TCK323G
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK323G
36 V, Dual Inputs – Single Output Power Multiplexer IC
with Over Voltage Protection
The TCK323G is 36 V high input voltage Dual Inputs－Single
Output multiplexer load switch ICs. It has Over Voltage Protection
featuring low switch ON resistance, high output current and wide
input voltage operation from 2.3 to 36V. Switch ON resistance is only
98 mΩ (typ.) at VIN = 4.5 V, - 1.0 A load conditions. And these
feature a slew rate control driver, thermal shutdown and flag function.
Also it can block reverse current if switch turned off. Output current
is available up to 2.0 A per channel. Thus this is suitable for power
management selector such as Battery Charge application.
This device is available in 0.5 mm pitch small package WCSP16C
(1.9 mm x 1.9 mm, t: 0.5 mm (typ.)).Thus this devices is ideal for
portable applications that require high-density board assembly such
as mobile phone.
WCSP16C
Weight : 3.9 mg ( typ.)
Feature
•
High output current: IOUT (DC) = 2 A, per channel
•
Low ON resistance : RON = 98 mΩ (typ.) at VIN = 4.5 V, - 1.0 A, per channel
•
Wide input voltage operation: VIN = 2.3 to 36 V
•
Over Voltage Lockout : 15.0 V (typ.)
•
Under Voltage Lockout: 2.9V (typ.)
•
Reverse current blocking per channel(SW OFF state)
•
Inrush current reducing circuit.
•
Auto selection mode
•
Break Before Make
•
Thermal Shutdown function
•
Small package: 0.5 mm pitch WCSP16C (1.9 mm x 1.9 mm, t: 0.5mm(typ.)), PD = 1.65 W
Top marking
Index
323: TCK323G
Start of commercial production
2015-01
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TCK323G
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VINA, VINB
-0.3 to 40
V
Control voltage
VCNT, VSEL
-0.3 to 6
V
Output voltage
VOUT
-0.3 to 18
V
FLAG voltage
VFLAG
-0.3 to 6
V
Output current
IOUT
DC
2.0
Pulse
3.0 (Note 1)
A
Power dissipation
PD
1.65 (Note 2)
W
Operating temperature range
Topr
−40 to 85
°C
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to 150
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc.).
Note1: 1 ms pulse, 1% duty cycle
Note2: Rating at mounting on a board: FR4 board. ( 40 mm × 40 mm , Cu 4 layer )
Pin Assignment (Top view/Bottom bump)
1
2
3
4
1
2
3
4
A
FLAG
VSEL
CNT
GND
B
VINA
VOUT
VOUT
VINB
C
VINA
VOUT
VOUT
VINB
D
VINA
VOUT
VOUT
VINB
A
B
C
D
Product list
Part number
Over voltage lockout
VINA
Over voltage lockout
VINB
FLAG monitored in
auto selection mode
TCK323G
15.0V (typ.)
15.0V (typ.)
Q2
Please ask your local retailer about the devices with other OVLO, logic and functions.
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TCK323G
Block Diagram
VINA
VINA
VINA
Reverse Current Blocking
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
Q1
OVLO/
UVLO
VINB
VINB
VINB
Reverse Current Blocking
Q2
Inrush Current
Reducing
OVLO/
UVLO
Charge
Pump
FLAG
Control
Logic
Thermal
Shutdown
CNT
Q3
Open Drain
VOP
VSEL
GND
PIN Description
PIN
Name
Description
A1
FLAG
Open drain acknowledge signal output.
A2
VSEL
Input selector function. It is internally connected to VOP(Pull up).
A3
CNT
Mode control function. It is internally connected to GND(Pull down)
A4
GND
Ground.
VINA ,VINB
Input. Each has Over Voltage Lock Out (OVLO) and Under Voltage Lock Out
function (UVLO).
VOUT
Output.
B1,C1,D1
B4,C4,D4
B2,C2,D2
B3,C3,D3
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TCK323G
Operation Logic Table
VSEL
Low
VSEL
High
CNT Low
CNT High
VINA Q1
OFF
OFF
VINB Q2
OFF
ON
FLAG Q3
OFF
ON (When VINA or VINB is out of
regular voltage )
Reverse current block
Q1 Active / Q2 Active
Q1 Active / Q2 Inactive
VINA Q1
Auto selection mode
ON
VINB Q2
Supplied VINA;
Q1 ON, Q2 and Q3 OFF
OFF
FLAG Q3
Supplied VINB;
Q2 and Q3 ON, Q1 OFF
Reverse current block
Supplied VINA and VINB;
Q1 ON, Q2 and Q3 OFF
4
ON (When VINA or VINB is out of
regular voltage )
Q1 Inactive / Q2 Active
2015-4-14
TCK323G
DC Characteristics (Ta = -40 to 85°C)
Ta = −40 to 85°C
Ta = 25°C
Characteristics
Symbol
Test Condition
Unit
Min
Typ.
Max
Min
Max
Input voltage
VIN
―
2.3
―
36
2.3
36
V
VSEL, CNT High-level input voltage
VIH
VINA, VINB = 2.3 to 36 V
1.6
―
―
1.6
―
V
VSEL, CNT Low-level input voltage
VIL
VINA, VINB = 2.3 to 36 V
―
―
0.4
―
0.4
V
Over voltage lock out (OVLO)
rising threshold
VOVL_RI
―
―
15.0
―
13.4
16.6
V
Over voltage lock out (OVLO)
falling threshold
VOVL_FA
―
―
VOVL_RI
- 0.5
―
―
―
V
Under voltage lock out (UVLO)
rising threshold
VUVL_RI
―
―
2.9
―
2.3
3.5
V
Under voltage lock out (UVLO)
falling threshold
VUVL_FA
―
―
VUVL_RI
- 0.3
―
―
―
V
Quiescent current (Switch ON state)
IQ(ON)
Q1 or Q2 = ON mode,
IOUT = 0 mA , VIN=5.0V
―
140
―
―
200
μA
Quiescent current (Switch OFF state)
IQ(OFF)
CNT and VSEL: Low,
VINA or VINB = 5.0 V,
VOUT = 0 V
―
60
―
―
90
μA
Switch OFF state current
IOFF
CNT and VSEL = Low,
VIN = Open, VOUT = 5 V
―
0.1
―
―
1
μA
Reverse blocking current
IRB
CNT and VSEL: Low,
VIN = 0 V, VOUT = 5.0 V
―
0.1
―
―
10
μA
On resistance
RON
IOUT = -1.0 A, VIN = 4.5 V
―
98
―
―
170
mΩ
FLAG Leak current
ILEAK
VIO = 5.0 V
―
―
2
―
2
μA
FLAG Output low voltage
VOL
ISINK = 1 mA, VIO = 5.0 V
―
―
0.4
―
0.4
V
VSEL , CNT Pull up resistance
RVC
―
―
500
―
―
―
kΩ
Min
Typ.
Max
Unit
―
15
―
ms
―
3
―
μs
―
0.5
―
μs
AC Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition (Figure 1, 2, 3, 4)
VUVL < VIN(5V)< VOVL, RL = 50 Ω
Hold time
tHD
VOUT OVP off time
tOVP
VOUT off time
tOFF
VOUT rise time
tr
VIN= 5.0V , RL = 50 Ω , CL= 1.0μF
―
2
―
ms
VOUT fall time
tf
VIN= 5.0V , RL = 50 Ω , CL= 1.0μF
―
0.12
―
ms
Initial start up VOUT off state to charge-pump on
state
VIN > VOVLO_RI , VIN rising = 2V/μs,
RL = 50 Ω , VOUT to 80% of VOVLO_RI
VUVL < VIN (5V) < VOVL, RL = 50 Ω ,
CNT low to high to VOUT to 80% of VIN
VIN selection delay time
tSEL
VIN= 5.0V , RL = 50 Ω ,
―
0.5
―
μs
Break Before Make time
tBBM
VIN= 5.0V , RL = 50 Ω ,
―
15
―
ms
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TCK323G
Timing chart
Manual selection mode
VINA
VOVL
VUVL
VINB
VOVL
VUVL
tOVP
tOVP
tOVP
tSEL
tOVP
VOUT
tHD
CNT
tBBM
tHD
tHD
tHD
High
Low
VSEL
High
Low
Low
tHD
FLAG
High
Low
Switch All OFF
Device active
OVP function
VINA selected
Device active
OVP function
VINB selected
Fig.1 tHD, tOVP, tSEL
tf
tr
VOUT
90%
90%
10%
10%
tSEL
tBBM
High
VSEL
Low
50%
Fig.2 tr, tf, tBBM
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TCK323G
Timing chart
Auto selection mode
VOVL
VINA
VUVL
VOVL
VINB
VUVL
tHD
tHD
tHD
tHD
tBBM
tHD
tBBM
VOUT
tr
CNT
VSEL
tOVP
tr
tr
tOVP
tOVP
tr
tOVP
tr
tOVP
tr
tr
tOVP
Low
High
FLAG
Automatically VINB selected
Automatically VINA selected
VINA has priority to be selected automatically
Fig.3 tHD, tOVP
VOUT
80%
tOFF
High
VCNT
Low
50%
Fig.4 tOFF
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TCK323G
Application Note
1.
Application circuit example
VINA
RUP
CINA
TCK323G
FLAG
1.0 μF
VINB
CINB
1.0 μF
VOUT
VSEL
COUT
1.0 μF
CNT
LOAD
CL
RL
GND
1) Input and Output capacitor
An input capacitor (CIN) and an output capacitor (COUT) are necessary for the stable operation of TCK323G. And
it is effective to reduce voltage overshoot or undershoot due to sharp changes in output current and also for
improved stability of the power supply. When used, place CIN and COUT more than 1.0μF as close to VIN pin to
improve stability of the power supply.
2) Control pin
Control pins for TCK323G is operated by the control voltage and Schmitt trigger. VSEL pin has a tolerant function
such that it can be used even if the control voltage is higher than the input voltage.
2. Reverse current blocking
Reverse current blocking(SW OFF state) function is designed in these products. This function is active at output
n-ch MOSEFT turned off.
However these does not assure for the suppression of uprising device operation. In use of these products, please
read through and understand dissipation idea for absolute maximum ratings from the above mention or our
‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any condition.
Furthermore, Toshiba recommend inserting failsafe system into the design.
3. Thermal shut down function
Thermal shutdown function is designed in these products, but these does not assure for the suppression of uprising
device operation. In use of these products, please read through and understand dissipation idea for absolute
maximum ratings from the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products
under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the
design.
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TCK323G
4. Power Dissipation
Board-mounted power dissipation ratings for TCK323G are available in the Absolute Maximum Ratings
table.
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40 mm x 40 mm (Cu 4 layer)
PD – Ta (WCSP16C)
Power dissipation PD (mW)
2000
1500
1000
500
0
−40
0
40
80
120
Ambient temperature Ta (°C)
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for
allowable power dissipation during operation.
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TCK323G
Representative Typical Characteristics
1) ON resistance
RON - VIN
RON - IOUT
(mΩ)
120
IOUT = -1.0A
Ta = 25°C
110
RON
Pulse test
100
ON resistance
ON resistance
RON
(mΩ)
120
90
80
70
0
3
6
9
Input voltage
12
VIN
VIN = 4.5V
Ta = 25°C
110
100
90
80
70
0
15
Pulse test
(V)
0.5
1.0
1.5
Output current
2.0
2.5
IOUT
(A)
3.0
2) Quiescent current
IQ(ON) - Ta
160
Ta = 25°C
160
(TCK323G)
120
80
40
0
0
(μA)
IOUT = 0mA
200
Quiescent current IQ(ON)
Quiescent current IQ(ON)
(μA)
IQ(ON) - VIN
200
10
20
Input voltage
30
VIN
IOUT = 0mA
VIN = 5.0V
120
80
40
0
-50
40
0
Ambient temperature
(V)
(nA)
VSEL, CNT = GND
120
VOUT = 0V
85°C
Ta = 25°C
80
-40°C
40
0
0
10
20
Input voltage
30
VIN
40
Reverse blocking current IRB
(μA)
Quiescent current IQ(OFF)
160
Ta
100
(°C)
IRB - VOUT
IQ(OFF) - VIN
200
50
1000
VSEL, CNT = GND
VIN = 0V
Ta = 25°C
100
10
1
0.1
0
4
8
Output voltage
(V)
10
12
VOUT
14
18
(V)
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TCK323G
Package Dimensions
WCSP16C
Unit: mm
Weight : 3.9 mg ( typ.)
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TCK323G
Land pattern dimensions (for reference only)
Unit：mm
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TCK323G
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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