TCK2291xG
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK2291xG
2A Load Switch IC with True Reverse Current Blocking
The TCK2291xG series is Load Switch ICs for power management with
True Reverse Current Blocking and Thermal Shutdown function featuring
low switch on resistance, ultra low quiescent current, high output current
and wide input operating voltage range of 1.1 to 5.5 V. Switch ON
resistance is only 31 mΩ at 5.0 V, -0.15 A load conditions and output
current is available on 2.0 A. And these feature a slew rate control driver
and output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package
WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm). Thus these devices are ideal
for portable applications that require high-density board assembly such
as cellular phone.
WCSP6E
Feature
Weight: 1 mg (typ.)
True Reverse Current Blocking
Thermal Shutdown function
Output auto-discharge (Option)
Under voltage lockout
Low ON resistance :
RON = 31 mΩ (typ.) at VIN = 5.0 V, IOUT = -0.15 A
RON = 40 mΩ (typ.) at VIN = 3.3 V, IOUT = -0.15 A
RON = 70 mΩ (typ.) at VIN = 1.8 V, IOUT = -0.15 A
RON = 141 mΩ (typ.) at VIN = 1.2 V, IOUT = -0.15 A
Low Quiescent Current: IQ = 11 μA (typ.) at IOUT = 0 mA
Low standby current: IQ(OFF) = 0.6 μA (typ.) at OFF state
Inrush current reduction circuitt
Pull down connection between Control and GND(Option)
Ultra small package : WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm)
Start of commercial production
2016-06
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Toshiba Electronic Devices & Storage Corporation
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TCK2291xG
Function Table
Function
Device
Marking
Part number
True Reverse
current
blocking
Output autodischarge
Under voltage
lock out
Thermal
shutdown
Control pin
polarity
Control pin
pull down
connection
TCK22910G
Built in
N/A
Built in
Built in
Active Low
N/A
4S
TCK22911G
Built in
Built in
Built in
Built in
Active Low
N/A
3S
TCK22912G
Built in
N/A
Built in
Built in
Active High
Built in
2S
TCK22913G
Built in
Built in
Built in
Built in
Active High
Built in
1S
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TCK2291xG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
-0.3 to 6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output voltage
VOUT
-0.3 to 6.0
V
2.0
A
Output current
IOUT
3.0 (Note1)
A
DC
Pulse
Power dissipation
PD
Operating temperature range
Topr
−40 to 85
°C
Tj
150
°C
Tstg
−55 to 150
°C
Junction temeperature
Storage temperature
800 (Note 2)
mW
Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design
the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
Note1: 100 μs pulse, 2% duty cycle
Note2: Rating at mounting on a board
Glass epoxy board dimension : 40mm x 40mm (both sides of board), t=1.6mm
Metal pattern ratio : a surface approximately 50%, the reverse side approximately 50%
Through hole : diameter 0.5mm x 28)
Operating conditions
Characteristics
Symbol
Condition
Min
Max
Unit
VIN
―
1.1
5.5
V
Output voltage
VOUT
―
―
VIN
V
Output current
IOUT
1.8 V ≤ VIN
―
2.0
A
―
VIH
1.2V < VIN ≤ 5.5 V
1.0
Control High-level input voltage
1.1V ≤VIN ≤1.2 V
0.9
―
―
0.4
Input voltage
Control Low-level input voltage
―
VIL
Pin Assignment(Top view)
A
2
1
B
V
V
Top marking
Lot trace code
C
A1: VOUT
B1: VOUT
C1: GND
A2: VIN
B2: VIN
C2: Control
Device Marking
Index
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TCK2291xG
Block Diagram
Reverse Current
Blocking
VIN
VOUT
Q1
Thermal
Shutdown
UVLO
Slew Rate
Control Driver
Control
Control
Logic
Q2
Output
Discharge
*
Pull
Down *
GND
*:Option
Operation logic table
Control
“High”
Control
“Low”
TCK22910G
TCK22911G
TCK22912G
Output Q1
OFF
OFF
ON
ON
Discharge Q2
Reverse
current
blocking
―
ON
―
OFF
Active
Active
Active
Active
ON
―
ON
OFF
OFF
―
OFF
ON
Active
Active
Active
Active
Output Q1
Discharge Q2
Reverse
current
blocking
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TCK22913G
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TCK2291xG
Electrical Characteristics
DC Characteristics (Ta = -40 to 85°C)
Ta = −40 to 85°C
Ta = 25°C
Characteristics
Quiescent current ( ON state)
Quiescent current ( OFF state)
Switch leakage current( OFF state)
Symbol
Test Condition
Unit
Min
Typ.
Max
Min
Max
VIN = 1.1 V
―
9
―
―
―
μA
VIN = 5.5 V
―
11
―
―
20
μA
IQ(OFF)
VIN = 5.5 V, VOUT = OPEN,
(Note 3)
―
0.6
―
―
2.5
μA
ISD(OFF)
VOUT = GND,
current through
from VIN to
VIN = VCT = 5.5 V
VOUT.
(Note 4)
―
20
―
―
2000
nA
IQ
IOUT = 0 mA
Reverse blocking current
IRB
VOUT = 5.0 V,
VIN = 0 V, RCB active
―
0.01
―
―
2
μA
Reverse blocking voltage threshold
VRB
VOUT – VIN
―
35
―
―
―
mV
Reverse blocking release voltage
threshold
VRBR
VOUT – VIN
―
-15
―
―
―
mV
Under Voltage Lock Out (UVLO)
rising threshold
VUVL_RI
―
―
0.82
―
―
1.1
V
Under Voltage Lock Out (UVLO)
falling threshold
VUVL_FA
―
―
0.77
―
―
―
V
VIN = 5.0 V
―
31
―
―
85
VIN = 3.3 V
―
40
―
―
95
VIN = 1.8 V
―
70
―
―
140
VIN = 1.2 V
―
141
―
―
―
VIN = 1.1 V
―
179
―
―
―
―
100
―
―
―
On resistance
Output discharge on resistance
RON
RSD
IOUT = -0.15 A
― (Note 5)
mΩ
Ω
Note 3 : Except ISD(OFF) OFF-state switch current
Note 4 : Only applies to the TCK22910G and TCK22912G
Note 5 : Only applies to the TCK22911G and TCK22913G
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TCK2291xG
AC Characteristics (Ta = 25°C)
VIN = 5.0 V, TCK22910G
Characteristics
Symbol
Test Condition(Figure 2)
Min
Typ.
Max
Unit
VOUT rise time
tr
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
1.4
―
ms
VOUT fall time
tf
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
120
―
μs
Turn on delay
tON
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
800
―
μs
Turn off delay
tOFF
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
5
―
μs
Min
Typ.
Max
Unit
VIN = 5.0 V, TCK22911G
Characteristics
Symbol
Test Condition(Figure 2)
VOUT rise time
tr
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
1.4
―
ms
VOUT fall time
tf
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
60
―
μs
Turn on delay
tON
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
800
―
μs
Turn off delay
tOFF
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
5
―
μs
Min
Typ.
Max
Unit
VIN = 5.0 V, TCK22912G
Characteristics
Symbol
Test Condition(Figure 1)
VOUT rise time
tr
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
1.4
―
ms
VOUT fall time
tf
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
120
―
μs
Turn on delay
tON
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
800
―
μs
Turn off delay
tOFF
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
10
―
μs
Min
Typ.
Max
Unit
VIN = 5.0 V, TCK22913G
Characteristics
Symbol
Test Condition(Figure 1)
VOUT rise time
tr
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
1.4
―
ms
VOUT fall time
tf
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
60
―
μs
Turn on delay
tON
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
800
―
μs
Turn off delay
tOFF
VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF,
―
10
―
μs
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TCK2291xG
AC Waveform
tr
VOUT
90%
10%
VIH
VCT
tf
50%
50%
90%
VIL
10%
90%
VOUT
10%
tOFF
tON
Figure 1
VOH
VOL
tr, tf, tON, tOFF Waveforms(Active High)
VIH
VCT
50%
50%
VIL
tr
VOUT
tf
90%
10%
90%
VOUT
10%
10%
Figure 2
90%
tON
tOFF
VOH
VOL
tr, tf, tON, tOFF Waveforms(Active Low)
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TCK2291xG
Application Note
Application circuit example (top view)
1.
The figure below shows the example of configuration for TCK2291xG.
Control
GND
VIN
CIN
VOUT
COUT
LOAD
CL
RL
1)
Input and Output capacitor
An input capacitor (CIN) and an output capacitor (COUT) are necessary for the stable operation of TCK2291xG. And
they are effective to reduce voltage overshoot or undershoot due to sharp changes in output current and also for improved
stability of the power supply. When used, place CIN and COUT more than 1.0μF as close to VIN pin and VOUT pin to improve
stability of the power supply.
2)
Control pin
The Control pin for TCK2291xG controls state of the switch, operated by the control voltage. Control pin is equipped
with Schmitt trigger. Also, pull down resistance equivalent to a few MΩ is connected between Control and GND. Thus the
load switch IC is in OFF state even when Control pin is OPEN. (except TCK22910G and TCK22911G). A control pins for
TCK22910G and TCK22911G is Active low. Products that Control pin is an open connection, please use be sure to fix the
potential of the Control pin to High or Low.
2. Thermal shutdown function
Each device has a built-in thermal shutdown circuit. If the junction temperature goes beyond 170°C (Typ.), thermal
shutdown circuit operates and turns off power switch. When the junction temperature decreases lower than 150°C, the
power switch is turned on due to hysteresis. This operation is repeated as long as the junction temperature continues
increasing.
3. True reverse current blocking
Each device has built-in true reverse current blocking circuit (TRCB) to block reverse current from VOUT to VIN regardless
of output MOSFET ON/OFF condition. (Full-Time Reverse Current Protection)
4. Under-voltage Lockout
Each device has a built-in under-voltage lockout circuit to turn off switch if VIN drops below UVLO.
hysteresis and UVLO is released when VIN exceeds threshold.
This circuit has
5. Instructions and directions for use
Each device has a built-in several functions, but these do not assure the suppression of uprising device operation. In use
of these products, please read through and understand dissipation idea for absolute maximum ratings from the above
mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any
condition. Furthermore, Toshiba recommends inserting failsafe system into the design.
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TCK2291xG
6. Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board), t=1.6mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
PD - Ta
Power Dissipation PD (mW)
1000
800
600
400
200
0
-40
0
40
80
Ambient Temperature Ta (℃)
120
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration
the ambient temperature, input voltage, output current, etc. and applying the appropriate derating for allowable power
dissipation during operation.
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TCK2291xG
TCK2291xG Representative Typical Characteristics
RON - VIN
RON - IOUT
IQ - VIN
tON - Ta
t r - Ta
tON Response(Except TCK22910G,TCK22911G)
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TCK2291xG
VUVL - Ta
Reverse blocking voltage threshold
VIN=5.5V
tOFF-Ta Representative Typical Characteristics
TCK22912G, TCK22913G
tf-Ta Representative Typical Characteristics
TCK22910G, TCK22912G
tOFF - Ta
t f - Ta
tOFF Response Representative Typical Characteristics
TCK22910G
TCK22911G
tOFF Response
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tOFF Response
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TCK2291xG
TCK22912
TCK22913G
tOFF Response
tOFF Response
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TCK2291xG
Package dimension
Unit: mm
Weight: 1 mg (typ.)
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Land pattern dimensions (for reference only)
Unit: mm
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RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
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Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to
property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the
Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,
including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and
conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product
will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited
to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any
other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
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PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
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