function
29
RSB(*)
Motor Bch current sense pin
30
RSB(*)
Motor Bch current sense pin
31
NC
Non-connection pin
32
VM
Motor power supply pin
33
NC
Non-connection pin
34
VCC
35
NC
Non-connection pin
36
NC
Non-connection pin
37
NC
Non-connection pin
38
NC
Non-connection pin
39
NC
Non-connection pin
Internal VCC regulator monitor pin
Ground pin
40
GND
41
VREFB
Motor Bch output set pin
42
VREFA
Motor Ach output set pin
43
OSCM
Oscillating circuit frequency for chopping set pin
44
INA1
Motor Ach excitation control input 1
45
INA2
Motor Ach excitation control input 2
46
PHASEA
Current direction signal input for motor Ach
47
PHASEB
Current direction signal input for motor Bch
48
NC
Non-connection pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB67S101A.
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3. Pin explanations
TB67S101AFNG (HTSSOP48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
OSCM
2
NC
3
INA1
Motor Ach excitation control input 1
4
INA2
Motor Ach excitation control input 2
5
PHASEA
6
NC
7
PHASEB
8
INB1
Motor Bch excitation control input 1
9
INB2
Motor Bch excitation control input 2
10
STANDBY
11
GND
12
NC
13
RSA(*)
Motor Ach current sense pin
14
RSA(*)
Motor Ach current sense pin
15
NC
16
OUTA＋(*)
Motor Ach (+) output pin
17
OUTA＋(*)
Motor Ach (+) output pin
18
NC
Non-connection pin
19
NC
Non-connection pin
20
GND
21
NC
22
OUTA－(*)
Motor Ach (-) output pin
23
OUTA－(*)
Motor Ach (-) output pin
24
GND
Ground pin
25
GND
Ground pin
26
OUTB－(*)
Motor Bch (-) output pin
27
OUTB－(*)
Motor Bch (-) output pin
28
NC
Oscillating circuit frequency for chopping set pin
Non-connection pin
Current direction signal input for motor Ach
Non-connection pin
Current direction signal input for motor Bch
All-function-initializing and Low power dissipation mode
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Non-connection pin
Non-connection pin
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TB67S101AFG/FTG/FNG
Pin No.29 – 48
Pin No.
Pin Name
Function
29
GND
30
NC
Non-connection pin
31
NC
Non-connection pin
32
OUTB＋(*)
Motor Bch (+) output pin
33
OUTB＋(*)
Motor Bch (+) output pin
34
NC
35
RSB(*)
Motor Bch current sense pin
36
RSB(*)
Motor Bch current sense pin
37
NC
Non-connection pin
38
NC
Non-connection pin
39
VM
Motor power supply pin
40
NC
Non-connection pin
41
VCC
42
NC
Non-connection pin
43
NC
Non-connection pin
44
NC
Non-connection pin
45
NC
Non-connection pin
Ground pin
Non-connection pin
Internal VCC regulator monitor pin
Ground pin
46
GND
47
VREFB
Motor Bch output set pin
48
VREFA
Motor Ach output set pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB67S101A.
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4. INPUT/OUTPUT equivalent circuit (TB67S101A)
IN/OUT signal
Equivalent circuit
INA1
INA2
PHASEA
Digital Input
INB2
VIH: 2.0V(min)~5.5V(max)
INB1
PHASEB
STANDBY
VCC
VREFA
VREFB
1kΩ
Logic
Input
(VIH/VIL)
Pin
100kΩ
Pin name
VIL : 0V(min)~0.8V(max)
GND
VCC
VCC voltage range
4.75V(min)~5.0V(typ)~5.25V(max)
1kΩ
VREF
VREF voltage range
0V~3.6V
GND
1kΩ
OSCM
OSCM frequency setting range
500Ω
OSCM
0.64MHz(min)~1.12MHz(typ)~2.4MHz(max)
GND
RS
OUTA+
OUTA-
OUTB+
OUTBRSA
RSB
VM power supply voltage range
10V(min)~47V(max)
OUT+
OUTPUT pin voltage
OUT-
10V(min)~47V(max)
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB67S101AFG/FTG/FNG
5. Function explanation (Stepping motor)
Motor output current (Iout) : The flow from OUT+ to OUT- is plus current. The flow from OUT- to OUT+ is minus current.
Ach
Bch
Input
Output
Input
Output
PHASEA
INA1
INA2
Iout(A)
PHASEB
INB1
INB2
Iout(B)
H
H
H
+100%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.
Ach
Bch
Input
Output
Input
Output
PHASEA
INA1
INA2
Iout(A)
PHASEB
INB1
INB2
Iout(B)
H
H
H
+100%
H
H
H
+100%
-
L
L
0%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
-
L
L
0%
L
H
H
-100%
L
H
H
-100%
-
L
L
0%
L
H
H
-100%
H
H
H
+100%
L
H
H
-100%
H
H
H
+100%
-
L
L
0%
- : Don't care
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Ach
Bch
Input
Output
Input
Output
PHASEA
INA1
INA2
Iout(A)
PHASEB
INB1
INB2
Iout(B)
H
H
L
+71%
H
H
L
+71%
H
L
H
+38%
H
H
H
+100%
X
L
L
0%
H
H
H
+100%
L
L
H
-38%
H
H
H
+100%
L
H
L
-71%
H
H
L
+71%
L
H
H
-100%
H
L
H
+38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
L
L
H
-38%
L
H
L
-71%
L
H
L
-71%
L
L
H
-38%
L
H
H
-100%
X
L
L
0%
L
H
H
-100%
H
L
H
+38%
L
H
H
-100%
H
H
L
+71%
L
H
L
-71%
H
H
H
+100%
L
L
H
-38%
H
H
H
+100%
X
L
L
0%
H
H
H
+100%
H
L
H
+38%
X : Don't care
Others
Pin Name
INA1, INA2
INB1, INB2
H
L
Notes
The current value of each ch is set up with 2
input 4 value.
PHASEA
OUT+: H
OUT+: L
PHASEB
OUT-: L
OUT-: H
STANDBY
Standby release
Standby mode
13
Please refer to the above-mentioned current value
setting table.
In PHASE=H, Charge current flows in the direction
of OUT- from OUT+.
In STANDBY= L, an internal oscillating circuit and a
motor output part are stopped. (The drive of a motor
cannot be performed.)
2013-11-05
TB67S101AFG/FTG/FNG
Current phasor (Full step resolution)
100%
D
A
CCW
Ach current [%]
CW
-100%
100%
0%
C
B
-100%
Bch current[%]
A
B
C
D
A
B
C
D
A
B
C
D
A
B
100%
Iout(A)
0%
-100%
100%
Iout(B)
0%
-100%
PHASEA
INA1
INA2
PHASEB
INB1
INB2
H
L
H
L
H
L
H
L
H
L
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.
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TB67S101AFG/FTG/FNG
Current phasor (Half step resolution)
G
100%
A
H
CCW
Ach current [%]
CW
F
B
-100%
0%
E
100%
C
-100% D
Bch current [%]
G
H
A
B
C
D
E
F
G
H
A
B
C
D
E
100%
Iout(A)
0%
-100%
100%
Iout(B)
0%
-100%
PHASEA
INA1
INA2
PHASEB
INB1
INB2
H
L
H
L
H
L
H
L
H
L
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.
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TB67S101AFG/FTG/FNG
Current phasor (Quarter step resolution)
N
P
100%
M
A
71%
L
Ach current [%]
O
CCW
38%
K
0%
-100% -71% -38%
B
CW
38%
71%100% C
-38%
J
D
-71%
I
E
-100%
H
G
F
Bch current [%]
N O P A BCD E F G H I J K L MN O P A BCD E F G H I J K L MN O P A
Iout(A)
100%
71%
38%
0%
-38%
-71%
-100%
Iout(B)
100%
71%
38%
0%
-38%
-71%
-100%
PHASEA
INA1
INA2
H
L
H
L
H
L
PHASEB
INB1
INB2
H
L
H
L
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.
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TB67S101AFG/FTG/FNG
6. Decay function
ADMD(Advanced Dynamic Mixed Decay) constant current control
The Advanced Dynamic Mixed Decay threshold, which determines the current ripple level during current feedback control, is
a unique value.
fchop
Internal
OSC
Setting
current value
NF detect
Detect
Advanced Dynamic Mixed
Decay threshold
ADMDth
Iout
Charge Mode→NF detect→Fast Decay→ADMDth detect→Slow
Decay→fchop 1 cycle→Charge mode
fchop 1 cycle：16clk
Auto Decay Mode current waveform
fchop
fchop
Internal
OSC
Setting
current value
NF detect
NF detect
Iout
Fast Decay
Slow Decay
ADMDth (Advanced Dynamic Mixed Decay threshold)
Timing charts may be simplified for explanatory purpose.
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TB67S101AFG/FTG/FNG
ADMD current waveform
・When the next current step is higher :
fchop
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
NF
Fast
Charge
Setting
current value
NF
Charge
Slow
NF
Fast
Charge
Fast
Fast
Slow
Slow
Charge
Slow
・When Charge period is more than 1 fchop cycle :
fchop
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
Fast
Slow
Charge
Setting
current value
NF
Charge
NF
Fast
Charge
Slow
Fast
Slow
When the Charge period is longer than fchop cycle, the Charge period will be extended until the motor current reaches the
NF threshold. Once the current reaches the next current step, then the sequence will go on to decay
mode.
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・When the next current step is lower :
fchop
Internal
OSC
Setting
current value
fchop
NF
Charge
The operation mode will be switched to ‘Charge’ to
monitor the motor current with the RS comparator;
then will be switched to ‘Fast’ because the motor
current is above the threshold.
NF
Fast
Charge
Fast
NF
Slow Charge
Slow
fchop
fchop
Fast
Setting
current value
Charge
Fast
Slow
・ When the Fast continues past
threshold during 1 fchop cycle)
fchop
Slow
1 fchop cycle (the motor current not reaching the ADMD
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
Charge
Fast
The operation mode will be switched to ‘Charge’ to
monitor the motor current with the RS comparator;
then will be switched to ‘Fast’ because the motor
current is above the threshold.
NF
Slow
Charge
If the motor current is still above the ADMD threshold
after reaching 1 fchop cycle, the output stage function
will stay ‘Fast’ until the current reaches the ADMDth.
Fast
Setting
current value
Charge
Slow
19
Fast
Slow
2013-11-05
TB67S101AFG/FTG/FNG
7．Output transistor function mode
VM
VM
RRS
VM
RRS
RSpin
RRS
RSpin
U1
RSpin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
L2
L1
ON
PGND
L2
ON
PGND
Charge mode
Load
OFF
PGND
Slow mode
Fast mode
Output transistor function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB67S101AFG/FTG/FNG
8．Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference
voltage (Vref), as follows:
Vref(V)
Iout(max) = Vref(gain) ×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example : In the case of a 100% setup
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Setting current value) will be
calculated as:
Iout = 3.0V / 5.0 / 0.51Ω= 1.18 A
9．Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM=1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C=270pF , R1=5.1kΩ => fOSCM =About 1.12MHz(Typ.))
fchop = fOSCM / 16
………fOSCM=1.12MHz => fchop =About 70kHz
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become large.
It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
Motor power supply
Motor output voltage
Motor output current
Internal Logic power supply
VM
Vout
Iout
VCC
50
50
4.0
6.0
V
V
A
V
VIN(H)
VIN(L)
Vref
PD
PD
PD
TOPR
6.0
-0.4
5.0
1.3
1.3
1.15
-20～85
V
V
V
W
W
W
℃
Note1
When externally
applied.
Note2
Note2
Note2
-
Storage temperature
TSTR
-55～150
℃
-
Junction temperature
Tj(max)
150
℃
-
Logic input voltage
Vref input voltage
QFN48
Power dissipation
HTSSOP48
HSOP28
Operating temperature
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a
standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions.
Note 2:
Device alone (Ta =25°C)
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (MAX), will not exceed 120°C.
Caution）Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB67S101A does not have overvoltage detection circuit. Therefore, the device is damaged if a
voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
Operation Ranges (Ta=-20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
Motor power supply
VM
10
24
47
V
Motor output current
Iout
-
1.5
3.0
A
Note1
VIN(H)
2.0
-
5.5
V
Logic input High Level
Logic input Low Level
Logic input voltage
VIN(L)
0
-
0.8
V
Phase input frequency
fPHASE
-
-
400
kHz
Chopper frequency
fchop(range)
40
70
150
kHz
Vref
GND
2.0
3.6
V
Vref input voltage
Remarks
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
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Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
HIGH
LOW
Logic input hysteresis voltage
HIGH
Logic input current
LOW
Logic input voltage
Power consumption
Symbol
Test condition
Min
Typ.
Max
Unit
VIN(H)
VIN(L)
VIN(HYS)
IIN(H)
IIN(L)
IM1
IM2
Logic input pin (*)
Logic input pin (*)
Logic input pin (*)
Logic input voltage=3.3V
Logic input voltage=0V
Output pins=open, STANDBY=L
Output pins=open, STANDBY=H
Output pins=open
Full step resolution
2.0
0
100
-
33
2
3.5
5.5
0.8
300
1
3.5
5.5
V
V
mV
µA
µA
mA
mA
-
5.5
7
mA
VRS=VM=50V,Vout=0V
-
-
1
µA
IM3
Output leakage current
High-side
Low-side
Motor current channel differential
Motor current setting accuracy
RS pin current
Motor output ON-resistance
(High-side+Low-side)
IOH
IOL
VRS=VM=Vout=50V
1
-
-
µA
ΔIout1
ΔIout2
IRS
Current differential between Ch
Iout=1.5A
VRS=VM=24V
Tj=25°C, Forward direction
-5
-5
0
0
0
-
5
5
10
%
%
µA
－
0.49
0.6
Ω
Ron(S)_PN
(High-side+Low-side)
*: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is
gradually raised from 0 V. VIN (L) is defined as the V IN voltage that causes the outputs (OUTA, OUTB) to change
when the pin is then gradually lowered. The difference between VIN (H) and VIN (L) is defined as the input
hysteresis.
*: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed not
to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM voltage
reaches the proper operating range.
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Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
Iref
Vref=2.0V
-
0
1
μA
VCC voltage
VCC
ICC=5.0mA
4.75
5.0
5.25
V
VCC current
ICC
VCC=5.0V
-
2.5
5
mA
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
Vref=2.0V
1/5.2
1/5.0
1/4.8
－
TjTSD
－
145
160
175
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
－
7.0
8.0
9.0
V
ISD
－
4.1
4.9
5.7
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered,
the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins
to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used
aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors.
Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is set to standby
mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB67S101A or other components will
be damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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TB67S101AFG/FTG/FNG
AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
Test condition
Min
Typ.
Max
fPHASE(min)
－
100
-
-
twp
－
50
-
-
twn
－
50
-
-
tr
－
30
80
130
Output transistor
tf
－
40
90
140
switching specific
tpLH(PHASE)
PHASE - Output
250
-
1200
tpHL(PHASE)
PHASE - Output
250
-
1200
250
400
550
ns
Minimum PHASE pulse width
VM=24V,Iout=1.5A
Unit
ns
ns
Analog noise blanking time
AtBLK
Oscillator frequency accuracy
⊿fOSCM
COSC=270pF, ROSC=5.1kΩ
-15
-
+15
%
Oscillator reference frequency
fOSCM
COSC=270pF, ROSC=5.1kΩ
952
1120
1288
kHz
Chopping frequency
fchop
Output:Active(IOUT =1.5 A),
fOSC = 1120 kHz
-
70
-
kHz
Analog tblank
AC Electrical Specification Timing chart
1/fPHASE
twn
50%
50%
50%
twp
【PHASE】
tpHL(PHASE)
tpLH(PHASE)
90%
90%
50%
50%
【OUT】
10%
tf
tr
10%
Timing charts may be simplified for explanatory purpose.
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Package Dimensions
(unit :mm)
HSOP28-P-0450-0.80
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TB67S101AFG/FTG/FNG
P-WQFN48-0707-0.50-003
(unit :mm)
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TB67S101AFG/FTG/FNG
HTSSOP48-P-300-0.50
(unit :mm)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
(2)
(3)
(4)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing IC
breakdown. IC breakdown may cause injury, smoke or ignition.
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection-type IC that inputs output DC voltage to a speaker directly.
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TB67S101AFG/FTG/FNG
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,
the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this
problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
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this document, and related hardware, software and systems (collectively "Product") without notice.
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incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
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