TB67S109AFTG(O,EL)

TB67S109AFTG/FNG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB67S109AFTG, TB67S109AFNG CLOCK-in controlled Bipolar Stepping Motor Driver The TB67S109A is a two-phase bipolar stepping motor driver using a PWM chopper. The clock in decoder is built in. Fabricated with the BiCD process, rating is 50 V/4.0 A . FTG Features • BiCD process integrated monolithic IC. • Capable of controlling 1 bipolar stepping motor. P-WQFN48-0707-0.50-003 • PWM controlled constant-current drive. Weight 0.10g (typ.) • Allows full, half, quarter, 1/8, 1/16, 1/32 step operation. • Low on-resistance (High + Low side=0.49Ω(typ.)) MOSFET output stage. FNG • High efficiency motor current control mechanism (Advanced Dynamic Mixed Decay) • High voltage and current (For specification, please refer to absolute maximum ratings and operation ranges) • Error detection (TSD/ISD) signal output function HTSSOP48-P-300-0.50 • Built-in error detection circuits (Thermal shutdown (TSD), over-current shutdown (ISD), and power-on reset (POR)) Weight 0.21g (typ.) • Built-in VCC regulator for internal circuit use. • Chopping frequency of a motor can be customized by external resistance and capacitor. • Multi package lineup TB67S109AFTG: P-WQFN48-0707-0.50-003 TB67S109AFNG: HTSSOP48-P-300-0.50 Note) Please be careful about thermal conditions during use. © 2014-2020 Toshiba Electronic Devices & Storage Corporation 1 2020-2-4 TB67S109AFTG/FNG Pin assignment (TB67S109A) NC OUTB+ OUTB+ NC RSB RSB NC VM NC VCC NC NC (Top View) 36 35 34 33 32 31 30 29 28 27 26 25 NC 37 24 NC LO 38 23 NC DMODE0 39 22 GND GND 40 21 OUTB- VREFB 41 20 OUTBFTG 19 GND 45 16 OUTA- DMODE1 46 15 GND DMODE2 47 14 NC NC 48 13 NC 4 5 6 7 8 9 10 11 12 NC 3 OUTA+ 2 OUTA+ 1 NC MO RSA 17 OUTA- RSA 44 NC CW/CCW GND 18 GND RESET 43 ENABLE OSCM CLK 42 NC VREFA Please solder the four corner pins of the QFN package and the exposed pad to the GND area of the PCB. (Top View) OSCM NC CW/CCW MO DMODE1 NC DMODE2 CLK ENABLE RESET GND NC RSA RSA NC OUTA+ OUTA+ NC NC GND NC OUTAOUTAGND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 FNG 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VREFA VREFB GND DMODE0 LO NC NC VCC NC VM NC NC RSB RSB NC OUTB+ OUTB+ NC NC GND NC OUTBOUTBGND Please solder the exposed pad of the HTSSOP package to the GND area of the PCB. 2 2020-2-4 TB67S109AFTG/FNG TB67S109A Block diagram DMODE0 Standby Control + Step Resolution Selector DMODE1 DMODE2 OSC-Clock Converter Motor Oscillator System Oscillator VCC Regulator OSCM VCC VM Power-on Reset Signal Decode Logic CW/CCW CLK Current Level Set RESET ENABLE Current Reference Setting MO VREFA VREFB LO Angle monitor Current Comp Error Output Motor Control Logic Predriver TSD Current Comp Predriver RSA RSB ISD H-bridge H-bridge GND OUTA+ OUTA- OUTB+ OUTB- Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes. 3 2020-2-4 TB67S109AFTG/FNG Application Notes When using TB67S109A, the GND pattern of PCB should be a solid pattern and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. 4 2020-2-4 TB67S109AFTG/FNG Pin explanations TB67S109AFTG (QFN48) Pin No.1 to 28 Pin No. Pin Name Function 1 NC Non-connection pin 2 CLK CLK signal input pin 3 ENABLE 4 RESET 5 GND 6 NC 7 RSA (*) Motor Ach current sense pin 8 RSA (*) Motor Ach current sense pin 9 NC 10 OUTA+ (*) Motor Ach (+) output pin 11 OUTA+ (*) Motor Ach (+) output pin 12 NC Non-connection pin 13 NC Non-connection pin 14 NC Non-connection pin 15 GND 16 OUTA- (*) Motor Ach (-) output pin 17 OUTA- (*) Motor Ach (-) output pin 18 GND Ground pin 19 GND Ground pin 20 OUTB- (*) Motor Bch (-) output pin 21 OUTB- (*) Motor Bch (-) output pin 22 GND 23 NC Non-connection pin 24 NC Non-connection pin 25 NC Non-connection pin 26 OUTB+ (*) Motor Bch (+) output pin 27 OUTB+ (*) Motor Bch (+) output pin 28 NC Ach/Bch output stage ON/OFF control pin Electric angle reset pin Ground pin Non-connection pin Non-connection pin Ground pin Ground pin Non-connection pin 5 2020-2-4 TB67S109AFTG/FNG Pin No.29 to 48 Pin No. Pin Name Function 29 RSB (*) Motor Bch current sense pin 30 RSB (*) Motor Bch current sense pin 31 NC Non-connection pin 32 VM Motor power supply pin 33 NC Non-connection pin 34 VCC 35 NC Non-connection pin 36 NC Non-connection pin 37 NC Non-connection pin 38 LO Error detect signal output pin 39 DMODE0 40 GND 41 VREFB Motor Bch output set pin 42 VREFA Motor Ach output set pin 43 OSCM Oscillating circuit frequency for chopping set pin 44 CW/CCW 45 MO Electric angle monitor pin 46 DMODE1 Step resolution set pin no.1 47 DMODE2 Step resolution set pin no.2 48 NC Internal VCC regulator monitor pin Step resolution set pin no.0 Ground pin Motor rotation direction set pin Non-connection pin • Please do not connect anything to the NC pins. *: Please connect the pins with the same pin name, while using the TB67S109A. 6 2020-2-4 TB67S109AFTG/FNG Pin explanations TB67S109AFNG (HTSSOP48) Pin No.1 to 28 Pin No. Pin Name Function 1 OSCM 2 NC 3 CW/CCW 4 MO Electric angle monitor pin 5 DMODE1 Step resolution set pin no.1 6 NC 7 DMODE2 8 CLK 9 ENABLE 10 RESET 11 GND 12 NC 13 RSA (*) Motor Ach current sense pin 14 RSA (*) Motor Ach current sense pin 15 NC 16 OUTA+ (*) Motor Ach (+) output pin 17 OUTA+ (*) Motor Ach (+) output pin 18 NC Non-connection pin 19 NC Non-connection pin 20 GND 21 NC 22 OUTA- (*) Motor Ach (-) output pin 23 OUTA- (*) Motor Ach (-) output pin 24 GND Ground pin 25 GND Ground pin 26 OUTB- (*) Motor Bch (-) output pin 27 OUTB- (*) Motor Bch (-) output pin 28 NC Oscillating circuit frequency for chopping set pin Non-connection pin Motor rotation direction set pin Non-connection pin Step resolution set pin no.2 CLK signal input pin Ach/Bch output stage ON/OFF control pin Electric angle reset pin Ground pin Non-connection pin Non-connection pin Ground pin Non-connection pin Non-connection pin 7 2020-2-4 TB67S109AFTG/FNG Pin No.29 to 48 Pin No. Pin Name Function 29 GND 30 NC Non-connection pin 31 NC Non-connection pin 32 OUTB+ (*) Motor Bch (+) output pin 33 OUTB+ (*) Motor Bch (+) output pin 34 NC 35 RSB (*) Motor Bch current sense pin 36 RSB (*) Motor Bch current sense pin 37 NC Non-connection pin 38 NC Non-connection pin 39 VM Motor power supply pin 40 NC Non-connection pin 41 VCC 42 NC Non-connection pin 43 NC Non-connection pin 44 LO Error detect signal output pin 45 DMODE0 46 GND 47 VREFB Motor Bch output set pin 48 VREFA Motor Ach output set pin Ground pin Non-connection pin Internal VCC regulator monitor pin Step resolution set pin no.0 Ground pin • Please do not connect anything to the NC pins. *: Please connect the pins with the same pin name, while using the TB67S109A. 8 2020-2-4 TB67S109AFTG/FNG INPUT/OUTPUT equivalent circuit (TB67S109A) DMODE0 DMODE1 DMODE2 CLK ENABLE RESET CW/CCW LO MO IN/OUT signal Equivalent circuit 1kΩ Logic Input Pin Digital Input (VIH/VIL) 100kΩ Pin name VIH: 2.0V(min) to 5.5V(max) VIL: 0V(min) to 0.8V(max) GND Logic Output Pin Digital Output (VOH/VOL) (Pullup resistance:10k to 100kΩ) GND VCC VCC VREFA VREFB VCC voltage range 4.75V(min) to 5.0V(typ.) to 5.25V(max) 1kΩ VREF VREF voltage range 0V to 3.6V GND 1kΩ OSCM OSCM frequency setting range 0.64MHz(min) to 1.12MHz(typ.) to 2.4MHz(max) 500Ω OSCM GND RS OUT A+ OUT AOUT B+ OUT BRSA RSB VM power supply voltage range 10V(min) to 47V(max) OUT+ OUTPUT pin voltage 10V(min) to 47V(max) OUT- GND The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 9 2020-2-4 TB67S109AFTG/FNG Function explanation (Stepping motor) CLK Function Each up-edge of the CLK signal will shift the motor’s electrical angle per step. CLK Input Function Up-edge Shifts the electrical angle per step. Down-edge (State of the electrical angle does not change.) ENABLE function The ENABLE pin controls the ON and OFF of the corresponding output stage. This pin serves to select if the motor is stopped in OFF mode (High impedance) or activated. Please set the ENABLE pin to ‘L’ during VM power-on and power-off sequence. ENABLE Input Function H Output stage=‘ON’ (Normal operation mode) L Output stage=’OFF (High impedance mode) CW/CCW function and the output pin function (Output logic at the time of a charge start) The CW/CCW pin controls the rotation direction of the motor. When set to ‘Clockwise’, the current of OUTA is output first, with a phase difference of 90°. When set to ‘Counterclockwise”, the current of OUTB is output first with a phase difference of 90°. CW/CCW Input OUT (+) OUT (-) H: Clockwise operation(CW) H L L: Counterclockwise operation(CCW) L H Step resolution select function DMODE0 DMODE1 DMODE2 Function L L L Standby mode (the OSCM is disabled and the output stage is set to ‘OFF’ status) L L H Full step resolution L H L Half step resolution(Type A) L H H Quarter step resolution H L L Half step resolution(Type B) H L H 1/8 step resolution H H L 1/16 step resolution H H H 1/32 step resolution When switching the DMODE0,1,2; setting the RESET signal to Low (will set the electrical angle to the initial status), is recommended. 10 2020-2-4 TB67S109AFTG/FNG Step resolution setting and initial angle [Full step resolution] CLK MO H L H L +100% Iout(A) 0% -100% +100% Iout(B) 0% -100% CCW CW [Half step resolution (Type A)] CLK MO H L H L +100% Iout(A) 0% -100% +100% Iout(B) 0% -100% CCW CW MO output shown in the timing chart is when the MO pin is pulled up. Timing charts may be simplified for explanatory purpose. 11 2020-2-4 TB67S109AFTG/FNG [Half step resolution (Type B)] CLK MO H L H L +100% +71% Iout(A) 0% -71% -100% +100% +71% Iout(B) 0% -71% -100% CCW CW [Quarter step resolution] CLK MO H L H L +100% +71% +38% 0% Iout(A) -38% -71% -100% +100% +71% +38% Iout(B) 0% -38% -71% -100% CCW CW MO output shown in the timing chart is when the MO pin is pulled up. Timing charts may be simplified for explanatory purpose. 12 2020-2-4 TB67S109AFTG/FNG [1/8 step resolution] CLK MO H L H L +100% +98% +96% +83% +71% +56% +38% +20% Iout(A) 0% -20% -38% -56% -71% -83% -96% -98% -100% +100% +98% +96% +83% +71% +56% +38% +20% Iout(B) 0% -20% -38% -56% -71% -83% -96% -98% -100% CCW CW MO output shown in the timing chart is when the MO pin is pulled up. Timing charts may be simplified for explanatory purpose. 13 2020-2-4 TB67S109AFTG/FNG [1/16 step resolution] CLK MO H L H L +100% +98% +96% +83% +71% +56% +38% +20% Iout(A) 0% -20% -38% -56% -71% -83% -96% -98% -100% +100% +98% +96% +83% +71% +56% +38% +20% Iout(B) 0% -20% -38% -56% -71% -83% -96% -98% -100% CCW CW MO output shown in the timing chart is when the MO pin is pulled up. Timing charts may be simplified for explanatory purpose. 14 2020-2-4 TB67S109AFTG/FNG [1/32 step resolution] H L H L CLK MO +100% Iout(A) 0% -100% +100% Iout(B) 0% -100% CCW CW MO output shown in the timing chart is when the MO pin is pulled up. Timing charts may be simplified for explanatory purpose. 15 2020-2-4 TB67S109AFTG/FNG Step setting and current percentage Current [%] 100% 99% 98% 97% 96% 94% 92% 90% 88% 86% 83% 80% 77% 74% 71% 67% 63% 60% 56% 52% 47% 43% 38% 34% 29% 25% 20% 15% 10% 5% 0% Full Available Half (A) Available Half (B) Available Quarter Available 1/8 Available Available Available 1/16 Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available 1/32 Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available RESET function RESET Input Function H Sets the electrical angle to the initial condition. L Normal operation mode The current for each channel (while RESET is applied) is shown in the table below. MO will show ‘L’ at this time. Step resolution setting Ach current setting Bch current setting Default electrical angle Full step 100% 100% 45° Half step (Type A) 100% 100% 45° Half step (Type B) 71% 71% 45° Quarter step 71% 71% 45° 1/8 step 71% 71% 45° 1/16 step 71% 71% 45° 1/32 step 71% 71% 45° 16 2020-2-4 TB67S109AFTG/FNG LO(Error detect signal) output function When Thermal shutdown(TSD) or Over-current shutdown(ISD) is applied, the LO voltage will be switched to Low(GND) level. VCC 10kΩ The LO is an open-drain output pin. LO pin needs to be pulled up to 3.3-V/5.0-V level for proper function. During regular operation, the LO pin level will stay High(VCC level). When error detection (TSD, ISD) is applied, the LO pin will show Low (GND) level. 17 2020-2-4 TB67S109AFTG/FNG Decay function ADMD(Advanced Dynamic Mixed Decay) constant current control The Advanced Dynamic Mixed Decay threshold, which determines the current ripple level during current feedback control, is a unique value. fchop Internal OSC Setting current value NF detect Detect Advanced Dynamic Mixed Decay threshold ADMDth Iout Charge Mode -> NF detect -> Fast Decay -> ADMDth detect -> Slow Decay -> fchop 1 cycle -> Charge mode fchop 1 cycle: 16clk Auto Decay Mode current waveform fchop fchop Internal OSC Setting current value NF detect NF detect Iout Fast Decay Slow Decay ADMDth (Advanced Dynamic Mixed Decay threshold) Timing charts may be simplified for explanatory purpose. 18 2020-2-4 TB67S109AFTG/FNG ADMD current waveform When the next current step is higher: fchop fchop fchop fchop Internal OSC Setting current value NF NF Fast Fast Charge Setting current value NF Slow NF Fast Fast Charge Charge Charge Slow Slow Slow When Charge period is more than 1 fchop cycle: fchop fchop fchop fchop Internal OSC Setting current value NF Fast Slow Charge Setting current value NF NF Fast Fast Charge Charge Slow Slow When the Charge period is longer than fchop cycle, the Charge period will be extended until the motor current reaches the NF threshold. Once the current reaches the next current step, then the sequence will go on to decay mode. 19 2020-2-4 TB67S109AFTG/FNG When the next current step is lower: fchop Internal OSC Setting current value fchop NF The operation mode will be switched to ‘Charge’ to monitor the motor current with the RS comparator; then will be switched to ‘Fast’ because the motor current is above the threshold. NF Fast Fast NF Charge Charge fchop fchop Slow Charge Slow Fast Setting current value Fast Charge Slow Slow When the Fast continues past 1 fchop cycle (the motor current not reaching the ADMD threshold during 1 fchop cycle) fchop fchop fchop fchop Internal OSC Setting current value NF Fast The operation mode will be switched to ‘Charge’ to monitor the motor current with the RS comparator; then will be switched to ‘Fast’ because the motor current is above the threshold. NF Charge Slow Charge If the motor current is still above the ADMD threshold after reaching 1 fchop cycle, the output stage function will stay ‘Fast’ until the current reaches the ADMDth. Fast Setting current value Fast Charge ADMDth Slow 20 Slow 2020-2-4 TB67S109AFTG/FNG Output transistor function mode VM VM RRS VM RRS RS pin RRS RS pin U1 RS pin U2 U1 U2 U1 U2 OFF OFF ON OFF OFF L1 L2 L1 L2 L1 OFF ON ON OFF ON ON Load Load PGND Load PGND Charge mode A current flows into the motor coil. L2 ON PGND Fast mode The energy of the motor coil is fed back to the power Slow mode A current circulates around the motor coil and this device. Output transistor function MODE U1 U2 L1 L2 CHARGE ON OFF OFF ON SLOW OFF OFF ON ON FAST OFF ON ON OFF Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above. If the current flows in the opposite direction, refer to the following table. MODE U1 U2 L1 L2 CHARGE OFF ON ON OFF SLOW OFF OFF ON ON FAST ON OFF OFF ON This IC controls the motor current to be constant by 3 modes listed above. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 21 2020-2-4 TB67S109AFTG/FNG Calculation of the Predefined Output Current For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator. The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference voltage (Vref), as follows: Vref(V) Iout(max) = Vref(gain) × RRS(Ω) Vref(gain): the Vref decay rate is 1/ 5.0 (typ.) For example: In the case of a 100% setup when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Setting current value) will be calculated as: Iout = 3.0V / 5.0 / 0.51Ω= 1.18 A Calculation of the OSCM oscillation frequency (chopper reference frequency) An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop) can be calculated by the following expressions. fOSCM=1/[0.56x{Cx(R1+500)}] ....... C,R1: External components for OSCM (C=270pF , R1=5.1kΩ => About fOSCM= 1.18MHz(Typ.)) fchop = fOSCM / 16 ....... fOSCM=1.18MHz => fchop =About 74kHz If chopping frequency is raised, Ripple of current will become small and wave-like reproducibility will improve. However, the gate loss inside IC goes up and generation of heat becomes large. By lowering chopping frequency, reduction in generation of heat is expectable. However, Ripple of current may become large. It is a standard about 70 kHz. A setup in the range of 50 to 100 kHz is recommended. 22 2020-2-4 TB67S109AFTG/FNG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Motor power supply VM 50 V ― Motor output voltage Vout 50 V ― Motor output current Iout 4.0 A (Note 1) Internal Logic power supply VCC 6.0 V When externally applied. VIN(H) 6.0 V ― Logic input voltage Remarks VIN(L) -0.4 V ― MO output voltage VMO 6.0 V ― LO output voltage VLO IMO ILO 6.0 30 30 V mA mA ― ― ― WQFN48 PD 1.3 W (Note 2) HTSSOP48 PD 1.3 W (Note 2) Operating temperature TOPR -20 to 85 °C ― Storage temperature TSTR -55 to 150 °C ― Junction temperature Tj(max) 150 °C ― MO Inflow current LO Inflow current Power dissipation Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a standard on thermal rating. The maximum output current may be further limited in view of thermal considerations, depending on ambient temperature and board conditions. Note 2: Device alone (Ta =25°C) Ta: Ambient temperature Topr: Ambient temperature while the IC is active Tj: Junction temperature while the IC is active. Tj(max) is limited by the thermal shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the maximum junction temperature, Tj (max), will not exceed 120°C. Caution) Absolute maximum ratings The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The TB67S109A does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated maximum is applied. All voltage ratings, including supply voltages, must always be followed. The other notes and considerations described later should also be referred to. Operation Ranges (Ta=-20 to 85°C) Characteristics Symbol Min Typ. Max Unit Motor power supply VM 10 24 47 V ― Motor output current Iout ― 1.5 3.0 A (Note 1) VIN(H) VIN(L) 2.0 0 ― ― 5.5 0.8 V V Logic input High Level Logic input Low Level VMO VLO ― ― 3.3 3.3 5.0 5.0 V V fCLK ― ― 100 kHz ― ― ― fchop(range) 40 70 150 kHz ― Vref GND 2.0 3.6 V ― Logic input voltage MO output pin voltage LO output pin voltage Clock input frequency Chopper frequency Vref input voltage Remarks Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions (exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on). 23 2020-2-4 TB67S109AFTG/FNG Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless otherwise specified) Characteristics Symbol Test condition Min Typ. Max Unit HIGH VIN(H) Logic input 2.0 ― 5.5 V LOW VIN(L) Logic input 0 ― 0.8 V VIN(HYS) Logic input (Note 1) 100 ― 300 mV HIGH IIN(H) VIN(H)=3.3V ― 33 ― µA LOW IIN(L) VIN(L)=0V ― ― 1 µA MO output pin voltage LOW VOL(MO) IOL=24mA output=Low ― 0.2 0.5 V LO output pin voltage LOW VOL(LO) IOL=24mA output=Low ― 0.2 0.5 V Output pins=open Standby mode Output pins=open Standby release ENABLE=Low Output pins=open Full step resolution ― 2 3.5 mA ― 3.5 5.5 mA ― 5.5 7 mA Logic input voltage Logic input hysteresis voltage Logic input current IM1 Current consumption IM2 IM3 High-side IOH VRS=VM=50V,Vout=0V ― ― 1 µA Low-side IOL VRS=VM=Vout=50V -1 ― ― µA -5 0 5 % Iout=1.5A -5 0 5 % Output leakage current Motor current channel differential ΔIout1 Motor current setting accuracy ΔIout2 RS pin current IRS VRS=VM=24V 0 ― 10 µA Ron(H+L) Tj=25°C, Forward direction (High-side+Low-side) ― 0.49 0.6 Ω Motor output ON-resistance (High-side+Low-side) Current differential between Ch Note 1: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is gradually raised from 0 V. V IN (L) is defined as the V IN voltage that causes the outputs (OUTA, OUTB) to change when the pin is then gradually lowered. The difference between V IN (H) and V IN (L) is defined as the V IN (HYS). Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM voltage reaches the proper operating range. 24 2020-2-4 TB67S109AFTG/FNG Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless otherwise specified) Characteristics Symbol Test condition Min Typ. Max Unit Vref input current Iref Vref=2.0V ― 0 1 μA VCC voltage VCC ICC=5.0mA 4.75 5.0 5.25 V VCC current ICC VCC=5.0V ― 2.5 5 mA Vref gain rate Thermal shutdown(TSD) threshold (Note1) Vref(gain) Vref=2.0V 1/5.2 1/5.0 1/4.8 ― TjTSD ― 145 160 175 °C VM recovery voltage Over-current detection (ISD) threshold (Note2) VMR ― 7.0 8.0 9.0 V ISD ― 4.1 4.9 5.7 A Note1: About TSD When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered, the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used aggressively. Note2: About ISD When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors. Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is set to standby mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary trouble. Back-EMF While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be fully verified that there is no risk that the TB67S109A or other components will be damaged or fail due to the motor back-EMF. Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD) The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output short-circuit; they do not necessarily guarantee the complete IC safety. If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be damaged due to an output short-circuit. The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by external hardware. IC Mounting Do not mount devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or deterioration of the device. 25 2020-2-4 TB67S109AFTG/FNG AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7Ω) Characteristics Symbol Test condition Min Typ. Max Unit Inside filter of CLK input minimum High width tCLK(H) The CLK(H) minimum pulse width 300 ― ― ns Inside filter of CLK input minimum Low width tCLK(L) The CLK(L) minimum pulse width 250 ― ― ns tr ― 30 80 130 ns Output transistor tf ― 40 90 140 ns switching specific tpLH(CLK) CLK-Output ― 1000 ― ns tpHL(CLK) CLK-Output ― 1500 ― ns Analog noise blanking time AtBLK VM=24V,Iout=1.5A 250 400 550 ns Oscillator frequency accuracy ΔfOSCM COSC=270pF, ROSC=5.1 kΩ -15 ― +15 % Oscillator reference frequency fOSCM COSC= 270 pF, ROSC =5.1 kΩ 952 1120 1288 kHz Chopping frequency fchop Output:Active(Iout =1.5 A), fOSCM = 1120 kHz ― 70 ― kHz AC Electrical Specification Timing chart 1/fCLK tCLK(L) 50% 50% 50% tCLK(H) [CLK] tpHL(CLK) tpLH(CLK) 90% 90% 50% 50% [OUT] 10% tr tf 10% Timing charts may be simplified for explanatory purpose. 26 2020-2-4 TB67S109AFTG/FNG (Reference) About the relation between power dissipation and ambient temperature Power dissipation Power dissipation PD (W) PD (W) PD-Ta Graph (1): Device alone (2): Measured when mounted on the four-layer board. θj-a=30.5°C/W. This value is dependent on a substrate pattern and mounting conditions. Ambient temperature Ta (°C) * This value is dependent on a substrate pattern and mounting conditions. Please be careful. Moreover, power dissipation becomes small when ambient temperature is high. 27 2020-2-4 TB67S109AFTG/FNG Package Dimensions P-WQFN48-0707-0.50-003 (Unit: mm) Weight 0.10g (typ.) 28 2020-2-4 TB67S109AFTG/FNG HTSSOP48-P-300-0.50 (Unit: mm) Weight 0.21g (typ.) 29 2020-2-4 TB67S109AFTG/FNG Notes on Contents Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing Charts Timing charts may be simplified for explanatory purposes. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback capacitor, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. 30 2020-2-4 TB67S109AFTG/FNG Points to remember on handling of ICs Overcurrent detection Circuit Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status immediately. Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition, depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over-temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal shutdown circuit to operate improperly or IC breakdown to occur before operation. Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor reverses the rotation direction, stops or slows abruptly, current flows back to the motor’s power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 31 2020-2-4 TB67S109AFTG/FNG RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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