TC74HC4511AP

TC74HC4511AP/AF TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC4511AP,TC74HC4511AF BCD-to-7 Segment Latch/Decoder/Driver The TC74HC4511A is a high speed CMOS BCD-TO-7 SEGMENT LATCH/DECODER/DRIVER fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. The segment output driver, which is of CMOS construction, has a large IOH capability which permits the device to drive cathode common LED directly. When lamp test (LT) is held low, all segment outputs will go high, and when the blanking input (BI) is held low and LT is held high, all segment outputs will go low. These functions are independent of other inputs and used to test the display. BI is used to pulse - modulate the brightness of the display. When error code (over 10) is applied to BCD inputs, all segment outputs will go to low (turn off). All inputs are equipped with protection circuits against static discharge or transient excess voltage. TC74HC4511AP TC74HC4511AF Features • • • • • • • High speed: tpd = 28 ns (typ.) at VCC = 5 V Low power dissipation: ICC = 4 μA (max) at Ta = 25°C High noise immunity: VNIH = VNIL = 28% VCC (min) Output drive capability: 10 LSTTL loads Symmetrical output impedance: |IOH| = 20 mA Wide operating voltage range: VCC (opr) = 2 to 6 V Pin and function compatible with TC4511B Weight DIP16-P-300-2.54A SOP16-P-300-1.27A : 1.00 g (typ.) : 0.18 g (typ.) Pin Assignment 1 2007-10-01 TC74HC4511AP/AF IEC Logic Symbol BCD / 7･SEG ［T］ V11 G10 C9 9D 1 2 4 8 a10,11 b10,11 c10,11 d10,11 e10,11 f10,11 g10,11 (13) (12) (11) (10) (9) (15) (14) LT BI LE A B C D (3) (4) (5) (7) (1) (2) (6) a b c d e f g [T]: Truth Table Display Mode Block Diagram 2 2007-10-01 TC74HC4511AP/AF Truth Table Inputs LE * * Outputs BI * LT L H H H H H H H H H H H H H H D * * C * * B * * A * * a H L H L H H L H L H H H L L b H L H H H H H L L H H H L L c H L H H L H H H H H H H L L d H L H L H H L H H L H L L L e H L H L H L L L H L H L L L f H L H L L L H H H L H H L L g H L L L H H H H H L H H L L Display Mode 8 Blank 0 1 2 3 4 5 6 7 8 9 Blank Blank L H H H H H H H H H H H H H L L L L L L L L L L L L H L L L L L L L L H H H H * L L L L H H H H L L L H * L L H H L L H H L L H * * L H L H L H L H L H * * * Hold the stage at the leading edge of LE *: Don’t care 3 2007-10-01 TC74HC4511AP/AF Logic Diagram 4 2007-10-01 TC74HC4511AP/AF Absolute Maximum Ratings (Note 1) Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating −0.5 to 7 −0.5 to VCC + 0.5 −0.5 to VCC + 0.5 ±20 ±20 +25 (sinc)/−35 (source) +150 (ICC)/−50 (IGND) Unit V V V mA mA mA mA mW °C 500 (DIP) (Note 2)/180 (SOP) −65 to 150 Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. Operating Ranges (Note) Characteristics Supply voltage Input voltage Output voltage Operating temperature Symbol VCC VIN VOUT Topr Rating 2 to 6 0 to VCC 0 to VCC −40 to 85 Unit V V V °C 0 to 1000 (VCC = 2.0 V) Input rise and fall time tr, tf 0 to 500 (VCC = 4.5 V) 0 to 400 (VCC = 6.0 V) ns Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. 5 2007-10-01 TC74HC4511AP/AF Electrical Characteristics DC Characteristics Test Condition Characteristics Symbol VCC (V) 2.0 High-level input voltage VIH ⎯ Ta = 25°C Min 1.50 3.15 4.20 ⎯ ⎯ ⎯ Ta = −40 to 85°C Max ⎯ ⎯ ⎯ Unit Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Min 1.50 3.15 4.20 ⎯ ⎯ ⎯ Max ⎯ ⎯ ⎯ 4.5 6.0 2.0 V 0.50 1.35 1.80 ⎯ ⎯ ⎯ ⎯ ⎯ 0.50 1.35 1.80 ⎯ ⎯ ⎯ ⎯ ⎯ Low-level input voltage VIL ⎯ 4.5 6.0 2.0 V 1.9 4.4 5.9 4.18 3.20 5.68 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 2.0 4.5 6.0 4.31 3.80 5.80 0.0 0.0 0.0 0.17 0.18 ⎯ ⎯ 1.9 4.4 5.9 4.13 2.90 5.63 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ IOH = −20 μA High-level output voltage VOH VIN = VIH or IOH = −6 mA VIL IOH = −20 mA IOH = −7.8 mA IOL = 20 μA IOL = 4 mA IOL = 5.2 mA Input leakage current Quiescent supply current IIN ICC VIN = VCC or GND VIN = VCC or GND 4.5 6.0 4.5 4.5 6.0 2.0 V 0.1 0.1 0.1 0.26 0.26 ±0.1 0.1 0.1 0.1 0.33 0.33 ±1.0 μA μA Low-level output voltage VOL VIN = VIH or VIL 4.5 6.0 4.5 6.0 6.0 6.0 V 4.0 40.0 Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Test Condition VCC (V) Minimum pulse width (LE) 2.0 tW (L) ⎯ Ta = 25°C Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Limit 95 19 16 95 19 16 0 0 0 Unit Limit 75 15 13 75 15 13 0 0 0 4.5 6.0 2.0 ns Minimum set-up time ts ⎯ 4.5 6.0 2.0 ns Minimum hold time th ⎯ 4.5 6.0 ns 6 2007-10-01 TC74HC4511AP/AF AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns) Characteristics Output transition time Output transition time Propagation delay time (BCD-segment) Propagation delay time ( BI -segment) Propagation delay time ( LT -segment) Propagation delay time (LE-segment) Symbol tTLH tTHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL Test Condition ⎯ ⎯ ⎯ Min ⎯ ⎯ ⎯ Typ. 4 4 28 Max 8 8 45 Unit ns ns ns ⎯ ⎯ 18 31 ns ⎯ ⎯ 12 21 ns ⎯ ⎯ 26 44 ns AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns) Test Condition Characteristics Symbol VCC (V) 2.0 Output transition time low to high tTLH ⎯ Ta = 25°C Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Max 60 12 11 75 15 13 255 51 43 175 35 30 120 24 20 240 48 41 10 ⎯ Unit Typ. 25 7 6 30 8 7 125 33 23 70 22 17 60 15 12 95 32 23 5 95 Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 75 15 13 95 19 16 320 64 54 220 44 37 150 30 26 300 60 51 10 ⎯ 4.5 6.0 2.0 ns Output transition time high to low tTHL ⎯ 4.5 6.0 ns Propagation delay time (BCD-segment) Propagation delay time ( BI -segment) Propagation delay time ( LT -segment) Propagation delay time (LE-segment) Input capacitance Power dissipation capacitance tpLH tpHL tpLH tpHL 2.0 ⎯ 4.5 6.0 2.0 ns ⎯ 4.5 6.0 2.0 ns tpLH tpHL ⎯ 4.5 6.0 2.0 ns tpLH tpHL CIN CPD (Note) ⎯ 4.5 6.0 ⎯ ⎯ ns pF pF Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC 7 2007-10-01 TC74HC4511AP/AF Application Circuit Static Display Circuit Recommended Resistance R Display TLR358T TLR362T TLR332T TLR342T TLG358T TLG362T TLG332T TLG342T Color Red Red Red Red Green Green Green Green Letter Hight 13.4 mm 14.2 7.6 10.9 13.4 mm 14.2 7.6 10.9 R 390 Ω 390 Ω 390 Ω 390 Ω 160 Ω 160 Ω 160 Ω 160 Ω 8 2007-10-01 TC74HC4511AP/AF Package Dimensions Weight: 1.00 g (typ.) 9 2007-10-01 TC74HC4511AP/AF Package Dimensions Weight: 0.18 g (typ.) 10 2007-10-01 TC74HC4511AP/AF RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 11 2007-10-01