TCK301G/TCK302G/TCK303G
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK301G, TCK302G, TCK303G
28 V, Single input – Single Output Load Switch IC
with Over Voltage Protection
The TCK30 series are 28 V high input voltage Single Inputs－Single
Output load switch ICs. It has Over Voltage Protection function
featuring low switch ON resistance, high output current and wide
input voltage operation. Switch ON resistance is only 73 mΩ at 4.5 V,
- 1.0 A load conditions. And these feature a slew rate control driver,
thermal shutdown and FLAG function. Also it can block reverse
current if switch turned off. Output current is available up to 3 A.
Thus this is suitable for power management such as Battery Charge
application.
This device is available in 0.5mm pitch ultra small package WCSP9
(1.5 mm x 1.5 mm, t: 0.5 mm (Typ.)).Thus this devices is ideal for
portable applications that require high-density board assembly such
as cellular phone.
WCSP9
Weight: 3.5 mg (Typ.)
Feature
•
High input voltage: VIN (Max) = 28 V
•
High output current: IOUT (DC) = 3.0 A
•
Low ON resistance : RON = 73 mΩ (Typ.) at VIN = 4.5 V, IOUT = - 1.0 A
•
Over Voltage Lockout : 6.6 V, 10.5 V, and 15.5 V (Typ.)
•
Under Voltage Lockout: 2.9 V (Typ.)
•
FLAG indicates
•
Internal 15 ms startup hold
•
Reverse current blocking (SW OFF state)
•
Inrush current reducing circuit
•
Thermal Shutdown function
•
Small package: 0.5 mm pitch WCSP9 ( 1.5 mm x 1.5 mm, t: 0.5 mm (Typ.)) , PD = 1.65 W
Top marking
A1 Index
301: TCK301G
302: TCK302G
303: TCK303G
Start of commercial production
2015-05
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TCK301G/TCK302G/TCK303G
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VIN
-0.3 to 30
V
Control voltage
VCT, VCE
-0.3 to 6
V
Output voltage
VOUT
-0.3 to 18
V
Flag voltage
VFLAG
-0.3 to 6
V
Input voltage
Output current
IOUT
DC
3.0
Pulse
4.0
(Note 1)
(Note 2)
A
Power dissipation
PD
1.65
Operating temperature range
Topr
−40 to 85
°C
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to 150
°C
W
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Note1: 1 ms pulse, 1% duty cycle
Note2: Rating at mounting on a board: FR4 board. ( 40 mm × 40 mm × 1.6 mm, Cu 4 layer )
Pin Assignment (Top view/Bottom bump)
1
2
3
1
2
3
A
FLAG
VCT
CE
B
VIN
GND
VOUT
C
VIN
GND
VOUT
A
B
C
Product list
Part number
TCK301G
TCK302G
TCK303G
Over voltage lockout
6.6 V (Typ.)
10.5 V (Typ.)
15.5 V (Typ.)
CE function
Active Low
Active Low
Active Low
VCT function
Active High
Active High
Active High
VCT resistance
Pull up
Pull up
Pull up
Please ask your local retailer about the devices with other OVLO, logic function and pull up resistance.
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TCK301G/TCK302G/TCK303G
Block Diagram
Reverse Current Blocking
VIN
VOUT
Q1
OVLO/
UVLO
Inrush
Current
Reducing
VIN
Charge
Pump
VOUT
FLAG
Control
Logic
Thermal
Shutdown
CE
Q2
Open Drain
VOP
VCT
GND
GND
PIN Description
PIN
A1
Name
FLAG
A2
A3
B1, C1
VCT
CE
VIN
B2, C2
B3, C3
GND
VOUT
Description
Open drain acknowledge signal output. When input voltage is in regular range (VUVL
< VIN < VOVL), Q2 turn ON. FLAG output turn to be high impedance in irregular input
voltage range, CE High state and thermal shutdown operation.
Switch Control function. It is internally connected to VOP (Pull up).
Chip Enable function. It is internally connected to GND(Pull down).
Input. It has Over Voltage Lock Out (OVLO) and Under Voltage Lock Out function
(UVLO).
Ground
Output
Operation Logic Table
TCK301G, TCK302G, TCK303G
Q1 (Main Switch)
VCT
“HIGH
Q2 (FLAG out)
Reverse current block
Q1 (Main Switch)
VCT
“LOW”
Q2 (FLAG out)
Reverse current block
CE “Low”
CE “ High”
ON
ON (When VUVL < VIN < VOVL),
OFF (When VUVL > VIN, or VIN > VOVL),
OFF (Thermal shut down = active)
Disable
OFF
OFF
Active
OFF
ON (When VUVL < VIN < VOVL),
OFF (When VUVL > VIN, or VIN > VOVL),
OFF (Thermal shut down = active)
OFF
Active
Active
3
OFF
2015-11-30
TCK301G/TCK302G/TCK303G
DC Characteristics (Ta = -40 to 85°C)
Ta = −40 to 85°C
Ta = 25°C
Characteristics
Symbol
Test Condition
Unit
Min
Typ.
Max
Min
Max
Input voltage
VIN
―
2.3
―
28
2.3
28
V
CE,VCT High-level input voltage
VIH
VIN = 2.3 to 28 V
1.6
―
―
1.6
―
V
CE,VCT Low-level input voltage
VIL
VIN = 2.3 to 28 V
―
―
0.3
―
0.3
V
TCK301G
―
6.6
―
5.9
7.3
TCK302G
―
10.5
―
9.1
11.9
TCK303G
―
15.5
―
13.9
17.1
TCK301G
―
VOVL_RI
- 0.35
―
―
―
TCK302G, TCK303G
―
VOVL_RI
- 0.5
―
―
―
Over voltage lock out (OVLO)
rising threshold
Over voltage lock out (OVLO)
falling threshold
VOVL_RI
VOVL_FA
V
V
Under voltage lock out (UVLO)
rising threshold
VUVL_RI
―
―
2.9
―
2.3
3.5
V
Under voltage lock out (UVLO)
falling threshold
VUVL_FA
―
―
VUVL_RI
- 0.3
―
―
―
V
Quiescent current (ON state)
IQ(ON)
CE = Open, VCT = Open
IOUT = 0 mA,
VIN = 5.0 V
―
130
―
―
190
μA
Quiescent current (OFF state)
IQ(OFF1)
CE = 0 V, VCT = 0 V,
VIN = 5.0 V, VOUT = 0 V
―
75
―
―
115
μA
Input Shutdown Current
IQ(OFF2)
CE = 3.0 V, VCT = Open,
VIN = 5.0 V, VOUT = 0 V
―
1.3
―
―
10
μA
Switch OFF state current
IOFF
CE = 3.0 V, VCT = Open,
VIN = Open, VOUT = 5 V
―
0.1
―
―
1
μA
Reverse blocking current
IRB
VOUT = 5.0 V,
VIN = 0 V, VCT = 0 V
―
0.1
―
―
10
μA
On resistance
RON
IOUT = -1.0 A, VIN = 4.5 V
―
73
―
―
140
mΩ
FLAG Leak current
ILEAK
VIO = 5.0 V
―
―
2
―
2
μA
V
FLAG Output low voltage
VOL
ISINK = 1 mA, VIO = 5.0 V
―
―
0.4
―
0.4
CE built-in resistance
RCE
―
―
530
―
―
―
VCT built-in resistance
RVCT
―
―
530
―
―
―
Min
Typ.
Max
Unit
―
15
―
ms
―
3
―
μs
―
2
―
μs
kΩ
AC Characteristics (Ta = 25°C)
Characteristics
Hold time
Symbol
tHD
Test Condition (Figure 1, 2)
VUVL < VIN(5V) < VOVL, RL = 50 Ω
Initial start up VOUT off state to charge-pump on state
VIN >VOVLO_RI , VIN rising = 2V/μs,
VOUT OVP off time
tOVP
VOUT off time
tOFF
VOUT rise time
tr
VIN= 5.0V , RL = 50 Ω , CL=1.0 uF
―
2
―
ms
VOUT fall time
tf
VIN= 5.0V , RL = 50 Ω , CL=1.0 uF
―
0.12
―
ms
RL = 50 Ω, VOUT to 80% of VOVLO_RI
VUVL < VIN (5V) < VOVL, RL = 50 Ω,
VOUT to 80% of VIN
VCT delay time (Enable to Disable)
tCT1
VIN= 5.0V , RL = 50 Ω
―
0.5
―
μs
VCT delay time (Disable to Enable)
tCT2
VIN= 5.0V , RL = 50 Ω
―
3.2
―
ms
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TCK301G/TCK302G/TCK303G
Timing chart
VIN
OVLO
UVLO
Thermal shutdown detect
tOVP
Thermal shutdown release
tOFF
VOUT
VCT
High
Low
High
CE
Low
FLAG High
tHD Low
tHD
tHD
tHD
Fig.1 tHD, tOVP, tOFF
tf
tr
VOUT
90%
90%
10%
tCT1
10%
tCT2
High
VCT
Low
50%
50%
Fig.2 tr, tf, tCT
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TCK301G/TCK302G/TCK303G
Application Note
1.
Application circuit example (top view)
VIN
CE
CIN
1.0 μF
VOUT
TCK301G
TCK302G
TCK303G
LOAD
FLAG
VCT
GND
1.0 μF
VIN
CE
CIN
1.0 μF
COUT
TCK301G
TCK302G
TCK303G
GND
CL
RL
RUP
FLAG
VCT
1) Input and Output capacitor
An input capacitor (CIN) and an output capacitor (COUT) are necessary for the stable operation of TCK301G,
TCK302G and TCK303G. And it is effective to reduce voltage overshoot or undershoot due to sharp changes in
output current and also for improved stability of the power supply. When used, place CIN and COUT more than
1.0μF as close to VIN pin to improve stability of the power supply.
2) Control pin
Control pins for TCK301G, TCK302G and TCK303G is operated by the control voltage and Schmitt trigger. VCT
pin has a tolerant function such that it can be used even if the control voltage is higher than the input voltage.
2. Reverse current blocking
Reverse current blocking (SW OFF state) function is designed in these products. This function is active at output
n-ch MOSEFT turned off.
However these does not assure for the suppression of uprising device operation. In use of these products, please
read through and understand dissipation idea for absolute maximum ratings from the above mention or our
‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any condition.
Furthermore, Toshiba recommend inserting failsafe system into the design.
3. Thermal shut down function
Thermal shutdown function is designed in these products, but these does not assure for the suppression of uprising
device operation. In use of these products, please read through and understand dissipation idea for absolute
maximum ratings from the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products
under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the
design.
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TCK301G/TCK302G/TCK303G
4. Power Dissipation
Board-mounted power dissipation ratings for TCK301G, TCK302G and TCK303G are available in the
Absolute Maximum Ratings table.
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40 mm x 40 mm (Cu 4 layer)
PD – Ta (WCSP9)
Power dissipation PD (mW)
2000
1500
1000
500
0
−40
0
40
80
120
Ambient temperature Ta (°C)
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc. and applying the appropriate derating for
allowable power dissipation during operation.
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TCK301G/TCK302G/TCK303G
Representative Typical Characteristics
1) ON resistance
RON - VIN
RON - IOUT
(mΩ)
100
IOUT = -1.0 A
Ta = 25°C
90
RON
Pulse test
(TCK303G)
80
ON resistance
ON resistance
RON
(mΩ)
100
70
60
50
0
3
6
Input voltage
9
12
VIN
VIN = 4.5 V
Ta = 25°C
90
80
70
60
50
0
15
Pulse test
(V)
1.0
2.0
Output current
4.0
3.0
IOUT
(A)
2) Quiescent current
IQ(ON) - Ta
200
Ta = 25°C
200
(TCK303G)
150
100
50
0
(μA)
IOUT = 0 mA
250
Quiescent current IQ(ON)
Quiescent current IQ(ON)
(μA)
IQ(ON) - VIN
250
10
Input voltage
20
VIN
IOUT = 0 mA
150
100
50
0
-50
30
(TCK303G)
150
85°C
100
-40°C
50
10
Input voltage
20
VIN
30
(μA)
VOUT = 0 V
25
Quiescent current IQ(OFF2)
(μA)
Quiescent current IQ(OFF1)
CE, VCT = GND
0
0
50
100
Ta
(°C)
IQ(OFF2) - VIN
IQ(OFF1) - VIN
Ta = 25°C
0
Ambient temperature
(V)
250
200
VIN = 5.0 V
20
CE = 3.0 V
VOUT = 0 V
15
85°C
10
Ta = 25°C
-40°C
5
0
0
10
Input voltage
(V)
8
20
VIN
30
(V)
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TCK301G/TCK302G/TCK303G
Package Dimensions
WCSP9
Unit: mm
Weight: 3.5 mg (Typ.)
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TCK301G/TCK302G/TCK303G
Land pattern dimensions (for reference only)
Unit： mm
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TCK301G/TCK302G/TCK303G
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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