TC74HC175AFN

TC74HC175AP/AF/AFN TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC175AP,TC74HC175AF,TC74HC175AFN Quad D-Type Flip Flop with Clear The TC74HC175A is a high speed CMOS D-TYPE FLIP FLOP fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. Information signals applied to D inputs are transferred to the Q and Q outputs on the positive going edge of the clock pulse. When the CLR input is held low, the Q outputs are at the low logic level and the Q outputs are at the high logic level independent of the other inputs. All inputs are equipped with protection circuits against static discharge or transient excess voltage. Note: xxxFN (JEDEC SOP) is not available in Japan. TC74HC175AP TC74HC175AF Features • • • • • • • High speed: fmax = 63 MHz (typ.) at VCC = 5 V Low power dissipation: ICC = 4 μA (max) at Ta = 25°C High noise immunity: VNIH = VNIL = 28% VCC (min) Symmetrical output impedance: |IOH| = IOL = 4 mA (min) Balanced propagation delays: tpLH ∼ tpHL − Wide operating voltage range: VCC (opr) = 2 to 6 V Pin and function compatible with 74LS175 TC74HC175AFN Pin Assignment Weight DIP16-P-300-2.54A SOP16-P-300-1.27A SOL16-P-150-1.27 : 1.00 g (typ.) : 0.18 g (typ.) : 0.13 g (typ.) 1 2007-10-01 TC74HC175AP/AF/AFN IEC Logic Symbol Truth Table Inputs CLR Outputs CK X Q L L H Qn D X L H X Q H H L Function Clear ⎯ ⎯ L H H H Qn No Change X: Don’t care System Diagram 2 2007-10-01 TC74HC175AP/AF/AFN Absolute Maximum Ratings (Note 1) Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating −0.5 to 7 −0.5 to VCC + 0.5 −0.5 to VCC + 0.5 ±20 ±20 ±25 ±50 Unit V V V mA mA mA mA mW °C 500 (DIP) (Note 2)/180 (SOP) −65 to 150 Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. Operating Ranges (Note) Characteristics Supply voltage Input voltage Output voltage Operating temperature Symbol VCC VIN VOUT Topr Rating 2 to 6 0 to VCC 0 to VCC −40 to 85 Unit V V V °C 0 to 1000 (VCC = 2.0 V) Input rise and fall time tr, tf 0 to 500 (VCC = 4.5 V) 0 to 400 (VCC = 6.0 V) ns Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. 3 2007-10-01 TC74HC175AP/AF/AFN Electrical Characteristics DC Characteristics Characteristics Symbol Test Condition VCC (V) 2.0 High-level input voltage VIH ⎯ Ta = 25°C Min 1.50 3.15 4.20 ⎯ ⎯ ⎯ Ta = −40 to 85°C Max ⎯ ⎯ ⎯ Unit Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Min 1.50 3.15 4.20 ⎯ ⎯ ⎯ Max ⎯ ⎯ ⎯ 4.5 6.0 2.0 V 0.50 1.35 1.80 ⎯ ⎯ ⎯ ⎯ ⎯ 0.50 1.35 1.80 ⎯ ⎯ ⎯ ⎯ ⎯ Low-level input voltage VIL ⎯ 4.5 6.0 2.0 V 1.9 4.4 5.9 4.18 5.68 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 2.0 4.5 6.0 4.31 5.80 0.0 0.0 0.0 0.17 0.18 ⎯ ⎯ 1.9 4.4 5.9 4.13 5.63 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ IOH = −20 μA High-level output voltage VOH VIN = VIH or VIL IOH = −4 mA IOH = −5.2 mA IOL = 20 μA Low-level output voltage VOL VIN = VIH or VIL IOL = 4 mA IOL = 5.2 mA Input leakage current Quiescent supply current IIN ICC VIN = VCC or GND VIN = VCC or GND 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V 0.1 0.1 0.1 0.26 0.26 ±0.1 0.1 0.1 0.1 0.33 0.33 ±1.0 μA μA V 4.0 40.0 4 2007-10-01 TC74HC175AP/AF/AFN Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Test Condition VCC (V) Minimum pulse width (CK) tW (L) tW (H) 2.0 ⎯ Ta = 25°C Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Limit 95 19 16 Unit Limit 75 15 13 4.5 6.0 ns Minimum pulse width ( CLR ) 2.0 tW (L) ⎯ 75 15 13 75 15 13 0 0 0 75 15 13 6 31 36 95 19 16 95 19 16 0 0 0 95 19 16 5 25 29 MHz ns ns ns ns 4.5 6.0 2.0 Minimum set-up time ts ⎯ 4.5 6.0 2.0 Minimum hold time th ⎯ 4.5 6.0 2.0 Minimum removal time trem ⎯ 4.5 6.0 2.0 Clock frequency f ⎯ 4.5 6.0 AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns) Characteristics Output transition time Propagation delay time (CK-Q, Q ) Propagation delay time ( CLR -Q, Q ) Maximum clock frequency Symbol tTLH tTHL tpLH tpHL tpLH tpHL fmax Test Condition ⎯ Min ⎯ Typ. 4 Max 8 Unit ns ⎯ ⎯ 16 24 ns ⎯ ⎯ ⎯ 13 63 21 ⎯ ns MHz 36 5 2007-10-01 TC74HC175AP/AF/AFN AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns) Characteristics Symbol Test Condition VCC (V) tTLH tTHL tpLH tpHL 2.0 ⎯ Ta = 25°C Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Max 75 15 13 140 28 24 125 25 22 ⎯ ⎯ ⎯ Unit Typ. 30 8 7 70 19 16 50 16 12 14 53 63 5 53 Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 95 19 16 175 35 30 160 32 27 ⎯ ⎯ ⎯ Output transition time 4.5 6.0 2.0 ns Propagation delay time (CK-Q, Q ) ⎯ 4.5 6.0 2.0 ns Propagation delay time ( CLR -Q, Q ) tpLH tpHL ⎯ 4.5 6.0 2.0 ns 6 31 36 ⎯ ⎯ 5 25 29 ⎯ ⎯ Maximum clock frequency fmax ⎯ 4.5 6.0 MHz Input capacitance Power dissipation capacitance CIN CPD (Note) ⎯ ⎯ 10 ⎯ 10 ⎯ pF pF Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/4 (per F/F) And the total CPD when n pcs. of Flip Flop operate can be gained by the following equation: CPD (total) = 32 + 21･n 6 2007-10-01 TC74HC175AP/AF/AFN Package Dimensions Weight: 1.00 g (typ.) 7 2007-10-01 TC74HC175AP/AF/AFN Package Dimensions Weight: 0.18 g (typ.) 8 2007-10-01 TC74HC175AP/AF/AFN Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.13 g (typ.) 9 2007-10-01 TC74HC175AP/AF/AFN RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. 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Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 10 2007-10-01