TC78H670FTG(O,EL)

TC78H670FTG TOSHIBA CD process Integrated Circuit Silicon Monolithic TC78H670FTG Clock-in and Serial controlled Bipolar Stepping Motor Driver 1. Outline The TC78H670FTG is a two-phase bipolar stepping motor driver using a PWM chopper which incorporate DMOS with low on-resistance in output transistors. The clock-in decoder is built in. P-VQFN16-0303-0.50-001 Weight: 22.9 mg (typ.) 2. Features • Built-in Dual H Bridges, Capable of controlling 1 bipolar stepping motor • PWM controlled constant-current drive • Power supply operating voltage: 2.5 V to 16.0 V • Output current ratings: 2.0 A (max) • Low on-resistance (High + Low side = 0.48 Ω (typ.)) MOSFET output stage • Allows full, half, quarter, 1/8, 1/16, 1/32, 1/64, 1/128 step operation • Built-in Sense resistor less current control architecture (Advanced Current Detection System) • Multi error detect functions (Thermal shutdown (TSD), Over current (ISD), motor load open (OPD) and Under voltage lockout(UVLO)) • Error detection (TSD/ISD/OPD) flag output function • Built-in VCC regulator for internal circuit • Chopping frequency of a motor can be adjusted by external resistor • Small QFN package with thermal pad (16pin) Note: Please be careful about thermal conditions during using. Note: It is possible to detect OPD only when Serial mode is selected. Start of commercial production 2020-01 © 2019-2020 Toshiba Electronic Devices & Storage Corporation 1 2020-07-02 TC78H670FTG 3. Pin Assignment (Top View) MODE2 / CLK / S_CLK MODE1 / SET_EN / LATCH 15 16 MODE0 / UP-DW / EN / ERR S_DATA 14 13 MODE3 / CW-CCW 1 12 STBY AGND 2 11 OSCM VM 3 10 VREF 4 9 PGND_B TC78H670FTG PGND_A 5 OUT_A+ 6 7 OUT_A- OUT_B- 8 OUT_B+ Note: Please solder the corner pads and the rear thermal pad of the QFN package, to the GND pattern of the PCB. 2 2020-07-02 TC78H670FTG 4. Pin Description Pin No. STBY = Low 1 STBY = High Pin description CLK-IN mode Serial mode MODE3 CW-CCW — MODE3: Step mode select pin CW-CCW: Current direction setup pin 2 AGND ← ← GND pin 3 VM ← ← Motor power supply input pin 4 PGND_A ← ← Ach Power GND pin 5 OUT_A+ ← ← A channel motor output(+) pin 6 OUT_A- ← ← A channel motor output(-) pin 7 OUT_B- ← ← B channel motor output(-) pin 8 OUT_B+ ← ← B channel motor output(+) pin 9 PGND_B ← ← Bch Power GND pin 10 VREF ← ← Current threshold reference pin 11 OSCM ← ← Internal oscillator frequency setting pin 12 STBY ← ← Standby pin 13 EN/ERR ← ← Enable(Motor output ON/OFF) pin / Error detection flag output pin 14 MODE0 UP-DW S_DATA 15 MODE1 SET_EN LATCH MODE1: Step mode select pin SET_EN: Step mode setting enable pin LATCH: Latch enable pin 16 MODE2 CLK S_CLK MODE2: Step mode select pin CLK: Step Clock input pin S_CLK: Serial clock input pin 3 MODE0: Step mode select pin UP-DW: Step mode setting pin S_DATA: Serial data input pin 2020-07-02 TC78H670FTG 5. Block Diagram VM AGND STBY INBuff STBY Control Regulator UVLO VREF GAIN OSC VREF OUT_A+ Predriver H Bridge ISD MODE3 / CW-CCW INBuff OUT_A- DAC MODE2 / CLK / S_CLK INBuff DET_ COMP SENS_ ILEVEL PGND_A MODE1 / SET_EN / LATCH INBuff OPD Control Logic MODE0 / UP-DW / S_DATA TSD INBuff OUT_B+ EN / ERR IOBuff OSCM OSCM Predriver ISD H Bridge OUT_B- DAC DET_ COMP SENS_ ILEVEL PGND_B Note: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. Note: All the grounding wires should be solid patterns and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, AGND, PGND_x, OUT_x+ and OUT_x- (x = A or B)) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mounting. 4 2020-07-02 TC78H670FTG 6. Input / Output Equivalent Circuit Pin name MODE3 / CW-CCW MODE2 / CLK / S_CLK MODE1 / SET_EN / LATCH MODE0 / UP-DW / S_DATA STBY Equivalent circuit MODE3 / CW-CCW MODE2 / CLK / S_CLK MODE1 / SET_EN / LATCH MODE0 / UP-DW / S_DATA STBY EN / ERR EN / ERR VREF VREF OSCM OSCM VM OUT_A+ OUT_AOUT_B+ OUT_BPGND_A PGND_B OUT_x+ OUT_x- X=A or B PGND_x Note: The equivalent circuit diagrams may be simplified for explanatory purposes. 5 2020-07-02 TC78H670FTG 7. Control Mode Select Function The MODE0-3 pins set Serial mode or CLK-IN mode. The control mode is set up by the input state of the MODE0-3 pins after releasing standby mode. MODE3 pin input MODE2 pin input MODE1 pin input MODE0 pin input L L L L Function Serial mode Other than the above CLK-IN mode VM tmodeho tmodeho tmodesu tmodesu H STBY L H MODE0 L H MODE1 L H MODE2 L H MODE3 L Control Mode Setting Non operation CLK-IN mode Non operation Serial mode Characteristics Symbol Test condition Min Typ. Max Unit Mode setting Setup time tmodesu To STBY edge 1 — — μs Mode setting Data hold time tmodeho From STBY edge 100 — — μs 6 2020-07-02 TC78H670FTG 8. Functional Description 1 (for CLK-IN mode) CLK Function Each up-edge of the CLK signal will shift the motor’s electrical angle per step. CLK pin input Function Up-edge Shifts the electrical angle per step Down-edge (State of the electrical angle does not change) ENABLE Function The EN pin controls the ON and OFF of the stepping motor outputs. Motor operation starts and stops by setting H and L to the EN pin. (When EN pin is set to L (OFF), all of the MOSFETs turn off and become high impedance (hereafter, Hi-Z).) Setting the EN pin to L, and avoiding the motor to operate during VM power-on and power-off (i.e., outside of the operating voltage range) is recommended. Then, switch the EN pin to H after the VM reaches the target voltage and becomes stable. EN pin input Function L OFF (Hi-Z) H ON (Normal operation mode) VM H STBY L H EN L Internal processing time 200μs(Reference value) CW-CCW Function CW-CCW pin controls the rotation direction of the motor. CW-CCW pin input Function L Counter clockwise operation (CCW) H Clockwise operation (CW) 7 2020-07-02 TC78H670FTG Step Resolution Select Function Step resolution is set up. TC78H670FTG has the two modes, Variable Mode and Fixed Mode. These modes are set up by the input state of MODE0-3 pins after releasing standby mode. Variable Mode: Variable mode can be started with Full step resolution and changed step resolution during motor operating Fixed Mode: Fixed mode can be started with the mode user selected and continued it during motor operating MODE3 pin input MODE2 pin input MODE1 pin input MODE0 pin input L L L H Full step resolution 1/2 step resolution (2-phase excitation) (1-2-phase excitation) L L H L Full step resolution 1/4 step resolution (2-phase excitation) (W1-2-phase excitation) L L H H Full step resolution 1/8 step resolution (2-phase excitation) (2W1-2-phase excitation) L H L L L H L H Full step resolution 1/32 step resolution (2-phase excitation) (8W1-2-phase excitation) L H H L Full step resolution 1/64 step resolution (2-phase excitation) (16W1-2-phase excitation) L H H H Full step resolution 1/128 step resolution (2-phase excitation) (32W1-2-phase excitation) H L L L Full step resolution (2-phase excitation) H L L H 1/2 step resolution (1-2-phase excitation) H L H L 1/4 step resolution (W1-2-phase excitation) H L H H H H L L H H L H 1/32 step resolution (8W1-2-phase excitation) H H H L 1/64 step resolution (16W1-2-phase excitation) H H H H 1/128 step resolution (32W1-2-phase excitation) Mode Variable Mode Fixed Mode 8 Function Full step resolution 1/16 step resolution (2-phase excitation) (4W1-2-phase excitation) 1/8 step resolution (2W1-2-phase excitation) 1/16 step resolution (4W1-2-phase excitation) 2020-07-02 TC78H670FTG When Step mode is changed during operating, Step resolution can be set by SET_EN pin and UP-DW pin. Step mode is changed synchronously with Step Clock. SET_EN pin input Function L Setting step mode is invalid H Setting step mode is available UP-DW pin input Function L Change step mode to high resolution H Change step mode to Low resolution [Example: Full Step 1/8 Step] EN SET_EN H L H L UP-DW H L H CLK L Step setting 1/1 1/2 1/4 1/8 9 1/4 2020-07-02 TC78H670FTG Timing Chart of Step Resolution Setting and Initial Angle The arrow in the below figures indicates the timing of initial angle. [Full step resolution] CLK H L +100% Iout (A) 0% -100% +100% Iout (B) 0% -100% CCW CW [1/2 step resolution] CLK H L +100% +71% Iout (A) 0% -71% -100% +100% +71% Iout (B) 0% -71% -100% CCW CW Note: Timing charts may be simplified for explanatory purpose. 10 2020-07-02 TC78H670FTG [1/4 step resolution] H CLK L +100% +92% +71% +38% Iout (A) 0% -38% -71% -92% -100% +100% +92% +71% +38% Iout (B) 0% -38% -71% -92% -100% CCW CW Note: Timing charts may be simplified for explanatory purpose. 11 2020-07-02 TC78H670FTG [1/8 step resolution] CLK H L +100% +98% +92% +83% +71% +56% +38% +20% Iout (A) 0% -20% -38% -56% -71% -83% -92% -98% -100% +100% +98% +92% +83% +71% +56% +38% +20% Iout (B) 0% -20% -38% -56% -71% -83% -92% -98% -100% CCW CW Note: Timing charts may be simplified for explanatory purpose. 12 2020-07-02 TC78H670FTG [1/16 step resolution] H L CLK +100% +98% +92% +83% +71% +56% +38% +20% Iout (A) 0% -20% -38% -56% -71% -83% -92% -98% -100% +100% +98% +92% +83% +71% +56% +38% +20% Iout (B) 0% -20% -38% -56% -71% -83% -92% -98% -100% CCW CW Note: Timing charts may be simplified for explanatory purpose. 13 2020-07-02 TC78H670FTG Step Setting and Current Percentage Current (%) 1/1 1/2 1/4 1/8 1/16 1/32 1/64 1/128 100% ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 99% ○ 98% 97% ○ 96% 95% ○ 94% 93% ○ 92% 91% ○ 90% 89% ○ ○ 88% 87% ○ 86% ○ 85% 84% ○ 83% ○ ○ 82% ○ 80% 79% ○ ○ ○ ○ ○ ○ ○ ○ 78% ○ 77% ○ 76% ○ ○ ○ ○ ○ 75% ○ 74% ○ ○ ○ 73% 71% ○ ○ ○ 81% 72% ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 70% ○ 69% ○ ○ 68% ○ 67% ○ ○ ○ 66% ○ 65% ○ ○ 64% ○ 63% ○ 62% ○ ○ ○ ○ ○ 61% ○ 60% ○ ○ ○ 59% ○ 58% ○ ○ 57% ○ 56% ○ ○ ○ ○ ○ 55% ○ 53% ○ 52% 14 ○ ○ 2020-07-02 TC78H670FTG Current (%) 1/1 1/2 1/4 1/8 1/16 1/32 51% ○ ○ ○ 49% ○ ○ 48% ○ 47% ○ ○ ○ ○ 46% ○ 45% ○ ○ 44% ○ 43% ○ ○ ○ 42% ○ 41% ○ ○ 39% ○ 38% ○ ○ ○ ○ ○ ○ 37% ○ 36% ○ ○ 35% ○ 34% ○ ○ ○ 33% ○ 31% ○ ○ 30% ○ 29% ○ ○ ○ ○ 28% ○ 27% ○ 25% ○ ○ ○ 24% ○ ○ 23% ○ 22% ○ ○ 21% ○ 20% ○ ○ ○ ○ ○ 18% ○ 17% ○ ○ 16% ○ 15% ○ ○ ○ 13% ○ 12% ○ ○ 11% ○ 10% ○ ○ ○ ○ 9% ○ 7% ○ ○ 6% ○ 5% ○ ○ ○ 4% ○ 2% 0% 1/128 ○ 50% 1% 1/64 ○ ○ ○ ○ ○ 15 ○ ○ ○ ○ 2020-07-02 TC78H670FTG Step Resolution and Set Current STEP 1/128 Ach Bch (%) (%) 1/64 Ach Bch (%) (%) 1/32 Ach Bch (%) (%) 1/16 Ach Bch (%) (%) Ach (%) Bch (%) Ach (%) Bch (%) Ach (%) Bch (%) θ0 100 0 100 0 100 0 100 0 100 0 100 0 100 0 θ1 100 1 θ2 100 2 100 2 θ3 100 4 θ4 100 5 100 5 100 5 θ5 100 6 θ6 100 7 100 7 θ7 100 9 θ8 100 10 100 10 100 10 100 10 99 12 99 15 99 15 99 17 98 20 98 20 98 20 98 20 98 22 97 24 97 24 96 27 96 29 96 29 96 29 95 31 94 34 94 34 93 36 92 38 92 38 92 38 92 38 92 38 91 41 90 43 90 43 89 45 88 47 88 47 88 47 — θ9 99 11 θ10 99 12 θ11 99 13 θ12 99 15 θ13 99 16 θ14 99 17 θ15 98 18 θ16 98 20 θ17 98 21 θ18 98 22 θ19 97 23 θ20 97 24 θ21 97 25 θ22 96 27 θ23 96 28 θ24 96 29 θ25 95 30 θ26 95 31 θ27 95 33 θ28 94 34 θ29 94 35 θ30 93 36 θ31 93 37 θ32 92 38 θ33 92 39 θ34 91 41 θ35 91 42 θ36 90 43 θ37 90 44 θ38 89 45 θ39 89 46 θ40 88 47 θ41 88 48 16 1/8 1/4 1/2 Full Ach (%) Bch (%) 2020-07-02 TC78H670FTG STEP 1/128 Ach Bch (%) (%) 1/64 Ach Bch (%) (%) θ42 87 49 87 49 θ43 86 50 θ44 86 51 86 51 θ45 85 52 θ46 84 53 84 53 θ47 84 55 θ48 83 56 83 56 θ49 82 57 θ50 82 58 82 58 θ51 81 59 θ52 80 60 80 60 θ53 80 61 θ54 79 62 79 62 θ55 78 62 θ56 77 63 77 63 θ57 77 64 θ58 76 65 76 65 θ59 75 66 θ60 74 67 74 67 θ61 73 68 θ62 72 69 72 69 θ63 72 70 θ64 71 71 71 71 θ65 70 72 θ66 69 72 69 72 θ67 68 73 θ68 67 74 67 74 θ69 66 75 θ70 65 76 65 76 θ71 64 77 θ72 63 77 63 77 θ73 62 78 θ74 62 79 62 79 θ75 61 80 θ76 60 80 60 80 θ77 59 81 θ78 58 82 58 82 θ79 57 82 θ80 56 83 56 83 θ81 55 84 θ82 53 84 53 84 θ83 52 85 θ84 51 86 51 86 θ85 50 86 — 1/32 Ach Bch (%) (%) 86 51 83 56 80 60 77 63 74 67 71 71 67 74 63 77 60 80 56 83 51 86 1/16 Ach Bch (%) (%) Ach (%) Bch (%) 83 56 83 56 77 63 71 71 71 71 63 77 56 83 56 83 17 1/8 1/4 1/2 Full Ach (%) Bch (%) Ach (%) Bch (%) Ach (%) Bch (%) 71 71 71 71 100 100 2020-07-02 TC78H670FTG STEP 1/128 Ach Bch (%) (%) 1/64 Ach Bch (%) (%) θ86 49 87 49 87 θ87 48 88 θ88 47 88 47 88 θ89 46 89 θ90 45 89 45 89 θ91 44 90 θ92 43 90 43 90 θ93 42 91 θ94 41 91 41 91 θ95 39 92 θ96 38 92 38 92 θ97 37 93 θ98 36 93 36 93 θ99 35 94 θ100 34 94 34 94 θ101 33 95 θ102 31 95 31 95 θ103 30 95 θ104 29 96 29 96 θ105 28 96 θ106 27 96 27 96 θ107 25 97 θ108 24 97 24 97 θ109 23 97 θ110 22 98 22 98 θ111 21 98 θ112 20 98 20 98 θ113 18 98 θ114 17 99 17 99 θ115 16 99 θ116 15 99 15 99 θ117 13 99 θ118 12 99 12 99 θ119 11 99 θ120 10 100 10 100 θ121 9 100 θ122 7 100 7 100 θ123 6 100 θ124 5 100 5 100 θ125 4 100 θ126 2 100 2 100 θ127 1 100 θ128 0 100 0 100 — 1/32 Ach Bch (%) (%) 1/16 Ach Bch (%) (%) 47 88 47 88 43 90 38 92 38 92 34 94 29 96 29 96 24 97 20 98 20 98 15 99 10 100 10 100 5 100 0 100 0 100 18 1/8 1/4 1/2 Ach (%) Bch (%) Ach (%) Bch (%) 38 92 38 92 20 98 0 100 0 100 Full Ach (%) Bch (%) 0 100 Ach (%) Bch (%) 2020-07-02 TC78H670FTG 9. Functional Description 2 (for Serial mode) Under the serial mode, it performs setting and motor control in the following 32 bit format. For the motor control, each current value is set in the serial setting, and the output is updated to the set current value at the timing of the LATCH signal. S_CLK S_DATA LATCH D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 MDT _A0 MDT _A1 PHA CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7 CA8 CA9 — — — D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 MDT _B0 MDT _B1 PHB CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7 CB8 CB9 TRQ 0 TRQ 1 OPD Note: Every issuing a command, the current setting transfers by one step. 19 2020-07-02 TC78H670FTG Register The registers to use the serial control are shown below. 9.1.1. PHx (x = A or B) The polality of the output current can be selected by PHx registers for each channel. PHx L Function Setting the direction of the output current to minus H * Default Setting the direction of the output current to plus 9.1.2. Cx0 to Cx9 (x = A or B) The output of each channel’s DAC for current limitation can be set by Cx0 to Cx9 registers. The relation between Setting DAC and the output current (Iout) are shown below. Iout (Max) = Vref (V) × Cx[9:0] 1023 × Setting torque by the torque function (%) 9.1.3. TRQ0 and TRQ1 The value of the motor torque can be set by TRQ0 and TRQ1 registers. TRQ1 TORQ0 Function L L L H Torque setting: 75% H L Torque setting: 50% H H Torque setting: 25% Torque setting: 100% * Default 9.1.4. OPD An ON/OFF of the open detection function of motor output pins can be switched by OPD register. OPD L H Function Open detection OFF * Default Open detection ON 20 2020-07-02 TC78H670FTG 9.1.5. Selectable Mixed Decay Function MDT_x0 and MDT_x1 (x = A or B) The Selectable Mixed Decay can adjust the current regeneration amount during the period of current regeneration. Though the Mixed Decay is determined by controlling 2 different types of Decay (Fast Decay and Slow Decay), this function enables the user to select the ratio of the Mixed Decay using MDT_x0 and MDT_x1 register. MDT_x1 MDT_x0 Function L L L H Fast Decay: 75% H L Fast Decay: 50% H H Fast Decay only Fast Decay: 37.5% (Fast Decay = OSCM × 6) * Default fchop OSCM internal signal Setting current (NFth) NF detection (MDT_x1/MDT_x0) = (L/L): Fast Decay 37.5% (MDT_x1/MDT_x0) = (L/H): Fast Decay: 75% (MDT_x1/MDT_x0) = (H/L): Fast Decay 50% (MDT_x1/MDT_x0) = (H/H): Fast Decay only Charge Mode -> NF detect -> Slow Decay -> Fast Decay -> 1 fchop cycle ->Charge Mode 1fchop cycle: OSCM × 16 clock Note: x = A or B Note: Decay control is controlled in order of Charge, Slow Decay and Fast Decay. Note: The blanking time(AtBLK) is also set to prevent an incorrect operation in the NF detection (the motor current reaches the set current value (NFth)).. Note: Timing charts may be simplified for explanatory purpose. 21 2020-07-02 TC78H670FTG Mixed Decay Waveform (Current Waveform) *Charge → Slow Decay → Fast Decay fchop fchop OSCM internal signal NF Detection NF Detection Setting current Iout Charge Slow Decay Fast Decay Note: Timing charts may be simplified for explanatory purpose. 22 2020-07-02 TC78H670FTG Constant Current PWM Function and Timings *Charge → Slow Decay → Fast Decay OSCM Internal signal OSCM Internal signal MDT setting MDT setting NF detection NF detection Setting current Setting current Iout Iout Charge Slow Decay Fast Decay Charge Slow Decay Fast Decay fchop fchop If the NF is detected during the early timing of the fchop cycle, the Slow Decay will be longer. If the NF is detected during the late timing of the fchop cycle, the Slow Decay will be shorter. The Charge period (the time until the motor current reaches the set current value) is determined by the operating status. Therefore the NF detection timing (the motor current reaches the set current value) with the chopping cycle (fchop) may change. If NF is detected in the early period of the fchop cycle, the Slow Decay will be longer. If NF is detected in the late period of the fchop cycle, the Slow Decay will be shorter, as shown above. Note: The chopping cycle is determined as: fchop - (Charge + Fast Decay) = Slow Decay (Fast Decay ratio can be changed by MDT_x0 and MDT_x1 (x = A or B) registers setting.) OSCM Internal signal MDT setting NF detection Setting current Iout Charge Fast Decay fchop If NF is detected within the MDT setting, Decay sequence will only be Fast Decay.(Slow Decay does not appear.) Note: Timing charts may be simplified for explanatory purpose. 23 2020-07-02 TC78H670FTG Mixed Decay current waveform *Charge → Slow Decay → Fast Decay  When the next current step is higher: fchop fchop fchop fchop OSCM Internal signal NF NF Setting current Slow Fast Setting current NF Fast Charge  NF Slow Slow Charge Fast Slow Charge Fast Charge When Charge Period is More Than 1 fchop Cycle: When the Charge period is longer than fchop cycle, the Charge period extends until the motor current reaches the NF threshold. Once the current reaches the next current step, then the sequence goes on to Decay mode. fchop fchop fchop fchop OSCM Internal signal NF Setting current Slow Fast Charge Setting current NF NF Slow Charge • Fast Charge Slow Fast When the Next Current Step is lower: fchop fchop fchop fchop OSCM Internal signal Charge mode will appear per each fchop cycle to check the current level using RS comparator. If the current level is Setting current NF switched to Slow Decay in a very short period. Slow Slow Charge already above the current set level, the sequence will be NF Fast Charge NF Fast Charge Setting current Slow NF Fast Charge Slow Fast Note: Timing charts may be simplified for explanatory purpose. 24 2020-07-02 TC78H670FTG Serial Setting Example when driving a motor Serial setting example for motor operation is shown below. The motor operates with full step resolution by transmitting from the 1st to 4th commands repeatedly. 1st Command D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 0 0 1 1 1 1 1 1 1 1 1 1 1 0 0 0 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 0 0 1 1 1 1 1 1 1 1 1 1 1 0 0 0 2nd Command D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 0 0 1 1 1 1 1 1 1 1 1 1 1 0 0 0 3rd Command D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 4th Command D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 0 0 1 1 1 1 1 1 1 1 1 1 1 0 0 0 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 25 2020-07-02 TC78H670FTG 10. Common Function (CLK-IN Mode and Serial Mode) Error Function (Error detect flag output) When TC78H670FTG detects some errors, ERR pin outputs low level to peripheral block. Since ERR pin and EN pin share the function, the below peripheral circuit between TC78H670FTG and HOST MCU should be inserted. In normal status, since the internal MOSFET is OFF, the level of ERR pin is equal to the MODE control voltage from outside. When the error function (Thermal shutdown (TSD), Over current (ISD), or motor load open (OPD)) occurs, ERR pin will become Low (the internal MOSFET is ON). When the error detection is released by reasserting the VM power supply or setting the device to STANDBY mode, ERR pins show “normal status”. TC78H670FTG HOST MCU EN EN/ERR TSD ISD OPD ERR Note: This figure may be simplified for explanatory purpose. Note: It is possible to detect OPD only when Serial mode is selected. ERR pin output Function H Normal status (Normal operation) L Detect error status (ISD, TSD, OPD) After detecting TSD detection: TC78H670FTG draws out currents of motor by Fast mode. If the output current is zerodetected or for 1ms at maximum, the output becomes Hi-Z. After detecting ISD detection: In H Bridge high-side (Pch DMOS) detection, TC78H670FTG draws out currents of motor by Slow mode on low-side. The output after 80 ms (typ.) becomes Hi-Z. In H Bridge low-side (Nch DMOS) detection, it draws out by Slow mode on high-side. Note: Above times are reference values, and are not guaranteed. 26 2020-07-02 TC78H670FTG STANDBY Function It is possible to switch to Standby mode by STBY pin. STBY pin input Function MEMO L Standby mode Electrical angle: 45° H Normal operation — Note: When STBY pin is Low, TC78H670FTG stops supplying the power to logic circuit. Therefore, Logic circuit is reset and Electrical angle and Step mode are initialized. H STBY L 1ms at maximum (Reference value) Output current Internal processing time 100μｓ(Reference value) Mode Normal mode 27 Standby mode 2020-07-02 TC78H670FTG 11. Output Transistor Function Mode VM VM U1 ON VM U2 U1 U2 OFF OFF OFF OUT_xOUT_x+ OUT_x- OUT_x+ U2 U1 OFF ON OUT_x+ Load Load L1 OFF Load OUT_x- L2 L1 L2 L1 L2 ON ON ON ON OFF PGND_x PGND_x PGND_x x = A or B Charge mode A current flows into the motor coil. Note: Slow mode A current circulates around the motor coil and this device. Fast mode The energy of the motor coil is fed back to the power. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Output Transistor Function MODE U1 U2 L1 L2 Charge ON OFF OFF ON Slow OFF OFF ON ON Fast OFF ON ON OFF Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above. If the current flows in the opposite direction, refer to the following table. MODE U1 U2 L1 L2 Charge OFF ON ON OFF Slow OFF OFF ON ON Fast ON OFF OFF ON This IC controls the motor current to be constant by changing 3 modes listed above automatically Note: To eliminate shoot-through current that flows from supply to ground due to the simultaneous conduction of high side and low side transistors in the bridge output, a dead time (100ns (Reference value)) is generated in this IC when transistors switch from on to off, or vice versa. 28 2020-07-02 TC78H670FTG 12. Calculation of the Predefined Output Current The peak output current (Setting current value) can be set via the reference voltage (Vref), as follows: Iout (Max) = 1.1 × Vref (V) 13. OSCM Oscillation Frequency and Chopping Frequency The OSCM oscillation frequency (fOSCM) and chopping frequency (fchop) can be adjusted by the external resistor (ROSC) connecting to OSCM pin. ROSC[kΩ] fOSCM [kHz](typ.) fchop[kHz](typ.) 18 3290 206 22 2691 168 30 1982 124 39 1526 95 47 1266 79 56 1064 66 75 795 50 91 656 41 If chopping frequency is raised, ripple of current will become small and wave-like reproducibility will improve. However, the gate loss inside IC goes up and generation of heat becomes large. By lowering chopping frequency, reduction in generation of heat is expectable. However, ripple of current may become large. It is a standard about 70 kHz. A setup in the range of 50 kHz to 100 kHz is recommended. 29 2020-07-02 TC78H670FTG 14. Absolute Maximum Ratings (Ta = 25°C) Characteristics Rating Unit Remarks 20 V Outputs are OFF 18 V Outputs are ON 20 V STBY pin = L -0.4 to 18 V STBY pin = H Iout 2.0 A (Note 1) VIN(H) 6.0 V — VIN(L) -0.4 V — ERR output pin voltage VLO 6.0 V — ERR output pin inflow current ILO 6.0 mA — Power dissipation PD 1.79 W (Note 2) Operating temperature Topr -40 to 85 °C — Storage temperature Tstg -55 to 50 °C — Junction temperature Tj(max) 150 °C — Motor output voltage Motor power supply (non-active) Motor power supply (active) Motor output current Logic input voltage Symbol Vout VM Note1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a standard on thermal rating. The maximum output current may be further limited in view of thermal considerations, depending on ambient temperature and board conditions. Note2: When mounted on the board (JEDEC 4 layers) (Ta =25°C) When Ta exceeds 25°C, it is necessary to do the derating with 14.3 mW/°C. Ta: Ambient temperature Topr: Ambient temperature while the IC is active Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the maximum junction temperature, Tj (MAX), will not exceed 120°C. Caution) Absolute maximum ratings The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The TC78H670FTG does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated maximum is applied. All voltage ratings, including supply voltages, must always be followed. The other notes and considerations described later should also be referred to. 30 2020-07-02 TC78H670FTG 15. Operating Range (Ta = -40 to 85°C) Characteristics Symbol Min Typ. Max Unit Remarks Motor power supply VM 2.5 - 16.0 V - Motor output current Iout - 1.1 2.0 A (Note 1) ERR pin output voltage VLO - - 5.5 V - Vref reference voltage Vref 0 - 1.8 V - Note1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions (exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on). 16. Electrical Specifications 1 (Ta = 25°C, VM = 2.5 to 16V unless otherwise specified) Characteristics Symbol Test condition Min Typ. Max Unit HIGH VIN(H) Logic input (Note1) 1.5 — 5.5 V LOW VIN(L) Logic input (Note1) 0 — 0.7 V VIN(HYS) Logic input (Note1) — 60 — mV HIGH IIN(H) VIN(H) = 3.3 V — 33 45 μA LOW IIN(L) VIN(L) = 0 V — — 1 μA LOW VOL(LO) IOL = 5 mA, output = L — — 0.5 V IM1 Output pins = open Standby mode — — 0.1 μA IM2 Output pins = open EN pin = L in releasing Standby mode — 2.8 3.5 mA IM3 Output pins = open Full step resolution fCLK=75 kHz — 3.3 4.3 mA High-side IOH VM = 18 V, Vout = 0 V — — 1 μA Low-side IOL VM = Vout = 18 V -1 — — μA Motor current channel differential ΔIout1 Current differential between Ch -5 0 5 % Motor current setting accuracy ΔIout2 Iout = 1.1 A -5 0 5 % Ron(H+L) Tj = 25°C, VM = 12 V, Iout = 1 A — 0.48 0.6 Ω Logic input voltage Logic input hysteresis voltage Logic input current ERR pin output voltage Current consumption Output leakage current Motor output ON resistance (High side + Low side) Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM voltage reaches the proper operating range. Note1: VIN(H) is defined as the VIN voltage that causes the outputs (OUT_A+ pin, OUT_A- pin, OUT_B+ pin, OUT_Bpin) to change when a pin under test is gradually raised from 0 V.VIN(L) is defined as the VIN voltage that causes the outputs (OUT_A+ pin, OUT_A- pin, OUT_B+ pin, OUT_B- pin) to change when the pin is then gradually lowered from 5V. The difference between VIN(H) and VIN(L) is defined as the VIN(HYS). 31 2020-07-02 TC78H670FTG 17. Electrical Specifications 2 (Ta = 25°C, VM = 2.5 to 16V unless otherwise specified) Characteristics Symbol Test condition Min Typ. Max Unit Iref Vref = 1.8 V — 0 1 μA Thermal shutdown (TSD) threshold (Note1) TjTSD — 145 165 175 °C UVLO release voltage (Note 2) VUVLO At rising VM 2.1 2.3 — V Vhys_uvlo — — 200 — mV ISD VM = 12V 2.5 3.2 4.2 A Vref input current UVLO hysteresis voltage Over current detection (ISD) threshold (Note3) Note1: Thermal shutdown (TSD) When the junction temperature of the device reaches the TSD threshold, the TSD circuit is triggered; the internal reset circuit then turns off the output transistors. Once the TSD circuit is triggered, the device will set output pin to Hi-Z, and can be cleared by reasserting the VM power source, or setting the STBY pins to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used aggressively. Note 2: Under voltage lockout (UVLO) When the supply voltage to VM pin is 2.1 or less (typ.), the internal circuit is triggered; the internal reset circuit then turns off the output transistors. Once the UVLO is triggered, it can be cleared by reasserting the VM supply voltage to 2.3V or more (typ.) Note3: Over current detection (ISD) When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors. It has a dead band time of 1.2 μs (typ.) to avoid ISD false triggering by switching noise. Once the ISD circuit is triggered, the device will set output pins to Hi-Z, and can be cleared by reasserting the VM power source, or setting the STBY pin to standby mode. VM-ISD threshold 5.0 H Bridge low-side Nch DMOS ISD threshold[A] 4.0 3.0 H Bridge high-side Pch DMOS 2.0 1.0 0.0 0 5 10 VM [V] 15 20 ISD threshold Output current Dead band time: 1.2 μs (typ.) Slow mode 80ms (typ.) Output pins to Hi-Z Note: Above ISD operation threshold value and band times are reference values, and are not guaranteed. 32 2020-07-02 TC78H670FTG Back-EMF While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be fully verified that there is no risk that the TC78H670FTG or other components will be damaged or fail due to the motor back-EMF. Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD) The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an output short-circuit; they do not necessarily guarantee the complete IC safety. If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device may be damaged due to an output short-circuit. The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed immediately by external hardware. IC Mounting Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or deterioration of the device. 33 2020-07-02 TC78H670FTG 18. AC Electrical Specification 1 (Ta = 25°C, VM =12V, 6.8 mH/5.7 Ω unless otherwise specified) Characteristics Symbol Test condition Min Typ. Max Unit fCLK — — — 400 kHz Inside filter of CLK input minimum High width tCLK(H) The CLK(H) minimum pulse width 500 — — ns Inside filter of CLK input minimum Low width tCLK(L) The CLK(L) minimum pulse width 500 — — ns tr — 10 20 30 ns tf — 10 20 30 ns tpLH(CLK) — — 840 — ns tpHL(CLK) — — 900 — ns AtBLK VM = 12 V 340 540 740 ns Oscillator frequency accuracy ∆fOSCM ROSC = 47 kΩ VM = 2.5 V to 16 V -15 — +15 % Oscillator reference frequency fOSCM ROSC = 47 kΩ 1076 1266 1456 kHz fchop Output: Active, fOSCM = 1266 kHz — 79 — kHz CLK input frequency Output transistor switching specific Analog noise blanking time Chopping frequency AC Electrical Specification Timing chart 1/fCLK tCLK(L) CLK 50% tCLK(H) tpLH(CLK) Output OUT_A+ OUT_AOUT_B+ OUT_B- 50% 50% 90% tpHL(CLK) 90% 50% 50% 10% 10% tr tf Note: Timing charts may be simplified for explanatory purpose. 34 2020-07-02 TC78H670FTG 19. AC Electrical Specification 2 (Ta = 25°C, VM = 2.5 to 16V unless otherwise specified) Symbol Test condition Min Typ. Max Unit No.in Timing Chart Serial CLK frequency fSCLK VIN = 3.3 V 1.0 — 25 MHz — CLK cycle tsCKW VIH = 3.3 V, VIL = 0 V, tr = tf = 23 ns 46 — — ns — 40 — — ns 1 20 — — ns 2 20 — — ns 3 20 — — ns 4 10 — — ns 5 10 — — ns 6 10 — — ns 7 40 — — ns 8 1.32 — — μs 9 Characteristics tw(CLK) Minimum CLK pulse width twp(CLK) VIN = 3.3 V twn(CLK) Minimum LATCH pulse width tLATCH (H) tsuSIN - CLK Data setup time tsuLT - CLK thSIN - CLK Data hold time thLT - CLK LATCH cycle tcLT VIN = 3.3 V VIN = 3.3 V VIN = 3.3 V VIN = 3.3 V tw(CLK) 1 H 50% S_CLK 50% L tsuLT – CLK 　　6 thLT-CLK 8 3 2 twn(CLK) twp(CLK) tcLT 9 H LATCH 50% 50% L 4 tLATCH(H) tsuSIN – CLK thSIN – CLK 　7 　5 H S_DATA 50% D31 50% D0 D1 D2 D31 L 35 2020-07-02 TC78H670FTG 20. (Reference data) PD–Ta Characteristics PD - Ta 2.0 1.8 1.6 PD(W) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 Ta (ºC) 100 125 150 When mounted on the board (JEDEC 4 layers) Note: Characteristics shown above are reference values and not guaranteed. 36 2020-07-02 TC78H670FTG 21. Application Circuit Example VREF VM CVREF VREF CVM2 CVM1 VM STBY OUT_A+ OUT_A- MODE3/CW-CCW PGND_A MODE2/CLK/S_CLK MODE1/SET_EN/LATCH TC78H670FTG MCU OUT_B+ MODE0/UP-DW/S_DATA OUT_BREN EN/ERR PGND_B CEN AGND OSCM ROSC The application circuit shown in this document is provided for reference purposes only. The data for mass production are not guaranteed. Component values (for reference only) Part’s symbol Component Value CVM1 Electrolytic capacitor 47 μF CVM2 Ceramic capacitor 0.1 μF CVREF Ceramic capacitor 0.1 μF CEN Ceramic capacitor 22 nF ROSC Resistor 47 kΩ REN Resistor 10 kΩ Note: Componet values in above table are for reference only. Some components other than reference value can be adopted depending on the usage conditions. 37 2020-07-02 TC78H670FTG 22. Package Dimensions P-VQFN16-0303-0.50-001 Unit: mm Weight: 22.9 mg (typ.) 38 2020-07-02 TC78H670FTG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Providing these application circuit examples does not grant a license for industrial property rights. 39 2020-07-02 TC78H670FTG IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. 40 2020-07-02 TC78H670FTG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor reverses the rotation direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 41 2020-07-02 TC78H670FTG RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ 42 2020-07-02