TC74HC365,366AP/AF
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74HC365AP,TC74HC365AF,TC74HC366AP,TC74HC366AF
Hex Bus Buffer TC74HC365AP/AF TC74HC366AP/AF
Non-Inverted (3-state) Inverted (3-state)
TC74HC365AP, TC74HC366AP
The TC74HC365A and TC74HC366A are high speed CMOS 3-STATE BUFFERs fabricated with silicon gate C2MOS technology. They achieve the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. The TC74HC366A is an inverting type, while the TC74HC365A is non-inverting. All six buffers are controlled by the combination of two enable inputs ( G1 and G2 ); the outputs of these buffers are enabled only when both G1 and G2 inputs held low, and at the other combinations, these outputs are disabled to the high impedance state. All inputs are equipped with protection circuits against static discharge or transient excess voltage.
TC74HC365AF, TC74HC366AF
Features
• • • • • • • • High speed: tpd = 9 ns (typ.) at VCC = 5 V Low power dissipation: ICC = 4 μA (max) at Ta = 25°C High noise immunity: VNIH = VNIL = 28% VCC (min) Output drive capability: 15 LSTTL loads Symmetrical output impedance: |IOH| = IOL = 6 mA (min) ∼ Balanced propagation delays: tpLH − tpHL Wide operating voltage range: VCC (opr) = 2 to 6 V Pin and function compatible with 74LS365/366 Weight DIP16-P-300-2.54A SOP16-P-300-1.27A : 1.00 g (typ.) : 0.18 g (typ.)
Pin Assignment
TC74HC365A TC74HC366A
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TC74HC365,366AP/AF
IEC Logic Symbol
TC74HC365A TC74HC366A
Truth Table
Inputs Outputs An Yn (365A)
G1
L L H X
G2
L L X H
Yn (366A) H L Z Z
L H X X
L H Z Z
X: Don’t care Z: High impedance
Absolute Maximum Ratings (Note 1)
Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating
−0.5 to 7 −0.5 to VCC + 0.5 −0.5 to VCC + 0.5 ±20 ±20 ±35 ±75
Unit V V V mA mA mA mA mW °C
500 (DIP) (Note 2)/180 (SOP)
−65 to 150
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW.
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Operating Ranges (Note)
Characteristics Supply voltage Input voltage Output voltage Operating temperature Symbol VCC VIN VOUT Topr Rating 2 to 6 0 to VCC 0 to VCC
−40 to 85
Unit V V V °C
0 to 1000 (VCC = 2.0 V) Input rise and fall time tr, tf 0 to 500 (VCC = 4.5 V) 0 to 400 (VCC = 6.0 V) ns
Note:
The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND.
Electrical Characteristics
DC Characteristics
Test Condition Characteristics Symbol VCC (V) 2.0 High-level input voltage VIH
⎯
Ta = 25°C Min 1.50 3.15 4.20
⎯ ⎯ ⎯
Ta = −40 to 85°C Max
⎯ ⎯ ⎯
Unit
Typ.
⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Min 1.50 3.15 4.20
⎯ ⎯ ⎯
Max
⎯ ⎯ ⎯
4.5 6.0 2.0
V
0.50 1.35 1.80
⎯ ⎯ ⎯ ⎯ ⎯
0.50 1.35 1.80
⎯ ⎯ ⎯ ⎯ ⎯
Low-level input voltage
VIL
⎯
4.5 6.0 2.0
V
1.9 4.4 5.9 4.18 5.68
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
2.0 4.5 6.0 4.31 5.80 0.0 0.0 0.0 0.17 0.18
⎯ ⎯ ⎯
1.9 4.4 5.9 4.13 5.63
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
High-level output voltage
VOH
VIN = VIH or VIL
IOH = −20 μA IOH = −6 mA IOH = −7.8 mA IOL = 20 μA IOL = 6 mA IOL = 7.8 mA
4.5 6.0 4.5 6.0 2.0
V
0.1 0.1 0.1 0.26 0.26
±0.5 ±0.1
0.1 0.1 0.1 0.33 0.33
±5.0 ±1.0 μA μA μA
Low-level output voltage
VOL
VIN = VIH or VIL
4.5 6.0 4.5 6.0 6.0 6.0 6.0
V
3-state output off-state current Input leakage current Quiescent supply current
IOZ IIN ICC
VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND VIN = VCC or GND
4.0
40.0
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AC Characteristics (input: tr = tf = 6 ns)
Test Condition Characteristics Symbol CL (pF)
⎯
Ta = 25°C VCC (V) 2.0 50 4.5 6.0 2.0 50 4.5 6.0 2.0 Min
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Ta = −40 to 85°C Max 60 12 10 90 18 15 130 26 22 130 26 22 170 34 29 130 26 22 10
⎯ ⎯
Unit
Typ. 20 6 5 38 12 10 51 17 14 56 17 13 69 22 17 42 18 15 5 10 25
Min
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Max 75 15 13 115 23 20 165 33 28 165 33 28 215 44 37 165 33 28 10
⎯ ⎯
Output transition time
tTLH tTHL
ns
Propagation delay time
tpLH tpHL
⎯
ns
150
4.5 6.0 2.0
50 Output enable time tpZL tpZH RL = 1 kΩ 150
4.5 6.0 2.0 4.5 6.0
ns
Output disable time
tpLZ tpHZ CIN COUT CPD (Note)
2.0 RL = 1 kΩ
⎯ ⎯ ⎯
50
4.5 6.0
ns
Input capacitance Output capacitance Power dissipation capacitance
pF pF pF
Note:
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD・VCC・fIN + ICC/6 (per gate)
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Package Dimensions
Weight: 1.00 g (typ.)
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Package Dimensions
Weight: 0.18 g (typ.)
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RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
20070701-EN GENERAL
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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