TC78H621FNG
TOSHIBA CDMOS Integrated Circuit
Silicon Monolithic
TC78H621FNG
DUAL-BRIDGE DRIVER IC
The TC78H621FNG is a dual-bridge driver IC which incorporates
DMOS in output transistors.
The TC78H621FNG is capable of driving 2 DC brushed motors or 1
stepping motor.
P-TSSOP16-0505-0.65-001 Weight: 0.06 g(Typ.)
Features
•
Power supply voltage for motor
: VM=18 V(Max)
•
Power supply voltage for control
: VCC=6 V(Max)
•
Output current
: IOUT=1.1 A(Max)
•
Output ON resistance
: Ron(upper and lower sum)=0.8 Ω(Typ.)
•
Internal pull-down resistors on inputs
: 200 kΩ(Typ.)
•
Built-in over current detection(ISD), thermal shutdwon(TSD) circuit, and under voltage lockout(UVLO) circuit.
•
Small package
•
Built-in cross conduction protection circuit
©2017 Toshiba Corporation
: P-TSSOP16-0505-0.65-001
1
2017-04-10
TC78H621FNG
Block Diagram
VCC
GND
UVLO
AO1
PHA_A
Predriver
EN_A
/STBY
H-Bridge A
AO2
ISD
Motor
Control
Logic
VM
UVLO
TSD
BO1
PHA_B
Predriver
H-Bridge B
BO2
EN_B
GND
GND
* Please note that in the block diagram, functional blocks or constants may be omitted or simplified for explanatory
purposes.
2
2017-04-10
TC78H621FNG
Pin Functions
Pin No.
Pin name
Functional description
Remarks
1
NC
Not connected
Please do not connect any pattern
2
NC
Not connected
Please do not connect any pattern
3
PHA_A
Control input pin for Ach (1)
See the table "Input/Output functions".
4
EN_A
Control input pin for Ach (2)
See the table "Input/Output functions".
5
VCC
Power supply pin for logic block
VCC=2.7 to 5.5 V
6
/STBY
Standby input
See the table "Input/Output functions".
7
PHA_B
Control input pin for Bch (1)
See the table "Input/Output functions".
8
EN_B
Control input pin for Bch (2)
See the table "Input/Output functions".
9
VM
Power supply pin for output
VM= 2.5 to 15.0 V
10
BO2
Output pin of B phase (2)
Please connect with a motor.
11
GND
Ground pin
12
BO1
Output pin of B phase (1)
Please connect with a motor.
13
AO2
Output pin of A phase (2)
Please connect with a motor.
14
GND
Ground pin
15
AO1
Output pin of A phase (1)
16
GND
Ground pin
Please connect with a motor.
Equivalent Input/Output Circuit
Input pin(EN_A, EN_B, PHA_A, PHA_B, /STBY)
Output pin(AO1, AO2, BO1, BO2)
200 kΩ
VM
AO1, BO1
AO2, BO2
Please note that in the equivalent input/output circuit, functional blocks or constants may be omitted or simplified for
explanatory purposes.
3
2017-04-10
TC78H621FNG
Pin Assignment (Top view)
NC
1
16
GND
NC
2
15
AO1
PHA_A
3
14
GND
EN_A
4
13
AO2
VCC
5
12
BO1
/STBY
6
11
GND
PHA_B
7
10
BO2
EN_B
8
9
VM
4
2017-04-10
TC78H621FNG
Absolute Maximum Ratings (Ta =25°C)
Characteristics
Symbol
Rating
Unit
VCC
6
V
VM
18
V
Output current
IOUT
1.1
A
Input voltage
VIN
-0.2 to VCC+0.2
V
Power dissipation
PD
0.78 (Note1)
W
Operation temperature
Topr
-30 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
Power supply voltage
Note 1: When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40 %, Cu thick:
35μm)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be
exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably
altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other
equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under
any operating condition.
Operating Range (Ta = -30 to 85°C)
Characteristics
Symbol
Conditions
Min
Typ.
Max
Unit
Controlled power supply
voltage
VCC
―
2.7
3.3
5.5
V
Motor power supply voltage
VM
―
2.5
5
15
V
Output current
IOUT
―
―
―
0.8
A
Input voltage
VIN
―
―
―
5.5
V
Control logic frequency
fPWM
EN_A, EN_B,
PHA_A, PHA_B
Duty50% condition
1
―
500
kHz
Maximum current is limited by power dissipation. It depends on the ambient temperature, excitation mode, and heat
radiation of the board. Determine a realistic maximum current by calculating the heat generated under the operating
environment.
5
2017-04-10
TC78H621FNG
Electrical Characteristics (Ta=25°C, VCC=3.3 V, VM=5 V, unless otherwise specified.)
Characteristics
Input voltage
Symbol
Min
Typ.
Max
Unit
2.0
―
5.5
V
-0.2
―
0.8
V
EN_A, EN_B,PHA_A, PHA_B
/STBY
―
200
―
mV
IIN(H)
VIN = 3.3 V
11
16.5
22
μA
IIN(L)
VIN = 0.8 V
2
4
8
μA
ICC1
Stop mode
/STBY = H, EN_A = EN_B = L
―
0.5
1
mA
ICC2
Operation mode
/STBY = EN_A = EN_B = H
―
0.5
1
mA
ICC3
Standby mode
/STBY = L
―
0
1
μA
IM1
Stop mode
/STBY = H, EN_A = EN_B = L
―
0.25
1
mA
IM2
Operation mode
/STBY = EN_A = EN_B = H
―
0.25
1
mA
IM3
Standby mode
/STBY = L
―
0
1
μA
IOUT = 0.2 A
―
0.8
1.6
IOUT = 0.6 A
―
0.8
1.6
―
1
1.2
―
1
1.2
―
―
1
―
―
1
VIN(H)
VIN(L)
Hysteresis voltage
Input current
VIN(HYS)
Consumption current
Drain-source
ON-resistance
(The sum of high side &
low side)
Diode forward voltage
Output leakage
current
RON(U+L)
VFU
VFL
Upper
IOH
Lower
IOL
Test Condition
EN_A, EN_B,PHA_A, PHA_B
/STBY
IOUT = 0.6 A
VM=15 V
6
Ω
V
μA
2017-04-10
TC78H621FNG
(Reference) PD – Ta characteristics
When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40 %, Cu thick: 35μm)
Note: The above- characteristics is a reference value and is not a guaranteed
7
2017-04-10
TC78H621FNG
Input/Output functions
Input
Output
Mode
/STBY
EN_A/EN_B
PHA_A/PHA_B
AO1/BO1
AO2/BO2
H
H
H
L
H
Operation
H
H
L
H
L
Operation
H
L
H or L
OFF
(High impedance)
Stop
L
H or L
H or L
OFF
(High impedance)
Standby
When driving the stepping motor
1: Full Step
Input
EN_A
EN_B
H
H
Output
PHA_A
PHA_B
AO1
H
L
L
H
H
L
H
H
H
H
H
L
L
STEP
AO2
BO1
BO2
H
L
H
L
1
L
H
H
L
2
H
L
H
L
H
3
L
H
H
L
L
H
4
H or L
H or L
OFF
(High impedance)
OFF
2: Half Step
Input
Output
STEP
EN_A
EN_B
PHA_A
PHA_B
AO1
AO2
BO1
BO2
H
H
L
L
H
L
H
L
1
L
H
H or L
L
H
L
2
H
H
H
L
H
L
3
OFF
(High impedance)
L
H
H
L
H
H or L
L
H
H
H
H
H
L
H
L
H
H or L
H
H
H
L
H
H
L
L
H or L
L
L
H or L
H or L
OFF
(High impedance)
H
H
L
L
OFF
(High impedance)
L
H
5
L
H
6
L
H
7
OFF
(High impedance)
OFF
(High impedance)
8
4
8
OFF
2017-04-10
TC78H621FNG
Output waveform timing chart (voltage waveform)
Input
(EN_A, EN_B, PHA_A, PHA_B)
50%
50%
tpLH
Output
(AO1, AO2, BO1, BO2)
tpHL
90%
90%
50%
50%
10%
10%
tr
tf
AC Electrical characteristics (Reference)
Symbol
Typical value
tpLH
500
tpHL
500
tr
20
tf
20
Unit
ns
Note: The above- characteristics is a reference value and is not a guaranteed
Timing charts may be simplified for explanatory purpose.
9
2017-04-10
TC78H621FNG
TSD (Thermal shut down)
The TC78H621FNG includes a thermal shutdown circuit, which turns the output transistors off when the junction
temperature (Tj) exceeds 170°C (Typ.).
State of the internal IC and output state when TSD function operates are same as that of the stop mode (EN_A =
EN_B = L).
The output transistors are automatically turned on when Tj cools lowered by 40°C(Typ.).
* The operative temperature and release temperature of the TSD are a reference value, and are not a guaranteed
performance.
ISD (Over current detection)
The TC78H621FNG includes an over current detection circuit, which turns the output transistors off when any of
current which flows in 8 DMOS transistors exceeds 1.7 A (Typ.). It does not resume automatically but latches. It
resumes when UVLO operates.
However, masking time of 4 μs(Typ.) should be added in order to avoid detection error by the noise.
State of the internal IC and output state when ISD function operates are same as that of the stop mode (EN_A = EN_B
= L).
The output transistors are turned on when one of the following controls is performed.
1. Re-turn on power supply
2. After setting to standby mode (/STBY = L), it sets to operational mode again.
3. After setting Ach and Bch into stop mode (EN_A = EN_B = L), it sets to operational mode again.
* The actuating current and masking term of the ISD are a reference value, and are not a guaranteed value.
1.7 A (Typ.)
DMOS power transistor current
masking time
4 μs(Typ.)
Output OFF
UVLO (Under voltage lockout)
The TC78H621FNG includes an under voltage lockout circuit, which turns the output transistors off when VCC
decreases to 2.2 V (Typ.) or lower.
The output transistors are automatically turned on when VCC is raised to 2.3 V (Typ.) .
The TC78H621FNG includes an under voltage lockout circuit, which turns the output transistors off when VM
decreases to 2.0 V (Typ.) or lower.
The output transistors are automatically turned on when VM is raised to 2.1 V (Typ.).
State of the internal IC and output state when UVLO function operates are same as that of the stop mode (EN_A =
EN_B = L).
* The operating voltage and release voltage of the UVLO are a reference value, and are not a guaranteed value.
10
2017-04-10
TC78H621FNG
Application circuit
When driving the DC brushed motor
VCC
/STBY
EN_A
Controller
I/O
EN_B
PHA_A
VM
TC78H621FNG
VCC
AO1
DC
brushed
motor
BO1
DC
brushed
motor
BO2
GND
VM
AO2
PHA_B
GND
+
-
GND
When driving the stepping motor
VCC
/STBY
EN_A
Controller
I/O
EN_B
PHA_A
VM
TC78H621FNG
VCC
AO1
VM
Stepping
motor
AO2
BO1
BO2
PHA_B
GND
+
-
GND
GND
Note 1: A power supply capacitor should be connected as close as possible to the IC.
Note 2: When the power is turned on and off, set /STBY = L or EN_A = EN_B = L. If these terminals are set high in
turning on and off the power, unexpected current may be flown in the output pin depending on the situation.
11
2017-04-10
TC78H621FNG
Package Dimensions
Weight: 0.06 g(Typ.)
12
2017-04-10
TC78H621FNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
13
2017-04-10
TC78H621FNG
Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current protection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease
in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
14
2017-04-10
TC78H621FNG
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
15
2017-04-10
