TC75S102F
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
Single Operational Amplifier
Ultra-Low supply current
TC75S102F
Features
•
•
•
•
Input and Output Full Range
Ultra-Low supply current 0.27µA (Typ.) @VDD=1.5V
Low Input offset voltage 1.3mV (Max) @VDD=1.5V
Wide Operating Voltage Range 1.5V to 5.5V
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
SMV
Symbol
Rating
Unit
VDD - VSS
6
V
DVIN
±6
V
VIN
VDD to VSS
V
Output voltage
VOUT
VSS -0.3V to VDD +0.3V ≤ VSS + 6V
V
Output current
IOUT
±25
mA
Power dissipation
PD
200
mW
Operating temperature
Topr
-40 to 105
°C
Storage temperature
Tstg
-55 to 150
°C
Supply voltage
Differential input voltage
Input voltage
Weight:
SMV (SOT-25)(SC-74A) :14 mg (typ.)
Note1: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Operating Ratings (Ta = -40 to 105°C)
Characteristics
Supply voltage
Symbol
Rating
Unit
VDD - VSS
1.5 to 5.5
V
Note2: A higher load capacitance will increase the risk of voltage oscillation. Allow sufficient capacitance value
when designing your circuit and using this product to prevent voltage oscillation.
Note3: This device is sensitive to electrostatic discharge.
Please ensure equipment, operator and tools are adequately earthed when handling.
Start of commercial production
2020-06
© 2020
Toshiba Electronic Devices & Storage Corporation
1
2020-06-05
TC75S102F
Marking (top view)
5
Pin Assignment (top view)
IN (-)
4
VDD
5
4
-
SA2
1
2
+
1
OUT
3
2
VSS
3
IN (+)
Electrical Characteristics
DC Characteristics (VDD = 1.5V, VSS = GND, Ta = 25°C, VIN = VDD/2, unless otherwise noted.)
Characteristics
Input offset voltage
Input offset voltage drift
Input offset current
Input bias current
Symbol
Test
Circuit
VIO
Test Condition
Min
Typ.
Max
Unit
1
RS = 1 kΩ, RF = 100kΩ
-1.3
-0.1
1.3
mV
VIOdrift
1
RS = 1 kΩ, RF = 100kΩ
-
2.8
-
µV/°C
IIO
-
-
1
-
pA
II
-
-
-
1
-
pA
0
-
VDD
V
64
139
-
dB
RL ≥ 100 kΩ
1.4
-
-
4
RL ≥ 100 kΩ
-
-
0.1
CMRR
2
VIN = 0 to 1.5V
53
80
SVRR
1
VDD = 1.5 to 5.0V
61
80
-
dB
Supply current
IDD
5
Ta = -40 to 105°C
-
0.27
0.60
µA
Ta = 25°C
-
0.27
0.46
µA
Source current
Isource
6
-
0.34
0.6
-
mA
Isink
7
-
0.28
0.4
-
mA
Common mode input voltage
CMVIN
2
GV
-
VOH
3
VOL
Common mode input signal
rejection ratio
Supply voltage rejection ratio
Voltage gain (open loop)
Maximum output voltage
Sink current
RS = 1 kΩ, RF = 100kΩ
-
-
V
dB
AC Characteristics (VDD = 0.75 V, VSS = -0.75 V, Ta = 25°C)
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
fT
-
-
-
0.5
-
kHz
Phase margin
Φm
-
-
-
53
-
degrees
Slew Rate
SR
-
-
-
0.37
-
V/ms
Characteristics
Unity Gain Cross Frequency
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Toshiba Electronic Devices & Storage Corporation
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2020-06-05
TC75S102F
DC Characteristics (VDD = 5.0V, VSS = GND, Ta = 25°C, VIN=VDD/2, unless otherwise noted.)
Characteristics
Symbol
Test
Circuit
VIO
1
VIOdrift
1
IIO
-
II
-
CMVIN
2
GV
-
VOH
3
VOL
Min
Typ.
Max
Unit
RS = 1 kΩ, RF = 100 kΩ
-1.7
-0.1
1.7
mV
RS = 1 kΩ, RF = 100 kΩ
-
2.4
-
µV/°C
-
-
1
-
pA
-
-
1
-
pA
0
-
VDD
V
80
100
-
dB
RL ≥ 100 kΩ
4.9
-
-
4
RL ≥ 100 kΩ
-
-
0.1
CMRR
2
VIN = 0 to 5.0V
59
80
-
dB
Supply current
IDD
5
Ta = -40 to 105°C
-
0.35
0.7
µA
Ta = 25°C
-
0.35
0.54
µA
Source current
Isource
6
-
7.8
11
-
mA
Isink
7
-
8.2
10
-
mA
Input offset voltage
Input offset voltage drift
Input offset current
Input bias current
Common mode input voltage
Voltage gain (open loop)
Maximum output voltage
Common mode input signal
rejection ratio
Sink current
Test Condition
RS = 1 kΩ, RF = 100 kΩ
-
V
AC Characteristics (VDD = 2.5 V, VSS = -2.5 V, Ta = 25°C)
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
fT
-
-
-
0.63
-
kHz
Phase margin
Φm
-
-
-
63
-
degrees
Slew Rate
SR
-
-
-
0.45
-
V/ms
Characteristics
Unity Gain Cross Frequency
© 2020
Toshiba Electronic Devices & Storage Corporation
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2020-06-05
TC75S102F
Test Circuit
1. SVRR, VIO
SVRR
For each of the two VDD values, measure the VOUT value, as indicated below, and
calculate the value of SVRR using the equation shown.
When VDD = 1.5 V, VDD = VDD1 and VOUT = VOUT1
When VDD = 5.0 V, VDD = VDD2 and VOUT = VOUT2
•
•
VDD
RF
RS
SVRR=20log ��
RF
RS
VOUT
5
VIO
Measure the value of VOUT and calculate the value of VIO using the following
equation.
•
VDD/2
VIO = �VOUT -
2. CMRR, CMVIN
VDD
•
RF
RS
CMRR=20log ��
RF
RS
VDD/2
VDD
RS
�×
2
RF +RS
CMRR
Measure the VOUT value, as indicated below, and calculate the value of the
CMRR using the equation shown.
When VIN = 0 V, VIN = VIN1 and VOUT = VOUT1
When VIN = 5.0 V, VIN = VIN2 and VOUT = VOUT2
VOUT
VIN
RF +RS
VDD1 -VDD2
�×
�
VDD1
VDD2
RS
�VOUT1 - �
�� - �VOUT2 - �
��
2
2
VIN1 - VIN2
RF +RS
� ×
�
VOUT1 - VOUT2
RS
•
CMVIN
Input range within which the CMRR specification guarantees
VOUT value (as varied by the VIN value).
•
VOH
3. VOH
VDD
VDD
-0.05V
2
VIN2 =
VDD
+0.05V
2
RL
VOH
VIN1 =
VIN1
VIN2
4. VOL
VDD
•
VOL
RL
VIN1 =
VOL
VIN1
VIN2 =
VDD
+0.05V
2
VDD
-0.05V
2
VIN2
© 2020
Toshiba Electronic Devices & Storage Corporation
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2020-06-05
TC75S102F
5. IDD
VDD
M
IDD
VDD/2
6. Isource
VDD
VDD
-0.05
2
M
VDD
+0.05
2
7. Isink
VDD
M
VDD
+0.05
2
VDD
-0.05
2
© 2020
Toshiba Electronic Devices & Storage Corporation
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2020-06-05
TC75S102F
Package Dimensions
SMV (SOT-25)(SC-74A)
Unit: mm
Weight : 14 mg ( typ.)
© 2020
Toshiba Electronic Devices & Storage Corporation
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2020-06-05
TC75S102F
RESTRICTIONS ON PRODUCT USE
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Hardware, software and systems described in this document are collectively referred to as “Product”.
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• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design
or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications;
(b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs,
algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs
and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical
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