TB67S289FTG
Toshiba BiCD process integrated circuit silicon monolithic
TB67S289FTG
Active Gain Control Clock-in control Bipolar stepping motor driver
The TB67S289FTG is a clock-in controlled bipolar stepping
motor driver with a built-in Active Gain Control architecture.
The TB67S289FTG also has an internal current feedback
control (ACDS) which enables the driver to control the motor
current without using a sense resistor.
Using the BiCD process, the TB67S289FTG is rated at 50 V,
3.0 A.
P-VQFN48-0707-0.50-004
Weight 0.14 g (typ.)
Features
•
Built-in Anti-stall architecture (AGC: Active Gain Control)
•
Built-in sense resistor less current control architecture (ACDS: Advanced Current Detection System)
•
Low Rds (on) MOSFET (High side+ Low side=0.4 Ω (typ.))
•
Built-in micro stepping control. (Full, Half (a), Half (b), Quarter, 1/8, 1/16, 1/32 step resolution)
•
Multi error detect functions (Thermal shutdown (TSD), Over current detection (ISD), Power-on-reset
(POR), Motor load open (OPD))
•
Error detection status output (Error Output)
•
Internal VCC (5 V) regulator enables the driver to operate with a single power supply (VM).
•
Adjustable constant current PWM frequency using external components
•
Small package with thermal pad on back side (QFN48: 7.0 mm x 7.0 mm)
Note: Please consider the heat condition when using the TB67S289FTG.
© 2017
Toshiba Electronic Devices & Storage Corporation
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TB67S289FTG
Pin assignment
NC
VMB
VMB
GND
NC
GND
VREFB
VREFA
VCC
VCC
OSCM
NC
(Top View)
36 35 34 33 32 31 30 29 28 27 26 25
NC
37
24 OUTB+
NC
38
23 OUTB+
DMODE0
39
22 RSBGND
DMODE1
40
21 RSBGND
DMODE2
41
20 OUTB-
CW/CCW
42
CLK
43
ENABLE
44
17 OUTA-
45
16 RSAGND
MO
46
15 RSAGND
LO1
47
14 OUTA+
LO2
48
13 OUTA+
3
4
5
6
7
8
9 10 11 12
AGC1
CLIM1
FLIM
BOOST
LTH
GND
NC
VMA
NC
2
VMA
1
CLIM0
18 OUTA-
AGC0
RESET
19 OUTB-
TB67S289FTG
Note: Please solder the corner pad and the rear thermal pad of the QFN package, to the GND pattern of the PCB.
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2017-09-15
TB67S289FTG
Pin description
Pin No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Pin name
AGC0
AGC1
CLIM0
CLIM1
FLIM
BOOST
LTH
GND
NC
VMA
VMA
NC
OUTA+
OUTA+
RSAGND
RSAGND
OUTAOUTAOUTBOUTBRSBGND
RSBGND
OUTB+
OUTB+
NC
VMB
VMB
NC
GND
GND
VREFB
VREFA
VCC
VCC
OSCM
NC
NC
NC
DMODE0
DMODE1
DMODE2
CW/CCW
CLK
ENABLE
RESET
MO
LO1
LO2
Pin function
Active Gain Control setup pin No.0
Active Gain Control setup pin No.1
AGC current limiter setup pin No.0
AGC current limiter setup pin No.1
AGC frequency limiter setup pin
AGC current boost setup pin
AGC threshold setup pin
Ground pin
Non connection
Motor power supply input pin
Motor power supply input pin
Non connection
Ach motor output (+) pin
Ach motor output (+) pin
Ach motor power ground pin
Ach motor power ground pin
Ach motor output (-) pin
Ach motor output (-) pin
Bch motor output (-) pin
Bch motor output (-) pin
Bch motor power ground pin
Bch motor power ground pin
Bch motor output (+) pin
Bch motor output (+) pin
Non connection
Motor power supply input pin
Motor power supply input pin
Non connection
Ground pin
Ground pin
Bch current threshold reference pin
Ach current threshold reference pin
Internal regulator voltage monitor pin
Internal regulator voltage monitor pin
Internal oscillator frequency monitor and setting pin
Non connection
Non connection
Non connection
Step resolution setting pin No.0
Step resolution setting pin No.1
Step resolution setting pin No.2
Current direction setup pin
Step clock input pin
Motor output ON/OFF pin
Electrical angle initialize pin
Electrical angle monitor pin
Error flag output pin No.1
Error flag output pin No.2
Note: Please leave the NC pins open and do not connect any PCB pattern.
Note: For pins with the same pin name; connect the pins together at the nearest point of the driver.
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TB67S289FTG
Block diagram
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purpose.
Note: All the grounding wires of the TB67S289FTG should run on the solder mask on the PCB and be externally terminated
at only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or
to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins
(VM, RS line, OUT line, and GND) through which a particularly large current may run. If these pins are wired incorrectly, an
operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mountings.
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2017-09-15
TB67S289FTG
Input-Output equivalent circuit
Pin name
DMODE0
DMODE1
DMODE2
CLK
ENABLE
RESET
CW/CCW
AGC0
AGC1
CLIM0
CLIM1
FLIM
Input-Output signal
Input-Output equivalent circuit
Logic input pin
1 kΩ
Logic input pin voltage
GND ≤ VIN1 (L) ≤ 0.8 V
100 kΩ
2.0 V ≤ VIN1 (H) ≤ 5.5 V
GND
VCC
Multi state input pin voltage
100 kΩ
VCC, GND, VCC-100 kΩ pull-up, or
GND-100 kΩ pull-down
(Resistance accuracy should be within
±20 %.)
1 kΩ
Logic input pin
100 kΩ
BOOST
LTH
100 kΩ pull-down
(Resistance accuracy should be within
±20 %.)
500 Ω
500 Ω
LTH
(10 kΩ to 100 kΩ) VCC
LO1
Logic output pin
LO2
0 V ≤ VOUT (L) ≤ 0.5 V
MO
4.75 V ≤ VOUT (H) ≤ 5.25 V
Logic output pin
VCC
OSCM
OSCM frequency range
OSCM
1 kΩ
500 Ω
0.64 MHz ≤ fOSCM ≤ 2.4 MHz
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TB67S289FTG
Pin name
Input-Output signal
Input-Output equivalent circuit
VCC
1 kΩ
VREFA
VCC
VCC voltage range
4.75 V ≤ VCC ≤ 5.25 V
VREFA
VREF input voltage range
GND ≤ VREF ≤ 3.6 V
VCC
1 kΩ
VREFB
VREFB
VMA
VMA
VMB
OUT A+
OUTA+
VM operation voltage range
10 V ≤ VM ≤ 47 V
OUTA-
OUT AVMB
RSAGND
OUT B+
Output pin voltage range
10 V ≤ VM ≤ 47 V
OUT B-
OUTB-
OUTB+
RSAGND
RSBGND
RSBGND
Note: The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
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TB67S289FTG
♦Basic function of stepping motor control
1. CLK function
Each up-edge of the CLK signal shifts the current step and electrical angle of the motor.
Note: Analog filter of 200 ns (±20 %) is adopted to CLK pin in the IC
CLK
Function
↑
Shifts the electrical angle and current step per each up-edge.
↓
— (no change, maintain former state)
2. ENABLE function
The ENABLE pin controls the ON and OFF of the stepping motor outputs. Motor operation is started by switching ON and
stopped by switching OFF. (In the state of OFF, all of the output MOSFET are turned off and become high impedance state
(Hi-Z).) It is recommended to set the ENABLE pin to Low during VM power-on and power-off sequence to avoid any motor
operation when VM voltage is below the operation range. And so, switching the ENABLE pin to High after VM voltage is
stabilized as the actually used voltage is recommended.
ENABLE
Function
High
Motor outputs: ON (Normal operation)
Low
Motor outputs: OFF (Hi-Z)
3. CW/CCW function / Output pin function (output logic at charge starting)
The CW/CCW pin controls the rotation direction of the stepping motor. When CW/CCW is set to High, OUT (+) outputs high
and OUT (-) outputs low in Charge starting. When CW/CCW is set to Low, OUT (+) outputs Low and OUT (-) outputs High
in Charge starting.
CW/CCW
Function
High (CW)
Clock-wise: The current of Ach leads the current of Bch by 90-degree phase difference.
Low (CCW)
Counter clock-wise: The current of Bch leads the current of Ach by 90-degree phase difference.
4. DMODE (step resolution setting) function
The DMODE pins are used to set the step resolution for stepping motor operation. If all 3 pins (DMODE0, 1, and 2) are set
to Low, the device goes into ‘standby mode’. During ‘standby mode’, few internal circuits are fully shutdown to reduce power
dissipation. If any of the 3 pins (DMODE0, 1, or 2) is set to High, the TB67S289FTG will reboot from standby mode.
However, it will take 7.5 μs (typ.) to stabilize the internal circuit. Therefore, please wait for this warm-up period and input
signals to boot up.
Note: Built-in digital filter of 1.25 μs (±20 %) is adopted to DMODE pins.
Note: Built-in digital filter of 0.94 μs (±20 %) is adopted to DMODE pins for standby mode.
DMODE0
DMODE1
DMODE2
Function
High
High
High
1/32 step resolution
High
High
Low
1/16 step resolution
High
Low
High
1/8 step resolution
High
Low
Low
1/2 (b) step resolution
Low
High
High
1/4 step resolution
Low
High
Low
1/2 (a) step resolution
Low
Low
High
1/1 step resolution
Low
Low
Low
Standby mode
(Internal oscillator circuit (OSCM) and output MOSFETs are set to ‘OFF’)
DMODE0, 1, and 2 pins can be switched during operation. For the following step, the current of the nearest electric angle
before or after switching will flow. Please refer to the application note for detailed functions.
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TB67S289FTG
5. RESET function
The RESET pin initializes the internal electrical angle.
Note: Built-in digital filter of 0.625 μs (±20 %) is adopted to RESET pin.
RESET
Function
High
Initializes the internal electrical angle
Low
Normal operation
When the RESET pin is set to High, the current setting for each H-bridge (Ach and Bch) will be set to the value below. Also,
the MO pin outputs Low level when the electrical angle corresponds to the initial value.
Step resolution
Ach current
Bch current
Electrical angle
1/32 step setting
71 %
71 %
45°
1/16 step setting
71 %
71 %
45°
1/8 step setting
71 %
71 %
45°
1/2 (b) step setting
71 %
71 %
45°
1/4 step setting
71 %
71 %
45°
1/2 (a) step setting
100 %
100 %
45°
1/1 step setting
100 %
100 %
45°
6. MO (Monitor output: electrical angle monitor) function
MO pin outputs an internal initial electrical angle as a signal. The MO is an open drain type pin; therefore to use the function
properly, please pull up the MO output to VCC. (The pull-up resistor value should be set between 10 kΩ and 100 kΩ.) The
pin level is high impedance (Hi-Z) during the normal operation (internal MOSFET is turned off and pin voltage is VCC). And
when the internal electrical angle is equal to the initial angle, the pin level will be Low (internal MOSFET is turned ON) as
shown below.
MO
Function
VCC (Hi-Z)
Electrical angle is not at the initial position
Low
Electrical angle is at the initial position
Note: Hi-Z: High impedance state
(10 kΩ to 100 kΩ) VCC
If the electrical angle is equal to the initial
angle, the internal MOSFET is turned on and
the pin voltage level is Low.
MO
If the electrical angle is not equal to the initial
angle, the internal MOSFET is turned off and
the pin voltage level is High (VCC).
Note: The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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2017-09-15
TB67S289FTG
Step resolution and set current (Electric angle: 0 to 180°)
Electrical
angle
0°
45°
90°
135°
180°
STEP
1/32 step
1/16 step
1/8 step
1/4 step
1/2(b) step
1/2(a) step
1
IOUTA(%) IOUTB(%)
+100
0
✔
✔
✔
✔
✔
✔
2
+100
+5
✔
3
+100
+10
✔
4
+99
+15
✔
5
+98
+20
✔
6
+97
+25
✔
7
+96
+29
✔
8
+94
+34
✔
✔
(Note1)
✔
✔
✔
(Note1)
✔
✔
9
+92
+38
✔
10
+90
+43
✔
11
+88
+47
✔
12
+86
+52
✔
13
+83
+56
✔
14
+80
+60
✔
15
+77
+63
✔
16
+74
+67
✔
17
+71
+71
✔
18
+67
+74
✔
19
+63
+77
✔
20
+60
+80
✔
21
+56
+83
✔
22
+52
+86
✔
23
+47
+88
✔
24
+43
+90
✔
25
+38
+92
✔
26
+34
+94
✔
27
+29
+96
✔
28
+25
+97
✔
29
+20
+98
✔
30
+15
+99
✔
31
+10
+100
✔
32
+5
+100
✔
33
0
+100
✔
34
-5
+100
✔
35
-10
+100
✔
36
-15
+99
✔
37
-20
+98
✔
38
-25
+97
✔
39
-29
+96
✔
40
-34
+94
✔
41
-38
+92
✔
42
-43
+90
✔
43
-47
+88
✔
44
-52
+86
✔
45
-56
+83
✔
46
-60
+80
✔
47
-63
+77
✔
48
-67
+74
✔
49
-71
+71
✔
50
-74
+67
✔
51
-77
+63
✔
52
-80
+60
✔
53
-83
+56
✔
54
-86
+52
✔
55
-88
+47
✔
56
-90
+43
✔
57
-92
+38
✔
58
-94
+34
✔
59
-96
+29
✔
60
-97
+25
✔
61
-98
+20
✔
62
-99
+15
✔
63
-100
+10
✔
64
-100
+5
✔
65
-100
0
✔
1/1 step
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
(Note1)
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
(Note1)
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
Note1: 1/1 step and 1/2 (a) step: Set current of 71 % corresponds to 100 %.
Note2: 1/4 step: Set current of 92 % corresponds to 100 %.
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TB67S289FTG
Step resolution and set current (Electric angle: 180 to 360°)
Electrical
angle
180°
225°
270°
315°
360°
STEP
1/32 step
1/16 step
1/8 step
1/4 step
1/2(b) step
1/2(a) step
65
IOUTA(%) IOUTB(%)
-100
0
✔
✔
✔
✔
✔
✔
66
-100
-5
✔
67
-100
-10
✔
68
-99
-15
✔
69
-98
-20
✔
70
-97
-25
✔
71
-96
-29
✔
72
-94
-34
✔
73
-92
-38
✔
74
-90
-43
✔
75
-88
-47
✔
76
-86
-52
✔
77
-83
-56
✔
78
-80
-60
✔
79
-77
-63
✔
80
-74
-67
✔
81
-71
-71
✔
✔
(Note1)
82
-67
-74
✔
83
-63
-77
✔
84
-60
-80
✔
85
-56
-83
✔
86
-52
-86
✔
87
-47
-88
✔
88
-43
-90
✔
89
-38
-92
✔
90
-34
-94
✔
91
-29
-96
✔
92
-25
-97
✔
93
-20
-98
✔
94
-15
-99
✔
95
-10
-100
✔
96
-5
-100
✔
97
0
-100
✔
✔
✔
98
+5
-100
✔
✔
(Note1)
✔
✔
99
+10
-100
✔
100
+15
-99
✔
101
+20
-98
✔
102
+25
-97
✔
103
+29
-96
✔
104
+34
-94
✔
105
+38
-92
✔
106
+43
-90
✔
107
+47
-88
✔
108
+52
-86
✔
109
+56
-83
✔
110
+60
-80
✔
111
+63
-77
✔
112
+67
-74
✔
113
+71
-71
✔
114
+74
-67
✔
115
+77
-63
✔
116
+80
-60
✔
117
+83
-56
✔
118
+86
-52
✔
119
+88
-47
✔
120
+90
-43
✔
121
+92
-38
✔
122
+94
-34
✔
123
+96
-29
✔
124
+97
-25
✔
125
+98
-20
✔
126
+99
-15
✔
127
+100
-10
✔
128
+100
-5
✔
(129)
+100
0
✔
1/1 step
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
(Note1)
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
(Note1)
✔
✔
✔
✔
✔
✔
(Note2)
✔
✔
✔
✔
✔
✔
✔
Note1: 1/1 step and 1/2 (a) step: Set current of 71 % corresponds to 100 %.
Note2 1/4 step: Set current of 92 % corresponds to 100 %.
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TB67S289FTG
7. LO1, LO2 (Error Output: error detect flag output) function
The LO1 and LO2 are signals that are flagged when the error state is detected. Both pins are open drain type, therefore to
use the function properly; the LO1 and LO2 pins should be pulled up to the VCC. (Set the pull-up resistor in the range of
10k to 100kΩ.) During normal operation, the pin is high-impedance (Internal MOSFET is turned off and the pin voltage is
VCC). Once the error detect function (thermal shutdown (TSD), over current detection (ISD), or motor load open (OPD))
operates, the pins will output Low level (Internal MOSFET is turned ON) as follows.
Reasserting the VM power or using the standby mode to release the error detection status, the LO1 and LO2 pins will show
“normal operation” status again. If function of LO1 or LO2 is not used, leave the pins open.
LO1
LO2
Function
VCC (Hi-Z)
VCC (Hi-Z)
Normal status (Normal operation)
VCC (Hi-Z)
Low
Detected motor load open (OPD)
Low
VCC (Hi-Z)
Detected over current (ISD)
Low
Low
Detected over thermal (TSD)
Note: Hi-Z: High impedance state
(10 kΩ to 100 kΩ) VCC
LO1, LO2
Once the error detection operates, internal
MOSFETs of both or either LO1 or LO2 is
turned on. (Pin voltage is low level.)
During normal state, internal MOSFETs of
both LO1 and LO2 are OFF. (The pin will
output High level (pull-up voltage of VCC).
Note: The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
8. OSCM (internal oscillator) function
OSCM is used to set the internal oscillator frequency for constant current PWM control. The values of the resistor and the
capacitor connected to this pin will set the OSCM frequency. Please connect the pull-up resistor to the VCC when PWM
frequency is set by the external components. Also, to use an internal ‘fixed value OSCM frequency’ (not using any external
components), disconnect the ROSC resistor and short the OSCM pin to the GND. Note that when using the internal ‘fixed
value OSCM frequency’, do not input any control signal for 20 μs (typ.) after power on or standby release. (It takes 20 μs to
judge the existence of the external components and switch to the ‘fixed value OSCM frequency’ mode.) The ‘fixed value
OSCM frequency’ will be around 0.92 MHz, so the fchop will be around 57 kHz.
OSCM
(ROSC)
VCC
When using the internal ‘fixed value OSCM
frequency’ (not using any external
components), disconnect the ROSC resistor
and short the COSC capacitor (short the
OSCM pin to the GND).
(COSC)
Note: The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
Note: The oscillator frequency can be adjusted by controlling the values of resistor (ROSC) and capacitor (COSC). When
conforming the frequency, it is recommended to fix the capacitor to 270 pF and change the ROSC value. For details,
please refer to the following descriptions.
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TB67S289FTG
OSCM oscillator frequency (chopping frequency) calculation
OSCM oscillator frequency can be calculated by using the external component values (ROSC and COSC), and the formula
is shown below. (COSC is fixed to 270 pF.)
fOSCM = 4.0 x ROSC (-0.8)
COSC and ROSC are external components to set the oscillator frequency. When adjusting the oscillator frequency with
components, it is recommended to fix COSC to 270 pF and change the constant number of ROSC.
Moreover, the relation between the chopping frequency for constant current PWM (fchop) and the OSCM oscillator
frequency (fOSCM) is as follows;
fchop = fOSCM / 16
For normal operation, setting the frequency in the range of 50 kHz to 70 kHz and adjusting suitably as needed is
recommended
When the chopping frequency is set high, the current ripple will be smaller, which will lead to a higher reproducibility of a
waveform. However, the chopping frequency per unit time is increased and so the gate loss and the switching loss of the
integrated MOSFET will be larger, which will lead to an additional heat generation. On the other hand, when the chopping
frequency is set low, the current ripple will be larger but the heat generation is reduced. Please set the frequency according
to the usage conditions and environment.
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♦Stepping motor application features (anti-stall, sense resistor less PWM)
9. Active Gain Control (Anti-stall) function
AGC0, AGC1 pins control the Active Gain Control to turn on or off. When both pins are set to High, the AGC is turned on.
The PWM current threshold will be reduced in a phased manner where the upper limited current is determined by VREF.
When both pins are set to Low, the AGC is turned off and the current, which is set by VREF, flows.
Note: Built-in digital filter of 0.625 μs (±20%) is adopted to AGC0 and AGC1 pins.
AGC0
AGC1
Function
High
High
AGC: ON
High
Low
(Note1)
Low
Low
AGC: OFF
Normally, set these pins as follows; AGC0, AGC1= (High, High) or (Low, Low). Please do not switch the AGC0 pin level
during operation.
Note1: Use this configuration when switching ON or OFF of AGC during operation. As for concrete usage method, refer to
the application note.
10. CLIM (AGC bottom current limit) function
The CLIM0 and CLIM1 pins set the bottom current limit of the AGC. When AGC is active, the PWM current threshold will be
reduced in a phased manner. By using the CLIM function, the motor current will not go below the bottom limit. The CLIM0 is
a 2 stated logic input, and the CLIM1 is a 4 stated logic input.
Note: Built-in digital filter of 0.625 μs (±20%) is adopted to CLIM0 and CLIM1 pins.
CLIM0
High
Low
CLIM1
Function
VCC short
AGC bottom current limit: IOUT x 80 %
VCC-100 kΩ pull-up
AGC bottom current limit: IOUT x 75 %
GND-100 kΩ pull-down
AGC bottom current limit: IOUT x 70 %
GND short
AGC bottom current limit: IOUT x 65 %
VCC short
AGC bottom current limit: IOUT x 60 %
VCC-100 kΩ pull-up
AGC bottom current limit: IOUT x 55 %
GND-100 kΩ pull-down
AGC bottom current limit: IOUT x 50 %
GND short
AGC bottom current limit: IOUT x 45 %
Note: Resistance accuracy should be within ±20 %.
11. BOOST (current boost) function
The BOOST pin sets the current boost level when the load torque is increased. When AGC is turned on, the PWM current
threshold will be reduced in a phased manner. However, once the load torque is increased, the device will then boost the
PWM current threshold to prevent the motor from stalling. The BOOST pin is a 4 stated logic input pin.
Note: Built-in digital filter of 0.625 μs (±20%) is adopted to BOOST pin.
BOOST
Function
VCC short
Takes 5 steps maximum to reach 100 % current (design value)
VCC-100 kΩ pull-up
Takes 7 steps maximum to reach 100 % current (design value)
GND-100 kΩ pull-down
Takes 9 steps maximum to reach 100 % current (design value)
GND short
Takes 11 steps maximum to reach 100 % current (design value)
Note: Resistance accuracy should be within ±20 %.
Note: Current boost step is largest when BOOST is shorted to VCC, and smallest when shorted to the GND.
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12. FLIM (AGC Frequency limit) function
The FLIM pin sets the bottom frequency limit for the AGC to be active. It can reduce the resonance frequency of the motor
start in using AGC. The FLIM pin is a 4 stated logic input.
Note: Built-in digital filter of 0.625 μs (±20%) is adopted to FLIM pin.
FLIM
Function
VCC short
Frequency limit: ON, AGC is invalid when fCLK is below 675 Hz
VCC-100 kΩ pull-up
Frequency limit: ON, AGC is invalid when fCLK is below 450 Hz
GND-100 kΩ pull-down
Frequency limit: ON, AGC is invalid when fCLK is below 225 Hz
GND short
FLIM: OFF
Note: Resistance accuracy should be within ±20%.
The frequency in the table above is in the case of full step resolution. Frequency limit threshold depends on the step
resolution setting.
FLIM
1/1
1/2 (a)
1/2 (b)
1/4
1/8
1/16
1/32
VCC short
675 Hz
1.35 kHz
1.35 kHz
2.7 kHz
5.4 kHz
10.8 kHz
21.6 kHz
VCC-100 kΩ pull-up
450 Hz
900 Hz
900 Hz
1.8 kHz
3.6 kHz
7.2 kHz
14.4 kHz
GND-100 kΩ pull-down
225 Hz
450 Hz
450 Hz
900 Hz
1.8 kHz
3.6 kHz
7.2 kHz
GND short
FLIM: OFF
Note: Resistance accuracy should be within ±20%.
13. LTH (AGC detection threshold) function
The LTH pin sets the AGC detection threshold. Connect a 100 kΩ pull-down resistor to GND.
LTH
Function
GND-100 kΩ pull-down
Standard configuration for AGC detection threshold
Note: Resistance accuracy should be within ±20%.
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14. ADMD + ACDS (sense-resistor less PWM) control
ADMD (Advanced Dynamic Mixed Decay)
The TB67S289FTG applied the ADMD architecture which monitors both charge and recirculating current during constant
current PWM. The basic sequence of the ADMD is as shown below.
fchop (=1/16 fOSCM)
NFth
fOSCM
IOUT
ADMDth
Charge
Fast Decay
Slow Decay
Mixed (Fast+Slow) Decay
Timing charts may be simplified for explanatory purpose.
The basic constant current PWM sequence is a loop of Charge→Fast Decay→Slow Decay→Charge→・・・ to keep the peak
current below the threshold. The chopping frequency (fchop) is a period of 16 counts per cycle of OSCM oscillator
frequency (fOSCM). The sequence of Charge, Fast Decay, and Slow Decay is switched within this fchop cycle.
First, the motor current is charged (Charge sequence) until it reaches the constant current threshold (NFth), which is set by
the VREF reference voltage. Once the motor current reaches the constant current threshold (NFth), a partial motor current
recirculates back to the power supply (Fast Decay sequence). When the motor current reaches the fixed value (ADMDth)
during recirculation; for the rest of the fchop cycle, the motor is controlled to naturally discharge and hold the motor current
as much as possible (Slow Decay sequence).
Motor output MOSFET operation mode (Advanced Dynamic Mixed Decay)
VM
VM
OUTA-/
OUTA+/
OUTB-
OUTB+
VM
OUTA+/
OUTA-/
OUTB+
OUTB-
RSAGND/
RSBGND
RSAGND/
RSBGND
Charge
Fast Decay
OUTA+/
OUTA-/
OUTB+
OUTB-
RSAGND/
RSBGND
Slow Decay
Note: Fixed value of 400 ns (design value) is prepared at the switching timing of MOSFET output to avoid any flow-through
current. The equivalent circuit diagrams may be simplified or omitted for explanatory purposes.
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Constant current threshold calculation
The constant current PWM threshold can be set by applying voltage to the VREF pin.
IOUT=VREF × 0.833
Example: When Current Ratio is 100 % and VREF voltage is 2.0 V, the constant current PWM threshold is calculated from
following formula.
IOUT = 2.0 × 0.833=1.67 A
ADMD current waveform
•
When the next current step/ratio is higher than the previous step
fchop
fchop
fchop
fchop
Internal
OSC
waveform
NFth
ADMDth
•
Charge
Fast
Slow
NF
Fast
Charge
Fast
Slow
Fast
Charge
ADMDth
NF
NF
NF
NFth
Slow
Charge
Slow
When the Charge period continues beyond 1 fchop cycle
fchop
fchop
fchop
fchop
Internal
OSC
waveform
NF
NFth
Fast
ADMDth
Slow
Charge
NFth
ADMDth
NF
Charge
NF
Fast
Charge
Slow
Charge sequence continues until
the motor current reaches the NF
threshold.
Fast
Slow
Timing charts may be simplified for explanatory purpose.
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•
When the next current step/ratio is lower than the previous step
fchop
fchop
fchop
fchop
Internal
OSC
waveform
NFth
ADMDth
NF
Charge
NF
Fast
Charge
Fast
NF
Slow Charge
Slow
Fast
The current is charged for a short period of time to
be compared in the RS comparator circuit. Since
the motor current level is higher than the next
NFth, the operation will be switched to Fast mode
instantly.
NFth
Charge
ADMDth
•
Fast
Slow
Slow
When the Fast period continues beyond 1 fchop cycle (Current does not reach ADMDth within
1 fchop cycle.)
fchop
fchop
fchop
fchop
Internal
OSC
waveform
NFth
ADMDth
The current is charged for a short period of time to be
compared in the NF comparator circuit. Since the
motor current level is higher than the next NFth, the
operation will be switched to Fast mode instantly.
NF
Charge
Fast
NF
Slow
Charge
When the motor current does not reach the
ADMDth after 1 fchop cycle, the Fast
recirculating sequence continues on until the
current level reaches the ADMDth.
Fast
NFth
Charge
ADMDth
Slow
Fast
Slow
Timing charts may be simplified for explanatory purpose.
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Constant current PWM blank/mask time
The TB67S289FTG has multi filter time to reject incoming noise or spike (inrush) current, which is generated during motor
operation, to avoid miss detection.
(2)
(1)
NFth
ADMDth
(4)
(3)
Charge
Fast
Slow
Timing charts may be simplified for explanatory purpose.
(1)
(2)
(3)
(4)
Digital NFblank (Filtering time to avoid spike current, which is generated before Charge): 1.25 μs (typ.)
Analog NFblank (Filtering time to avoid pulse noise for NFth): 0.35 μs (typ.)
Digital ADMDblank (Filtering time to avoid spike current, which is generated between Charge and Decay for
ADMDth: 2.2 μs (typ.)
Analog ADMDblank (Filtering time to avoid pule noise for ADMDth): 0.35 μs (typ.)
Note: Above periods are design values. They are not guaranteed.
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Absolute maximum ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
Motor power supply
Motor output voltage
Motor output current
Internal Logic power supply
VM
VOUT
IOUT
VCC
VIN (H)
VIN (L)
VMO
VLO
IMO
ILO
PD
Topr
Tstg
Tj (max)
50
50
3.0
6.0
6.0
-0.4
6.0
6.0
6.0
6.0
1.3
-20 to 85
-55 to 150
150
V
V
A
V
V
V
V
V
mA
mA
W
°C
°C
°C
—
—
(Note1)
—
—
—
—
—
—
—
(Note2)
—
—
—
Logic input voltage
MO output voltage
LO output voltage
MO Inflow current
LO Inflow current
Power dissipation
Operating temperature
Storage temperature
Junction temperature
Note1: For normal usage, the maximum current value should be determined by heat calculation.
The maximum output current may be further limited depending on ambient temperature and board conditions
(heat conditions).
Note2: Device alone (Ta =25°C)
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. Tj (max) is limited by the thermal shutdown (TSD) threshold.
Please set the usage conditions so that the peak Tj is kept under 120°C for indication.
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion. The value of even one parameter of the absolute
maximum ratings should not be exceeded under any circumstances. All voltage ratings, including supply voltages, must
always be followed. Other notes and considerations described in the datasheet should also be referred to.
Operation ranges (Ta=-20 to 85°C)
Symbol
Min
Typ.
Max
Unit
Remarks
Motor power supply
VM
10
24
47
V
—
Motor output current
IOUT
—
1.5
3.0
A
(Note1)
MO output pin voltage
VMO
—
3.3
VCC
V
Pull-up voltage
LO output pin voltage
VLO
—
3.3
VCC
V
Pull-up voltage
Clock input frequency
fCLK
—
-—
1000
kHz
(Note2)
Chopping frequency
Fchop (range)
40
70
150
kHz
—
VREF
GND
2.0
3.6
V
—
Characteristics
VREF input voltage
Note1: The actual maximum current may be limited due to operating circumstances (operating conditions of step resolution,
continuous operation time, etc. and thermal conditions of ambient temperature, PCB layout, etc.)
Note2: The actual maximum frequency may be limited due to operating circumstances (operating conditions of step
resolution, continuous operation time, etc. and thermal conditions of ambient temperature, PCB layout, etc.)
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Electrical characteristics 1 (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Logic input voltage 1
(Except BOOST, CLIM1, and FLIM)
VIN1 (H)
VIN1 (L)
VIN (HYS)
VIN2 (H)
VIN2 (PU)
VIN2 (PD)
VIN2 (L)
IIN1 (H)
IIN1 (L)
VOL (MO)
VOL (LO)
IM1
High level
Low level
Hysteresis voltage
VCC short
VCC-100 kΩ pull-up
GND-100 kΩ pull-down
GND short
Input voltage=3.3 V
Input voltage=0 V
IOL=5 mA LO=Low
IOL=5 mA LO=Low
Standby mode
OUT: OPEN, ENABLE: Low,
Standby mode: Release
OUT: OPEN, ENABLE: High,
Standby mode: Release
2.0
0
0.1
4.2
2.8
1.45
0
—
—
—
—
—
—
—
—
—
—
—
—
33
—
0.2
0.2
2
5.5
0.8
0.3
VCC
3.55
2.2
0.8
—
1
0.5
0.5
—
V
V
V
V
V
V
V
µA
µA
V
V
mA
3
5
7
mA
4
6
8
mA
Logic input hysteresis voltage
Logic input voltage 2
(BOOST, CLIM1, and FLIM)
Logic input current 1
(Except BOOST, CLIM1, and FLIM)
MO output pin voltage
LO output pin voltage
Current consumption
IM2
IM3
Output leakage current
High-side
IOH
VM=50 V,VOUT=0 V
—
—
1
µA
Low-side
IOL
VM=VOUT=50 V
Current differential between
channels
IOUT=1.5 A
Tj=25°C, Forward direction
(High + Low side)
1
—
—
µA
-5
0
5
%
-5
0
5
%
—
0.4
0.5
Ω
Motor current channel differential
ΔIOUT1
Motor current setting differential
Motor output ON-resistance
( High-side + Low-side)
ΔIOUT2
Ron (H+L)
Note: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA+, OUTA-, OUTB+ and OUTB-) to change when
a pin under test is gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA+,
OUTA-, OUTB+ and OUTB-) to change when the pin is then gradually lowered. The difference between VIN (H) and
VIN (L) is defined as the VIN (HYS).
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Electrical characteristics 2 (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
VREF input current
IREF
VREF=2.0 V
—
0
1
μA
VCC voltage
VCC
ICC=5.0 mA
4.75
5.0
5.25
V
VCC current
ICC
VCC=5.0 V
—
2.5
5.0
mA
VREF gain
VREF (gain)
VREF=2.0 V
—
0.833
—
A/V
Thermal shutdown (TSD) threshold (Note1)
TjTSD
—
145
160
175
°C
VMPOR (H)
POR release
6.5
7.5
8.5
V
VMPOR (L)
POR detect
6.0
7.0
8.0
V
ISD
—
3.3
4.3
5.5
A
VM power-on-reset threshold
Over current detection (ISD) threshold
(Not2)
Note 1: Thermal shutdown (TSD)
When the IC detects an over temperature, the internal circuit turns off the output MOSFETs. It has a dead band time to
avoid TSD misdetection, which may be triggered by external noise. Reassert the VM power supply or use the standby mode
by DMODE terminal to release this function. The TSD is triggered when the device is over heated irregularly. Make sure not
to use the TSD function aggressively.
Note 2: Over current detection (ISD)
When the IC detects an over current, the internal circuits turns off the output MOSFETs. It has a dead band time to avoid
ISD misdetection, which may be triggered by external noise. Reassert the VM power supply or use the standby mode by
DMODE terminal to release this function. The ISD is triggered when the motor current is over rated irregularly. Make sure
not to use the ISD function aggressively.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current
recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above
the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be
fully verified that there is no risk that the TB67S289FTG or other components will be damaged or fail due to the motor
back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output
short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be
damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists
for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by
external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC electrical characteristics (Ta = 25°C and VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Minimum CLK ‘High’ pulse width
tCLK (H)
CLK (H) minimum pulse width
500
—
—
ns
Minimum CLK ‘Low’ pulse width
tCLK (L)
CLK (L) minimum pulse width
500
—
—
ns
tr
—
30
80
130
ns
tf
—
40
90
140
ns
tpLH (CLK)
CLK to OUT
—
1000
—
ns
tpHL (CLK)
CLK to OUT
—
1500
—
ns
ΔfOSCM1
COSC=270 pF, ROSC=5.1 kΩ
-15
—
+15
%
-20
—
+20
%
—
67
—
kHz
—
57
—
kHz
Output MOSFET switching
specifications
OSCM oscillator accuracy
fchop1
PWM chopping frequency
COSC: GND short,
ΔfOSCM2
ROSC: Open
COSC=270 pF, ROSC=5.1 kΩ
COSC: GND short,
fchop2
ROSC: Open
AC characteristics timing chart
Logic input [CLK]
tCLK(H)
tCLK(L)
tpHL(CLK)
Motor output [OUT]
tr
tf
tpLH(CLK)
The timing chart may be simplified for explanatory purpose.
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Application circuit example
The application circuit shown in this document is provided for reference purposes only. The data for mass production are not
guaranteed.
Constant numbers of components (for reference only)
Symbol
CVM1
CVM2
RVF1,RVF2
CVCC
ROSC
COSC
RMO
RLO1, RLO2
Component
Electrolytic capacitor
Ceramic capacitor
Resistor
Ceramic capacitor
Resistor
Ceramic capacitor
Resistor
Resistor
Reference constant number
100 μF (CVM1 ≥ 10 μF)
(0.1 μF)
Arbitrary (10 kΩ ≤ RVF1+RVF2 ≤ 50 kΩ)
0.1 μF
5.1 kΩ (1.8 kΩ to 8.2 kΩ)
270 pF
10 kΩ (10 kΩ to 100 kΩ)
10 kΩ (10 kΩ to 100 kΩ)
Constant numbers in above table are for reference only. Some components outside of the recommendation range can be
adopted depending on the usage conditions.
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Package dimensions
(Unit: mm)
P-VQFN48-0707-0.50-004
Weight 0.14 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required,
especially at the mass production design stage.
Any license to any industrial property rights are not granted by providing these examples of application circuits.
IC Usage Considerations
Notes on handling of ICs
[1]
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion
or combustion.
[2]
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current
and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings,
when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large
current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a
large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
[3]
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent
device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative
current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4]
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s)
may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even
just one time.
[5]
Carefully select external components (such as inputs and negative feedback capacitors) and load components (such
as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage
will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure
can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay
attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current protection circuits operate against the over current, clear the over current status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the
method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may
generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is
appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs
generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the
effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power
supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem,
take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
•
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
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ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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2017-09-15
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