TB67S179FTG
Toshiba BiCD Process Integrated Circuit Silicon Monolithic
TB67S179FTG
Clock controlled 2-phase Unipolar stepping motor driver
FTG
The TB67S179FTG is a Clock controlled PWM chopping type 2-phase
unipolar stepping motor driver. Using the BiCD process, the TB67
S179FTG can be operated with VM voltage of 80V, output voltage
of 80V, and output current of 1.5A at max (absolute maximum ratings).
P-VQFN48-0707-0.50-004
Features
Weight 0.14 (g) (typ.)
・BiCD processed monolithic integrated circuit.
・Capable of operating one unipolar stepping motor.
・Full, half(a), half(b), quarter, 1/8, 1/16, 1/32 step resolution.
・PWM controlled synchronous rectification constant current drive.
・Reverse current protection function
・Error detect feedback signal output function (Over current/Thermal shutdown).
・Error detect function (Thermal shutdown(TSD), Over current(ISD), and Low voltage(POR).
・Standby mode (low power) function
・Brake function
・Low on resistance(0.5Ω (Typ.) output MOSFET.
・High voltage and current (For specification, please refer to the absolute maximum ratings and operation ranges).
・Build-in VCC regulator for internal circuit use.
・Fixed off time can be adjusted by external components.
Note: Please be careful about the thermal conditions during use.
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TB67S179FTG
Pin assign (TB67S179FTG)
NC
VCOM
VCOM
NC
GND
NC
VM
NC
VCC
VCC
VREF
NC
(Top View)
36 35 34 33 32 31 30 29 28 27 26 25
OSCM
37
24 OUTB+
ERR
38
23 OUTB+
ALM
39
22 RSGNDB
MO
40
21 RSGNDB
NC
41
20 OUTB-
NC
42
NC
43
NC
44
17 OUTA-
DMODE0
45
16 RSGNDA
DMODE1
46
15 RSGNDA
DMODE2
47
14 OUTA+
RESET
48
13 OUTA+
19 OUTB-
NC
CLK
NC
ENABLE
CW/CCW
7
8
9 10 11 12
NC
6
NC
5
NC
4
18 OUTA-
NC
3
GND
2
BRAKE
1
NC
TB67S179FTG
* Please mount the four corner pins of the VQFN package and the exposed pad to the GND area of the PCB.
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TB67S179 block diagram
RESET
ENABLE
Ach
Pre
drv
Polarity and Angle control
CW/CCW
MO
VREF
OSCM
VREF
Internal OSC
External brake
STANDBY
Control
POR
VCC regulator
OUT ARSGNDA
ERR
Pre TSD
ALM
VCOM
Bch
Pre
drv
DMODE0
Step Resolution Control
DMODE2
BRAKE
Error detect
(TSD/ISD)
RS Comp
CLK
DMODE1
OUT A+
RS Comp
VM
VCC
Ach
OUT
Nch×2
Bch
OUT
Nch×2
OUT B+
OUT BRSGNDB
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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Application Notes
All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at only one
point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD (VM) and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply
pins (VM, RSGND, OUT, GND) through which a particularly large current may run. If these pins are wired incorrectly, an
operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current.
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Pin explanations
TB67S179FTG (VQFN48)
Pin No.1 to 28
Pin No.
Pin Name
Function
1
NC
Non connection
2
NC
Non connection
3
CLK
External Clock input pin
4
NC
Non connection
5
ENABLE
Motor output ON/OFF pin
6
CW/CCW
Clock-wise/Counter Clock-wise setting pin
7
BRAKE
8
GND
9
NC
Non connection
10
NC
Non connection
11
NC
Non connection
12
NC
Non connection
13
OUTA+
Motor output
A+ pin
14
OUTA+
Motor output
A+ pin
15
RSGNDA
Ach current sense ground pin
16
RSGNDA
Ach current sense ground pin
17
OUTA-
Motor output
A-pin
18
OUTA-
Motor output
A-pin
19
OUTB-
Motor output
B-pin
20
OUTB-
Motor output
B-pin
21
RSGNDB
Bch current sense ground pin
22
RSGNDB
Bch current sense ground pin
23
OUTB+
Motor output
B+ pin
24
OUTB+
Motor output
B+ pin
25
NC
26
VCOM
Common pin
27
VCOM
Common pin
28
NC
Brake input pin
Ground pin
Non connection
Non connection
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Pin No.29 to 48
Pin No.
Pin Name
Function
29
GND
30
NC
Non connection
31
VM
VM power supply pin
32
NC
Non connection
33
VCC
Internal VCC regulator monitor pin
34
VCC
Internal VCC regulator monitor pin
35
VREF
Constant current threshold set pin
36
NC
37
OSCM
38
ERR
Error detect feedback signal output pin
39
ALM
Thermal alarm output pin
40
MO
Electrical angle monitor pin
41
NC
Non connection
42
NC
Non connection
43
NC
Non connection
44
NC
Non connection
45
DMODE0
Step setting pin 0
46
DMODE1
Step setting pin 1
47
DMODE2
Step setting pin 2
48
RESET
Ground pin
Non connection
Fixed off time set pin
Electrical angle reset pin
Note:
･Please do not run patterns under NC pins.
･Please connect the pins with the same pin name, while using the device.
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INPUT/OUTPUT Equivalent circuit
DMODE0
DMODE1
DMODE2
CW/CCW
CLK
RESET
ENABLE
BRAKE
Input / Output
Equivalent circuit
1kΩ
Logic
Input
Logic input (VIH/VIL)
100kΩ
Pin name
VIH: 2.0V(min) to 5.5V(max)
VIL : 0V(min) to 0.8V(max)
GND
Logic
Output
ERR
ALM
MO
Logic output (VOH/VOL)
(Pullup resistance: 10kΩ to100kΩ)
GND
VCC
VCC
VREF
VCC voltage range
4.75V(min) to 5.0V(Typ.) to 5.25V(max)
1kΩ
VREF
VREF input voltage range
0V to 2.0V (Constant current control)
VCC short (Constant current control: OFF)
GND
OSCM frequency setup (reference)
0.8MHz(min) to 3.2MHz(Typ.) to 8.2MHz(max)
500Ω
OSCM
1kΩ
OSCM
(R_OSCM=3.9kΩ to 10kΩ to 39kΩ)
GND
VCOM
OUT A+
OUT AOUT B+
OUT BRSGNDA
RSGNDB
VCOM
OUTPUT
(-) pin
OUTPUT
(+) pin
VM voltage range
10V(min) to 60V(max)
OUT pin voltage range
10V(min) to 80V(max)
RSGND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB67S179 function explanation
CLK function
The CLK pin controls the rotation speed of the motor. Each CLK signal will shift the motor’s electrical angle per step, due
to each up-edge of the CLK signal.
CLK
Function
↑ (Low to High)
Shifts the electrical angle per step.
↓ (High to Low)
－ (State of the electrical angle does not change.)
ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. For accurate operation, please
set the ENABLE to Low during VM power-on and power-off sequence.
ENABLE
Function
High
Motor output: ON (normal operation)
Low
Motor output: OFF (high impedance)
CW/CCW function
The CW/CCW pin controls the rotation direction of the motor.
CW/CCW
Function
High
Clock-wise (CW)
Low
Counter Clock-wise (CCW)
When set to ‘CW’, the Ach current phase leads the Bch current phase by 90°.
When set to ‘CCW’, the Bch current phase leads the Ach current phase by 90°.
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RESET function
The RESET pin controls the reset of the internal electrical angle. For accurate operation, please set the RESET pin to
‘High’ during VM power-on. Switch the RESET to ‘Low’, once the
VM voltage has reached the operation range.
RESET
Function
High
Sets the electrical angle to the initial position
Low
Normal operation
The current setting for each channel while RESET is applied is shown in the table below.
MO pin level will show ‘Low’ level at this time.
Step resolution setting
Ach current
Bch current
Electrical angle to the initial position
Full step
100%
100%
45°
Half step (a)
100%
100%
45°
Quarter step
71%
71%
45°
Half step (b)
71%
71%
45°
1/8 step
71%
71%
45°
1/16 step
71%
71%
45°
1/32 step
71%
71%
45°
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DMODE (Step resolution setting) function
The DMODE pin controls the Standby mode and the step resolution setting.
DMODE0
DMODE1
DMODE2
Function
Low
Low
Low
Standby mode (The internal oscillator is disabled and the motor output is set to
‘OFF’ status. The internal status is Full step, Torque100% (*))
Low
Low
High
Full step
Low
High
Low
Half step(a)
Low
High
High
Quarter step
High
Low
Low
Half step(b)
High
Low
High
1/8 step
High
High
Low
1/16 step
High
High
High
1/32 step
(*) [Full step, Torque 100%] written above shows the initial status of the logic. (During Standby mode, the internal oscillator
and motor output is set to OFF, therefore does not mean that the device will operate at [Full step, Torque 100%])
Standby mode function
Setting all of the DMODE pins(DMODE0,DMODE1,and DMODE2) to Low will set the device to Standby mode. During
Standby mode, the internal bias current is cut so that the device be set to low power mode. Also, setting the device to
Standby mode will release the error detection such as TSD and ISD. Moreover, the electrical angle is initialized by setting
the Standby mode.
Standby mode
Function
ON (DMODE0,1,2=L,L,L)
Standby mode: ON (Low power mode)
OFF (other than DMODE0,1,2=L,L,L)
Standby mode: OFF (Normal operation)
After the device detects an error such as TSD or ISD, setting the device to Standby mode to OFF and then ON again
will release the error detect latch signal. (Reasserting the VM power will also release the error detect latch signal.)
In the Standby mode, the internal functions are suspended. Therefore, during the startup period (10μs after setting the
Standby mode: OFF), please do not send any control signals. (If the signal is sent to the device during the startup period,
the device may not be able to accept the signal correctly.)
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Step resolution and current ratio
Characteristics
Step resolution
Typ.
○
θ32
100
-
○
θ31
100
○
○
θ30
100
-
○
θ29
99
○
○
θ28
98
-
○
θ27
97
○
○
θ26
96
-
○
θ25
94
○
○
θ24
92
-
○
θ23
90
○
○
θ22
88
-
○
θ21
86
○
○
θ20
83
-
○
θ19
80
○
○
θ18
77
-
○
θ17
74
○
○
θ16
71
-
○
θ15
67
○
○
θ14
63
-
○
θ13
60
○
○
θ12
56
-
○
θ11
52
○
○
θ10
47
-
○
θ9
43
○
○
θ8
38
-
○
θ7
34
○
○
θ6
29
-
○
θ5
25
○
○
θ4
20
-
○
θ3
15
○
○
θ2
10
-
○
θ1
5
○
○
θ0
0
Half (a)
Half (b)
Quarter
1/8
1/16
1/32
○
○
○
○
○
○
-
-
○
-
-
-
(*2)
○
-
-
○
-
Current Ratio
Step
Full
-
(*1)
○
○
○
-
-
○
-
-
-
○
○
-
-
○
--
○
○
○
○
Unit
%
(*1) At Half (a) setting, the current ratio will be 100%.
(*2) At Quarter setting, the current ratio will be 100%.
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TB67S179FTG
BRAKE mode function
OUTA-
OUTA+
OUTB-
OUTB+
VCOM
RSGNDA
RSGNDB
Equivalent circuit(s) may be omitted for explanatory purpose.
BRAKE
Function
H
Brake mode: ON
L
Brake mode: OFF (Normal operation)
The brake function is changed according to the control setting (of the constant current or the constant voltage).
・During Constant current control: VREF≤2.0V
When BRAKE is set to H, the constant current operation is performed with the current of 100% setting value, regardless of
the current setting value then.
Internal current setting when BRAKE
is set to H from L.
IOUT= 0% to +100%
IOUT= 0% to -100%
Setting value of constant current when
BRAKE is set to H.
+100%
-100%
* The IOUT in the above table is indicated as plus current when OUT+ turns on, and as minus current when OUT- turns on,
at the time of Charge.
* When the CLK signal is input during BRAKE=H, the internal current setting status is advanced ordinarily.
・During Constant voltage control: VREF-VCC direct connected
When BRAKE is set to H, the motor output becomes the full step resolution (OUTA+, OUTA-, OUTB+, and OUTB-: ON).
* Make sure to connect the VREF pin and VCC pin directly without using the external power supply in the constant voltage
mode.
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TB67S179FTG
MO pin functions (MO feedback)
MO pin
Function
Hi-Z (*)
－ (Other than initial electrical angle)
Low
Initial electrical angle
(*) MO pin is an open drain logic output. To use the function correctly, please make sure the MO pin is connected to 3.3V
or 5.0V with a pull-up resistance. If the internal electrical angle is at the initial angle, the pin level will be Low (internal
MOSFET: ON). If the internal electrical angle is not at the initial angle, the pin level will be Hi-Z (internal MOSFET: OFF)
(it will show High level when pulled up correctly). Please refer to the 'RESET function' for the initial angle. MO pin should
be left open; when not using the MO feedback function.
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
MO pin
MO logic
[MO MOSFET]
ON: Initial electrical angle
OFF: Other than initial electrcal angle
Equivalent circuit(s) may be omitted for explanatory purpose.
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ERR pin functions (ERR feedback)
ERR pin
Function
Hi-Z (*)
Normal operation
Low
Error detected (TSD or ISD)
(*) The ERR pin an open drain logic output. To use this function correctly, please make sure the ERR pin is connected to
3.3V or 5.0V with a pull-up resistance. During normal operation, the pin level will be Hi-Z (internal MOSSET: OFF) (it will
show High level when pulled up), and once an error (TSD or ISD) has been detected, the pin level will be Low (internal
MOSFET: ON). Reasserting the VM power supply or using the STBY function, the ERR pin will return to the initial status
(internal MOSFET: OFF). ERR pin should be left open; when not using the ERR feedback function.
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
ERR pin
ERR logic
[ERR MOSFET]
ON: TSD or ISD detected
OFF: Normal operation
Equivalent circuit(s) may be omitted for explanatory purpose.
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ALM pin functions (Thermal ALM feedback)
ALM pin
Function
Hi-Z (*)
Normal operation
Low
Thermal Alarm detected
(*)The ALM pin is an open drain logic output. To use the function correctly, please make sure the ALM pin is connected to
3.3V or 5.0V with a pull-up resistance. During normal operation, the pin level will be Hi-Z (internal MOSFET: OFF) (it will
show High level when pulled up), and once the device detects a temperature rise, the pin level will be Low (internal
MOSFET: ON). The ALM is an auto recovery type output. Once the device reaches the ALM detect threshold
(120°C±15°C), the pin level will show Low (internal MOSFET: ON), and after the device reaches the ALM release
threshold (‘detect threshold’-30°C), the pin level will show Hi-Z (internal MOSFET: OFF) (it will show High level when
pulled up). ALM pin should be left open; when not using the thermal ALM feedback function.
Pull-up voltage
ALM pin
GND
Hysteresis
(30°C (typ.))
Thermal Alarm detect
Threshold: 120°C (±15°C)
Pull-up voltage
ALM pin
GND
Thermal Alarm release
Threshold: 90°C (±15°C)
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
ALM pin
ALM logic
[ALM MOSFET]
ON: ALM detect threshold
OFF: Normal operation
or ALM release threshold
Equivalent circuit(s) may be omitted for explanatory purpose.
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TB67S179 setup
Constant-current threshold setting
The constant-current threshold can be set by asserting the VREF voltage.
IOUT = VREF × 3/4 × IOUT(RATIO)
Example: Current setting 100%, VREF=2.0V: The constant current threshold (peak current) will be as shown below.
IOUT = 2.0×3/4×1.0=1.5A
To set the constant-current function ‘off’, connect the VCC and VREF pin directly (do not use any external power supply).
Fixed off time setting
To set the fixed off time for constant-current PWM control, please connect a pull-down resistance to the OSCM pin.
The relation between the pull-down resistance (ROSCM) and fixed off time is as shown below.
Operation mode
Constant-current mode
Constant-voltage mode
Pull-down resistance (ROSCM)
3.9kΩ
4.7kΩ
5.6kΩ
6.8kΩ
8.2kΩ
10kΩ
15kΩ
18kΩ
22kΩ
27kΩ
39kΩ
Fixed off time (toff (Typ.))
4.1μs
4.9μs
5.8μs
7.0μs
8.3μs
10μs
15μs
18μs
21μs
26μs
37μs
Note
Open
10μs
Electric characteristics
[fOSCM2] prescribes.
(GND short: GND)
open
-
Stops the internal oscillator.
Electric characteristics
[fOSCM1] prescribes.
The value shown in the table above does not include any dispersion of the device / external components.
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Absolute maximum ratings (Ta=25°C)
Characteristics
Symbol
Rating
Unit
VM
80
V
VM-VCOM voltage differential
VDIFF
70
V
Motor output voltage
VOUT
80
V
Motor output current (per channel)
IOUT
1.5
A
Internal logic power supply
VCC
6.0
V
VIN(H)(max)
6.0
V
VIN(L)(min)
-0.4
V
VREF input voltage
VREF
6.0
V
Open drain output pin (ERR,ALM,MO) voltage
VOD
6.0
V
Open drain output pin (ERR,ALM,MO) inflow current
IOD
20
mA
Power dissipation (VQFN48; device alone)
PD
1.3
W
Operating temperature
Topr
-20 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
Junction temperature
Tj
150
°C
Motor power supply
Logic input voltage
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or
combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The
device does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated
maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations described
later should also be referred to.
Note: Allowable power dissipation
When Ta exceeds 25°C, the derating at 10.4 mw/°C is required.
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Operation ranges
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Motor power supply
VM
-
10
-
60
V
Motor output voltage
VOUT
-
10
-
80
V
Motor output current (per
channel)
Internal logic power supply
IOUT
Ta=25°C
-
1.0
1.5
A
VCC
-
4.75
5.0
5.25
V
VIN(H)
Logic input High level
2.0
-
5.5
V
VIN(L)
Logic input Low level
0
-
0.8
V
VREF(range)1
Constant-current mode
GND
-
2.0
V
VREF(Vrange)2
Constant-voltage mode
-
VCC
-
V
Logic input voltage
Voltage range of VREF input
pin
Connected between VREF
and VCC directly
Pull-up voltage range of
open drain pin
Inflow current range of open
drain output pin
Motor setting frequency
range
Fixed off time range
VOD(range)
ERR,ALM,MO pin
3.0
-
5.5
V
IOD(range)
ERR,ALM,MO pin
-
-
10
mA
fOSCM1(range)
-
820
3200
8200
kHz
tOFF(range)
-
5
10
40
μs
Note: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
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DC Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Logic input voltage
Logic input hysteresis
Test condition
Max
Unit
Logic input pin High level (*)
2.0
-
5.5
V
VIL
Logic input pin Low level (*)
GND
-
0.8
V
100
-
300
mV
VIN(HYS)
Login input pin (*)
High
IIN(H)
Logic input voltage High level (VIN=VIH)
-
33
55
μs
Low
IIN(L)
Logic input voltage Low level (VIN=VIL)
-
-
1
μA
Output pins: open, Standby mode
-
-
1.0
mA
-
3.0
5.0
mA
0
-
0.5
V
-5
0
+5
%
-6
0
+6
%
1.0
-
1.6
V
IM1
Power consumption
IM2
Output pins: open, Normal operation,
Full step resolution
Open drain output pin voltage
VOD(L)
IOD=10mA
Motor current setting
⊿IOUT1
Current differential between channels
differential
Motor current setting
(IOUT=1.0A)
⊿IOUT2
IOUT=1.0A
VFN
IOUT=1.5A
Ileak
VOUT=80V, Output MOSFET:OFF
-
-
1
μA
IOUT=1.5A
-
0.5
0.65
Ω
accuracy
Source-drain diode forward
voltage
Motor output off leak current
Motor output ON-resistance
(Low side)
Typ.
VIH
voltage
Login input current
Min
RON
(D-S)
(*)VIN (H) is defined as the VIN voltage that causes the outputs (OUTA, OUTB) to change when a pin under test is
gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA and OUTB) to change
when the pin is then gradually lowered. The difference between VIN (L) and VIN (H) is defined as VIN (HYS).
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DC Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
VCC regulator voltage
VCC
ICC=5.0mA
4.75
5.0
5.25
V
VCC regulator current
ICC
4.75V≤VCC≤5.25V
-
2.5
5.0
mA
VREF input current
IREF
VREF=2.0V
-
0
1.0
μA
Thermal shutdown (TSD) threshold (*)
TjTSD
-
140
155
170
°C
VCC recovery voltage
VCCR
-
3.5
4.0
4.5
V
VM recovery voltage
VMR
-
7.0
8.0
9.0
V
Over-current detection (ISD) threshold (*)
ISD
-
2.1
3.0
4.0
A
(*) About Thermal shutdown (TSD)
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset
circuit then turns off the output stage. Noise rejection blanking time is built-in to avoid misdetection by the switching and so
on.
Once the TSD circuit is triggered; the detect latch signal can be cleared by reasserting the VM power source, or setting
the device to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended
to be used aggressively.
(*) About Over-current detection (ISD)
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns
off the output stage. The masking time is built in the IC to avoid misdetection by the switching and so on. Once the ISD
circuit is triggered, the detect latch signal can be cleared by reasserting the VM power source, or setting the device to
standby mode. The ISD function is a function to detect that the over-current flows into the motor output, therefore, is not
recommended to be used aggressively.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current
recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above
the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must
be fully verified that there is no risk that the device or other components will be damaged or fail due to the motor
back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output
short-circuits; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may
be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such condition persists
for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by
external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specifications (Ta=25°C, VM=24V, unless specified otherwise)
Characteristics
Symbol
CLK input frequency
Test condition
Min
Typ.
Max
Unit
-
-
100
kHz
fCLK
fOSCM=3200kHz
tCLK(twp)
-
50
-
-
ns
tCLK(twn)
-
50
-
-
ns
Output MOSFET switching
tr
-
50
100
150
ns
specification
tf
-
50
100
150
ns
Output MOSFET response
tpLH(CLK)
CLK→OUT
200
700
1200
ns
specification
tpHL(CLK)
CLK→OUT
200
700
1200
ns
Analog noise blanking time
AtBLK
Analog tblank time
250
400
550
ns
fOSCM1
ROSC=10kΩ
-15
0
+15
%
fOSCM2
ROSC=Open
-20
-
+20
%
OSCS frequency tolerance
fOSCS
-
-20
0
+20
%
Fixed OFF time
tOFF
fOSCM=3.2MHz
8.5
10
11.5
μs
Over current (ISD) detect masking
tISD(mask)
fOSCS(=6.4MHz)*8clk
1.0
1.25
1.5
μs
tTSD(mask)
fOSCS(=6.4MHz)*32clk
4.0
5.0
6.0
μs
tALM(mask)
fOSCS(=6.4MHz)*16clk
2.0
2.5
3.0
μs
Minimum CLK pulse width
OSCM frequency tolerance
time
Thermal shutdown (TSD) detect
masking time
Thermal Alarm (ALM) detect
masking time
AC specification timing chart
tCLK(twn)
[CLK]
50%
50%
50%
tCLK(twp)
fCLK
[OUT]
90%
tpLH(CLK)
50%
50%
10%
10%
90%
tr
tf
90%
[OUT]
50%
tpHL(CLK)
10%
Timing charts may be simplified for explanatory purpose.
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Application circuit example (Constant current control)
2kΩ
10kΩ
3kΩ
100μF
0.1μF
0.1μF
10kΩ
36
37
24V
ZD
25
24
M
48
1
13
12
* Please mount the four corner pins of the VQFN package and the exposed pad to the GND area of the PCB.
The application circuit above is an example; therefore, mass-production design is not guaranteed.
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Application circuit example (Constant voltage control)
10kΩ
100μF
0.1μF
0.1μF
36
37
24V
ZD
25
24
M
13
12
48
1
* Please mount the four corner pins of the VQFN package and the exposed pad to the GND area of the PCB.
The application circuit above is an example; therefore, mass-production design is not guaranteed.
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(For reference) PD-Ta graph
Note that Ta, Rth(j-a), and Ptotal are dependent on the usage environment.
Moreover, when ambient environment temperature is high, permissible power consumption is
reduced accordingly.
Other reference value: T(j-c)=3.5°C/W of the VQFN48 package
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Package dimensions (Unit: mm): P-VQFN48-0707-0.50-004
Weight 0.14 g (Typ.)
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Notes on Contents
1. Block Diagram
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case
of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke
or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate
settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design
to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power
ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may
cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the
power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown
may cause injury, smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or
combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied
even just once.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection-type IC that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
・Over current detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances.
If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the overcurrent
detection circuit to operate improperly or IC breakdown may occur before operation. In addition, depending on the method
of use and usage conditions, if overcurrent continues to flow for a long time after operation, the IC may generate heat
resulting in breakdown.
・Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate
against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
・Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the
effect of IC heat radiation with peripheral components.
・Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply
owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply
and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the
effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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