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TC74AC32FN

TC74AC32FN

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

  • 描述:

    TC74AC32FN - CMOS Digital Integrated Circuit Silicon Monolithic Quad 2-Input OR Gate - Toshiba Semic...

  • 详情介绍
  • 数据手册
  • 价格&库存
TC74AC32FN 数据手册
TC74AC32P/F/FN/FT TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74AC32P,TC74AC32F,TC74AC32FN,TC74AC32FT Quad 2-Input OR Gate The TC74AC32 is an advanced high speed CMOS 2-INPUT OR GATE fabricated with silicon gate and double-layer metal wiring C2MOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation. The internal circuit is composed of 2 stages including buffer output, which provide high noise immunity and stable output. All inputs are equipped with protection circuits against static discharge or transient excess voltage. Note: xxxFN (JEDEC SOP) is not available in Japan. TC74AC32P Features • • • • High speed: tpd = 4.1 ns (typ.) at VCC = 5 V Low power dissipation: ICC = 4 μA (max) at Ta = 25°C High noise immunity: VNIH = VNIL = 28% VCC (min) Symmetrical output impedance: |IOH| = IOL = 24 mA (min) Capability of driving 50 Ω transmission lines. ∼ Balanced propagation delays: tpLH − tpHL Wide operating voltage range: VCC (opr) = 2 to 5.5 V Pin and function compatible with 74F32 TC74AC32F • • • TC74AC32FN TC74AC32FT Weight DIP14-P-300-2.54 SOP14-P-300-1.27A SOL14-P-150-1.27 TSSOP14-P-0044-0.65A : 0.96 g (typ.) : 0.18 g (typ.) : 0.12 g (typ.) : 0.06 g (typ.) 1 2007-10-01 TC74AC32P/F/FN/FT Pin Assignment IEC Logic Symbol 1A 1B 2A 2B 3A 3B 4A 4B (1) (2) (4) (5) (9) (10) (12) (13) >1 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 (top view) 14 13 12 11 10 9 8 VCC 4B 4A 4Y 3B 3A 3Y (3) (6) (8) (11) 1Y 2Y 3Y 4Y Truth Table A H L H L B H H L L Y H H H L Absolute Maximum Ratings (Note 1) Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating −0.5 to 7.0 −0.5 to VCC + 0.5 −0.5 to VCC + 0.5 ±20 ±50 ±50 ±100 500 (DIP) (Note 2)/180 (SOP/TSSOP) −65 to 150 Unit V V V mA mA mA mA mW °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C should be applied up to 300 mW. 2 2007-10-01 TC74AC32P/F/FN/FT Operating Ranges (Note) Characteristics Supply voltage Input voltage Output voltage Operating temperature Input rise and fall time Symbol VCC VIN VOUT Topr dt/dV Rating 2.0 to 5.5 0 to VCC 0 to VCC −40 to 85 0 to 100 (VCC = 3.3 ± 0.3 V) 0 to 20 (VCC = 5 ± 0.5 V) Unit V V V °C ns/V Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Electrical Characteristics DC Characteristics Ta = 25°C Characteristics Symbol Test Condition VCC (V) 2.0 High-level input voltage VIH ― 3.0 5.5 2.0 Low-level input voltage VIL ― 3.0 5.5 2.0 IOH = −50 μA High-level output voltage VOH VIN = VIH or IOH = −4 mA VIL IOH = −24 mA IOH = −75 mA (Note) 3.0 4.5 3.0 4.5 5.5 2.0 IOL = 50 μA Low-level output voltage VOL VIN = VIL 3.0 4.5 IOL = 12 mA IOL = 24 mA IOL = 75 mA Input leakage current Quiescent supply current IIN ICC VIN = VCC or GND VIN = VCC or GND (Note) 3.0 4.5 5.5 5.5 5.5 Min 1.50 2.10 3.85 ― ― ― 1.9 2.9 4.4 2.58 3.94 ― ― ― ― ― ― ― ― ― Typ. ― ― ― ― ― ― 2.0 3.0 4.5 ― ― ― 0.0 0.0 0.0 ― ― ― ― ― Max ― ― ― 0.50 0.90 1.65 ― ― ― ― ― ― 0.1 0.1 0.1 0.36 0.36 ― ±0.1 4.0 Ta = −40 to 85°C Min 1.50 2.10 3.85 ― ― ― 1.9 2.9 4.4 2.48 3.80 3.85 ― ― ― ― ― ― ― ― Max ― ― ― 0.50 0.90 1.65 ― ― ― ― ― ― 0.1 0.1 0.1 0.44 0.44 1.65 ±1.0 40.0 μA μA V V V V Unit Note: This spec indicates the capability of driving 50 Ω transmission lines. One output should be tested at a time for a 10 ms maximum duration. 3 2007-10-01 TC74AC32P/F/FN/FT AC Characteristics (CL = 50 pF, RL = 500 Ω, input: tr = tf = 3 ns) Characteristics Symbol tpLH tpHL CIN CPD Test Condition VCC (V) Propagation delay time Input capacitance Power dissipation capacitance ― ― (Note) 3.3 ± 0.3 5.0 ± 0.5 Min ― ― ― ― Ta = 25°C Typ. 6.1 5.2 5 64 Max 10.3 7.4 10 ― Ta = −40 to 85°C Min 1.0 1.0 ― ― Max 11.9 8.5 10 ― ns pF pF Unit Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD·VCC·fIN + ICC/4 (per gate) 4 2007-10-01 TC74AC32P/F/FN/FT Package Dimensions Weight: 0.96 g (typ.) 5 2007-10-01 TC74AC32P/F/FN/FT Package Dimensions Weight: 0.18 g (typ.) 6 2007-10-01 TC74AC32P/F/FN/FT Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.12 g (typ.) 7 2007-10-01 TC74AC32P/F/FN/FT Package Dimensions Weight: 0.06 g (typ.) 8 2007-10-01 TC74AC32P/F/FN/FT RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 9 2007-10-01
TC74AC32FN
物料型号: - TC74AC32P:DIP14封装 - TC74AC32F:SOP14封装 - TC74AC32FN:SOL14封装 - TC74AC32FT:TSSOP14封装

器件简介: TC74AC32是一款高速CMOS 2输入或门集成电路,采用硅门和双层金属C2MOS技术制造。它实现了类似于双极肖特基TTL的高速操作,同时保持了CMOS的低功耗特性。内部电路包括缓冲输出的两个阶段,提供高噪声免疫和稳定输出。所有输入都配备了防静电放电或瞬态过电压的保护电路。

引脚分配: 文档中提供了IEC逻辑符号和真值表,展示了或门的逻辑关系。

参数特性: - 高速:典型值4.1ns(在5V供电时) - 低功耗:最大4μA(在25°C时) - 高噪声免疫:VNIH=VNIL=28%VCC(最小值) - 对称的输出阻抗:|Ioh|=Iol=24mA(最小值) - 平衡的传播延迟:tpLH = tpHI - 宽工作电压范围:2至5.5V - 引脚和功能与74F32兼容

功能详解: TC74AC32系列集成电路包含四个2输入或门,具有高速、低功耗、高噪声免疫和对称输出阻抗等特点,能够驱动50欧姆传输线。

应用信息: TC74AC32系列产品适用于一般电子应用,如计算机、个人设备、办公设备、测量设备、工业机器人、家用电器等。这些产品不适用于需要极高质量和/或可靠性的设备,或其故障可能导致人员伤亡的设备(例如原子能控制仪器、飞机或宇宙飞船仪器、交通仪器、交通信号仪器、燃烧控制仪器、医疗仪器、各种安全设备等)。

封装信息: - DIP14:P-300-2.54封装,典型重量0.96g - SOP14:P-300-1.27A封装,典型重量0.18g - SOL14:P-150-1.27封装,典型重量0.12g - TSSOP14:P-0044-0.65A封装,典型重量0.06g
TC74AC32FN 价格&库存

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