TCK106AG/TCK107AG/TCK108AG
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK106AG, TCK107AG, TCK108AG
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
The TCK106AG, TCK107AG and TCK108AG are load switch ICs
for a general power management with slew rate control driver,
featuring low ON resistance and wide input voltage operation from
1.1 to 5.5 V. ON resistance is only 34 mΩ typical at 5.0 V, -0.5 A
condition and output current is available on 1.0 A. TCK107AG and
TCK108AG feature output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package
WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm) .Thus this devices is
ideal for portable applications that require high-density board
assembly such as cellular phone.
WCSP4D
Weight: 0.79 mg (typ.)
Feature
•
Low ON resistance :
RON = 34 mΩ (typ.) at VIN = 5.0 V, -0.5 A
RON = 42 mΩ (typ.) at VIN = 3.3 V, -0.5 A
RON = 71 mΩ (typ.) at VIN = 1.8 V, -0.5 A
RON = 139 mΩ (typ.) at VIN = 1.2 V, -0.2 A
RON = 176 mΩ (typ.) at VIN = 1.1 V, -0.2 A
•
Low Quiescent current
IQ = 110 nA (typ.) at VIN = 5.5 V, 0 mA
•
High output current: IOUT = 1.0 A
•
Wide input voltage operation: VIN = 1.1 to 5.5 V
•
Built in Slew rate control driver
•
Built in Auto-discharge (TCK107AG and TCK108AG)
•
Active High and Pull down connection between CONTROL and GND (TCK106AG and TCK107AG)
•
Active Low (TCK108AG)
•
Ultra small package : WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm)
Pin Assignment(Top view)
VIN
(A2)
Top marking
CONTROL
(B2)
6M: TCK106AG
7M: TCK107AG
8M: TCK108AG
VOUT
(A1)
GND
(B1)
Index
Start of commercial production
2015-06
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TCK106AG/TCK107AG/TCK108AG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
-0.3 to 6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output voltage
VOUT
Output current
IOUT
-0.3 to VIN +0.3
DC
(Note 1)
V
1.0
A
Power dissipation
PD
800
Operating temperature range
Topr
-40 to 85
°C
Tj
150
°C
Tstg
-55 to 150
°C
Junction temeperature
Storage temperature
(Note 2)
mW
Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1 : VIN +0.3 ≤6.0 V
Note 2: Rating at mounting on a board
(Glass epoxy board dimension: 40 mm x 40 mm, both sides of board
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5 mm x 28)
Block Diagram
TCK106AG, TCK107AG
TCK108AG
VOUT
V
IN
VOUT
V
IN
Slew Rate
Control Driver
Slew Rate
Control Driver
Control
Logic
Control
Logic
CONTROL
CONTROL
Output
Discharge (Note 3)
Pull
Down
Note 3: TCK107AG only
GND
GND
Operating conditions
Characteristics
Symbol
Condition
Input voltage
VIN
―
Output current
IOUT
―
CONTROL High-level input voltage
VIH
CONTROL Low-level input voltage
VIL
1.1 V ≤ VIN ≤ 5.5 V
2
Min
Max
Unit
1.1
5.5
V
1.0
A
0.9
―
V
―
0.4
V
2015-10-05
TCK106AG/TCK107AG/TCK108AG
Electrical Characteristics
DC Characteristics (Ta = -40 to 85°C)
Characteristics
Quiescent current (ON state)
Standby current (OFF state)
Switch leakage current( OFF state)
On resistance
Discharge on resistance
Symbol
IQ
IQ(OFF)
ISD(OFF)
RON
RSD
Test Condition
Min
Typ.
Max
Unit
―
110
230
nA
―
65
150
nA
―
14
1000
nA
VIN = 5.0 V, IOUT = -0.5 A
―
34
55
VIN = 3.3 V, IOUT = -0.5 A
―
42
68
VIN = 1.8 V, IOUT = -0.5 A
―
71
105
VIN = 1.2 V, IOUT = -0.2 A
―
139
220
VIN = 1.1 V, IOUT = -0.2 A
―
176
―
― (TCK107AG and TCK108AG)
―
100
―
VIN = VCT = 5.5 V,
IOUT = 0 mA
TCK106AG
TCK107AG
VIN = 5.5 V, VCT = 0 V,
IOUT = 0 mA
TCK108AG
VIN = 5.5 V, VCT = 0 V,
TCK106AG
VOUT = OPEN (Note 4) TCK107AG
VIN = VCT = 5.5 V,
TCK108AG
VOUT = OPEN (Note 4)
VIN = 5.5 V, VCT = 0 V,
VOUT = GND
TCK106AG
TCK107AG
VIN = VCT = 5.5 V,
VOUT = GND
TCK108AG
mΩ
Ω
Note 4: Except ISD(OFF) OFF-state switch current
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TCK106AG/TCK107AG/TCK108AG
AC Characteristics (Ta = 25°C)
VIN = 1.2 V
Characteristics
Symbol
Test Condition (Figure 1)
VOUT rise time
tr
RL = 500 Ω, CL = 0.1 μF
VOUT fall time
tf
RL = 500 Ω, CL = 0.1 μF
Min
Typ.
Max
Unit
―
290
―
μs
TCK107AG
TCK108AG
―
30
―
TCK106AG
―
104
―
μs
Turn on delay
tON
RL = 500 Ω, CL = 0.1 μF
―
305
―
μs
Turn off delay
tOFF
RL = 500 Ω, CL = 0.1 μF
―
5
―
μs
Min
Typ.
Max
Unit
―
130
―
μs
TCK107AG
TCK108AG
―
25
―
TCK106AG
―
110
―
VIN = 3.3 V
Characteristics
Symbol
Test Condition (Figure 1)
VOUT rise time
tr
RL = 500 Ω, CL = 0.1 μF
VOUT fall time
tf
RL = 500 Ω, CL = 0.1 μF
μs
Turn on delay
tON
RL = 500 Ω, CL = 0.1 μF
―
100
―
μs
Turn off delay
tOFF
RL = 500 Ω, CL = 0.1 μF
―
10
―
μs
AC Waveform
tr
tf
VOUT
90%
10%
90%
10%
TCK106AG, TCK107AG
TCK108AG
VIH
VCT
50%
VIH
VCT
50%
50%
50%
VIL
VIL
90%
VOUT
10%
tON
tOFF
Figure 1
VOH
90%
VOUT
10%
VOL
tON
tOFF
tr, tf, tON, tOFF Waveforms
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VOH
VOL
TCK106AG/TCK107AG/TCK108AG
Application Note
1.
Application circuit example (top view)
The figure below shows configuration example for TCK106AG, TCK107AG and TCK108AG.
CONTROL
GND
Part number
VIN
LOAD
VOUT
TCK106AG
CIN
CL
RL
TCK107AG
TCK108AG
Control
voltage
IC
Operation
HIGH
ON
LOW
OFF
OPEN
OFF
HIGH
OFF
LOW
ON
1) Input capacitor
An input capacitor (CIN) is not necessary for the guaranteed operation of TCK106AG, TCK107AG and
TCK108AG. However, the use of CIN is effective to reduce voltage drop due to sharp changes in output current
and also for improved stability of the power supply. When used, place CIN as close to VIN pin to improve stability of
the power supply. Also, due to the CIN selected, VIN < VOUT may occur, causing a reverse current to flow through
the body diode of the pass-through p-ch MOSFET of the load switch IC. In this case, a higher value for CIN as
compared to CL is recommended.
2) Output capacitor
An output capacitor (COUT) is not necessary for the guaranteed operation of TCK106AG, TCK107AG and
TCK108AG. However, there is a possibility of overshoot or undershoot caused by output load transient response,
board layout and parasitic components of load switch IC. In this case, an output capacitor with COUT more than
0.1μF us recommended.
3) Control pin
A control pins for TCK106AG and TCK107AG are both Active High and TCK108AG is Active Low. These
controls both the pass-through p-ch MOSFET and the discharge n-ch MOSFET (except TCK106AG), operated by
the control voltage and Schmitt trigger. When the control voltage level is High (Low; TCK108AG), p-ch MOSFET is
ON state and n-ch MOSFET is OFF state. When control voltage level is Low (High; TCK108AG), and the state of
the MOSFETs is reversed. Also, pull down resistance equivalent to a few MΩis connected between CONTROL
and GND, thus the load switch IC is in OFF state even when CONTROL pin is OPEN(except TCK108AG). In
addition, CONTROL pin has a tolerant function such that it can be used even if the control voltage is higher than
the input voltage.
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TCK106AG/TCK107AG/TCK108AG
2. Power Dissipation
Board-mounted power dissipation ratings for TCK106AG, TCK107AG and TCK108AG are available in the
Absolute Maximum Ratings table
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40 mm x 40 mm (both sides of board), t=1.8 mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5 mm x 28
PD - Ta
Power Dissipation PD (mW)
1000
800
600
400
200
0
-40
80
0
40
Ambient Temperature Ta (℃)
120
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for
allowable power dissipation during operation.
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TCK106AG/TCK107AG/TCK108AG
Representative Common Characteristics
RON - VIN
RON - IOUT
Ta = 25°C
ON resistance RON (mΩ)
ON resistance RON (mΩ)
IOUT = 200 mA
Ta = 25°C
85°C
-40°C
VIN = 1.2V
3.3V
1.8V
5.0V
Input voltage VIN (V)
Output current IOUT (mA)
Quiescent current (ON state) IQ (nA)
RON - Ta
ON resistance RON (mΩ)
IOUT = 200 mA
VIN = 1.2V
3.3V
1.8V
5.0V
IQ - VIN
85°C
-40°C
Ta = 25°C
IOUT = 0 mA, VCT = 5.5 V
Input voltage VIN (V)
Ambient temperature Ta (°C)
(nA)
ISD(OFF) - VIN
OFF-state switch current ISDOFF
Standby current IQ(OFF) (nA)
IQ(OFF) - VIN
Ta = 25°C
85°C
-40°C
VCT = 0 V, VOUT = GND
Ta = 85°C
25°C
-40°C
VCT = 0 V, VOUT = GND
Input voltage VIN (V)
Input voltage VIN (V)
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TCK106AG/TCK107AG/TCK108AG
VIN = 3.3 V tON Response
VIN = 1.2 V tON Response
VCT (V)
2.0
RL = 500Ω
1.0
0
2.0
CL = 0.1μF
VOUT (V)
4.0
1.0μF
0
4.7μF
10
IOUT (mA)
IOUT (mA)
VOUT (V)
VCT (V)
TCK107AG tON Response
0
2.0
RL = 500Ω
1.0
0
4.0
2.0
4.7μF
100
0
time t (200 μs/div)
VIN = 5.0 V tON Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
IOUT (mA)
VCT (V)
1.0μF
0
time t (200 μs/div)
2.0
CL = 0.1μF
100
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
time t (200 μs/div)
VIN = 3.3 V tOFF Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
10
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
2.0
RL = 500Ω
1.0
0
VOUT (V)
VCT (V)
VIN = 1.2 V tOFF Response
4.0
IOUT (mA)
2.0
IOUT (mA)
VCT (V)
TCK106AG tOFF Response
100
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
time t (1 ms/div)
time t (1 ms/div)
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TCK106AG/TCK107AG/TCK108AG
VCT (V)
2.0
VIN = 5.0 V tOFF Response
RL = 500Ω
1.0
VOUT (V)
4.0
IOUT (mA)
0
100
CL = 0.1μF
1.0μF
2.0
4.7μF
0
0
time t (1 ms/div)
VIN = 3.3 V tOFF Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
CL = 0.1μF
2.0
1.0μF
10
4.7μF
0
0
0
4.0
100
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
VIN = 5.0 V tOFF Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
IOUT (mA)
VCT (V)
RL = 500Ω
1.0
time t (200 μs/div)
time t (200 μs/div)
2.0
2.0
VOUT (V)
VCT (V)
VIN = 1.2 V tOFF Response
IOUT (mA)
2.0
IOUT (mA)
VCT (V)
TCK107AG tOFF Response
100
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
time t (200 μs/div)
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TCK106AG/TCK107AG/TCK108AG
Package Dimensions
WCSP4D
Unit: mm
Weight : 0.79 mg ( typ.)
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TCK106AG/TCK107AG/TCK108AG
Land pattern dimensions for reference only
Unit: mm
0.4
0.4
0.25
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TCK106AG/TCK107AG/TCK108AG
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• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
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