TB67S522FTAG
Toshiba BiCD Process Integrated Circuit Silicon Monolithic
TB67S522FTAG
PWM method CLK-IN bipolar stepping motor driver
The TB67S522FTAG is a PWM chopper type two-phase
bipolar stepping motor driver.
By applying the BiCD process, the TB67S522FTAG is rated at
40 V/2.8 A .
The internal voltage regulator allows control of the motor with
a single VM power supply.
P-WQFN36-0606-0.50-002
Weght: 0.14 g (typ.)
Features
●
Bipolar stepping motor driver
●
PWM constant current drive
●
Operational in full, half, and quarter step resolutions
●
Low on-resistance of output stage transistor by using BiCD process
●
High withstand voltage and large current (For details, refer to absolute maximum ratings and operating
ranges.)
●
Built-in thermal shutdown circuit (TSD), over-current detection circuit (ISD), and POR for VM power
supply
●
Built-in VCC regulator allows the TB67S522FTAG to function with only VM power supply.
●
Able to customize PWM signal frequency by external resistance/capacitor.
●
Package: P-WQFN36-0606-0.50-002
Note: Please be careful about thermal conditions during use.
©2016 TOSHIBA Corporation
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TB67S522FTAG
Pin Assignment
OUT_B1+
OUT_B2+
VM
RS_B1
RS_B2
VCC
NC
NC
NC
(Top View)
27 26 25 24 23 22 21 20 19
18
17
NC 28
GND 29
VREF_B 30
VREF_A 31
OSCM 32
16
15
14
13
TB67S522FTAG
CW/CCW 33
MO_OUT 34
D_MODE1 35
D_MODE2 36
12
11
10
OUT_B1OUT_B2GND
NC
GND
OUT_A2OUT_A1GND
OUT_A2+
OUT_A1+
RS_A2
4 5 6 7 8 9
GND
NC
RS_A1
ENABLE
RESET
CLK_IN
1 2 3
GND
*: Please mount the four corner pads of the package and the exposed pad to the GND area of the PCB.
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TB67S522FTAG
Block Diagram
CW/CCW
MO_OUT
VMR Detect
VCC Voltage
Regulator
D_MODE1
D_MODE2
Step Decoder
CLK_IN
ENABLE
(Input Logic)
VCC
Chopper OSC
OSCM
RESET
OSC
Current Level Set
VREF
Torque Control
2bit D/A
CR-CLK
Converter
(Angle Control)
Current Control
VM
Current Feedback
Output Control
(Mixed Decay Control)
RS COMP
RS_A1
RS_A2
RS_B1
RS_B2
ISD/VRS
Output
(H-Bridge ×2)
VM
TSD
VMR
Detect
Detection Circuit
Stepping Motor
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
Note: All the grounding wires of the TB67S522FTAG should run on the solder mask on the PCB and be
externally terminated at only one point. Also, a grounding method should be considered for efficient
heat dissipation. Careful attention should be paid to the layout of the output, VM and GND traces, to
avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs,
the device may be permanently damaged. Also, the utmost care should be taken for pattern designing
and implementation of the device since it has power supply pins (VM, RS_A1, RS_A2, RS_B1, RS_B2,
OUT_A1+, OUT_A2+, OUT_A1-, OUT_A2-, OUT_B1+, OUT_B2+, OUT_B1-, OUT_B2-, and GND)
through which a particularly large current may run. If these pins are wired incorrectly, an operation error
may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise,
the device may be damaged owing to a current running through the IC that is larger than the specified
current. Careful attention should be paid to design patterns and mountings.
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TB67S522FTAG
Pin Function Description
Pin number
Pin name
Function
1
CLK_IN
2
ENABLE
3
RESET
4
GND
5
NC
6
RS_A1 (Note)
Sense resistance connection pin for setting current value of A ch output
7
RS_A2 (Note)
Sense resistance connection pin for setting current value of A ch output
8
OUT_A1+ (Note)
A ch (+) output
9
OUT_A2+ (Note)
A ch (+) output
10
GND
11
OUT_A1- (Note)
A ch (-) output
12
OUT_A2- (Note)
A ch (-) output
13
GND
Clock signal input pin for determining the number of motor rotations
The electrical angle progresses at rising.
Output enable pin of A ch and B ch
Electrical angle reset pin
GND
Non-connection
GND
GND
14
NC
15
GND
Non-connection
16
OUT_B2- (Note)
B ch (-) output
17
OUT_B1- (Note)
B ch (-) output
18
GND
19
OUT_B2+ (Note)
B ch (+) output
20
OUT_B1+ (Note)
B ch (+) output
21
RS_B2 (Note)
Sense resistance connection pin for setting current value of B ch output
22
RS_B1 (Note)
Sense resistance connection pin for setting current value of B ch output
23
24
25
VM
NC
VCC
26
NC
Non-connection
27
NC
Non-connection
GND
GND
Monitor pin of motor power supply
No connection
Monitor pin for internal generated VCC regulator
28
NC
29
GND
Non-connection
30
VREF_B
Bias pin for current value setting for B ch output
31
VREF_A
Bias pin for current value setting for A ch output
32
OSCM
33
CW/CCW
Clockwise / counter clockwise of motor operation
34
MO_OUT
Monitor pin of electrical angle
35
D_MODE1
Step resolution setting pin 1
36
D_MODE2
Step resolution setting pin 2
GND
Oscillation circuit frequency setting pin for chopping
The NC pin should be used open.
Note: Connect the same function pins (numbered 1, 2) indicated as (Note) after the pin name at near their respective
pins.
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TB67S522FTAG
Input/Output Equivalent Circuit
6, 7
21, 22
1 kΩ
33, 35, 36
100 kΩ
1, 2, 3,
8, 9
19, 20
11, 12
16, 17
GND
GND
25
1kΩ
32
GND
GND
1 kΩ
34
500 Ω
30, 31
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Pin No
1
2
3
6,7
8,9
11,12
16,17
19,20
21,22
23
25
30
31
32
33
34
35
36
Pin name
CLK_IN
ENABLE
RESET
RS_A1, RS_A2
OUT_A1+, OUT_A2+
OUT_A1-, OUT_A2OUT_B2-, OUT_B1OUT_B2+, OUT_B1+
RS_B2, RS_B1
VM
VCC
VREF_B
VREF_A
OSCM
CW/CCW
MO_OUT
D_MODE1
D_MODE2
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TB67S522FTAG
1. CLK Function
Eech up-edge of the CLK signal shifts the motor’s electrical angle per step. The signal is reflected at
up-edge.
CLK Input
Function
Up-edge
Shifts the electrical angle per step.
Down-edge
State of the electrical angle does not change.
2. ENABLE Function
The ENABLE pin specifies ON and OFF of the current in the case of driving a stepping motor.
This pin should be fixed to “L” during VM power-on and power off sequence.
ENABLE input
Function
H
Output transistor operation ON (Normal operation)
L
Output transistor operation OFF (High impedance)
3. CW/CCW Function
The CW/CCW pin controls the rotation direction of the stepping motor.
CW/CCW input
Input function
H
Clockwise (CW)
L
Counter clockwise (CCW)
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TB67S522FTAG
4. Step Resolution Select Function
D_MODE1
D_MODE2
Function
L
L
L
H
Full step resolution
H
L
Half step resolution
H
H
Quarter step resolution
STANDBY MODE
The OSCM is disabled, the output stage is set to ‘OFF’ state, full step resolution, torque 100%
When switching the D_MODE1,2; setting the RESET signal to Low (sets the electrical angle to the initial
state), is recommended.
5. RESET Function
RESET input
Input function
H
Electrical angle RESET
L
Normal operation
In the case of RESET input, the current for each channel is as follows.
MO_OUT pin shows Low in this case.
Step resolution
Current of A ch
Current of B ch
Electrical angle
Full step
100 %
100 %
45°
Half step
100 %
100 %
45°
Quarter step
71 %
71 %
45°
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TB67S522FTAG
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Motor power supply
Motor output voltage
Motor output current
Internal logic power supply
Logic input pin voltage
MO output pin voltage
MO output pin inflow current
Power dissipation
Operating temperature
Storage temperature
Junction temperature
Symbol
VM
VOUT
IOUT
VCC
VIN
VMO
IMO
PD
Topr
Tstg
Tj (max)
Rating
40
40
2.8
6.0
6.0
6.0
30.0
1.3
-20 to 85
-55 to 150
150
Unit
V
V
A/ch
V
V
V
mA
W
°C
°C
°C
Remark
―
―
(Note1)
When externally applied
―
―
―
(Note2)
―
―
―
Note1: Maximum current value at normal operation should be used about 2 A per phase after thermal calculation.
The maximum output current may be further limited in view of thermal considerations, depending on
ambient temperature and board conditions.
Note2: When Ta exceeds 25°C for device alone measurement, please correct the PD values by de-rating at 10.4
mW/°C.
Ta : Ambient temperature of the IC
Topr : Ambient temperature while the IC is activate
Tj :
Junction temperature while the IC is active. Tj(max) is limited by the thermal shutdown (TSD) circuitry.
It is advisable to keep the maximum current below a certain level so that the maximum junction temperature, Tj
(max), will not exceed 120°C.
Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB67S522FTAG does not have overvoltage detection circuit. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
(Reference) Relation between power dissipation (single, PCB mounted) and ambient
temperature
PD - Ta
PCB mounting condition
Single condition
Board condition
4 layers board for glass epoxy exclusive use
Cu thickness: 1st layer and 4th layer 55μm, 2nd layer and 3rd layer 35μm
Board size: 100mm × 110mm × 1.6mm
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TB67S522FTAG
Operating Ranges (Ta = 0 to 85°C)
Characteristic
Symbol
Min
Typ.
Max
Unit
Remark
―
Per 1 channel (Note1)
Logic High level
Logic input voltage
Logic Low level
Voltage of pull-up
―
MO output pin voltage
VMO
3.3
5.5
V
destination
―
―
―
Clock input frequency
fCLK
100
kHz
―
Chopping frequency
fchop
40
100
150
kHz
―
―
Vref reference voltage
Vref
GND
3.6
V
Sense resistance connection
Reference value: VM
VRS
0.0
±1.0
±1.5
V
pin voltage
pin (Note2)
Note1: The actual maximum current may be limited by the operating environment (operating conditions such as
excitation mode or operating duration, or by the surrounding temperature or board heat dissipation).
Comfirm a realistic maximum current by calculating the heat generated under the operating environment.
Note2: The maximum VRS voltage should not exceed the maximum rated voltage.
Motor power supply voltage
Motor output current
VM
IOUT
VIN (H)
VIN (L)
10.0
―
2.0
-0.4
24.0
1.5
―
―
35.0
2.5
5.5
1.0
V
A
V
V
Electric Characteristic 1
(Unless otherwise specified, Ta = 25°C, VM = 24 V)
Test
circuit
Logic input pin
HIGH VIN (H)
DC
Input voltage
LOW VIN (L)
DC
Input hysteresis
VIN (HYS) DC
Logic input pin
HIGH IIN (H)
DC
Input current
LOW
II (L)
DC
HIGH VOH(MO) DC
MO pin output voltage
LOW VOL(MO) DC
Characteristic
Current consumption
Test condition
Min
Typ.
Max
Unit
Logic input pin (Note)
Logic input pin (Note)
Logic input pin (Note)
Test logic input pin: 5 V
Test logic input pin: 5 V
IOH=-24 mA Output: High
IOL=24 mA Output: Low
Output: OPEN, in
STANDBY mode
Output: OPEN, ENABLE=L
Output: OPEN (full step
resolution)
VRS=VM=40 V, VOUT=0 V
VRS=VM=VOUT=40 V
IOUT=2 A
2
0
100
35
―
2.4
―
3.3
―
200
50
―
―
―
5.5
0.8
300
75
1
―
0.5
V
V
mV
µA
µA
V
V
―
2
3
mA
―
―
3.5
5
5
7
mA
mA
Symbol
IM1
DC
IM2
DC
DC
IM3
―
―
HIGH
IOH
DC
1
Motor output
leak current
―
―
LOW
IOL
DC
1
Differential between output
ΔIOUT1
DC
-5
0
5
current channels
Output current setting
ΔIOUT2
DC IOUT=2 A
-5
0
5
differential
―
RS pin current
IRS
DC VRS=VM=24 V
0
27
Output transistor
IOUT=2.0 A, Tj=25°C
―
0.53
0.64
drain-source ON-resistance RON(D-S)
DC
(Design value)
(H-side + L-side)
Note: VIN ( H) is defined as the VIN voltage that causes the outputs to change when a pin under test is gradually
raised from 0V. VIN (L) is defined as the VIN voltage that causes the outputs to change when the pin is then
gradually lowered.
The difference between VIN (H) and VIN (L) is defined as VIN (HYS).
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µA
µA
%
%
µA
Ω
TB67S522FTAG
Electric Characteristic 2
(Unless otherwise specified, Ta = 25°C, VM = 24 V)
Symbol
Test
circuit
Test condition
Min
Typ.
Max
Unit
Iref
DC
Vref=3.0 V
―
0
1
μA
Vref (gain)
DC
Vref=2.0 V
1/4.8
1/5.0
1/5.2
―
TjTSD
DC
―
140
150
170
°C
VM return voltage
VMR
DC
―
7.0
8.0
9.0
V
ISD operation current (Note2)
ISD
DC
(Design value)
3.0
4.0
5.0
A
Characteristic
Vref input current
Vref decay ratio
TSD temperature (Note1)
Power supply voltage for internal
Vcc
DC
Icc=5.0 mA
4.75 5.00 5.25
V
circuit operation (Note3) (Note4)
Note1: Thermal shut down (TSD) circuit
When the IC junction temperature reaches the specified value and become overheated under irregular
conditions causing the TSD circuit to be activated, the internal halt circuit is activated shutting down all
the outputs to off.
When the temperature is set between 140°C (min) to 170°C (max), the TSD circuit operates (design
target value). When the TSD circuit is operating, it can be returned by re-starting the VM power supply or
setting D_MODE_1/2 to L/L (the STANDBY mode). The TSD function aims at detecting abnormal
heating of ICs. Please avoid positively using the TSD function.
Note2: Over-current detection (ISD) circuit
When the current exceeding the specified value flows to the output under irregular conditions, the
internal halt circuit is activated switching all the outputs to off. The blanking time of four cycles of CR
cycle is set to avoid the incorrect operation by switching. It can be returned by re-starting the VM power
supply or setting D_MODE1/2 to L/L (the STANDBY mode). The IC is in the STANDBY mode when
ISD function is operating.
Note3: When the power supply voltage (VCC) for internal circuit operation is divided with external resistance and
used as Vref input voltage, the accuracy of the output setting value becomes ±8%, together with the
accuracy of Vcc output and Vref decay ratio.
Note4: Even if the logic input signal is input in the state that the VM voltage is not supplied, although the circuit
is designed so that electromotive force and leakage current by the signal input do not occur, please
control the logic input signal so that the motor does not operate before re-supplying VM voltage.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current is fed back to the power supply owing to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device
might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and
motor characteristics. It must be fully verified that there is no risk that the TB67S522FTAG or other
components will be damaged or fail owing to the motor back-EMF.
Cautions on over-current shutdown (ISD) and thermal shutdown (TSD)
●
●
●
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions
such as an output short circuit; they do not necessarily guarantee complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then
the device may be damaged owing to an output short circuit.
The ISD circuit is only intended to provide temporary protection against an output short circuit. If such a
condition persists for a long time, the device may be damaged owing to overstress. Overcurrent
conditions must be removed immediately by external hardware.
IC Mounting
Do not insert devices in the wrong orientation or incorrectly. Otherwise, it may cause device breakdown,
damage and/or deterioration.
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TB67S522FTAG
AC Electric Characteristic
(Ta = 25°C, VM = 24 V, 6.8 mH/5.7Ω)
Symbol
Test
circuit
Test condition
Min
Typ.
Max
Unit
fCLK
AC
fOSC=1600 kHz
―
―
100
kHz
Internal filter of CLK input
minimum High width
TCLK (H)
AC
The CLK (H) minimum pulse
width
300
―
―
ns
Internal filter of CLK input
minimum Low width
TCLK (L)
AC
The CLK (L) minimum pulse
width
250
―
―
ns
tr
AC
―
100
150
200
ns
tf
AC
―
100
150
200
ns
tpLH (CLK)
AC
Between CLK and output
voltage
―
1000
―
ns
tpHL (CLK)
AC
Between CLK and output
voltage
―
1500
―
ns
Noise rejection blanking time
tBLANK
AC
IOUT =1.0 A
200
300
500
ns
OSCM oscillation frequency
fOSC
AC
COSC=270pF, ROSC=3.6kΩ
1200
1600
2000
kHz
Chopping frequency range
fChop (range)
AC
VM=24 V,
Output ACTIVE (IOUT=1.0 A)
30
100
150
kHz
Chopping setting frequency
fchop
AC
Output ACTIVE (IOUT =1.0 A),
CR= 1600 kHz
―
100
―
kHz
tISD (Mask)
AC
―
4
―
Characteristic
CLK (clock) input frequency
Switching characteristic of
output transistor
Over current detection blanking
time (Note)
Operation time of over current
detection (Note)
tISD
After exceeding a threshold
when the outputs are
short-circuited to the power
supply and GND
AC
Osc-CLK
―
―
8
Note: Count using number of clocks of OSCM clock after exceeding ISD threshold when the outputs are
short-circuited to the power supply and GND.
Timing of output transistor switching characteristic
90%
CLK
1/fCLK
50%
50%
10%
tpLH
tpHL
VM
90%
Output voltage
出力電圧
GND
90%
50%
50%
10%
10%
tr
tf
Timing charts may be simplified for explanatory purposes.
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TB67S522FTAG
Mixed Decay Mode
fchop
OSC internal
waveform
IOUT
MDT
NF detect
Current
threshold
Charge Mode →NF detect → Slow Mode → Mixed
Decay Timing → Fast Mode → Charge Mode
6clk / 16clk
= 37.5% fchop
fchop 1cycle: 16clk
Mixed Decay Mode Sequence Waveform
fchop
fchop
OSC internal
waveform
37.5% Mixed Decay Mode
Current
threshold
NF detect
NF detect
IOUT
MDT (Mixed Decay Timing): 37.5% fchop
Timing charts may be simplified for explanatory purposes.
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TB67S522FTAG
Mixed (Slow + Fast) Decay Mode Current Waveform
･ When the next step's current threshold is more than that of the previous step
fchop
fchop
fchop
fchop
OSC internal
waveform
Current
threshold
Current
threshold
NF
Slow
NF
Slow
Charge
NF
NF
Fast
Charge
Slow
Fast
Charge
Slow
Fast
Fast
Charge
･ When the next step's current threshold is less than that of the previous step
fchop
fchop
fchop
fchop
OSC internal
waveform
Current
threshold
NF
NF
Slow
Slow
Charge
Charge
Fast
Fast
The instant ‘Charge Mode’ will enable to compares
the motor current with the current threshold.
NF
Charge
Current
threshold
Slow
NF
Fast
NF
Slow
Charge
Fast
Charge
Timing charts may be simplified for explanatory purposes.
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TB67S522FTAG
Output Transistor Operation Mode
VM
VM
RRS
VM
RRS
RRS
RS pin
RS pin
U1
RS pin
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
L1
L2
L1
OFF
ON
ON
ON
Load
Load
L2
L1
ON
GND
Load
ON
OFF
GND
Charge Mode
A current flows into
the motor coil.
L2
GND
Slow Mode
A current circulates
around the motor coil
and this device.
Fast Mode
The energy of the
motor coil is fed back
to the power
Output Transistor Operating Function
Mode
U1
L1
U2
L2
Charge
Slow
ON
OFF
OFF
ON
OFF
OFF
ON
ON
Fast
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown
above. If the current flows in the opposite direction, refer to the following table.
Mode
U1
L1
U2
L2
Charge
OFF
ON
ON
OFF
Slow
Fast
OFF
ON
ON
OFF
OFF
OFF
ON
ON
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TB67S522FTAG
Calculation of the Setting Current
This IC drives a motor by controlling the PWM constant current base of the OSCM oscillating frequency.
The peak output current can be set via the current-sensing resistor (RS) and the reference voltage (Vref), as
follows:
Iout(Max) = Vref (gain) ×
Vref(V)
RRS(Ω)
Vref (gain) : Vref decay ratio is 1 / 5.0 (typ.)
Example : In case of 100 % setting,
When Vref = 3.0 V, Torque = 100%, RS = 0.51 Ω,
constant current output value of the motor (Peak current) is calculated as follows;
Iout = 3.0V / 5.0 / 0.51Ω= 1.18 A
Calculation of OSCM oscillation frequency (chopping reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following formulas.
fOSCM=1/[0.56×{C×(R1+500)}] C,R1: External constants for OSCM (C=270 pF, R1=3.6 kΩ)
fchop = fOSCM / 16
If the chopping frequency is raised, the reappearance of a waveform is higher since the ripple of the current
decreases. However the gate loss in the IC is raised and the heat generation becomes large.
It is expected that the heat generation is reduced by being lowered the chopping frequency, but the current
pulsating flow may be increased. Generally it is recommended that the reference frequency is set as 70 kHz,
the range from 50 kHz to 100 kHz.
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TB67S522FTAG
IC Power Consumption
Power of the IC is consumed by the transistor of the output block and that of the logic block mainly.
1.
Power consumed of power transistor (calculated as Ron H-side + L-side = 0.6Ω)
The power of output blocks is consumed by the transistor placed at H-side and L-side of H-bridge.
The power of a transistor of one H bridge can be shown in the following formula.
P (out) =
Iout (A) × VDS (V) =
2
Iout (A) × Ron (Ω) ............................................................ (1)
In the case of full step resolution, when the output current waveform becomes completely square waveform, the
average power consumption can be calculated as follows.
In the case of Ron = 0.6Ω, Iout (peak: Max) = 1.0 A, VM = 24 V,
2
P (out) = 2 (Tr) × 1.0 (A) × 0.6(Ω)............................................................................................. (2)
= 1.2(W)
2.
Power consumption of logic and IM domain
Power consumptions of logic and IM systems are calculated by separating the states (operating and stopping).
I (IM3) = 5 mA (typ.)
: Opearting /axis
I (IM2) = 3.5 mA (typ.)
: Stopping/axis
I (IM1) = 2 mA (typ.)
: Standby/axis
Output block are connected to VM (24V). (Output block: Current consumed by the circuit connected to VM +
Current consumed by switching output steps)
Power consumption is calculated as follows;
P (IM3) = 24 (V) × 0.005 (A) ...................................................................................................... (3)
= 0.12 (W)
3.
Power consumption
Total power consumption P is calculated from the values of formula (2) and (3).
P = P (out) + P (IM3) = 1.32(W)
Moreover the power consumption of one axis in STANDBY is as follows.
P (in STANDBY) = 24 (V) × 0.002 (A) = 0.048 (W)
For the heat design of the board, evaluate enough, and configure the appropriate margin.
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Sequence According to Drive Mode
CLK
Full step resolution
IOUTA
IOUTB
MO
Half step resolution
IOUTA
IOUTB
MO
Quarter step resolution
IOUTA
IOUTB
MO
The MO output shown in the timing chart is when the MO pin is pulled-up.
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Electrical Angle and Initialize Position of Step Resolution Mode
Full step resolution mode
100%
Initialize position
CW
Current of B ch [ %]
MO output: Low
-100%
100%
0%
CCW
-100%
Current of A ch [%]
Half step resolution mode
100%
Initialize position
Current of B ch [ %]
CW
MO output: Low
-100%
100%
0%
CCW
-100%
Current of A ch [%]
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Quarter step resolution mode
Step3 Step2 Step1 Step0 Step1 Step2 Step3
100%
Current of B ch [ %]
71%
CW
Step2
Step1
-71%
-100%
MO output: Low
Step3
38%
-38%0%
Initialize position
38%
71% 100%
-38%
Step0
Step1
-71%
-100% CCW
Step2
Step3
Current of A ch [%]
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Example of Application Circuit (Chopping Frequency: 70 kHz)
The values shown in the following figure are recommended values. For input conditions, see the Operating
Ranges.
OUT_B2+
OUT_B1+
0.51Ω
1
1
1
VREF_A
GND
1
1
OSCM
GND
1
1
CW/CCW
OUT_A2-
1
1
MO_OUT
OUT_A1-
1
1
D_MODE1
GND
1
1
D_MODE2
5V
5V
0V
0V
1
1
1
0.51Ω
1
M
OUT_A2+
OUT_B2-
OUT_A1+
VREF_B
RS_A2
1
RS_A1
1
GND
OUT_B1-
RESET
0V
5V
RS_B2
VCC
0V
GND
GND
ENABLE
5V
1
1
CLK-IN
0.1 μF
270pF 5.1kΩ
5V
5V
0V
1
RS_B1
1
VM
1
0.1 μF
100μF
0.1μF
24V
5V
0V
Note: It is recommended that a bypass capacitor is added if necessary.
The example of an applied circuit is for reference, and enough evaluation should be done before the mass-production
design. Moreover, it is not the one to permit the use of the industrial property.
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Package Dimensions
P-WQFN36-0606-0.50-002
Unit:mm
.
Weight: 0.14 g (typ.)
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Note on Contents
(1) Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
(2) Timing Charts
Timing charts may be simplified for explanatory purposes..
(3) Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
(4) Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion
(2)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
(3)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over-current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead
smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as Fast-blow fuse capacity, fusing time and insertion circuit location, are
required.
(4)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke
or ignition.
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(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback capacitor, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, over-current or IC failure can cause smoke or ignition. (The over-current can cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection type IC that inputs output DC voltage to a speaker directly.
Points to Remember on Handling of ICs
(1) Over-current Protection Circuit
Over-current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over-current protection circuits operate against the over-current, clear the
over-current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the over-current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over-current continues to flow for a
long time after operation, the IC may generate heat resulting in breakdown.
(2)
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(4)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in
this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design
or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications;
(b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs,
algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs
and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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