TCK105G,LF

TCK104G,TCK105G TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK104G, TCK105G Load Switch IC with Current Limit function The TCK104G and TCK105G are load switch ICs for power management with slew rate control driver and current limit function featuring wide input voltage operation from 1.1 to 5.5 V. Switch ON resistance is only 50 mΩ typical at 5.0V, -700mA load condition and these feature a slew rate control driver, thermal shutdown and output auto-discharge function. Output current type is available on -500mA, and -800mA. Thus it is easy to select devices and helpful for the design. This device is available in 0.4 mm pitch ultra small package WCSP6B (0.8 mm x 1.2 mm, t: 0.64 mm (max)) .Thus this devices is ideal for portable applications that require high-density board assembly such as cellular phone. WCSP6B Weight: 1 mg (typ.) Feature • • Wide input voltage operation: VIN = 1.1 to 5.5 V Low ON resistance : RON = 50 mΩ (typ.) at VIN = 5.0 V, -700 mA RON = 55 mΩ (typ.) at VIN = 3.3 V, -700 mA RON = 75 mΩ (typ.) at VIN = 1.8 V, -700 mA RON = 140 mΩ (typ.) at VIN = 1.2 V, -700 mA • Low Quiescent Current: IQ = 20 μA (typ.) at IOUT = 0 mA • Low standby current: IQ(OFF) = 0.1 μA (typ.) at OFF state • Current limit function • Inrush current reducing circuit • Thermal Shutdown function • Auto-discharge • Pull down connection between CONTROL and GND • Ultra small package : WCSP6B (0.8mm x 1.2mm, t: 0.64mm(max)) Start of commercial production 2013-04 1 2014-03-01 TCK104G,TCK105G Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Input voltage VIN -0.3 to 6.0 V Control voltage VCT -0.3 to 6.0 V Output voltage VOUT -0.3 to VIN +0.3 V Output current IOUT TCK104G 800 TCK105G 1200 mA Power dissipation PD 800 (Note 1) mW Operating temperature range Topr −40 to 85 °C Junction temperature Tj 150 °C Storage temperature Tstg −55 to 150 °C Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Rating at mounting on a board (Glass epoxy board dimension: 40mm x 40mm, both sides of board Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5mm x 28) Pin Assignment(Top view) 1 A B C Top marking 2 Index A1: VOUT B1: VOUT C1: GND A2: VIN B2: VIN C2: CONTROL Lot trace code T: TCK104G U: TCK105G 2 2014-03-01 TCK104G,TCK105G Block Diagram VOUT VIN Thermal Shut down Slew Rate Control Driver Current Limit Control Logic CONTROL Output Discharge Pull Down GND Function Table Function Part number Current limit TCK104G TCK105G Bulit in (Available up to 500mA) Bulit in (Available up to 800mA) Thermal Shutdown Output auto-discharge Control pin connection Bulit in Bulit in Pull down Bulit in Bulit in Pull down 3 2014-03-01 TCK104G,TCK105G Electrical Characteristics DC Characteristics (Ta = -40 to 85°C) Ta = −40 to 85°C Ta = 25°C Characteristics Symbol Input voltage VIN CONTROL High-level input voltage VIH CONTROL Low-level input voltage VIL Quiescent current ( ON state) IQ Standby current ( OFF state) IQ(OFF) OFF-state switch current ISD(OFF) Test Condition Typ. Max Min Max ⎯ 1.1 ⎯ 5.5 1.1 5.5 1.2 V < VIN ≤ 5.5 V 1.0 ⎯ ⎯ 1.0 ⎯ 1.1 V ≤ VIN ≤ 1.2 V 0.9 ⎯ ⎯ 0.9 ⎯ VIN = 1.1 to 5.5 V ⎯ ⎯ 0.4 ⎯ 0.4 V ⎯ 20 ⎯ ⎯ 65 μA ⎯ 0.1 ⎯ ⎯ 1 μA VIN = 5.0 V ⎯ 20 ⎯ ⎯ 1000 (Note3) VIN = 3.3 V ⎯ 2 ⎯ ⎯ 1000 VIN = 1.8 V ⎯ 1 ⎯ ⎯ 1000 VIN = 1.2 V ⎯ 1 ⎯ ⎯ 1000 VIN = 5.0 V ⎯ 50 60 ⎯ 83 VIN = 3.3 V ⎯ 55 66 ⎯ 83 VIN = 1.8 V ⎯ 75 89 ⎯ 101 VIN = 1.2 V ⎯ 128 166 ⎯ 171 VIN = 1.1 V ⎯ 165 ⎯ ⎯ ⎯ VIN = 5.0 V ⎯ 50 60 ⎯ 83 VIN = 3.3 V ⎯ 55 66 ⎯ 83 VIN = 1.8 V ⎯ 75 89 ⎯ 101 VIN = 1.2 V ⎯ 140 181 ⎯ 183 VIN = 1.1 V ⎯ 214 ⎯ ⎯ ⎯ TCK104G ⎯ 800 ⎯ ⎯ ⎯ TCK105G ⎯ 1200 ⎯ ⎯ ⎯ ⎯ 100 ⎯ ⎯ ⎯ IOUT = 0 mA, VIN = VCT = 5.5 V VIN = 5.5 V, VCT = 0 V, VOUT = OPEN VCT = 0 V, VOUT = GND IOUT = -400 mA (TCK104G) On resistance Unit Min RON IOUT = -700 mA (TCK105G) Output current limit ICL ⎯ Discharge on resistance RSD ⎯ (Note2) V V nA mΩ mA Ω (Note 2) ： Except ISD(OFF) OFF-state switch current (Note 3) ： Ta = 65 ℃ 4 2014-03-01 TCK104G,TCK105G AC Characteristics (Ta = 25°C) Characteristics Symbol Test Condition(Figure 1) Min Typ. Max Unit VOUT rise time tr VIN = 3.3 V , RL = 500 Ω , CL = 0.1 μF ⎯ 175 ⎯ μs VOUT fall time tf VIN = 3.3 V , RL = 500 Ω , CL = 0.1 μF ⎯ 40 ⎯ μs Turn on delay tON VIN = 3.3 V , RL = 500 Ω , CL = 0.1 μF ⎯ 130 ⎯ μs Turn off delay tOFF VIN = 3.3 V , RL = 500 Ω , CL = 0.1 μF ⎯ 9 ⎯ μs AC Waveform VIH VCT tr VOUT 50% tf 90% 10% 50% VIL 90% 10% 90% VOUT 10% tON tOFF VOH VOL Figure 1 tr, tf, tON, tOFF Waveforms 5 2014-03-01 TCK104G,TCK105G Application Note 1. Application circuit example (top view) The figure below shows the recommended configuration for TCK104G and TCK105G CONTROL VIN CIN GND VOUT LOAD CL RL Control voltage IC Operation HIGH ON LOW OFF OPEN OFF 1) Input capacitor An input capacitor(CIN) is not necessary for the guaranteed operation of TCK104G and TCK105G. However, it is recommended to use input capacitors to reduce voltage drop due to sharp changes in output current and also for improved stability of the power supply. When used, place CIN as close to VIN pin to improve stability of the power supply. Also, due to the CIN selected, VIN < VOUT may occur, causing a reverse current to flow through the body diode of the pass-through p-ch MOSFET of the load switch IC. In this case, a higher value for CIN as compared to CL is recommended. 2) Output capacitor An output capacitor (COUT) is not necessary for the guaranteed operation of TCK104G and TCK105G. However, there is a possibility of overshoot or undershoot caused by output load transient response, board layout and parasitic components of load switch IC. In this case, an output capacitor with COUT more than 0.1μF us recommended. 3) Control pin A control pins for TCK104G and TCK105G are both Active High, which controls both the pass-through p-ch MOSFET and the discharge n-ch MOSFET, operated by the control voltage and Schmitt trigger. When the control voltage level is High, p-ch MOSFET is ON state and n-ch MOSFET is OFF state. When control voltage level is Low, and the state of the MOSFETs is reversed. Also, pull down resistance equivalent to a few MΩis connected between CONTROL and GND, thus the load switch IC is in OFF state even when CONTROL pin is OPEN. In addition, CONTROL pin has a tolerant function such that it can be used even if the control voltage is higher than the input voltage. 6 2014-03-01 TCK104G,TCK105G 2. Power Dissipation Power dissipation is measured on the board condition shown below. [The Board Condition] Board material: Glass epoxy (FR4) Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5mm x 28 PD - Ta Power Dissipation PD (mW) 1000 800 600 400 200 0 -40 0 40 80 Ambient Temperature Ta (℃) 120 Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for allowable power dissipation during operation. 3. Current limit and Thermal shut down function Current limit and Thermal shutdown function are designed in these products, but these does not assure for the suppression of uprising device operation. In use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design. 7 2014-03-01 TCK104G,TCK105G Representative Common Characteristics Ron - Ta (mΩ) (mΩ) Ron - VIN RON Ta = 25℃ On resistance On resistance RON IOUT = -500mA 85℃ IOUT = -500mA VIN = 1.2V VIN = 1.8V VIN = 3.3V -45℃ Input voltage VIN = 5.0V VIN (V) Ambient temperature Ta Ron - IOUT (TCK104G) VIN = 1.2V On resistance VIN = 3.3V VIN = 1.8V VIN = 5.0V OFF-state switch current ISD(OFF) (nA) IOUT TA = 25℃ (mΩ) RON (mΩ) RON On resistance Ron - IOUT (TCK105G) TA = 25℃ Output current (℃) VIN = 1.2V VIN = 1.8V VIN = 3.3V VIN = 5.0V (mA) Output current IOUT (mA) ISD(OFF) - VIN VCT = 0 V, VOUT = GND Input voltage VIN (V) 8 2014-03-01 TCK104G,TCK105G Output Voltage vs Output Current VOUT - IOUT (TCK104G) VOUT - IOUT (TCK105G) 1.8V 5.0V VIN = 1.2V Output current IOUT (mA) 3.3V 5.0V 1.8V VIN = 1.2V Output current IOUT (mA) tON Response IOUT (mA) VOUT (V) VCT (V) IOUT (mA) IOUT (mA) VOUT (V) VOUT (V) VCT (V) VCT (V) TCK104G, TCR105G VOUT (V) 3.3V Pulse width= 2.5ms Output voltage Output voltage VOUT (V) Pulse width= 2.5ms 9 2014-03-01 IOUT (mA) VOUT (V) VCT (V) VOUT (V) VOUT (V) VCT (V) VCT (V) TCK104G, TCR105G IOUT (mA) IOUT (mA) TCK104G,TCK105G tOFF Response 10 2014-03-01 TCK104G,TCK105G Package dimension Unit: mm Weight: 1 mg (typ.) 11 2014-03-01 TCK104G,TCK105G RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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