TB67S511FTAG,EL

TB67S511FTAG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB67S511FTAG Phase-in controlled Bipolar Stepping Motor Driver The TB67S511FTAG is a two-phase bipolar stepping motor driver using a PWM chopper. An interface is phase-in control. Fabricated with the BiCD process, rating is 40 V/2.0 A. Features P-WQFN36-0606-0.50-002 • Monolithic IC integrated by BiCD process • Capable of controlling bipolar stepping motor by single IC • PWM controlled constant-current drive • Supporting full, half, and quarter step resolutions • Built-in output MOSFET with low ON resistance (Upper + Lower side = 0.8 Ω (typ.)) • Weight: 0.10 g (typ.) High voltage and current drive (For specifications, please refer to the absolute maximum ratings and the operation ranges) • Built-in output functions of error detection (TSD and ISD) flags • Built-in error detection circuits (Thermal shutdown (TSD), over-current detection circuit (ISD), and power-on reset (POR)) • Built-in VCC regulator for internal circuit drive • Chopping frequency of a motor can be customized by external components • Package: P-WQFN36-0606-0.50-002 Note: Please be careful about thermal conditions during use. ©2016 TOSHIBA CORPORATION 1 2016-12-08 TB67S511FTAG OUT_B2+ OUT_B1+ RS_B2 VM RS_B1 NC VCC NC NC Pin assignment 27 26 25 24 23 22 21 20 19 18 GND NC 28 GND 29 17 OUT_B1- VREF_B 30 16 OUT_B2- VREF_A 31 15 GND OSCM 32 IN_A1 33 TB67S511FTAG 14 NC (Top View) 13 GND IN_A2 34 12 OUT_A2- 4 5 6 NC RS_A1 7 8 9 OUT_A2+ 3 OUT_A1+ 2 RS_A2 1 GND 10 GND STANDBY PHASE_B 36 IN_B1 11 IN_B2 PHASE_A 35 OUT_A1- *: Please mount the four-corner pins of the QFN package and the exposed pad to the GND area of the PCB. 2 2016-12-08 TB67S511FTAG Block diagram IN_A1 IN_A2 Standby Control + Phase/Step Selector + Signal Decode Logic IN_B1 IN_B2 PHASE_A PHASE_B Motor Oscillator System Oscillator VCC Regulator Current Level Set Current Reference Setting Motor Control Logic Predriver TSD OSCM VCC VM Power-on Reset STANDBY Current Comp OSC-Clock Converter VREF_A VREF_B Current Comp Predriver RS_A* RS_B* ISD GND OUT_A*+ OUT_A*- OUT_B*+ OUT_B*Note: * means 1 or 2. Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 3 2016-12-08 TB67S511FTAG Note: All the grounding wires of the TB67S511FTAG should run on the solder mask on the PCB and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Utmost care is necessary in the design of the output, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, or by short-circuiting to the power supply or ground. Especially, if power supply pins (VM, RS, OUT, and GND), through which a particularly large current may run, are wired incorrectly, an operation error may occur or the device may be destroyed. Also, if logic input pins are wired incorrectly, an operation error may occur or the device may be destroyed. In this case, the IC may be destroyed because over rating current flows. Pay enough attention in designing patterns and mounting the IC. 4 2016-12-08 TB67S511FTAG Pin descriptions Pin No. Pin Name Function 1 IN_B1 Bch step resolution control 1 2 IN_B2 Bch step resolution control 2 3 STANDBY 4 GND 5 NC 6 RS_A1 Sense resistor connection pin for setting current of Ach output 7 RS_A2 Sense resistor connection pin for setting current of Ach output 8 OUT_A1+ Motor Ach (+) output pin 9 OUT_A2+ Motor Ach (+) output pin 10 GND Power ground pin of Ach 11 OUT_A1- Motor Ach (-) output pin 12 OUT_A2- Motor Ach (-) output pin 13 GND Power ground pin of Ach 14 NC Standby mode set pin Ground pin Non-connection pin Non-connection pin 15 GND Power ground pin of Bch 16 OUT_B2- Motor Bch (-) output pin 17 OUT_B1- Motor Bch (-) output pin 18 GND Power ground pin of Bch 19 OUT_B2+ Motor Bch (+) output pin 20 OUT_B1+ Motor Bch (+) output pin 21 RS_B2 Sense resistor connection pin for setting current of Bch output 22 RS_B1 Sense resistor connection pin for setting current of Bch output 23 VM VM power supply pin 24 NC Non-connection pin 25 VCC 26 NC Non-connection pin 27 NC Non-connection pin 28 NC Non-connection pin 29 GND 30 VREF_B Motor Bch current threshold set pin 31 VREF_A Motor Ach current threshold set pin 32 OSCM Internal oscillator frequency set pin for chopping 33 IN_A1 Ach step resolution control 1 34 IN_A2 Ach step resolution control 2 35 PHASE_A Signal input pin of PWM current direction for Ach 36 PHASE_B Signal input pin of PWM current direction for Bch Internal VCC regulator monitor pin Ground pin *: Please keep NC pins open. 5 2016-12-08 TB67S511FTAG Equivalent circuit 6, 7 21, 22 1 kΩ 100 kΩ 1, 2, 3, 33, 34, 35, 36 8, 9 19, 20 11, 12 16, 17 GND GND 25 1 kΩ 1 kΩ 32 500 Ω 30, 31 GND GND The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Pin No 1 2 3 6, 7 8, 9 11, 12 16, 17 19, 20 21, 22 23 25 30 31 32 33 34 35 36 Pin name IN_B1 IN_B2 STANDBY RS_A* OUT_A*+ OUT_A*OUT_B*OUT_B*+ RS_B* VM VCC VREF_B VREF_A OSCM IN_A1 IN_A2 PHASE_A PHASE_B Note: * means 1 or 2. 6 2016-12-08 TB67S511FTAG Function description (Stepping motor modes) Motor output current (Iout): The flow from OUT+ to OUT- is defined as the plus current. The flow from OUT- to OUT+ is defined as the minus current. A ch B ch Input Output Input Output PHASE_A IN_A1 IN_A2 Iout (A) PHASE_B IN_B1 IN_B2 Iout (B) H H H +100 % H H H +100 % L H H -100 % H H H +100 % L H H -100 % L H H -100 % H H H +100 % L H H -100 % Please set IN_A1, IN_A2, IN_B1, and IN_B2 low in supplying a power. A ch B ch Input Output Input Output PHASE_A IN_A1 IN_A2 Iout (A) PHASE_B IN_B1 IN_B2 Iout (B) H H H +100 % H H H +100 % X L L 0% H H H +100 % L H H -100 % H H H +100 % L H H -100 % X L L 0% L H H -100 % L H H -100 % X L L 0% L H H -100 % H H H +100 % L H H -100 % H H H +100 % X L L 0% X: Don't care 7 2016-12-08 TB67S511FTAG A ch B ch Input Output Input Output PHASE_A IN_A1 IN_A2 Iout (A) PHASE_B IN_B1 IN_B2 Iout (B) H H L +71 % H H L +71 % H L H +38 % H H H +100 % X L L 0% H H H +100 % L L H -38 % H H H +100 % L H L -71 % H H L +71 % L H H -100 % H L H +38 % L H H -100 % X L L 0% L H H -100 % L L H -38 % L H L -71 % L H L -71 % L L H -38 % L H H -100 % X L L 0% L H H -100 % H L H +38 % L H H -100 % H H L +71 % L H L -71 % H H H +100 % L L H -38 % H H H +100 % X L L 0% H H H +100 % H L H +38 % X: Don't care Others Pin Name IN_A1, IN_A2 IN_B1, IN_B2 H L Notes The current value of each ch is set up with 2 inputs and 4 values. PHASE_A OUT+: H OUT+: L PHASE_B OUT-: L OUT-: H STANDBY Standby release Standby mode 8 Please refer to the above-mentioned current value setting table. When PHASE is set high, the charge current flows from OUT+ to OUT-. When STANDBY is set low, operations of an internal oscillating circuit and a motor output block stop. (The motor cannot drive.) 2016-12-08 TB67S511FTAG Current vector (Full step resolution) 100% D A CCW Current of A ch [%] CW -100% 100% 0% C B -100% Current of B ch [%] A B C D A B C D A B C D A B 100% Iout (A) 0% -100% 100% Iout (B) 0% -100% PHASE_A IN_A1 IN_A2 PHASE_B IN_B1 IN_B2 H L H L H L H L H L H L CCW CW Timing charts may be simplified for explanatory purpose. Please set IN_A1, IN_A2, IN_B1, and IN_B2 low in supplying a power. 9 2016-12-08 TB67S511FTAG Current vector (Half step resolution) G 100% A H CCW Current of A ch [%] CW F B -100% 0% E 100% C D -100% Current of B ch [%] G H A B C D E F G H A B C D E 100% Iout (A) 0% -100% 100% Iout (B) 0% -100% PHASE_A IN_A1 IN_A2 PHASE_B IN_B1 IN_B2 H L H L H L H L H L H L CCW CW Timing charts may be simplified for explanatory purpose. Please set IN_A1, IN_A2, IN_B1, and IN_B2 low in supplying a power. 10 2016-12-08 TB67S511FTAG Current vector (Quarter step resolution) N O P 100% M A 71% Current of A ch [%] L CCW 38% K B CW 0% -100% -71% 38% -38% J 71% 100% C -38% D -71% I E -100% H G F Current of B ch [%] N O P A BCD E F G H I J K L MN O P A BCD E F G H I J K L MN O P A Iout (A) 100% 71% 38% 0% -38% -71% -100% Iout (B) 100% 71% 38% 0% -38% -71% -100% PHASE_A IN_A1 IN_A2 PHASE_B IN_B1 IN_B2 H L H L H L H L H L H L CCW CW Timing charts may be simplified for explanatory purpose. Please set IN_A1, IN_A2, IN_B1, and IN_B2 low in supplying a power. 11 2016-12-08 TB67S511FTAG Mixed Decay Mode /Detecting zero point fchop CR pin Internal CLK waveform DECAY MODE Setting current NF 37.5% MIXED DECAY MODE MDT CHARGE MODE → NF: Reach setting current → SLOW MODE → MIXED DECAY TIMMING → FAST MODE → Monitoring current → (In case setting current > Outputting current) CHARGE MODE Charge Charge RNF Fast Slow Slow Fast Note Iout = 0 Hi-Z Note: When the motor current reaches zero level (Iout = 0 A), the output becomes “Hi-Z” state. 12 2016-12-08 TB67S511FTAG Output transistor function mode VM VM RRS VM RRS RS pin RRS RS pin U1 RS pin U2 U1 U2 U1 U2 OFF OFF OFF OFF ON L1 L2 L1 OFF ON ON ON Load Load L2 L1 ON GND L2 ON GND Charge mode A current flows into the motor coil. Load OFF GND Fast mode The energy of the motor coil is fed back to the power Slow mode A current circulates around the motor coil and the IC. Output transistor function MODE U1 U2 L1 L2 CHARGE ON OFF OFF ON SLOW OFF OFF ON ON FAST OFF ON ON OFF Note: In case of the current direction shown in the above figures. If the current flows in the opposite direction, refer to the following table. MODE U1 U2 L1 L2 CHARGE OFF ON ON OFF SLOW OFF OFF ON ON FAST ON OFF OFF ON This IC controls the constant motor current by 3 modes listed above. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 13 2016-12-08 TB67S511FTAG Calculation of setting current This IC drives a motor by controlling the PWM constant current with the base of the OSCM oscillating frequency. The peak output current (Setting current) can be determined by the current-sensing resistor (RS) and the reference voltage (Vref) as follows; Vref (V) Iout (max) = Vref (gain) × RRS (Ω) Vref (gain): Vref decay rate = 1/ 5.0 (typ.) Example: In the case of a 100% setup, When Vref = 3.0 V, Torque = 100%, and RS = 0.51 Ω, the constant output current (peak current) of the motor is calculated as follows; Iout = 3.0 V / 5.0 / 0.51 Ω = 1.18 A Calculation of the OSCM oscillation frequency (chopper reference frequency) An approximation of the OSCM oscillation frequency (fOSCM) and chopping frequency (fchop) can be calculated by the following formula. fOSCM = 1/ [0.56 × {Cx (R1+500)}] *C and R1: External constant number for OSCM (When C = 270 pF and R1 = 3.6 kΩ, fOSCM = 1.6 MHz (typ.)) fchop = fOSCM / 16 *When fOSCM = 1.6 MHz, fchop is approximately 100 kHz. If chopping frequency is raised, the ripple of the current decreases and the waveform reproducibility is improved. However, the gate loss inside IC becomes large and the heat generation increases. By lowering chopping frequency, reduction of heat generation is expectable. However, the ripple of the current may increase. Generally, a frequency of about 70 kHz is set as a reference value. A setup in the range of 50 to 100 kHz is recommended. 14 2016-12-08 TB67S511FTAG Absolute Maximum Ratings (Ta = 25°C) Characteristics Motor power voltage Motor output voltage Motor output current Internal logic power supply Logic input voltage Vref reference voltage Power dissipation Operating temperature Storage temperature Junction temperature Symbol VM Vout Iout VCC VIN(H) VIN(L) Vref PD Topr Tstg Tj(max) Rating 40 40 2.0 6.0 6.0 -0.4 5.0 1.3 -20 to 85 -55 to 150 150 Unit V V A V V V V W °C °C °C Remarks ― ― (Note 1) When externally applied. ― ― ― (Note 2) ― ― ― Note 1: The maximum current value in the normal operation should be set 70% or less of the absolute maximum ratings after thermal calculation. The maximum output current may be further limited in view of thermal considerations, depending on the ambient temperature and the board conditions. Note 2: Device alone (Ta = 25°C) When Ta exceeds 25°C, please correct the values by derating (10.4 mW/°C). Ta: Ambient temperature Topr: Ambient temperature while the IC is active Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal shutdown (TSD) circuitry. It is recommended to keep the maximum current below a certain level so that the maximum junction temperature (Tj (max)) will not exceed 120°C. Caution) Absolute maximum ratings The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The TB67S511FTAG does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated maximum is applied. All voltage ratings, including supply voltages, must always be followed. The other notes and considerations described later should also be referred to. PD-Ta graph (Device alone / Mounted to board) (For reference only) PD - Ta Mounted to board Device alone Board conditions 4-layer glass epoxy board μm 35 μm Cu thickness: 1 layer and 4 layers:μm 55 μm, 2 layers and 3 layers: Board size: 100 mm ×110 mm ×1.6 mm 15 2016-12-08 TB67S511FTAG Operation Ranges (Ta = -20 to 85°C) Characteristics Symbol Min Typ. Max Unit Remarks Motor power supply VM 10 24 35 V ― Motor output current Iout ― ― 2.0 A (Note) VIN(H) 2.0 ― 5.5 V Logic input High Level VIN(L) 0 ― 0.8 V Logic input Low Level Phase input frequency fPHASE ― ― 400 kHz ― Chopping frequency fchop(range) 40 70 150 kHz ― Vref input voltage Vref 0.5 2.0 3.6 V ― Logic input voltage Note: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions (exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on). Please confirm the maximum usage current by thermal calculation under the usage circumstances. Electrical characteristics 1 (Ta = 25°C and VM = 24 V, unless specified otherwise) Characteristics HIGH LOW Logic input hysteresis voltage HIGH Logic input current LOW Logic input voltage Symbol Test condition Min Typ. Max Unit VIN(H) VIN(L) VIN(HYS) IIN(H) IIN(L) Logic input (Note) Logic input (Note) Logic input (Note) VIN(H) = 3.3 V VIN(L) = 0 V 2.0 0 100 ― ― ― ― ― 33 ― 5.5 0.8 300 ― 1 V V mV µA µA ― 2.5 3.5 mA 4.0 5.5 5 7 IM1 Power consumption IM2 IM3 Output leakage current Output pins = open STANDBY = L Output pins = open STANDBY = H Output pins = open (Full step resolution) ― ― mA mA Upper IOH VRS = VM = 40 V, Vout = 0 V ― ― 1 µA Lower IOL VRS = VM = Vout = 40 V Current differential between Ch Iout = 1.0 A Iout = 1.0 A VRS = VM = 24 V Tj = 25°C, Forward direction (Upper-side + Lower-side) Design value 1 ― ― µA -5 0 5 % -5 0 0 ― 5 27 % µA ― 0.8 0.88 Ω Motor current channel differential Motor current setting accuracy RS pin current Motor output ON-resistance between drain and source (Upper-side + Lower-side) ΔIout1 ΔIout2 IRS Ron(H+L) Note: VIN(H) is defined as the VIN voltage that makes the outputs (OUT_A and OUT_B) change when the test pin voltage is gradually raised from 0 V. VIN(L) is defined as the VIN voltage that makes the outputs (OUT_A and OUT_B) change when the test pin voltage is gradually lowered from 5 V. The difference between VIN(H) and VIN(L) is defined as the VIN (HYS). Note: When the logic signal is input to the device while the VM is not supplied, the device is designed not to generate EMF and the leakage current. However, for safe usage, please control the logic signal to prevent motor operation by VM resupply. 16 2016-12-08 TB67S511FTAG Electrical characteristics 2 (Ta =25°C and VM = 24 V, unless specified otherwise) Symbol Test condition Min Typ. Max Unit Vref input current Characteristics Iref VREF = 2.0 V ― 0 1 μA VCC voltage VCC ICC = 5.0 mA 4.75 5.0 5.25 V VCC current ICC VCC = 5.0 V ― 2.5 5 mA Vref gain rate Vref(gain) VREF = 2.0 V 1/5.2 1/5.0 1/4.8 ― Thermal shutdown (TSD) threshold (Note1) TjTSD ― 145 160 175 °C VM recovery voltage VMR ― 7.0 8.0 9.0 V Over current detection (ISD) threshold (Note2) ISD Design value 2.5 3.2 4.0 A Note 1: Thermal shutdown circuit (TSD) When the junction temperature of the device reaches the TSD threshold, the TSD circuit is triggered; the internal reset circuit then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered, the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the STANDBY pin to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used aggressively. Note 2: Over current detection (ISD) When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection occurred by switching. Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is set to standby mode by STANDBY pin. For fail-safe, please insert a fuse to avoid secondary trouble. Back-EMF While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. Cautions on Overcurrent detection (ISD) and Thermal shutdown (TSD) The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output short-circuits; they do not necessarily guarantee the complete IC safety. If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be damaged due to an output short-circuit. The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by external hardware. IC Mounting Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or deterioration of the device. 17 2016-12-08 TB67S511FTAG AC electrical characteristics (Ta = 25°C, VM = 24 V, and 6.8 mH/5.7 Ω) Characteristics Symbol Test condition Min Typ. Max tPHASE(min) ― 100 ― ― twp ― 50 ― ― twn ― 50 ― ― tr ― 150 200 250 Output transistor tf ― 100 150 200 switching characteristics tpLH(PHASE) Between PHASE and OUT 250 750 1200 tpHL(PHASE) Between PHASE and OUT 250 750 1200 450 700 950 ns Minimum PHASE pulse width VM = 24 V, IOUT = 1.5 A Unit ns ns Blanking time for noise reduction AtBLK OSCM oscillation frequency fOSCM COSC = 270 pF, ROSC = 3.6 kΩ 1200 1600 2000 kHz Chopping frequency fchop Output: Active (IOUT = 1.5 A), fOSCM = 1600 kHz ― 100 ― kHz Analog tblank AC characteristics timing chart 1/fPHASE twn 50% 50% 50% twp PHASE tpHL(PHASE) tpLH(PHASE) 90% 90% 50% 50% OUT 10% tf tr 10% Timing charts may be simplified for explanatory purpose. 18 2016-12-08 TB67S511FTAG Application circuit example (TB67S511FTAG) (in case chopping frequency = 70 kHz) The values in the following figure are recommended values. OUT_B2+ RS_B2 VM VCC RS_B1 0.1 µF 0.51 Ω 100 µF OUT_B1+ 24 V 0.1 µF GND 0.1 µF GND OUT_B1- GND VREF_B OUT_B2GND VREF_A 5.1 kΩ M GND OSCM 270 pF 5V 3.3 V OUT_A2+ OUT_A1+ 0.51 Ω RS_A2 RS_A1 PHASE_B IN_B1 0V 5V 3.3 V GND PHASE_A GND 0V OUT_A1- IN_A2 5V 3.3 V STANDBY 0V 5V 3.3 V OUT_A2IN_A1 IN_B2 0V 5V 5V 5V 3.3 V 3.3 V 3.3 V 0V 0V 0V Note: The addition of a bypass capacitor is recommended if necessary. The GND wiring should be connected to one point as much as possible. The application circuit shown above is provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 19 2016-12-08 TB67S511FTAG Package dimensions P-WQFN36-0606-0.50-002 unit: mm Weight: 0.10 g (typ.) 20 2016-12-08 TB67S511FTAG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback capacitor, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. 21 2016-12-08 TB67S511FTAG Points to remember on handling of ICs Overcurrent detection Circuit Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status immediately. Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition, depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over-temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal shutdown circuit to operate improperly or IC breakdown to occur before operation. Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 22 2016-12-08 TB67S511FTAG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 23 2016-12-08