TC74VCXH16646FT_07

TC74VCXH16646FT TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74VCXH16646FT Low-Voltage 16-Bit Bus Transceiver/Register with Bushold The TC74VCXH16646FT is a high-performance CMOS 16-bit bus transceiver/register. Designed for use in 1.8-V, 2.5-V or 3.3-V systems, it achieves high-speed operation while maintaining the CMOS low power dissipation. This device is bus transceiver with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the internal registers. The A, B data inputs include active bushold circuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. All inputs are equipped with protection circuits against static discharge. Weight: 0.25 g (typ.) Features (Note) • • • Low-voltage operation: VCC = 1.8 to 3.6 V Bushold on data inputs eliminating the need for external pull-up/pull-down resistors High-speed operation : tpd = 2.9 ns (max) (VCC = 3.0 to 3.6 V) : tpd = 3.5 ns (max) (VCC = 2.3 to 2.7 V) : tpd = 7.0 ns (max) (VCC = 1.8 V) • • 3.6-V tolerant control inputs Output current : IOH/IOL = ±24 mA (min) (VCC = 3.0 V) : IOH/IOL = ±18 mA (min) (VCC = 2.3 V) : IOH/IOL = ±6 mA (min) (VCC = 1.8 V) • • • Latch-up performance: −300 mA ESD performance: Machine model ≥ ±200 V Human body model ≥ ±2000 V Package: TSSOP Note: Do not apply a signal to any bus pins when it is in the output mode. Damage may result. 1 2007-10-19 TC74VCXH16646FT Pin Assignment (top view) IEC Logic Symbol 56 1 55 54 2 3 29 28 30 31 27 26 1DIR 1CAB 1SAB GND 1A1 1A2 VCC 1A3 1A4 1 2 3 4 5 6 7 8 9 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1OE 1CBA 1SBA GND 1B1 1B2 VCC 1B3 1B4 1B5 GND 1B6 1B7 1B8 2B1 2B2 2B3 GND 2B4 2B5 2B6 VCC 2B7 2B8 GND 2SBA 2CBA 1OE 1DIR 1CBA 1SBA 1CAB 1SAB G3 3EN1 (BA) 3EN2 (AB) C4 G5 C6 G7 G10 10EN8 (BA) 10EN9 (AB) C11 G12 C13 G14 >1 2OE 2DIR 2CBA 2SBA 2CAB 2SAB 1A5 10 GND 11 1A6 12 1A7 13 1A8 14 2A1 15 2A2 16 2A3 17 GND 18 2A4 19 2A5 20 2A6 21 VCC 22 2A7 23 2A8 24 GND 25 2SAB 26 2CAB 27 2DIR 28 1A1 5 5 5 7> 4D 1 1 2 52 1B1 1 6D 1 6 8 9 10 12 13 14 15 >1 7 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 51 49 48 47 45 44 43 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1 12 11D 42 8 13D 16 17 19 20 21 23 24 12 1 14 > 1 9 14 1 41 40 38 37 36 34 33 2B2 2B3 2B4 2B5 2B6 2B7 2B8 2A2 2A3 2A4 2A5 2A6 2A7 2A8 2OE 2 2007-10-19 TC74VCXH16646FT Truth Table Control Inputs Bus SAB X SBA X A Input Z X Input X* X* L X L H X* L H X* X* H X L X L H X L X* H X H Output X* X* X L L H X* L L X* X* X H X L L H Qn L X* X H H B Input Z X Output L H L H Qn L H Input L H L H X L H The data on the B Bus are displayed on the A Bus, and are stored into the B storage flip-flops on the rising edge of CBA. The data in the B storage flip-flops are displayed on the A Bus. The data on the B Bus are stored into the B storage flip-flops on the rising edge of CBA, and the stored data propagate directly onto the A Bus. The data on the B Bus are displayed on the A bus. The data on the A bus are displayed on the B Bus, and are stored into the A storage flip-flops on the rising edge of CAB. The data in the A storage flop-flops are displayed on the B Bus. The data on the A Bus are stored into the A storage flip-flops on the rising edge of CAB, and the stored data propagate directly onto the B Bus. The data on the A bus are displayed on the B bus. OE DIR CAB X* CBA X* Function The output functions of A and B Busses are disabled. Both A and B Busses are used as inputs to the internal flip-flops. Data on the Bus will be stored on the rising edge of the Clock. H X X X X: Don’t care Z: High impedance Qn: The data stored into the internal flip-flops by most recent low to high transition of the clock inputs. *: The clocks are not internally with either OE or DIR. Therefore, data on the A and/or B busses may be clocked into the storage flip-flops at any time. 3 2007-10-19 TC74VCXH16646FT System Diagram 1OE 56 1DIR 1 1A1 5 φA D CK Q φA φB φB Q D CK 52 1B1 1A8 1CAB 1SAB 14 2 3 φA Same as above block 43 55 φB 1B8 1CBA 1SBA 54 φA φB 2OE 29 2DIR 28 2A1 15 φA D CK Q φA φB φB Q D CK 42 2B1 2A8 2CAB 2SAB 24 27 26 φA Same as above block 33 30 φB 31 2B8 2CBA 2SBA φA φB 4 2007-10-19 TC74VCXH16646FT Timing Chart OE DIR SAB SBA CAB CBA A B A: Input B: Output A: Output B: Input A: Z B: Z : Don’t care Z: High impedance Absolute Maximum Ratings (Note 1) Characteristics Power supply voltage DC input voltage DC output voltage Input diode current Output diode current Output current Power dissipation DC VCC/ground current per supply pin Storage temperature (DIR, OE , CAB, CBA, SAB, SBA) (An, Bn) Symbol VCC Rating −0.5 to 4.6 −0.5 to 4.6 VIN −0.5 to VCC + 0.5 (Note 2) VOUT IIK IOK IOUT PD ICC/IGND Tstg −0.5 to VCC + 0.5 (Note 3) −50 ±50 ±50 400 ±100 −65 to 150 (Note 4) V mA mA mA mW mA °C V Unit V (An, Bn) Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: OFF state Note 3: High or low state. IOUT absolute maximum rating must be observed. Note 4: VOUT < GND, VOUT > VCC 5 2007-10-19 TC74VCXH16646FT Operating Ranges (Note 1) (Note 2) Characteristics Power supply voltage (DIR, OE , CAB, CBA, SAB, SBA) (An, Bn) (An, Bn) VOUT Symbol VCC Rating 1.8 to 3.6 1.2 to 3.6 (Note 3) −0.3 to 3.6 0 to VCC (Note 4) 0 to VCC (Note 5) ±24 Output current IOH/IOL ±18 ±6 Operating temperature Input rise and fall time Topr dt/dv −40 to 85 0 to 10 (Note 9) (Note 6) (Note 7) (Note 8) °C ns/V mA V Unit V Input voltage Output voltage VIN V Note 1: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Note 2: Floating or unused control inputs must be held high or low. Note 3: Data retention only Note 4: OFF state Note 5: High or low state Note 6: VCC = 3.0 to 3.6 V Note 7: VCC = 2.3 to 2.7 V Note 8: VCC = 1.8 V Note 9: VIN = 0.8 to 2.0 V, VCC = 3.0 V 6 2007-10-19 TC74VCXH16646FT Electrical Characteristics < DC Characteristics (Ta = −40 to 85°C, 2.7 V < VCC = 3.6 V) Characteristics H-level L-level Symbol VIH VIL Test Condition ⎯ ⎯ IOH = −100 μA H-level VOH VIN = VIH or VIL IOH = −12 mA IOH = −18 mA Output voltage IOH = −24 mA IOL = 100 μA L-level VOL VIN = VIH or VIL IOL = 12 mA IOL = 18 mA IOL = 24 mA Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current Increase in ICC per input IIN VIN = 0 to 3.6 V VIN = 0.8 V VIN = 2.0 V (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND VIH = VCC − 0.6 V VCC (V) 2.7 to 3.6 2.7 to 3.6 2.7 to 3.6 2.7 3.0 3.0 2.7 to 3.6 2.7 3.0 3.0 2.7 to 3.6 3.0 3.0 3.6 3.6 2.7 to 3.6 2.7 to 3.6 2.7 to 3.6 Min 2.0 ⎯ VCC − 0.2 2.2 2.4 2.2 ⎯ ⎯ ⎯ ⎯ ⎯ 75 −75 ⎯ ⎯ ⎯ ⎯ ⎯ Max ⎯ 0.8 ⎯ ⎯ ⎯ ⎯ 0.2 0.4 0.4 0.55 ±5.0 ⎯ ⎯ 450 −450 ±10.0 20.0 750 μA V Unit Input voltage V II (HOLD) μA II (OD) μA IOZ ICC ΔICC μA μA μA Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 7 2007-10-19 TC74VCXH16646FT < < DC Characteristics (Ta = −40 to 85°C, 2.3 V = VCC = 2.7 V) Characteristics H-level L-level Symbol VIH VIL Test Condition ⎯ ⎯ IOH = −100 μA H-level Output voltage VOH VIN = VIH or VIL IOH = −6 mA IOH = −12 mA IOH = −18 mA IOL = 100 μA L-level VOL VIN = VIH or VIL IOL = 12 mA IOL = 18 mA Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current IIN VIN = 0 to 3.6 V VIN = 0.7 V VIN = 1.6 V (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND VCC (V) 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 2.3 2.3 2.3 to 2.7 2.3 2.3 2.3 to 2.7 2.3 2.3 2.7 2.7 2.3 to 2.7 2.3 to 2.7 Min 1.6 ⎯ VCC − 0.2 2.0 1.8 1.7 ⎯ ⎯ ⎯ ⎯ 45 −45 ⎯ ⎯ ⎯ ⎯ Max ⎯ 0.7 ⎯ ⎯ ⎯ ⎯ 0.2 0.4 0.6 ±5.0 ⎯ ⎯ 300 −300 ±10.0 20.0 μA V Unit Input voltage V II (HOLD) μA II (OD) μA IOZ ICC μA μA Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 8 2007-10-19 TC74VCXH16646FT < DC Characteristics (Ta = −40 to 85°C, 1.8 V = VCC < 2.3 V) Characteristics Symbol Test Condition ⎯ ⎯ IOH = −100 μA IOH = −6 mA L-level Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current VOL VIN = VIH or VIL IOL = 100 μA IOL = 6 mA VCC (V) 1.8 to 2.3 1.8 to 2.3 1.8 1.8 1.8 1.8 1.8 1.8 1.8 (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND 1.8 1.8 1.8 1.8 Min 0.7 × VCC ⎯ VCC − 0.2 1.4 ⎯ ⎯ ⎯ 25 −25 ⎯ ⎯ ⎯ ⎯ Max ⎯ 0.2 × VCC ⎯ ⎯ 0.2 0.3 ±5.0 ⎯ ⎯ 200 −200 ±10.0 20.0 μA V V Unit H-level Input voltage L-level VIH VIL H-level Output voltage VOH VIN = VIH or VIL IIN VIN = 0 to 3.6 V VIN = 0.36 V VIN = 1.26 V II (HOLD) μA II (OD) μA IOZ ICC μA μA Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 9 2007-10-19 TC74VCXH16646FT AC Characteristics (Ta = −40 to 85°C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 Ω) (Note 1) Characteristics Symbol Test Condition VCC (V) 1.8 Maximum clock frequency fmax Figure 1, Figure 3 2.5 ± 0.2 3.3 ± 0.3 Propagation delay time (An, Bn-Bn, An) tpLH tpHL 1.8 Figure 1, Figure 2 2.5 ± 0.2 3.3 ± 0.3 1.8 Figure 1, Figure 3 2.5 ± 0.2 3.3 ± 0.3 1.8 Figure 1, Figure 2 2.5 ± 0.2 3.3 ± 0.3 1.8 Figure 1, Figure 4, Figure 5 2.5 ± 0.2 3.3 ± 0.3 1.8 Figure 1, Figure 4, Figure 5 2.5 ± 0.2 3.3 ± 0.3 1.8 Figure 1, Figure 3 2.5 ± 0.2 3.3 ± 0.3 1.8 Minimum setup time ts Figure 1, Figure 3 2.5 ± 0.2 3.3 ± 0.3 1.8 Minimum hold time th Figure 1, Figure 3 2.5 ± 0.2 3.3 ± 0.3 tosLH tosHL 1.8 (Note 2) 2.5 ± 0.2 3.3 ± 0.3 Min 100 200 250 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 4.0 1.5 1.5 2.5 1.5 1.5 1.0 1.0 1.0 ⎯ ⎯ ⎯ Max ⎯ ⎯ ⎯ 7.0 3.5 2.9 8.8 4.4 3.2 8.8 4.4 3.5 9.8 4.9 3.8 7.6 4.2 3.7 ― Unit MHz ns Propagation delay time (CAB, CBA-Bn, An) tpLH tpHL ns Propagation delay time (SAB, SBA-Bn, An) tpLH tpHL ns Output enable time ( OE , DIR-An, Bn) tpZL tpZH ns Output disable time ( OE , DIR-An, Bn) tpLZ tpHZ ns Minimum pulse width tw (H) tw (L) ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 0.5 0.5 0.5 ns ns ns Output to output skew ns Note 1: For CL = 50 pF, add approximately 300 ps to the AC maximum specification. Note 2: Parameter guaranteed by design. (tosLH = |tpLHm − tpLHn|, tosHL = |tpHLm − tpHLn|) 10 2007-10-19 TC74VCXH16646FT Dynamic Switching Characteristics (Ta = 25°C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 Ω) Characteristics Symbol Test Condition VIH = 1.8 V, VIL = 0 V Quiet output maximum dynamic VOL VOLP VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V VIH = 1.8 V, VIL = 0 V Quiet output minimum dynamic VOL VOLV VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V VIH = 1.8 V, VIL = 0 V Quiet output minimum dynamic VOH VOHV VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V (Note) (Note) (Note) (Note) (Note) (Note) (Note) (Note) (Note) VCC (V) 1.8 2.5 3.3 1.8 2.5 3.3 1.8 2.5 3.3 Typ. 0.25 0.6 0.8 −0.25 −0.6 −0.8 1.5 1.9 2.2 V V V Unit Note: Parameter guaranteed by design. Capacitive Characteristics (Ta = 25°C) Characteristics Input capacitance Bus I/O capacitance Power dissipation capacitance Symbol CIN CI/O CPD fIN = 10 MHz Test Condition (DIR, OE , CAB, CBA, SAB, SBA) ⎯ VCC (V) 1.8, 2.5, 3.3 1.8, 2.5, 3.3 (Note) 1.8, 2.5, 3.3 Typ. 6 7 20 Unit pF pF pF Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/16 (per bit) 11 2007-10-19 TC74VCXH16646FT AC Test Circuit 6.0 V or VCC × 2 Open GND Measure CL RL Switch RL Parameter tpLH, tpHL tpLZ, tpZL tpHZ, tpZH 6.0 V VCC × 2 Switch Open @VCC = 3.3 ± 0.3 V @VCC = 2.5 ± 0.2 V @VCC = 1.8 V GND Output CL = 30 pF RL = 500 Ω Figure 1 AC Waveform tr 2.0 ns Input (An, Bn, SAB, SBA) tf 2.0 ns 90% VM VIH 10% GND VOH VM tpLH tpHL VOL Output (Bn, An) Figure 2 tpLH, tpHL tr 2.0 ns Input (CAB, CBA) tf 2.0 ns VIH GND tw (H) tw (L) VIH VM ts (H) th (H) ts (L) th (L) GND VOH VM VOL 10% 90% VM Input (An, Bn) Output (Bn, An) tpHL tpLH Figure 3 tpLH, tpHL, tw, ts, th 12 2007-10-19 TC74VCXH16646FT tr 2.0 ns Output Disable ( OE ) tpLZ Output (An, Bn) Low to Off to Low tpHZ Output (An, Bn) High to Off to High Outputs enabled tf 2.0 ns 90% VM 2.7 V 10% tpZL 3.0 V or VCC VM VX tpZH VOL VOH VM GND Outputs disabled Outputs enabled GND VY Figure 4 tpLZ, tpH, tpZ, tpZH tf 2.0 ns Input (DIR) tr 2.0 ns 90% 10% VM GND 3.0 V or VCC VM VX tpLZ VY tpHZ VOL VOH GND 3.0 V or VCC VM VX tpZL VOL VOH VM GND tpZH VIN Output (An) tpZL Output (An) tpZH tpLZ Output (Bn) VM Output (Bn) tpHZ VY Figure 5 tpLZ, tpH, tpZ, tpZH VCC 3.3 ± 0.3 V 2.7 V 1.5 V VOL + 0.3 V VOH − 0.3 V 2.5 ± 0.2 V VCC VCC/2 VOL + 0.15 V VOH − 0.15 V 1.8 V VCC VCC/2 VOL + 0.15 V VOH − 0.15 V Symbol VIH VM VX VY 13 2007-10-19 TC74VCXH16646FT Package Dimensions Weight: 0.25 g (typ.) 14 2007-10-19 TC74VCXH16646FT RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 15 2007-10-19