TC78H651AFNG,EL

TC78H651AFNG TOSHIBA CDMOS Integrated Circuit Silicon Monolithic TC78H651AFNG 1.8-V Dual bridge driver IC The TC78H651AFNG is a dual bridge driver IC for DC motors/Stepping motors which incorporates DMOS with low ON resistance in output transistors. Forward, reverse, or stop mode can be selected. Over current detection, thermal shutdown, and under voltage lockout functions are implemented. Features • Power supply voltage (Absolute maximum ratings): 8.0 V (max) • Power supply voltage (Operating Range): 1.8 V to 7.5 V • Output current (Absolute maximum ratings): 2.0A (max) • Output ON resistance: 0.22 Ω (typ.) (Ta = 25 °C, Sum of upper and lower side, VM = 5.0 V) • P-TSSOP16-0505-0.65-001 Weight: 0.06 g (typ.) Built-in standby function: Consumption current 0 μA (typ.) • Built-in cross conduction protection circuit • Built-in over current detection (ISD), thermal shutdown (TSD), and under voltage lockout (UVLO) • Forward / Reverse / Stop modes are selectable • Package: P-TSSOP16-0505-0.65-001 © 2019 Toshiba Electronic Devices & Storage Corporation 1 2019-1-31 TC78H651AFNG Pin assignment (Top view) VM 1 16 NC NC 2 15 OUT4 IN4 3 14 OUT3 IN3 4 13 NC NC 5 12 OUT1 IN1 6 11 OUT2 IN2 7 10 NC NC 8 9 GND 2 2019-1-31 TC78H651AFNG Block Diagram VM Regulator OUT1 OUT2 37kΩ IN1 150kΩ 37kΩ IN2 150kΩ Control Circuit 37kΩ IN3 150kΩ OUT3 OUT4 37kΩ IN4 150kΩ UVLO GND TSD ISD Note: Please note that in the block diagram, functional blocks or constants may be omitted or simplified for explanatory purposes. Pin Functions Functional description Remarks Pin name Pin No. VM 1 Power supply pin for motor NC 2 Non connection Operation range is from 1.8 V to 7.5 V. Use this pin open. IN4 3 Control input pin 4 Refer to the section of “Input/Output Functions”. IN3 4 Control input pin 3 Refer to the section of “Input/Output Functions”. NC 5 No connection Use this pin open. IN1 6 Control input pin 1 Refer to the section of “Input/Output Functions”. IN2 7 Control input pin 2 Refer to the section of “Input/Output Functions”. NC 8 Non connection Use this pin open. GND 9 GND pin — NC 10 Non connection Use this pin open.. OUT2 11 Output pin 2 Motor coil connection pin OUT1 12 Output pin 1 Motor coil connection pin NC 13 Non connection Use this pin open. OUT3 14 Output pin 3 Motor coil connection pin OUT4 15 Output pin 4 Motor coil connection pin NC 16 Non connection Use this pin open. 3 2019-1-31 TC78H651AFNG Input/Output Functions IN1 IN2 IN3 IN4 OUT1 OUT2 OUT3 OUT4 Mode L L — — OFF OFF — — Stop H L — — H L — — Forward L H — — L H — — Reverse H H — — (Note1) (Note1) — — — — L L — — OFF OFF — — — H L — — H L Forward — — L H — — L H Reverse — — H H — — (Note1) (Note1) L L L L OFF OFF OFF OFF Stop — Standby Note1: ”H” that is input previously becomes effective. Note: —: Don’t Care Switching from “IN1 = L / IN2= L” to “IN1 = H / IN2 = H”: Don’t Care Switching from “IN3 = L / IN4= L” to “IN3 = H / IN4 = H”: Don’t Care 4 2019-1-31 TC78H651AFNG Timing Chart of Output Waveforms Input (IN1, IN2, IN3, and IN4) 50 % 50 % tpLH Output (OUT1, OUT2, OUT3, and OUT4) tpHL 90 % 90 % 50 % 50 % 10 % 10 % tr tf Note: Timing charts may be simplified for explanatory purposes. AC characteristic reference values (VM = 3.0 V, Ta = 25°C) Symbol Typ. tpLH 90 tpHL 90 tr 20 tf 10 Unit ns 5 2019-1-31 TC78H651AFNG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power supply voltage VM 8.0 V Input voltage VIN -0.3 to 6 V Output current IOUT 2.0 A Output DMOS body diode forward current If 2.0 A Power dissipation PD 0.78 (Note 1) W Operation temperature Topr -40 to 105 °C Storage temperature Tstg -55 to 150 °C Note 1: When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40 %, Cu thickness: 35 μm) Back-EMF While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltage (7 V). The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be fully verified that there is no risk that the device or other components will be damaged or fail due to the motor back-EMF. When the power is fed back to the power supply, the body diode of the output DMOS may turn on and a regenerative current may flow. At this time, the voltage applied to the output pin may become a negative value by the voltage of the body diode (Vf). However, if the current of the body diode (If) is a rated value (shown in above table) or less, it is no problem. Over Current Detection (ISD) and Thermal Shutdown (TSD) The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output short-circuits; they do not necessarily guarantee the complete IC safety. If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be damaged due to an output short-circuit. The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by external hardware. IC Mounting Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or deterioration of the device. Operating Range (Ta = -40 to 105°C) Characteristics Symbol Min Typ. Max Unit Remarks Power supply voltage VM 1.8 3.0 7.5 V — Output current IOUT — — 2.0 A VM = 5.0 V PWM frequency fPWM — — 500 kHz Duty = 50 % 6 2019-1-31 TC78H651AFNG Electrical Characteristics (VM = 1.8 to 7.0 V, Ta = 25°C, unless otherwise specified.) Characteristics Consumption current Input voltage Control circuit Symbol ICC1 Test condition Forward / Reverse mode, VM = 3.0 V, Output Open ON-resistance between drain and source of output transistor (Sum of upper and lower side) Output leakage current Output DMOS body diode forward voltage Typ. Max Unit — 0.6 1.0 mA μA ICC2 Standby mode, VM = 3.0 V — 0 0.22 VIH1 VM = 1.8 V 1.5  5.5 VIH2 VM = 3.0 V 1.7  5.5 VIH3 VM = 5.0 V 2.0  5.5 VIH4 VM = 7.0 V 2.0  5.5 -0.3 — 0.5 10 16 22 — — 1.0 — 0.22 0.35 — — 0.5 — — 0.5 — 0.7 1.0 VIL Input current Min IIH — VIN = 3.0 V IIL RON(D-S) IOH IOL Vf — IOUT = 1.0 A, VM = 5.0 V VM = 3.0 V If = 0.4 A, VM = 5.0 V 7 V μA Ω μA V 2019-1-31 TC78H651AFNG Power dissipation graph PD - Ta PD-Ta (Reference data) 1.0 0.9 0.8 PD (W) PD (W) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 Ta (°C) (℃) T 125 150 a When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40%, Cu thickness: 35 μm) Note: Characteristics shown above are reference values and not guaranteed. 8 2019-1-31 TC78H651AFNG Error Detection Functions TSD (Thermal shut down) When the junction temperature (Tj) of the IC exceeds 170°C (typ.), all outputs are turned off. When the junction temperature (Tj) falls by 40°C (typ.) or more, it returns to the normal mode. Note: Above TSD operation and release thresholds are reference values, and are not guaranteed. ISD (Over current detection) When the IC detects an over current in the output transistors (exceeding ISD operation threshold value), all outputs are turned off. It has a dead band time of 1.5 μs (typ.) to avoid ISD misdetection, which may be triggered by switching noise, etc. ISD releases when one of the followings is provided. 1. Power supply turns on again. 2. Operation mode is re-configured after setting to the standby mode (pin voltages of IN1, IN2, IN3, and IN4 = low level). o peration threshold value (A)(A) ISD ISD operation threshold value VVMM-- ISD threshold (Reference ISD threshold (Reference data) data) 7.0 6.0 5.0 H bridge lower side Nch DMOS 4.0 3.0 2.0 H bridge upper side Pch DMOS 1.0 0.0 1 2 3 4 5 6 7 VM M (V) V (V) ISD operation threshold value Motor output current Dead band time: 1.5 μs (typ.) Output OFF Note: Above ISD operation threshold value and dead band time are reference values, and are not guaranteed. Under voltage lockout (UVLO) When VM pin voltage falls to 1.7 V (typ.) or less, all outputs are turned off. UVLO is released when VM pin voltage rises more than 1.7 V (typ.). Note: Above UVLO operation and release thresholds are reference values, and are not guaranteed. 9 2019-1-31 TC78H651AFNG Application Circuit Example VM Note1 Note2 VM OUT1 IN1 M IN2 OUT2 TC78H651AFNG OUT3 IN3 M IN4 OUT4 GND Note2 Note1: A power supply ceramics capacitor for noise absorption should be connected as close to the IC as possible. Note2: Utmost care is necessary in the design of VM and GND line since the IC may be destroyed by short-circuiting between outputs, by short-circuiting to the power supply or ground, or by short-circuiting between contiguous pins. Capacitor Connection to VM Pin Connect a capacitor to VM pin to reduce the effects of power supply noise and back electromotive force during inductive load drive for power supply stabilization. To avoid voltage drops due to the wire impedance, connect the capacitor as close as possible to the IC. Also, in the electrolytic capacitor, the ESR may cause a voltage drop. Therefore, use a ceramic capacitor with a low ESR. Select a capacity value that can stabilize the power supply voltage in the operation range after enough evaluation. Board Layout Example When NC pin is in open state Connect a ceramic capacitor as close as possible to VM pin. VM NC NC OUT4 IN4 OUT3 IN3 NC NC OUT1 IN1 OUT2 IN2 NC NC GND 10 Connector 2019-1-31 TC78H651AFNG Package Dimensions P-TSSOP16-0505-0.65-001 Unit: mm Weight: 0.06 g (typ.) 11 2019-1-31 TC78H651AFNG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Providing these application circuit examples does not grant a license for industrial property rights. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 12 2019-1-31 TC78H651AFNG Points to remember on handling of ICs (1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amplifier, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF When a motor reverses the rotation direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 13 2019-1-31 TC78H651AFNG RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ 14 2019-1-31