TB67S149FG
Toshiba BiCD Process Integrated Circuit Silicon Monolithic
TB67S149FG
Clock controlled Unipolar stepping motor driver
FG
The TB67S149FG is a Clock controlled PWM chopping type 2 phase unipolar
stepping motor driver. Using the BiCD process, the TB67 S149FG can be
of operated with VM voltage of 45 V, output voltage of 84 V, and output current
3.0 A at max (absolute maximum ratings).
P-HSSOP28-0819-0.80-001
Features
・BiCD processed monolithic integrated circuit.
Weight: 0.88 g (Typ.)
・Capable of operating one unipolar stepping motor.
・PWM controlled current sense resistance-less constant current drive .
・Full, half(a), half(b), quarter, 1/8, 1/16, 1/32 step resolution.
・Low on resistance(0.25 Ω (Typ.) output MOSFET.
・High voltage and current (For specification, please refer to the absolute maximum ratings and operation ranges).
・Standby (low power) mode function
・Error detect feedback signal output function (Over current/Thermal shutdown).
・Error detect function (Thermal shutdown(TSD), Over current(ISD), and Low voltage(POR).
・Built-in VCC regulator for internal circuit use.
・Fixed off time can be adjusted by external components.
Note) Please be careful about the thermal conditions during use.
©2014 TOSHIBA Corporation
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2015-06-15
TB67S149FG
Pin assignment (TB67S149FG)
(Top View)
1
DMODE0
MO
28
2
DMODE1
ERR
27
3
DMODE2
OSCM
26
4
RESET
VREF
25
5
CLK
VCC
24
6
ENABLE
NC
23
7
CW/CCW
VM
22
GND
FIN
FIN
GND
TB67S149FG
8
NC
VCOM
21
9
OUTA+
OUTB+
20
10
OUTA+
OUTB+
19
11
RSGNDA
RSGNDB
18
12
RSGNDA
RSGNDB
17
13
OUTA-
OUTB-
16
14
OUTA-
OUTB-
15
*Note) Please solder the FIN to the GND pattern of the board.
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TB67S149FG
TB67S149 block diagram
RESET
ENABLE
Ach
Pre
drv
Polarity and Angle control
CW/CCW
MO
VREF
Ach
OUT
Nch×2
OUT A+
OUT ARSGNDA
RS Comp
VREF
STANDBY
Control
OSCM
Internal OSC
VCC
ERR
VCC regulator
RS Comp
CLK
VCOM
Bch
Pre
drv
DMODE0
DMODE1
Error detect
(TSD/ISD)
POR
VM
Step Resolution Control
DMODE2
Bch
OUT
Nch×2
OUT B+
OUT BRSGNDB
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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TB67S149FG
Application Notes
All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at
only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RSGND, OUT, GND) through which a particularly large current may run. If these pins are
wired incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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TB67S149FG
Pin explanations
TB67S149FG (HSSOP28)
Pin No.1 to 28
Pin No.
Pin Name
Function
1
DMODE0
Step setting pin 0
2
DMODE1
Step setting pin 1
3
DMODE2
Step setting pin 2
4
RESET
Electrical angle reset pin
5
CLK
External Clock input pin
6
ENABLE
Motor output ON/OFF pin
7
CW/CCW
Clock-wise/Counter Clock-wise setting pin
(FIN)
GND
8
NC
9
OUTA+
Motor output
A+ pin
10
OUTA+
Motor output
A+ pin
11
RSGNDA
Ach current sense ground pin
12
RSGNDA
Ach current sense ground pin
13
OUTA-
Motor output
A-pin
14
OUTA-
Motor output
A-pin
15
OUTB-
Motor output
B-pin
16
OUTB-
Motor output
B-pin
17
RSGNDB
Bch current sense ground pin
18
RSGNDB
Bch current sense ground pin
19
OUTB+
Motor output
B+ pin
20
OUTB+
Motor output
B+ pin
21
VCOM
Common pin
(FIN)
GND
22
VM
VM power supply pin
23
NC
Non connection
24
VCC
Internal VCC regulator monitor pin
25
VREF
Constant current threshold set pin
26
OSCM
Fixed off time set pin
27
ERR
Error detect feedback signal output pin
28
MO
Electrical angle monitor pin
Ground pin
Non connection
Ground pin
Please solder the FIN to the GND pattern of the board.
Please do not run patterns under NC pins.
Please connect the pins with the same pin name, while using the device.
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2015-06-15
TB67S149FG
INPUT/OUTPUT Equivalent circuit
DMODE0
DMODE1
DMODE2
CW/CCW
CLK
RESET
ENABLE
Equivalent circuit
Input / Output
1 kΩ
Logic
Input
Logic input (VIH/VIL)
100 kΩ
Pin name
VIH: 2.0 V(min) to 5.5 V (max)
VIL : 0 V (min) to 0.8 V (max)
GND
Logic
Output
ERR
MO
Logic output (VOH/VOL)
(Pullup resistance: 10 kΩ to 100 kΩ)
GND
VCC
VCC
VCC voltage range
4.75 V (min) to 5.0 V (Typ.) to 5.25 V (max)
1 kΩ
VREF
VREF
VREF input voltage range
0 V to 4.0 V (Constant current control)
VCC short (Constant current control : off)
GND
1 kΩ
OSCM
500 Ω
OSCM
OSCM frequency setup (reference)
0.82 MHz(min) to 3.2 MHz(Typ.) to 8.2 MHz(max)
(R_OSCM = 3.9 kΩ to 10 kΩ to 39 kΩ)
GND
VCOM
OUT A+
OUT AOUT B+
OUT BRSGNDA
RSGNDB
VCOM
OUTPUT
(-) pin
OUTPUT
(+) pin
VM voltage range
10 V (min) to 40 V (max)
OUT pin voltage range
10 V (min) to 80 V (max)
RSGND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB67S149FG
TB67S149 function explanation
CLK function
The CLK pin controls the rotation speed of the motor. Each CLK signal will shift the motor’s electrical angle per step, due
to each up-edge of the CLK signal.
CLK
Function
↑ (Low to High)
Shifts the electrical angle per step.
↓ (High to Low)
－ (State of the electrical angle does not change.)
ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. (For accurate operation, please set the
ENABLE to ‘Low’ during VM power-on and power-off sequence.)
ENABLE
Function
High
Output stage=’ON’ (Normal operation mode)
Low
Output stage=’OFF’ (High impedance mode)
CW/CCW function
The CW/CCW pin controls the rotation direction of the motor.
CW/CCW
Function
High
Clock-wise (CW)
Low
Counter Clock-wise (CCW)
When set to ‘CW’, the Ach current phase leads the Bch current phase by 90°.
When set to ‘CCW’, the Bch current phase leads the Ach current phase by 90°.
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TB67S149FG
RESET function
The RESET pin controls the resetting of the internal electrical angle. (For accurate operation, please set the RESET pin to
‘High’ during VM power-on. Switch the RESET to ‘Low’, once the VM voltage has reached the operation range.)
RESET
Function
High
Sets the electrical angle to the initial position.
Low
Normal operation
The current setting for each channel (while RESET is applied) is shown in the table below. MO pin level will show ‘Low’
level at this time.
Step resolution setting
Ach current
Bch current
Electrical angle
Full step
100%
100%
45°
Half step (a)
100%
100%
45°
Quarter step
71%
71%
45°
Half step (b)
71%
71%
45°
1/8 step
71%
71%
45°
1/16 step
71%
71%
45°
1/32 step
71%
71%
45°
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TB67S149FG
DMODE (Step resolution setting) function
The DMODE pin controls the Standby mode and the step resolution setting.
DMODE0
DMODE1
DMODE2
Function
Low
Low
Low
Standby mode (The internal oscillator is disabled and the output stage is set to
‘OFF’ status. The internal status is Full step, Torque100% (*))
Low
Low
High
Full step
Low
High
Low
Half step(a)
Low
High
High
Quarter step
High
Low
Low
Half step(b)
High
Low
High
1/8 step
High
High
Low
1/16 step
High
High
High
1/32 step
(*) [Full step, Torque 100%] written above shows the initial status of the logic. During Standby mode, the internal
oscillator and output stage is set to OFF, therefore does not mean that the device will operate at [Full step, Torque 100%].
Standby mode function
Setting all of the DMODE pins(DMODE0,DMODE1,DMODE2) to Low will set the device to Standby mode. During Standby
mode, the internal bias current is cut so that the device be set to low power mode. Also, setting the device to Standby
mode will release the error detection such as TSD or ISD.
Standby mode
Function
ON (DMODE0,1,2=L,L,L)
Standby mode : ON (Low power mode)
OFF (other than DMODE0,1,2=L,L,L)
Standby mode: OFF (Normal operation)
After the device detects an error such as TSD or ISD, setting the device to Standby mode to OFF and then ON again
will release the error detect latch signal. (Reasserting the VM power will also release the error detect latch signal.)
Note) After setting the Standby mode: OFF, the internal circuit will restart from low power mode. During the
startup period (10μs after setting the Standby mode : OFF), please do not send any control signals. (If the
signal is sent to the device during the startup period, the device may not be able to accept the signal correctly.)
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TB67S149FG
Step resolution and current ratio
Characteristics
Full
Half (a)
Half (b)
○
○
○
Step resolution
Quarter
1/8
○
○
-
-
○
-
-
-
(*2)
○
-
-
○
-
Step
Typ.
○
θ32
100
-
○
θ31
100
○
○
θ30
100
-
○
θ29
99
○
○
θ28
98
-
○
θ27
97
○
○
θ26
96
-
○
θ25
94
○
○
θ24
92
-
○
θ23
90
○
○
θ22
88
-
○
θ21
86
○
○
θ20
83
-
○
θ19
80
○
○
θ18
77
-
○
θ17
74
○
○
θ16
71
-
○
θ15
67
○
○
θ14
63
-
○
θ13
60
○
○
θ12
56
-
○
θ11
52
○
○
θ10
47
-
○
θ9
43
○
○
θ8
38
-
○
θ7
34
○
○
θ6
29
-
○
θ5
25
○
○
θ4
20
-
○
θ3
15
○
○
θ2
10
-
○
θ1
5
○
○
θ0
0
1/16
1/32
○
Unit
Current
(*1)
Ratio
○
○
○
%
-
-
○
-
-
-
○
○
-
-
○
-
○
○
○
○
(*1) At Half (a) setting, the current ratio will be 100%.
(*2) At Quarter setting, the current ratio will be 100%.
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TB67S149FG
Monitor pin functions (MO feedback)
MO
Function
Hi-Z (*)
- (Other than the initial angle)
Low
Initial electrical angle
(*) The MO pin is an open drain logic output. To use the function correctly, please make sure the MO pin
is connected to 3.3 V or 5.0 V with a pull-up resistance. If the internal electrical angle is at the initial angle,
the pin level will be Low (internal MOSFET: ON). If the internal electrical angle is not at the initial angle,
the pin level will be Hi-Z (internal MOSFET: OFF) (it will show High level when pulled up correctly).
Please refer to the ‘RESET function’ for the initial angle.
MO pin should be left open; when not using the MO feedback function.
3.3 V or 5 V
Pull-up resistance
(10 kΩ to 100 kΩ)
MO pin
MO logic
[MO MOSFET]
ON ：Initial angle
OFF：Other than the initial angle
Equivalent circuit(s) may be omitted for explanatory purpose.
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TB67S149FG
Monitor pin functions (ERR feedback)
ERR
Function
Hi-Z (*)
Normal operation
Low
Error detected (TSD or ISD)
(*) The ERR pin is an open drain logic output. To use the function correctly, please make sure the ERR
pin is connected to 3.3 V or 5.0 V with a pull-up resistance. During normal operation, the pin level will be
Hi-Z (internal MOSFET: OFF) (it will show High level when pulled up), and once an error (TSD or ISD) has
been detected, the pin level will be Low (internal MOSFET: ON).
Reasserting the VM power supply or using the STBY function, the ERR pin will return to the initial status
(internal MOSFET: OFF).
ERR pin should be left open; when not using the ERR feedback function.
3.3 V or 5 V
Pull-up resistance
(10 kΩ to 100 kΩ)
ERR pin
ERR logic
[ERR MOSFET]
ON : TSD or ISD detected
OFF: Normal operation
Equivalent circuit(s) may be omitted for explanatory purpose.
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TB67S149FG
TB67S149 setup
Constant-current threshold setting
The constant-current threshold can be set by VREF voltage.
IOUT(max) = VREF × 3/4
Example: Current setting 100%, VREF = 2.0 V: The constant current thredhold(peak current) will be as shown below.
IOUT = 2.0 × 3/4 = 1.5 A
To set the constant-current function ‘off’, connect the VCC and VREF pin directly (do not use any external power supply).
Fixed off time setting
To set the fixed off time for constant-current PWM control, please connect a pull-down resistance to the OSCM pin.
The relation between the pull-down resistance (ROSCM) and fixed off time is as shown below.
Note that the value shown in the graph above does not include any dispersion of the device / external components.
(For reference)
Pull-down resistance
(ROSCM)
Fixed off time (toff)
4.1 μs
4.9 μs
5.8 μs
7.0 μs
8.3 μs
10 μs
15 μs
18 μs
21 μs
26 μs
37 μs
3.9 kΩ
4.7 kΩ
5.6 kΩ
6.8 kΩ
8.2 kΩ
10 kΩ
15 kΩ
18 kΩ
22 kΩ
27 kΩ
39 kΩ
Please connect 10 kΩ resistance while using the device with constant current mode: off.
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TB67S149FG
Absolute maximum ratings（Ta = 25°C）
Characteristics
Symbol
Rating
Unit
VM(max)
45
V
VM-VCOM voltage differential
VDIFF(max)
45
V
Motor output voltage
VOUT(max)
84
V
Motor output current (per channel)
IOUT(max)
3.0
A
Internal logic power supply
VCC(max)
6.0
V
VIN(H)(max)
6.0
V
VIN(L)(min)
-0.4
V
VREF input voltage
VREF(max)
6.0
V
Open drain output pin (ERR,MO) voltage
VOD(max)
6.0
V
Open drain output pin (ERR,MO) inflow current
IOD(max)
20
mA
Power dissipation (HSSOP28; device alone)
PD
1.15
W
Operating temperature
Topr
-20 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
Junction temperature
Tj(max)
150
°C
Motor power supply
Logic input voltage
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under
any circumstances. The device does not have overvoltage detection circuit. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and
considerations described later should also be referred to.
Note: About the power dissipation
If the ambient temperature is above 25°C, the power dissipation must be de-rated by 9.2 mW/°C.
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TB67S149FG
Operation ranges
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Motor power supply
VM
-
10
-
40
V
Motor output voltage
VOUT
-
10
-
80
V
Motor output current (per channel)
IOUT
Ta = 25°C
-
1.5
3.0
A
Internal logic power supply
VCC
-
4.75
5.0
5.25
V
VIN(H)
Logic input high level
2.0
-
5.5
V
VIN(L)
Logic input low level
0
-
0.8
V
VREF input voltage range
VREF(range)
-
GND
-
5.5
V
Open drain pin voltage range
VOD(range)
ERR,MO pin
3.0
-
5.5
V
Open drain pin inflow current range
IOD(range)
ERR,MO pin
-
-
10
mA
Internal oscillator frequency range
fOSCM(range)
-
820
3200
8200
kHz
tOFF(range)
-
5
10
40
μs
Logic input voltage
Fixed off time range
Note) Maximum current for actual usage may be limited by the operating circumstances such as operating
conditions (step settings, operating time, and so on), ambient temperature, and heat conditions (board condition
and so on).
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TB67S149FG
Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Logic input
VIH
Logic input pin High level (*)
2.0
-
5.5
V
voltage
VIL
Logic input pin Low level (*)
GND
-
0.8
V
Logic input pin (*)
100
-
300
mV
Logic input
VIN(HYS)
hysteresis voltage
Logic
High
IIN(H)
Logic input voltage High level (VIN = VIH)
-
33
55
μA
Low
IIN(L)
Logic input voltage Low level (VIN = VIL)
-
-
1
μA
Output pins = open, Standby mode
-
-
1.0
mA
-
3.0
5.0
mA
0
-
0.5
V
-5
0
+5
%
input
current
IM1
Power
Output pins = open, Normal operation,
consumption
IM2
Output stage: ON
Open drain output
VOD(L)
IOD = 10 mA
pin voltage
Motor current
⊿IOUT1
channel differential
Motor current
Current differential between channels
(IOUT = 1.0 A)
⊿IOUT2
IOUT = 1.0 A
-6
0
+6
%
VFN
IOUT = 2.0 A
0.85
-
1.45
V
Ileak
VOUT = 80 V, Output MOSFET: OFF
-
-
1
μA
IOUT = 2.0 A
-
0.25
0.35
Ω
setting accuracy
Source-drain
diode
forward voltage
Motor output off
leak current
Motor output
ON-resistance
RON(D-S)
(Low side)
(*) VIN (H) is defined as the voltage that causes the motor output pins to change when a logic input pin under test is
gradually raised from 0 V. VIN(L) is defined as the voltage that causes the motor output pins to change when the logic
input pin is then gradually lowered. The voltage difference between VIN(L) and VIN(H) is defined as logic input hysteresis
voltage VIN(HYS).
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TB67S149FG
Electrical Specifications 2 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
4.75
5
5.25
V
VCC regulator voltage
VCC
ICC = 5.0 mA
VCC regulator current
ICC
4.75 V ≤ VCC ≤ 5.25 V
-
2.5
5.0
mA
VREF input current
IREF
VREF = 2.0 V
-
0
1.0
μA
Thermal shutdown(TSD) threshold (*)
TjTSD
-
140
155
170
°C
VCC recovery voltage
VCCR
-
3.5
4.0
4.5
V
VM recovery voltage
VMR
-
7.0
8.0
9.0
V
Over-current detection(ISD) threshold (*)
ISD
-
3.1
4.0
5.0
A
(*) About Thermal shutdown (TSD)
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal
reset circuit then turns off the output stage. Noise rejection blanking time is built-in to avoid misdetection.
Once the TSD circuit is triggered; the detect latch signal can be cleared by reasserting the VM power source, or
setting the device to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore
is not recommended to be used aggressively.
(*) About Over-current detection (ISD)
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns
off the output stage. Once the ISD circuit is triggered, the detect latch signal can be cleared by reasserting
the VM power source, or setting the device to standby mode. For fail-safe, please insert a fuse to avoid secondary
trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the device or other components will
be damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such condition
persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed
immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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TB67S149FG
AC Electrical Specification (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
CLK input frequency
fCLK
Test condition
fOSCM = 3200 kHz
Min
Typ.
Max
Unit
-
-
100
kHz
tCLK(twp)
-
50
-
-
ns
tCLK(twn)
-
50
-
-
ns
Output MOSFET switching specific
tr
-
50
100
150
ns
(rise time, fall time)
tf
-
50
100
150
ns
Minimum CLK pulse width
Output MOSFET response specific
tpLH(CLK)
CLK→OUT
200
700
1200
ns
(CLK-OUT response time)
tpHL(CLK)
CLK→OUT
200
700
1200
ns
Analog noise blanking time
AtBLK
Analog tblank
250
400
550
ns
OSCM frequency
fOSCM
ROSC = 10 kΩ
2720
3200
3680
kHz
OSCS frequency
fOSCS
-
5120
6400
7680
kHz
fOSCM = 3.2 MHz
8.5
10
11.5
μs
tISD(mask)
fOSCS(= 6.4 MHz)*8clk
1.0
1.25
1.5
μs
tTSD(mask)
fOSCS(= 6.4 MHz)*32clk
4.0
5.0
6.0
μs
Fixed off time
tOFF
Over current (ISD) detect
masking time
Thermal shutdown (TSD) detect
masking time
AC specification timing chart
tCLK(twn)
[CLK]
50%
50%
50%
tCLK(twp)
fCLK
[OUT]
90%
tpLH(CLK)
50%
50%
10%
10%
90%
tr
tf
90%
[OUT]
50%
tpHL(CLK)
10%
Timing charts may be simplified for explanatory purpose.
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TB67S149FG
Application circuit example
10 kΩ
1
DMODE0
MO
28
2
DMODE1
ERR
27
3
DMODE2
OSCM
26
4
RESET
VREF
25
5
CLK
VCC
24
6
ENABLE
NC
23
7
CW/CCW
VM
22
GND
FIN
10 kΩ
10 kΩ
(2.0 V)
0.1 μF
FIN
GND
TB67S149FG
0.1 μF
100 μF
ZD
8
NC
VCOM
21
9
OUTA+
OUTB+
20
10
OUTA+
OUTB+
19
11
RSGNDA
RSGNDB
18
12
RSGNDA
RSGNDB
17
13
OUTA-
OUTB-
16
14
OUTA-
OUTB-
15
(24 V)
M
The application circuit above is an example; therefore, mass-production design is not guaranteed.
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Package dimensions (Unit: mm): P-HSSOP28-0819-0.80-001
Weight: 0.88 g (Typ.)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required,
especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum
ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a
large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a
large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent
device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative
current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use
a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function
may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of
power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may
cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just
once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such
as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage
will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may
cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay
attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances.
If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the overcurrent
detection circuit to operate improperly or IC breakdown may occur before operation. In addition, depending on the method
of use and usage conditions, if overcurrent continues to flow for a long time after operation, the IC may generate heat
resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate
against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the
effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply
owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply
and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the
effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
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LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
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including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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