TC74VHC221AFT

TC74VHC123,221AF/AFN/AFT/AFK TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74VHC123AF,TC74VHC123AFN,TC74VHC123AFT,TC74VHC123AFK TC74VHC221AF,TC74VHC221AFN,TC74VHC221AFT,TC74VHC221AFK Dual Monostable Multivibrator TC74VHC123AF/AFN/AFT/AFK Retriggerble TC74VHC221AF/AFN/AFT/AFK Non-Retriggerble The TC74VHC123A/221A are high speed CMOS MONOSTABLE MULTIVIBRATOR fabricated with silicon gate C2MOS technology. There are two trigger inputs, A input (negative edge), and B input (positive edge). These inputs are valid for a slow rise/fall time signal (tr = tf = 1 s) as they are schmitt trigger inputs. This device may also be triggered by using CLR input (positive edge). After triggering, the output stays in a MONOSTABLE state for a time period determined by the external resistor and capacitor (RX, CX). A low level at the CLR input breaks this state. Limits for CX and RX are: External capacitor, CX: No limit External resistor, RX: VCC = 2.0 V more than 5 kΩ VCC ≥ 3.0 V more than 1 kΩ An input protection circuit ensures that 0 to 5.5 V can be applied to the input pins without regard to the supply voltage. This device can be used to interface 5 V to 3 V systems and two supply systems such as battery back up. This circuit prevents device destruction due to mismatched supply and input voltages. Note: xxxFN (JEDEC SOP) is not available in Japan. TC74VHC123AF, TC74VHC221AF TC74VHC123AFN, TC74VHC221AFN TC74VHC123AFT, TC74VHC221AFT Features • • High speed: tpd = 8.1 ns (typ.) at VCC = 5 V Low power dissipation Standby state: 4 μA (max) at Ta = 25°C Active state: 600 μA (max) at Ta = 25°C TC74VHC123AFK, TC74VHC221AFK • • • • • High noise immunity: VNIH = VNIL = 28% VCC (min) Power down protection is equipped with all inputs. ∼ Balanced propagation delays: tpLH − tpHL Wide operating voltage range: VCC (opr) = 2 to 5.5 V Pin and function compatible with 74HC123A/221A Weight SOP16-P-300-1.27A SOL16-P-150-1.27 TSSOP16-P-0044-0.65A VSSOP16-P-0030-0.50 : 0.18 g (typ.) : 0.13 g (typ.) : 0.06 g (typ.) : 0.02 g (typ.) 1 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Pin Assignment 1A 1B 1 2 3 4 5 6 7 8 (top view) 16 15 14 13 12 11 10 VCC 1RX/CX 1C X 1Q 2Q 2CLR 1CLR 1Q 2Q 2CX 2RX/CX GND 2B 2A 9 IEC Logic Symbol TC74VHC123A 1A TC74VHC221A (13) (4) 1A 1B 1CLR (1) (2) (3) (14) (15) (9) (10) (11) (6) (7) & 1Q 1B 1CLR (1) (2) (3) (14) (15) (9) (10) (11) (6) (7) & 1 (13) (4) 1Q 1CX 1RX/CX 2A R CX RX/CX & 1Q 1CX 1RX/CX (5) (12) 2A R CX RX/CX & 1 1Q 2B 2CLR 2CX 2RX/CX 2Q 2B 2CLR 2CX 2RX/CX (5) (12) 2Q R CX RX/CX 2Q R CX RX/CX 2Q Truth Table Inputs A Outputs CLR B H Q Q Function Output Enable H H H H L L H H X H L L X L X Inhibit Inhibit Output Enable Output Enable H X L L H Reset X: Don’t care 2 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Block Diagram (Note 1) (Note 2) DX CX 14 15 RX VCC CX RX 6 13 Q A B Q 11 CLR 9 10 12 Q 7 5 Q CX RX/CX DX VCC CX RX/CX A B 1 2 4 3 CLR Note 1: CX, RX, DX are external Capacitor, resistor, and diode, respectively. Note 2: External clamping diode, DX; The external capacitor is charged to VCC level in the wait state, i.e. when no trigger is applied. If the supply voltage is turned off, CX is discharges mainly through the internal (parasitic) diode. If CX is sufficiently large and VCC drops rapidly, there will be some possibility of damaging the IC through in rush current or latch-up. If the capacitance of the supply voltage filter is large enough and VCC drops slowly, the in rush current is automatically limited and damage to the IC is avoided. The maximum value of forward current through the parasitic diode is ±20 mA. In the case of a large CX, the limit of fall time of the supply voltage is determined as follows: tf ≥ (VCC − 0.7) CX/20 mA (tf is the time between the supply voltage turn off and the supply voltage reaching 0.4 VCC.) In the even a system does not satisfy the above condition, an external clamping diode (DX) is needed to protect the IC from rush current. 3 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK System Diagram TC74VHC123A VCC Vref L Vref H QP C1 C2 RX/CX QN VCC DRQ CX F/F A B CK Q Q Q CLR Timing Chart TC74VHC123A trr VIH A VIL VIH B VIL VIH CLR VIL RX/CX VCC VrefH VrefL GND VOH Q VOL VOH Q twOUT twOUT twOUT + trr VOL 4 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK System Diagram TC74VHC221A VCC Vref L Vref H QP C1 C2 RX/CX QN CX DRQ A B CK F/F Q Q Q CLR Timing Chart TC74VHC221A VIH A VIL VIH B VIL VIH CLR VIL RX/CX VCC VrefH VrefL GND VOH Q VOL VOH Q twOUT twOUT twOUT VOL 5 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Functional Description (1) Standby state The external capacitor (CX) is fully charged to VCC in the stand-by state. That means, before triggering, the QP and QN transistors which are connected to the RX/CX node are in the off state. Two comparators that relate to the timing of the output pulse, and two reference voltage supplies turn off. The total supply current is only leakage current. Trigger operation Trigger operation is effective in any of the following three cases. First, the condition where the A input is low, and the B input has a rising signal; second, where the B input is high, and the A input has a falling signal; and third, where the A input is low and the B input is high, and the CLR input has a rising signal. After a trigger becomes effective, comparators C1 and C2 start operating, and QN is turned on. The external capacitor discharges through QN. The voltage level at the RX/CX node drops. If the RX/CX voltage level falls to the internal reference voltage VrefL, the output of C1 becomes low. The flip-flop is then reset and QN turns off. At that moment C1 stops but C2 continues operating. After QN turns off, the voltage at the RX/CX node starts rising at a rate determined by the time constant of external capacitor CX and resistor RX. Upon triggering, output Q becomes high, following some delay time of the internal F/F and gates. It stays high even if the voltage of RX/CX changes from falling to rising. When RX/CX reaches the internal reference voltage VrefH, the output of C2 becomes low, the output Q goes low and C2 stops its operation. That means, after triggering, when the voltage level of the RX/CX node reaches VrefH, the IC returns to its MONOSTABLE state. With large values of CX and RX, and ignoring the discharge time of the capacitor and internal delays of the IC, the width of the output pulse, tw (OUT), is as follows: tw (OUT) = 1.0 · CX · RX Retrigger operation (TC74VHC123A) When a new trigger is applied to either input A or B while in the MONOSTABLE state, it is effective only if the IC is charging CX. The voltage level of the RX/CX node then falls to VrefL level again. Therefore the Q output stays high if the next trigger comes in before the time period set by CX and RX. If the new trigger is very close to previous trigger, such as an occurrence during the discharge cycle, it will have no effect. The minimum time for a trigger to be effective 2nd trigger, trr (min.), depends on VCC and CX. Reset operation In normal operation, the CLR input is held high. If CLR is low, a trigger has no effect because the Q output is held low and the trigger control F/F is reset. Also, QP turns on and CX is charged rapidly to VCC. This means if CLR is set low, the IC goes into a wait state. (2) (3) (4) 6 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Absolute Maximum Ratings (Note) Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating −0.5 to 7.0 −0.5 to 7.0 −0.5 to VCC + 0.5 −20 ±20 ±25 ±50 Unit V V V mA mA mA mA mW °C 180 −65 to 150 Note: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Operating Ranges (Note 1) Characteristics Supply voltage Input voltage Output voltage Operating temperature Input rise and fall time External capacitor External resistor Symbol VCC VIN VOUT Topr dt/dv CX RX Rating 2.0 to 5.5 0 to 5.5 0 to VCC −40 to 85 Unit V V V °C ns/V F Ω 0 to 100 (VCC = 3.3 ± 0.3 V) 0 to 20 (VCC = 5 ± 0.5 V) No limitation (Note 2) ≥ 5 k (Note 3) (VCC = 2.0 V) ≥ 1 k (Note 3) (VCC ≥ 3.0 V) Note 1: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Note 2: The maximum allowable values of CX and RX are a function of leakage of capacitor CX, the leakage of TC74VHC123A/221A, and leakage due to board layout and surface resistance. Susceptibility to externally induced noise signals may occur for RX > 1 MΩ. 7 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Electrical Characteristics DC Characteristics Characteristics Symbol Test Condition VCC (V) High-level input voltage 2.0 VIH ⎯ Ta = 25°C Min 1.50 VCC × 0.7 ⎯ ⎯ Ta = −40 to 85°C Max ⎯ ⎯ Unit Typ. ⎯ ⎯ ⎯ ⎯ Min 1.50 VCC × 0.7 ⎯ ⎯ Max ⎯ ⎯ 3.0 to 5.5 2.0 V Low-level input voltage 0.50 VCC × 0.3 ⎯ ⎯ ⎯ ⎯ ⎯ 0.50 VCC × 0.3 ⎯ ⎯ ⎯ ⎯ ⎯ VIL ⎯ 3.0 to 5.5 2.0 V 1.9 2.9 4.4 2.58 3.94 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 2.0 3.0 4.5 ⎯ ⎯ 1.9 2.9 4.4 2.48 3.80 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ IOH = −50 μA High-level output voltage VOH VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOL = 50 μA Low-level output voltage VOL VIN = VIH or VIL IOL = 4 mA IOL = 8 mA Input leakage current RX/CX terminal off-state current Quiescent supply current Active-state supply current (Note) IIN IIN ICC VIN = 5.5 V or GND VIN = VCC or GND VIN = VCC or GND VIN = VCC or GND RX/CX = 0.5 VCC 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to 5.5 5.5 5.5 3.0 4.5 5.5 V 0.0 0.0 0.0 ⎯ ⎯ ⎯ ⎯ ⎯ 0.1 0.1 0.1 0.36 0.36 ±0.1 ±0.25 0.1 0.1 0.1 0.44 0.44 ±1.0 ±2.5 μA μA μA V 4.0 250 500 750 40.0 280 650 975 160 380 560 ICC μA Note: Per circuit 8 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Timing Requirements (input: tr = tf = 3 ns) Characteristics Symbol Test Condition VCC (V) Minimum pulse width Minimum clear width ( CLR ) tw (L) tw (H) tw (L) RX = 1 kΩ Minimum retrigger time (Note) trr CX = 100 pF RX = 1 kΩ CX = 0.01 μF ⎯ Ta = 25°C Typ. ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Limit 5.0 5.0 5.0 5.0 ⎯ ⎯ ⎯ ⎯ Unit Limit 5.0 5.0 5.0 5.0 ⎯ ⎯ ⎯ ⎯ 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 ns ⎯ ns 60 39 1.5 1.2 ns μs Note: For TC74VHC123A only AC Characteristics (input: tr = tf = 3 ns) Characteristics Symbol Test Condition VCC (V) Propagation delay time ( A , B-Q, Q ) 3.3 ± 0.3 ⎯ Ta = 25°C CL (pF) 15 50 15 50 15 50 15 50 15 50 15 50 50 Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Ta = −40 to 85°C Max 20.6 24.1 12.0 14.0 22.4 25.9 12.9 14.9 15.8 19.3 9.4 11.4 240 200 110 110 1.1 1.1 ⎯ Unit Typ. 13.4 15.9 8.1 9.6 14.5 17.0 8.7 10.2 10.3 12.8 6.3 7.8 160 133 100 100 1.0 1.0 ±1 Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 ― ― 90 90 0.9 0.9 ⎯ ⎯ ⎯ Max 24.0 27.5 14.0 16.0 26.0 29.5 15.0 17.0 18.5 22.0 11.0 13.0 300 240 110 110 1.1 1.1 ⎯ tpLH tpHL ns 5.0 ± 0.5 Propagation delay time ( CLR trigger-Q, Q ) tpLH tpHL 3.3 ± 0.3 ⎯ ns 5.0 ± 0.5 Propagation delay time ( CLR -Q, Q ) tpLH tpHL 3.3 ± 0.3 ⎯ ns 5.0 ± 0.5 CX = 28 pF RX = 2 kΩ 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 3.3 ± 0.3 5.0 ± 0.5 ⎯ ⎯ ns Output pulse width twOUT CX = 0.01 μF RX = 10 kΩ CX = 0.1 μF RX = 10 kΩ 50 90 90 0.9 0.9 ⎯ ⎯ μs 50 ms Output pulse width error between circuits (in same package) Input capacitance Power dissipation capacitance ΔtwOUT % pF pF CIN CPD 4 73 10 ⎯ 10 ⎯ (Note) ⎯ Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD·VCC·fIN + ICC’·Duty/100 + ICC/2 (per circuit) (I CC’: active supply current) (duty: %) 9 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK trr – VCC Characteristics (typ.) (TC74VHC123A) Ta = 25°C twOUT – CX Characteristics (typ.) VCC = 4.5 V CL = 50 pF RX = 1 MΩ Minimum retrigger time trr 103 (μs) 10 Output pulse width twOUT (μs) CX = 0.01 μF 1 102 RX = 100 kΩ CX = 1000 pF 0.1 CX = 100 pF 10 RX = 10 kΩ RX = 1 kΩ 0.01 0 1 2 3 4 5 6 Supply voltage 1 VCC (V) 10−1 10 2 103 104 External capacitor CX (pF) Output Pulse Width Constant K − Supply Voltage (typ.) (external resistor (RX) = 10 kΩ: twOUT = K·CX·RX) Output pulse width constant K 1.2 CX = 1000 pF 1.1 CX = 0.01 μF 1.0 CX = 1 μF, CX = 0.1 μF 2 3 4 5 6 Supply voltage VCC (V) Input Equivalent Circuit INPUT 10 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Package Dimensions Weight: 0.18 g (typ.) 11 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.13 g (typ.) 12 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Package Dimensions Weight: 0.06 g (typ.) 13 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK Package Dimensions Weight: 0.02 g (typ.) 14 2007-10-19 TC74VHC123,221AF/AFN/AFT/AFK RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 15 2007-10-19