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TC62D749CFG,C,EL,B

TC62D749CFG,C,EL,B

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

    SOP24

  • 描述:

    LED 驱动器 IC 16 输出 线性 移位寄存器 调光 90mA

  • 数据手册
  • 价格&库存
TC62D749CFG,C,EL,B 数据手册
TC62D749CFG TOSHIBA CDMOS Integrated Circuit Silicon Monolithic TC62D749CFG 16-Output Constant Current LED Driver (Output switching high-speed version) The TC62D749CFG is a constant-current driver for LED and LED display lighting applications. The output current from each of the 16 outputs is programmable via a single external resistor. The TC62D749CFG contains a 16-channel shift register, a 16-channel latch, a 16-channel AND gate and a 16-channel constant-current output. Fabricated with a CMOS process, the TC62D749CFG allows high-speed data transfer. It operates with a 3.3- or 5-V power supply. SSOP24-P-300-1.00B Weight: 0.29 g (Typ.) Features • Supply voltages • 16-output built-in : VDD = 3.0 V to 5.5 V • Output current setup range • Constant current output accuracy (@ REXT = 1.2 kΩ, VOUT = 1.0 V, VDD = 3.3 V, 5.0 V) : IOUT = 1.5 to 90 mA : S rank;between outputs ± 1.5 % (max) : S rank;between devices: ± 1.5 % (max) : N rank;between outputs ± 2.5 % (max) : N rank;between devices: ± 2.5 % (max) : VOUT = 17 V (max) • Output voltage • High-speed output switching : twOE = 25 ns (min), tor = 10ns (typ.), tof = 10ns (typ.) • I/O interface : CMOS interfaces (Schmitt trigger input) • Data transfer frequency • Operation temperature range There is TC62D748 as an output switching standard-speed version of this product. : fSCK = 25 MHz (max) : Topr = −40 to 85 °C • Power-on-reset function built-in. (When the power supply is turned on, internal data is reset) • Package : SSOP24-P-300-1.00B For detailed part naming conventions, contact your local Toshiba sales representative or distributor. When the LED driver of high-speed output switching is used, back EMF may occur at the time of output OFF, and output terminal voltage may rise. Please be careful. It is necessary to reduce inductance to prevent the back EMF. It is possible to reduce inductance of a substrate by making the power supply for LED wiring shorter and wider designing the layout pattern. © 2014 TOSHIBA Corporation 1 2014-10-01 TC62D749CFG Block Diagram OUT0 OUT1 OUT15 VDD OUT0 OUT1 OUT15 B.G Constant current outputs POR GND VDD REXT OE SLAT SIN G D0 Q0 Q1 Q15 16-bit D-latch D0 D1 D15 R Q0 Q1 Q15 16-bit shift register D15 R SOUT SCK 2 2014-10-01 TC62D749CFG Pin Assignment (top view) GND VDD SIN REXT SCK SOUT SLAT OE OUT0 OUT15 OUT1 OUT14 OUT2 OUT13 OUT3 OUT12 OUT4 OUT11 OUT5 OUT10 OUT6 OUT9 OUT7 OUT8 Short circuiting an output pin to a power supply pin (Power-supply voltage VDD and LED anode power supply), or short-circuiting the REXT pin to the GND pin will likely exceed the absolute maximum ratings, which in turn may result in smoldering and/or permanent damage. Please keep this in mind when determining the wiring layout for the power supply and GND pins. Pin Functions Pin No Pin Name I/O Function 1 GND ― 2 SIN I Serial data input terminal 3 SCK I Serial data transfer clock input terminal 4 SLAT I Latch signal input pin. 5 OUT0 O Constant-current output terminal 6 OUT1 O Constant-current output terminal 7 OUT2 O Constant-current output terminal 8 OUT3 O Constant-current output terminal 9 OUT4 O Constant-current output terminal 10 OUT5 O Constant-current output terminal 11 OUT6 O Constant-current output terminal 12 OUT7 O Constant-current output terminal 13 OUT8 O Constant-current output terminal 14 OUT9 O Constant-current output terminal 15 OUT10 O Constant-current output terminal 16 OUT11 O Constant-current output terminal 17 OUT12 O Constant-current output terminal 18 OUT13 O Constant-current output terminal 19 OUT14 O Constant-current output terminal 20 OUT15 O 21 OE I 22 SOUT O 23 REXT ― 24 VDD ― Constant-current output terminal An output current enable signal input terminal In "H" level input, outputs are turned off compulsorily. In "L" level input, outputs are ON/OFF controlled according to serial data. Serial data output terminal. An external resistance for an output current setup is connected between this terminal and ground. Power supply terminal GND terminal 3 2014-10-01 TC62D749CFG I/O Equivalent Circuits 1. SCK, SIN 2. OE VDD VDD (SCK) (SIN) OE GND GND 3. SLAT 4. SOUT VDD VDD SOUT SLAT GND GND 5. OUT0 to OUT15 OUT0 to OUT15 GND 4 2014-10-01 TC62D749CFG Truth Table SCK SLAT OE SIN OUT0 … OUT7 … OUT15 (Note1) SOUT H L Dn Dn … Dn − 7 … Dn − 15 Dn − 15 L L Dn + 1 No Change Dn − 14 H L Dn + 2 Dn + 2 … Dn − 5 … Dn − 13 Dn − 13 − (Note2) L Dn + 3 Dn + 2 … Dn − 5 … Dn − 13 Dn − 13 − (Note2) H Dn + 3 OFF Dn − 13 Note1: When OUT0 to OUT15 output pins are set to "H" the respective output will be ON and when set to "L" the respective output will be OFF. Note2: “-“ is irrelevant to the truth table. Timing Diagram n=0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 H SCK L H SIN L H SLAT L H OE L ON OUT0 OFF ON OUT1 OFF ON OUT2 OFF ON OUT15 OFF H SOUT L ・The latch circuit is a leveled-latch circuit. Please exercise precaution as it is not triggered-latch circuit. ・Keep the SLAT pin is set to “L” to enable the latch circuit to hold data. In addition, when the SLAT pin is set to “H” the latch circuit does not hold data. The data will instead pass onto output. When the OE pin is set to “L” the OUT0 to OUT15 output pins will go ON and OFF in response to the data. In addition, when the OE pin is set to “H” all the output pins will be forced OFF regardless of the data. ・This product can use 3.3V and 5.0V power supply, but power supply and input (SCK/SIN/ SLAT / OE ) must use same voltage. 5 2014-10-01 TC62D749CFG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating (Note1) Unit S u p p l y v o l t a g e VDD −0.3 to 6.0 V O u t p u t c u r r e n t IOUT 95 mA VIN −0.3 to VDD + 0.3 (Note2) V VOUT −0.3 to 17 V L o g i c i n p u t v o l t a g e O u t p u t v o l t a g e Operating temperature Topr −40 to 85 °C t e m p e r a t u r e Tstg −55 to 150 °C Rth(j-a) 94 (Note3) °C/W PD 1.32 (Note3, 4) W St o r a g e T h e r m a l P o w e r r e s i s t a n c e d i s s i p a t i o n Note1: Voltage is ground referenced. Note2: Do not exceed 6.0V. Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming) Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C). Operating Conditions DC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics Symbol Test Conditions Min Typ. Max Unit v o l t a g e VDD ― 3.0 ― 5.5 V H i g h l e v e l l o g i c i n p u t v o l ta g e VIH Test terminal are SIN,SCK, SLAT , OE 0.7 × VDD ― VDD V Low level logic input voltage VIL Test terminal are SIN,SCK, SLAT , OE GND ― 0.3 × VDD V High level SOUT output current IOH ― ― ― −1 mA S u p p l y Low level SOUT output current Constant current output ― IOL IOUT Test terminal is OUTn ― ― 1 mA 1.5 ― 90 mA AC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit S e ri a l d a ta t ra n s f e r f r e q u e n c y fSCK 6 ― ― ― 25 MHz tHOLD1 6 ― 5 ― ― ns tHOLD2 6 ― 5 ― ― ns tSETUP1 6 ― 5 ― ― ns tSETUP2 6 ― 5 ― ― ns Serial Serial data data Hold Setup time time Maximum clock rise time tr 6 (Note1) ― ― 500 ns Maximum clock tf 6 (Note1) ― ― 500 ns fall time Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind when designing your application. 6 2014-10-01 TC62D749CFG Electrical Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Symbol Test Circuits VOH 1 L o w l e v e l S O UT out put vol tage VOL High level logic input current Characteristics Min Typ. Max Unit IOH = −1 mA VDD − 0.4 ― ― V 1 IOL = +1 mA ― ― 0.4 V IIH 2 VIN = VDD, OE , SIN, SCK ― ― 1 μA Low level logic input current IIL 3 VIN = GND, SLAT , SIN, SCK ― ― −1 μA Power current IDD 4 REXT = 1.2 kΩ, All output on ― ― 8.0 mA c u r r e n t IOUT 5 VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― 14.4 ― mA Constant current error(Ch to Ch) ( S r a n k ) ∆IOUT(Ch) 5 VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±1.5 % Constant current error(IC to IC) ( S r a n k ) ∆IOUT(IC) 5 VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±1.5 % Constant current error(Ch to Ch) ( N r a n k ) ∆IOUT(Ch) 5 VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±2.5 % Constant current error(IC to IC) ( N r a n k ) ∆IOUT(IC) 5 VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±2.5 % IOK 5 VDD = 3.3 V, VOUT= 17 V, REXT = 1.2 kΩ ― ― 0.5 μA Constant current output power supply v o l t a g e r e g u l a t i o n %VDD 5 VDD = 3.0 to 3.6 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±5 %/V Constant current output output voltage r e g u l a t i o n %VOUT 5 VDD = 3.3 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on ― ±0.1 ±0.5 %/V R (Up) 3 OE 400 500 600 kΩ R (Down) 2 SLAT 400 500 600 kΩ H i g S O UT h l e v e l out put vol tage supply O u t p u t Output OFF P u l l - u p P u l l - d o w n leak current r e s i s t o r r e s i s t o r Test Conditions 7 2014-10-01 TC62D749CFG Electrical Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Symbol Test Circuits VOH 1 L o w l e v e l S O UT out put vol tage VOL High level logic input current Characteristics Min Typ. Max Unit IOH = −1 mA VDD − 0.4 ― ― V 1 IOL = +1 mA ― ― 0.4 V IIH 2 VIN = VDD, OE , SIN, SCK ― ― 1 μA Low level logic input current IIL 3 VIN = GND, SLAT , SIN, SCK ― ― −1 μA Power IDD 4 REXT = 1.2 kΩ, All output on ― ― 8.0 mA IOUT 5 VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― 14.4 ― mA Constant current error(Ch to Ch) ( S r a n k ) ∆IOUT(Ch) 5 VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±1.5 % Constant current error(IC to IC) ( S r a n k ) ∆IOUT(IC) 5 VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±1.5 % Constant current error(Ch to Ch) ( N r a n k ) ∆IOUT(Ch) 5 VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±2.5 % Constant current error(IC to IC) ( N r a n k ) ∆IOUT(IC) 5 VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±2.5 % IOK 5 VOUT = 17 V, REXT = 1.2 kΩ ― ― 0.5 μA Constant current output power supply v o l t a g e r e g u l a t i o n %VDD 5 VDD = 4.5 to 5.5 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on ― ±1 ±5 %/V Constant current output output voltage r e g u l a t i o n %VOUT 5 VDD = 5.0 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on ― ±0.1 ±0.5 %/V R (Up) 3 OE 400 500 600 kΩ R (Down) 2 SLAT 400 500 600 kΩ H i g S O UT h l e v e l out put vol tage supply O u t p u t Output OFF P u l l - u p P u l l - d o w n current c u r r e n t leak current r e s i s t o r r e s i s t o r Test Conditions 8 2014-10-01 TC62D749CFG Switching Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Symbol Test Circuits SCK- OUT0 tpLH1 6 SLAT - OUT0 tpLH2 OE - OUT0 Min Typ. Max Unit SLAT = “H”, OE = “L” ― 50 65 ns 6 OE = “L” ― 50 65 ns tpLH3 6 SLAT = “H” ― 50 65 ns SCK-SOUT tpLH 6 CL=10.5 pF 10 20 35 ns SCK- OUT0 tpHL1 6 SLAT = “H”, OE = “L” ― 30 40 ns SLAT - OUT0 tpHL2 6 OE = “L” ― 30 40 ns OE - OUT0 tpHL3 6 SLAT = “H” ― 30 40 ns SCK-SOUT tpHL 6 CL=10.5 pF 10 20 35 ns Characteristics Propagation delay t i m e Test Conditions O u t p u t r i s e t i m e tor 6 10 to 90% of voltage waveform ― 10 20 ns O u t p u t f a l l t i m e tof 6 90 to 10% of voltage waveform ― 10 20 ns p u l s e w i d t h twOE 6 OE = “H” or “L” 25 ― ― ns E n a b l e C l o c k p u l s e w i d t h twSCK 6 SCK = “H” or “L” 20 ― ― ns L a t c h p u l s e w i d t h twSLAT 6 SLAT = “H” 20 ― ― ns Switching Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Symbol Test Circuits SCK- OUT0 tpLH1 6 SLAT - OUT0 tpLH2 6 Characteristics Propagation delay t i m e Test Conditions Min Typ. Max Unit SLAT = “H”, OE = “L” ― 50 65 ns OE = “L” ― 50 65 ns OE - OUT0 tpLH3 6 SLAT = “H” ― 50 65 ns SCK-SOUT tpLH 6 CL=10.5 pF 10 20 35 ns SCK- OUT0 tpHL1 6 SLAT = “H”, OE = “L” ― 30 40 ns SLAT - OUT0 tpHL2 6 OE = “L” ― 30 40 ns OE - OUT0 tpHL3 6 SLAT = “H” ― 30 40 ns SCK-SOUT tpHL 6 CL=10.5 pF 10 20 35 ns O u t p u t r i s e t i m e tor 6 10 to 90% of voltage waveform ― 10 20 ns O u t p u t f a l l t i m e tof 6 90 to 10% of voltage waveform ― 10 20 ns p u l s e w i d t h twOE 6 OE = “H” or “L” 25 ― ― ns E n a b l e C l o c k p u l s e w i d t h twSCK 6 SCK = “H” or “L” 20 ― ― ns L a t c h p u l s e w i d t h twSLAT 6 SLAT = “H” 20 ― ― ns 9 2014-10-01 TC62D749CFG Test Circuits Test Circuit1: High level SOUT output voltage / Low level SOUT output voltage SCK SIN F.G VDD OUT0 SLAT OUT7 OE OUT15 GND SOUT CL = 10.5 pF IO = -1mA to 1mA REXT V VDD = 3.3 V, 5.0 V VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) Test Circuit2: High level logic input current / Pull-down resistor VIN = VDD A A A SCK SIN VDD OUT0 SLAT A OUT7 OE OUT15 SOUT VDD = 3.3 V, 5.0 V GND CL = 10.5 pF REXT Test Circuit3: Low level logic input current / Pull-up resistor A A VDD OUT0 SLAT OUT7 OE OUT15 REXT GND SOUT 10 VDD = 3.3 V, 5.0 V A SCK SIN CL = 10.5 pF A 2014-10-01 TC62D749CFG Test Circuit4: Power supply current F.G SCK SIN VDD OUT0 SLAT OUT7 OE OUT15 A SOUT VOUT = 1.0 V VDD = 3.3 V, 5.0 V GND REXT = 1.2kΩ REXT CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) Test Circuit5: Constant current output / Output OFF leak current / Constant current error Test Circuit5: Constant current output power supply voltage regulation Constant current output output voltage regulation VDD OUT0 A OUT7 A OUT15 A OE GND REXT = 1.2kΩ REXT SOUT CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) VDD = 3.0~3.6 V, 4.5~5.5 V SLAT VOUT = 1.0~3.0 V, 17 V F.G SCK SIN Test Circuit6: Switching Characteristics RL = 300 Ω VDD OUT0 CL SLAT RL OUT7 OE CL GND SOUT CL = 10.5 pF REXT REXT = 1.2kΩ VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) 11 RL CL = 10.5 pF VDD = 3.3 V, 5.0 V OUT15 VLED = 5.32 V F.G SCK SIN 2014-10-01 TC62D749CFG Timing Waveforms 1. SCK, SIN, SOUT twSCK 90% SCK 50% 50% tSETUP1 SIN 50% twSCK 50% 90% 10% 10% tr tf 50% tHOLD1 SOUT 50% tpLH/tpHL 2. SCK, SIN, SLAT , OE , OUT0 SCK 50% 50% SIN tHOLD2 SLAT tSETUP2 50% 50% twSLAT twOE 50% OE 50% 50% OUT0 tpHL1/tpLH1 tpHL2/tpLH2 3. OE , OUT0 ~ OUT15 twOE 50% 50% OE tpLH3 tpHL3 OFF 90% 50% 50% 90% OUT0 ~ OUT15 10% 10% tof ON tor 12 2014-10-01 TC62D749CFG Power on reset (POR) The TC62D749CFG provides a power-on reset to reset all internal data in order to prevent malfunctions. The POR circuitry works properly only when VDD rises from 0 V. To re-activate the POR circuitry, VDD must be brought to less than 0.1 V. Internal data is guaranteed to be retained after VDD exceeds 3.0 V. VDD waveform VDD=3.0V VDD voltage for guaranteed data VDD=2.8 V VDD voltage for end of reset VDD=0.1 V End of POR VDD=0 V POR working range Beyond POR working range 13 POR working range 2014-10-01 TC62D749CFG Reference data The above data is for reference only, not guaranteed. Careful evaluation is required prior to creating a production design. Output Current (IOUT) – Output current setting resistance (REXT) IOUT - REXT 90 80 Theoretical formula IOUT (A) = (1.04(V) ÷ REXT (Ω)) × 16.6 70 I OUT (mA) 60 50 40 30 20 10 VOUT=1.0V Ta=25°C 0 0 1000 2000 3000 4000 5000 REXT (Ω) 14 2014-10-01 TC62D749CFG Reference data The above data is for reference only, not guaranteed. Careful evaluation is required prior to creating a production design. Output current (IOUT) – Output voltage (VOUT) IOUT - VOUT VDD =3.3V,Ta=25℃,1chON 100 90 80 IOUT (mA) 70 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 2 2.5 3 2 2.5 3 IOUT - VOUT VDD=5.0V,Ta=25℃,1chON 100 90 80 IOUT (mA) 70 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 15 2014-10-01 TC62D749CFG Application Circuit: General Composition for Static Lighting of LEDs In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 1.0 V. VLED OUT14 OUT15 SOUT OUT0 OUT1 SIN C.U. OE OE TC62D749CFG SLAT SLAT SCK SCK REXT GND OUT14 OUT15 OUT0 OUT1 SIN TC62D749CFG REXT 16 SOUT GND 2014-10-01 TC62D749CFG Application Circuit: General Composition for Dynamic Lighting of LEDs In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 1.0 V. VLED OUT0 OUT1 OUT14 SIN C.U. OE OUT15 SOUT OUT0 OE TC62D749CFG SLAT SLAT SCK SCK REXT GND OUT1 OUT14 SIN TC62D749CFG REXT 17 OUT15 SOUT GND 2014-10-01 TC62D749CFG Notes on design of ICs 1.Decoupling capacitors between power supply and GND It is recommended to place decoupling capacitors between power supply and GND as close to the IC as possible. 2.Output current setting resistors When the output current setting resistors (REXT) are shared among multiple ICs, production design should be evaluated carefully. 3.Board layout Ground noise generated by output switching might cause the IC to malfunction if the ground line exhibits inductance and resistance due to PC board traces and wire leads. Also, the inductance between the IC output pins and the LED cathode pins might cause large surge voltage, damaging LEDs and the IC outputs. To avoid this situation, PC board traces and wire leads should be carefully laid out. 4.Consult the latest technical information for mass production. 18 2014-10-01 TC62D749CFG Package Dimensions Weight: 0.29 g (typ.) 19 2014-10-01 TC62D749CFG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 20 2014-10-01 TC62D749CFG IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 21 2014-10-01 TC62D749CFG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 22 2014-10-01
TC62D749CFG,C,EL,B 价格&库存

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