TCD1254GFG（8Z,AA）

TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device) TCD1254GFG TCD1254GFG TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device) TCD1254GFG The TCD1254GFG is a high sensitive and low dark current 2500 elements CCD linear image sensor. This device consists of sensitivity CCD chip. The TCD1254GFG has electronic shutter function (ICG). Electronic shutter function can keep always output voltage constant that vary with intensity of lights. Features WQFN16X-240A  Number of Image Sensing Elements: 2500 elements  Image Sensing Element Size: 5.25m by 64m on 5.25 m  Photo Sensing Region: High sensitive PN photodiode  Power Supply Voltage: 3.0 V (min)  Internal Circuit: CCD drive circuit  Package: 16 pin GLCC  Function: Electronic shutter, Sample and hold circuit center ABSOLUTE MAXIMUM RATINGS (Note 1) Characteristic Symbol Pin Connections (top view) Rating Unit -0.3 to +7.0 V Information in this datasheet is preliminary and should not be relied on in undertaking system design. Master clock pulse voltage VM Shift pulse voltage VSH Integration clear pulse voltage VICG Digital power supply voltage VDD Analog power supply voltage VAD Operating temperature Topr -25 to +60 °C Storage temperature Tstg -40 to +85 °C Note 1: All voltages are with respect to SS terminals (ground). None of the ABSOLUTE MAXIMUM RATINGS must be exceeded, even instantaneously. If any one of the ABSOLUTE MAXIMUM RATINGS is exceeded, the electrical characteristics, reliability and life time of the device cannot be guaranteed. If the ABSOLUTE MAXIMUM RATINGS are exceeded, the device can be permanently damaged or degraded. Create a system design in such a manner that any of the ABSOLUTE MAXIMUM RATINGS will not be exceeded under any circumstances. © 2017 Toshiba Electronic Devices & Storage Corporation 1 Rev.1.3 2019-01-24 TCD1254GFG Circuit Diagram CCD analog shift register 2 Shift gate 2 Integration clear gate 2 Signal output buffer  Photodiode  Integration clear gate 1 Shift gate 1 CCD analog shift register 1 Logic circuit Pin Names Information in this datasheet is preliminary and should not be relied on in undertaking system design. Pin No. Symbol 1 OS 2 SS 3 4 Name Pin No. Symbol Name Output signal 16 NC Non connection* Ground 15 NC Non connection* VAD Power supply (Analog) 14 NC Non connection* VDD Power supply (Digital) 13 NC Non connection* 5 M Master clock 12 NC Non connection* 6 ICG Integration clear gate 11 NC Non connection* 7 SH Shift gate 10 NC Non connection* 8 NC Non connection* 9 NC Non connection* * All NC pins should be kept open, or connected to ground on PCB. © 2017 Toshiba Electronic Devices & Storage Corporation 2 Rev.1.3 2019-01-24 TCD1254GFG Optical/Electrical Characteristics Ta  25°C, VAD  VDD  4.0 V, V  4.0 V (pulse), fM  2.0 MHz (data rate  1.0 MHz), tINT (integration time)  10 ms, light source  daylight fluorescent lamp Characteristics Sensitivity Photo response non uniformity Register imbalance Symbol Min Typ. Max Unit Note R 72 103  V/lxs (Note 2) PRNU   10 % (Note 3) RI  1.5 3 % (Note 4) VSAT 0.7 1.0  V (Note 5) Saturation exposure SE  0.01  lxs (Note 6) Dark signal voltage VMDK  2.5 15 mV (Note 7) DC power dissipation PD  24 60 mW  Total transfer efficiency TTE 92 95  % (Note 8) 92 95  % (Note 9) 83 88  % (Note 10) ZO  0.5 1.0 k  DC output signal voltage VOS 1.5 2.3 3.0 V (Note 11) Dynamic range DR  400   (Note 12) Saturation output voltage Low voltage total transfer efficiency Output impedance LVTTE Note 2: Sensitivity is defined for signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU is defined for a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature, where measured approximately 500 mV of signal output. X PRNU   100 (%) X Information in this datasheet is preliminary and should not be relied on in undertaking system design. X : Average of total signal outputs X: The maximum deviation from X Note 4: Register imbalance is defined as follows. Y ×100 (%) RI  X X : Average of total signal outputs Y: | average of odd effective signal outputs  average of even effective signal outputs | Note 5: VSAT is defined as the minimum saturation output voltage of all effective pixels. Note 6: Definition of SE: VSAT SE  R Note 7: VMDK is defined as the maximum dark signal voltage of all effective pixels. OS VMDK © 2017 Toshiba Electronic Devices & Storage Corporation 3 Rev.1.3 2019-01-24 TCD1254GFG Note 8: Total transfer efficiency is defined as follows. * Q0  500 mV Average of dummy outputs Q1’ Q0’ Q0 Q1 TTE  Q0  100 Q0  Q1 Use Q0’ and Q1’ instead of Q0 and Q1 if Q1’  Q1. Note 9: Definition of low voltage total transfer efficiency is the same as Note 8 without power supply and Q0. * 4 V  Power supply  5 V * Q0  50 mV Note 10: Definition is the same as Note 9 without power supply as follows. * 3 V  Power supply  4 V Note 11: DC output signal voltage is defined as follows. OS VOS SS Information in this datasheet is preliminary and should not be relied on in undertaking system design. Note 12: Definition of DR: VSAT DR  VMDK VMDK is proportional to tINT (integration time). So the shorter integration time makes wider dynamic range. © 2017 Toshiba Electronic Devices & Storage Corporation 4 Rev.1.3 2019-01-24 TCD1254GFG Recommended Operating Conditions (Ta  25°C) For best performance, the device should be used within the Recommended Operating Conditions. Characteristics Symbol “H” level Master clock pulse voltage VM “L” level “H” level Shift pulse voltage VSH “L” level “H” level Integration clear pulse voltage VICG “L” level Min Typ. Max 3.0 4.0 5.0 0 0 0.44 3.0 4.0 5.0 0 0 0.44 3.0 4.0 5.0 0 0 0.44 Unit Note V (Note 13) V (Note 13) V (Note 13) Power supply voltage (Digital) VDD 3.0 4.0 5.0 V (Note 14) Power supply voltage (Analog) VAD 3.0 4.0 5.0 V (Note 14) Note 13: “H” level of the maximum pulse voltage  VDD  VDD  0.5 V  “H” level of the minimum pulse voltage. Note 14: VAD  VDD Clock Characteristics (Ta  25°C) (3.0 V  VAD  VDD  5.0 V) For best performance, the device should be used within the Recommended Operating Conditions. Characteristics Symbol Min Typ. Max Unit fM 0.4 2.0 4.0 MHz fDATA 0.2 1.0 2.0 MHz  10  pF Master clock pulse frequency Data rate Master clock capacitance CM Shift gate capacitance CSH  200  pF Integration clear gate capacitance CICG  50  pF Information in this datasheet is preliminary and should not be relied on in undertaking system design. Power-on Characteristics CCD sensor has the characteristics that a correct output signal will be appeared after power supply reached to regular voltage. It is required to 10 cycles of read out time at least after power supply reached to regular voltage. This characteristics should be considered, when circuit designs. © 2017 Toshiba Electronic Devices & Storage Corporation 5 Rev.1.3 2019-01-24 TCD1254GFG Timing Chart 1 tINT（integration time） SH ICG M Dummy outputs (16 elements) D45 D46 D44 D43 D41 D42 S2498 S2499 S2500 D32 D33 D34 D35 D36 D37 S2496 S2497 D25 D26 D27 D28 D29 D30 D31 S1 S2 S3 D13 D14 D15 D16 D17 D18 D19 OS D0 D1 D2 D3 Information in this datasheet is preliminary and should not be relied on in undertaking system design. Light shielded outputs (13 elements) (3 elements) Dummy outputs (32 elements) Effective outputs (2500 elements) Dummy outputs (15 elements) 1 line readout period (2547 elements) © 2017 Toshiba Electronic Devices & Storage Corporation 6 Rev.1.3 2019-01-24 TCD1254GFG Timing Chart 2 (Use Electronic Shutter Function) tINT (integration time) Readout time SH ICG M Dummy outputs (16 elements) D45 D46 D44 D43 D41 D42 S2498 S2499 S2500 D32 D33 D34 D35 D36 D37 S2496 S2497 D25 D26 D27 D28 D29 D30 D31 S1 S2 S3 D13 D14 D15 D16 D17 D18 D19 OS D0 D1 D2 D3 Information in this datasheet is preliminary and should not be relied on in undertaking system design. Light shielded outputs (13 elements) (3 elements) Dummy outputs (32 elements) Effective outputs (2500 elements) Dummy outputs (15 elements) 1 line readout period (2547 elements) © 2017 Toshiba Electronic Devices & Storage Corporation 7 Rev.1.3 2019-01-24 TCD1254GFG Timing Requirements t2 t3 t1 t4 SH ICG M OS Characteristics D1 D0 D2 Symbol Min Typ. Max Unit ICG pulse delay t1 1000 5000  ns Pulse timing of ICG and SH t2 100 500 1000 ns Shift pulse width t3 1000   ns Pulse timing of ICG and M t4 0 20  ns *: To keep M “H” level when ICG switch from “L” to “H” level. Information in this datasheet is preliminary and should not be relied on in undertaking system design. Use Electronic Shutter Pulse timing of SH and ICG tINT (integration time) t3 ** *** *** *** **** ・・・・・・・・・・・ SH ICG Readout time ** : Each SH high pulse have to keep always the same value with “t3“. (t3  1000 ns (min)) *** : SH pulse cycle have to keep the same cycle (SH cycle period  10 s) except tINT period. **** : tINT  10 s (min) Note: The illumination of light source must be used with less than 1000 times based on 0.7 V signal output with10 ms tINT. © 2017 Toshiba Electronic Devices & Storage Corporation 8 Rev.1.3 2019-01-24 TCD1254GFG Typical Performance Curves Relative response Spectral Response Wavelength [nm] Sensitivity Response SENSITIVITY RESPONSE 200 Sensitivity [V/lx·s] SENSITIVITY (V/lx.s) Information in this datasheet is preliminary and should not be relied on in undertaking system design. 150 100 50 0 3 3.5 4 4.5 5 PowerSUPPLY supply VAD , VDDVDD [V] (V) POWER VAD, © 2017 Toshiba Electronic Devices & Storage Corporation 9 Rev.1.3 2019-01-24 TCD1254GFG Typical Performance Curves DC output signal voltage VOS [V] DC Output Signal Voltage – Power Supply Voltage Power supply VAD, VDD [V] Information in this datasheet is preliminary and should not be relied on in undertaking system design. © 2017 Toshiba Electronic Devices & Storage Corporation 10 Rev.1.3 2019-01-24 TCD1254GFG Typical Drive Circuit * All NC pins should be kept open, or connected to ground on PCB. 4.0 V 4.0 V 10 F/25 V Information in this datasheet is preliminary and should not be relied on in undertaking system design. © 2017 Toshiba Electronic Devices & Storage Corporation 11 Rev.1.3 2019-01-24 TCD1254GFG Cautions 1. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. b. c. d. e. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. Ground the tools such as cutting pliers, tweezers or pincer. When the product is handed, please use tweezers to avoid the damage of CCD image sensor. Ionized air is recommended for discharge when handling CCD image sensors. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 2. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 3. Ultrasonic Cleaning Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because the bonding wires can become disconnected due to resonance during the cleaning process. 4. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. Information in this datasheet is preliminary and should not be relied on in undertaking system design. © 2017 Toshiba Electronic Devices & Storage Corporation 12 Rev.1.3 2019-01-24 TCD1254GFG 5. Cleaning Method of the Window Glass Surface Wiping Cloth a. Use soft cloth with a fine mesh. b. The wiping cloth must not cause dust from itself. c. Use a clean wiping cloth necessarily. Cleaner When using solvents, such as alcohol, unavoidably, it is cautious of the next. a. A clean thing with quick-drying. b. After liquid dries, there needs to be no residual substance. c. A thing safe for a human body. And, please observe the use term of a solvent and use the storage container of a solvent to be clean. Be cautious of fire enough. Way of Cleaning First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated. Please wipe down the surface of window glass at least 2 times or more. Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of window glass at least 3 times or more. Finally, blow cleaning is performed by dry N2 filtered. If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains, TOSHIBA recommends repeating the clean operation from the beginning. Be cautious of the next thing. a. Don't infiltrate the cleaner too much. b. A wiping portion is performed into the optical range and don't touch the edge of window glass. c. Be sure to wipe in a long direction and the same direction. d. A wiping cloth always uses an unused portion. Information in this datasheet is preliminary and should not be relied on in undertaking system design. Wiper © 2017 Toshiba Electronic Devices & Storage Corporation 13 Rev.1.3 2019-01-24 TCD1254GFG The Standard Reflow Condition for GLCC (Surface Mount Device) 1. Storage Precautions 1) 2) 3) 4) 5) 6) 2. CCD surface mount products may have a haze on the inside of glass, so be careful about following. Even if the haze arises inside of glass, when it is not on the pixel area, there is no problem in quality. Do not drop or toss device packaging. The laminated aluminum material in it can be rendered ineffective by rough handling. Ensure devices should be stored in a 30°C·90 %RH or better environment. Use devices within 12 months; do not store them longer than that. In the following cases, in order to remove humidity from a device, bake for 24 hours at 125°C. When a "30 % humidity indicator" has become pink after the package opened, or when the effective period of the indicator has passed. Prevent destruction of the device by static electricity in the case of the bake processing for removing humidity. After opening moisture-proof packing, store a product in 30°C·60 %RH or better environment and use them within five days. If the effective usage period passed after opening the moisture-proof packing, baking should be done before use at 125°C for 24 hours. Mounting Conditions Using Reflow 1) Mounting method: 2) 3) Preheating condition: Reflow condition: 4) Heating times: (a) Hot air reflow (b) Infrared ray reflow 150 to 180°C, 60 to 120 s (a) Maximum 240°C (b) Over 230°C, within 30 to 50 s Only 1 time * The temperature profile is specified in terms of the temperature of top surface of the device. This temperature profile shows the maximum guaranteed device temperature. Please set up the optimum temperature profile conditions within the fig.1 profile. Information in this datasheet is preliminary and should not be relied on in undertaking system design. Reflow Profile Main-Heat 30 to 50 [s] Pre-Heat 60 to 120 [s] Time [s] fig.1 Example of recommended temperature profile for reflows In addition, in case of the repair work accompanied by IC removal, since the degree of parallel may be spoiled with the left solder, please do not carry out. © 2017 Toshiba Electronic Devices & Storage Corporation 14 Rev.1.3 2019-01-24 TCD1254GFG 3. Mounting 1) 2) 3) 4) 5) 4. In the case of solder mounting, the devices should be mounted with the window glass protective tape in order to avoid dust or dirt included in reflow machine. The window glass protective tape is manufactured from materials in which static charges tend to build up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape from being charged with static electricity. When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as black or white flaws on the image, please wipe the window glass surface with the cloth into which the organic solvent was infiltrated. Then please attach CCD to a product. Do not reuse the window glass protective tape. The parts of glass seal area have possibility to be became clouded by reflow process, however, there is no problem in quality. Foot Pattern on the PCB We recommend fig.2’s foot pattern for your PCB (Printed Circuit Board). Unit: mm Information in this datasheet is preliminary and should not be relied on in undertaking system design. fig.2 Foot pattern 5. Mask for Solder Paste Application We recommend metal mask that have the following thickness. Thickness: 0.1 mm. And we recommend that the opened area size on the metal mask is 100 % for pads on solder. © 2017 Toshiba Electronic Devices & Storage Corporation 15 Rev.1.3 2019-01-24 TCD1254GFG Package Dimensions WQFN16X-240A 3.250.15 Unit: mm 13.13(5.25 µm  2500) Information in this datasheet is preliminary and should not be relied on in undertaking system design. Note 1: Distance between the edge of the package and the first pixel (S1) Note 2: Distance between the top of chip and bottom of the package Note 3: Distance between the edge of the package and the chip center © 2017 Toshiba Electronic Devices & Storage Corporation 16 Rev.1.3 2019-01-24 TCD1254GFG RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”.  TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.  This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.  Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. 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