TCR2DG series
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCR2DG series
Low Noise 200 mA CMOS Low Drop-Out Regulator in ultra small package
The TCR2DG series are CMOS general-purpose single-output
voltage regulators with an on/off control input, featuring low dropout
voltage, low quiescent bias current and fast load transient response.
These voltage regulators are available in fixed output voltages
between 1.2 V and 3.6 V and capable of driving up to 200 mA. They
feature overcurrent protection and thermal shut down function.
The TCR2DG series is offered in the ultra small package WCSP4
( 0.79 mm x 0.79 mm x 0.5 mm). It has a low dropout voltage of 75
mV ( 2.5 V output, IOUT = 100 mA) with low output noise voltage of 18
μVrms (2.5 V output) and a load transient response of only
WCSP4
⊿VOUT = ±65 mV ( IOUT = 1 mA⇔150 mA, COUT =1.0 μF).
Weight : 0.7 mg (typ.)
As small ceramic input and output capacitors can be used with the
TCR2DG series, these devices are ideal for portable applications that require high-density board assembly such as
cellular phones.
Features
•
Low Drop-out Voltage ( VIN-VOUT = 75 mV (typ.) at 2.5 V-output, IOUT = 100 mA )
•
Low quiescent bias current ( IB = 45 μA (typ.) at IOUT = 0 mA )
•
Low stand-by current ( IB(OFF) = 0.1 μA (typ.) at Stand-by mode )
•
Low output noise voltage
VNO = 22 μVrms (typ.) at 3.0 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
VNO = 18 μVrms (typ.) at 2.5 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
VNO = 14 μVrms (typ.) at 1.2 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
•
High ripple rejection ratio
R.R = 75 dB (typ.) at 2.5 V-output, IOUT = 10 mA, f =1kHz
R.R = 62 dB (typ.) at 2.5 V-output, IOUT = 10 mA, f =10kHz
R.R = 50 dB (typ.) at 2.5 V-output, IOUT = 10 mA, f =100kHz
•
Fast load transient response (⊿VOUT = ±65 mV (typ.) at IOUT = 1mA ⇔ 150 mA, COUT =1.0 μF )
•
Output voltage accuracy ±1.0 %
•
Over current protection
•
Thermal shut down function
•
Built-in inrush current reduction circuit
•
Pull down connection between CONTROL and GND
•
Ceramic capacitors can be used ( CIN = 0.47μF, COUT =1.0 μF )
•
Ultra small package, WCSP4 ( 0.79 mm x 0.79 mm x 0.50 mm )
Pin Assignment (top view)
CONTROL
(A2)
VIN
(B2)
GND
(A1)
VOUT
(B1)
Start of commercial production
2013-01
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TCR2DG series
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output voltage
VOUT
-0.3 to VIN + 0.3
V
Output current
IOUT
200
mA
Power dissipation
PD
800
Operation temperature range
Topr
−40 to 85
°C
Tj
150
°C
Tstg
−55 to150
°C
Junction temperature
Storage temperature range
(Note1)
mW
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note1:
Rating at mounting on a board
Glass epoxy(FR4) board dimension: 40mm x 40mm x 1.8mm, both sides of board
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
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TCR2DG series
List of Products Number, Marking and Output voltage
Products No.
Marking
Output voltage (V)
TCR2DG12
D3
1.2
TCR2DG125
D8
1.25*
TCR2DG13
D4
1.3*
TCR2DG14
D5
1.4*
TCR2DG15
DA
1.5
TCR2DG16
DB
1.6*
TCR2DG17
DD
1.7*
TCR2DG18
DE
1.8
TCR2DG19
DF
1.9*
TCR2DG20
DG
2.0*
TCR2DG21
DH
2.1*
TCR2DG22
DI
2.2*
TCR2DG23
DK
2.3*
TCR2DG24
DL
2.4*
TCR2DG25
DM
2.5
TCR2DG26
DN
2.6*
TCR2DG27
DO
2.7*
TCR2DG28
DP
2.8
TCR2DG285
D7
2.85*
TCR2DG29
DR
2.9*
TCR2DG295
D6
2.95*
TCR2DG30
DS
3.0
TCR2DG31
DT
3.1*
TCR2DG32
DV
3.2*
TCR2DG33
DW
3.3
TCR2DG34
DX
3.4*
TCR2DG35
DY
3.5*
TCR2DG36
DZ
3.6
Top Marking
Example: TCR2DG15 (1.5 V output)
DA
Index
* Please contact your local Toshiba representative if you are interested in products with * sign
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TCR2DG series
Electrical Characteristics
(Unless otherwise specified,
VIN = VOUT + 1 V, IOUT = 50 mA, CIN = 0.47 μF, COUT = 1.0 μF, Tj = 25°C)
Characteristics
Output voltage accuracy
Input voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
VOUT
⎯
-1.0
⎯
+1.0
%
VIN
⎯
2.0
⎯
5.5
V
Line regulation
Reg･line
2.0 V ≤ VIN ≤ 5.5 V, IOUT = 1 mA
⎯
0.1
5
mV
Load regulation
Reg･load
1 mA ≤ IOUT ≤ 150 mA
⎯
5
10
mV
IOUT = 0 mA
⎯
45
70
μA
VCT = 0 V
⎯
0.1
0.7
μA
⎯
75
130
mV
⎯
70
⎯
ppm/°C
VOUT = 1.2 V
⎯
14
⎯
VOUT = 2.5 V
⎯
18
⎯
VOUT = 3.0 V
⎯
22
⎯
VOUT = 1.2 V
⎯
85
⎯
VOUT = 2.5 V
⎯
75
⎯
VOUT = 3.0 V
⎯
73
⎯
VOUT = 1.2 V
⎯
68
⎯
VOUT = 2.5 V
⎯
62
⎯
VOUT = 3.0 V
⎯
60
⎯
VOUT = 1.2 V
⎯
50
⎯
VOUT = 2.5 V
⎯
50
⎯
VOUT = 3.0 V
⎯
50
⎯
⎯
±65
⎯
mV
Quiescent current
IB
Stand-by current
IB (OFF)
Drop-out voltage
VIN-VOUT
Temperature coefficient
TCVO
IOUT = 100 mA
(Note 2)
−40°C ≤ Topr ≤ 85°C
VIN = VOUT + 1 V,
Output noise voltage
VNO
IOUT = 10 mA,
10 Hz ≤ f ≤ 100 kHz,
Ta = 25°C
f = 1 kHz
VIN = VOUT + 1 V,
Ripple rejection ratio
R.R.
IOUT = 10 mA,
VRipple =500mVp-p,
f = 10 kHz
Ta = 25°C
f = 100 kHz
μVrms
dB
Load transient response
⊿VOUT
Control voltage (ON)
VCT (ON)
⎯
1.1
⎯
5.5
V
Control voltage (OFF)
VCT (OFF)
⎯
0
⎯
0.5
V
Note 2:
IOUT = 1mA ⇔150mA, COUT = 1.0 μF
The 2.5 V output product.
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TCR2DG series
Drop-out voltage
(IOUT = 100 mA, CIN = 0.47 μF, COUT = 1.0 μF, Tj = 25°C)
Output voltages
Min
Typ.
Max
1.2 V
⎯
193
800
1.25 V
⎯
181
750
1.3 V
⎯
168
700
1.4 V
⎯
148
600
1.5 V
⎯
133
500
1.6 V
⎯
121
400
1.7 V
⎯
112
300
⎯
104
200
⎯
101
190
1.9 V
⎯
98
170
2.0 V
⎯
92
160
2.1 V
⎯
87
150
2.2 V, 2.3 V
⎯
82
140
2.4V ≤ VOUT ≤ 2.6 V
⎯
78
130
2.7V ≤ VOUT ≤ 2.95V
⎯
69
120
3.0V ≤ VOUT ≤ 3.6 V
⎯
64
110
1.8 V
1.85 V
Symbol
VIN − VOUT
5
Unit
mV
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TCR2DG series
Application Note
1.
Recommended Application Circuit
VOUT
VIN
CONTROL
voltage
Output
voltage
HIGH
ON
LOW
OFF
OPEN
OFF
1.0 μF
0.47 μF
CONTROL
GND
The figure above shows the recommended configuration for using a Low-Dropout regulator. Insert a capacitor
at VOUT and VIN pins for stable input/output operation. (Ceramic capacitors can be used).
2. Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
PD - Ta
Power Dissipation PD (mW)
1000
800
600
400
200
0
-40
0
40
80
Ambient Temperature Ta (℃)
6
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TCR2DG series
Attention in Use
●
Output Capacitors
Ceramic capacitors can be used for these devices. However, because of the type of the capacitors, there might be
unexpected thermal features. Please consider application condition for selecting capacitors. And Toshiba
recommend the ESR of ceramic capacitor is under 10 Ω.
●
Mounting
The long distance between IC and output capacitor might affect phase assurance by impedance in wire and inductor.
For stable power supply, output capacitor need to mount near IC as much as possible. Also GND pattern need to
be large and make the wire impedance small as possible.
●
Permissible Loss
Please have enough design patterns for expected maximum permissible loss. And under consideration of
surrounding temperature, input voltage, and output current etc, we recommend proper dissipation ratings for
maximum permissible loss; in general maximum dissipation rating is 70 to 80 percent.
●
Over current Protection and Thermal shut down function
Over current protection and Thermal shut down function are designed in these products, but these does not assure
for the suppression of uprising device operation.
In use of these products, please read through and understand dissipation idea for absolute maximum ratings from
the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum
ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design.
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TCR2DG series
Representative Typical Characteristics
VOUT=1.8V
CIN = 0.47 μF, COUT = 1 μF
CIN = 0.47 μF, COUT = 1 μF
VOUT (V)
VOUT=1.2V
IOUT = 1mA
Output voltage
Output voltage
VOUT (V)
1) Output Voltage vs. Input Voltage
IOUT = 100mA
IOUT = 150mA
Input voltage
VIN (V)
IOUT = 1mA
IOUT = 100mA
IOUT = 150mA
Input voltage
VIN (V)
VOUT=3.0V
Output voltage
VOUT (V)
CIN = 0.47 μF, COUT = 1 μF
IOUT = 1mA
IOUT = 100mA
IOUT = 150mA
Input voltage
VIN (V)
2) Output Voltage vs. Output Current
VOUT=1.8V
VOUT (V)
VIN = 2.2 V,
CIN = 0.47 μF, COUT = 1 μF
VIN = 2.8 V,
CIN = 0.47 μF, COUT = 1 μF
Output voltage
Output voltage
VOUT (V)
VOUT=1.2V
Output current
IOUT
Output current
(mA)
8
IOUT
(mA)
2014-03-01
TCR2DG series
VIN = 4.0 V,
CIN = 0.47 μF, COUT = 1 μF
Output voltage
VOUT (V)
VOUT=3.0V
Output current
IOUT
(mA)
VOUT=1.8V
VIN = 2.2 V,
CIN = 0.47 μF, COUT = 1 μF
VIN = 2.8 V,
CIN = 0.47 μF, COUT = 1 μF
Output voltage
VOUT (V)
VOUT=1.2V
Output voltage
VOUT (V)
3) Output Voltage vs. Ambient Temperature
Ambient Temperature
Ambient Temperature
Ta (℃)
Ta (℃)
VIN = 4.0 V,
CIN = 0.47 μF, COUT = 1 μF
Output voltage
VOUT (V)
VOUT=3.0V
Ambient Temperature
Ta (℃)
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TCR2DG series
4) Dropout Voltage vs. Output Current
VOUT=1.8V
Dropout voltage VIN - VOUT (mV)
Dropout voltage VIN - VOUT (mV)
VOUT=1.2V
CIN = 0.47 μF, COUT = 1 μF
Output current
IOUT
CIN = 0.47 μF, COUT = 1 μF
Output current
(mA)
IOUT
(mA)
Dropout voltage VIN - VOUT (mV)
VOUT=3.0V
CIN = 0.47 μF, COUT = 1 μF
Output current
IOUT
(mA)
5) Quiescent Current vs. Input Voltage
VOUT=1.8V
IB (μA)
CIN = 0.47 μF, COUT = 1 μF
CIN = 0.47 μF, COUT = 1 μF
IOUT = 0 mA
Quiescent current
IOUT = 0 mA
Quiescent current
IB (μA)
VOUT=1.2V
Input voltage
Input voltage
VIN (V)
10
VIN (V)
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TCR2DG series
CIN = 0.47 μF, COUT = 1 μF
IOUT = 0 mA
Quiescent current
IB (μA)
VOUT=3.0V
Input voltage
VIN (V)
VOUT=1.8V
CIN = 0.47 μF, COUT = 1 μF
CIN = 0.47 μF, COUT = 1 μF
IB (μA)
VOUT=1.2V
IOUT = 0 mA , VIN=2.8V
Quiescent current
IOUT = 0 mA , VIN=2.2V
Quiescent current
IB (μA)
6) Quiescent Current vs. Ambient Temperature
Ambient Temperature
Ta (℃)
Ambient Temperature
Ta (℃)
CIN = 0.47 μF, COUT = 1 μF
IOUT = 0 mA , VIN=4.0V
Quiescent current
IB (μA)
VOUT=3.0V
Ambient Temperature
Ta (℃)
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TCR2DG series
7) Output Voltage vs. Output Current
VOUT=1.2V
VOUT=3.0V
5.5V
IOUT
5.5V
Output voltage
Output voltage
VIN = 2.2V
Output current
Pulse width= 1ms
VOUT (V)
VOUT (V)
Pulse width= 1ms
VIN = 4.0V
(mA)
Output current
IOUT
(mA)
8) Ripple Rejection Ratio vs. Frequency
VOUT=2.8V
VOUT=1.2V
(dB)
Ripple rejection ratio
Ripple rejection ratio
(dB)
90
60
50
40
30
20
VIN = 2.2 V ,Vripple = 500 mVp−p
10
0
10
CIN = none, COUT = 1μF
IOUT = 10 mA, Ta = 25°C
100
1k
Frequency f
10 k
100 k
80
70
60
50
40
30
20
VIN = 3.8 V ,Vripple = 500 mVp−p
10
0
10
300k
(Hz)
CIN = none, COUT = 1μF
IOUT = 10 mA, Ta = 25°C
100
1k
Frequency f
10 k
100 k 300 k
(Hz)
9) Control Transient vs. Response
VOUT=3.0V
Control voltage
VCT (V)
2.0
VIN = 2.2 V,
CIN = 0.47 μF, COUT = 1 μF
1.0
0
1.0
Output voltage
VOUT (V)
Output voltage
VOUT (V)
Control voltage
VCT (V)
VOUT=1.2V
IOUT = 50mA
0.5
0
IOUT = 150mA
2.0
VIN = 4.0 V,
CIN = 0.47 μF, COUT = 1 μF
1.0
0
3.0
IOUT = 50mA
2.0
1.0
0
IOUT = 150mA
Time t (100 μs/div)
Time t (100 μs/div)
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TCR2DG series
10) Load Transient Response
VIN = 2.2 V,
CIN = 0.47 μF, COUT = 1 μF
100
0
Output current
IOUT (mA)
200
VOUT=3.0V
(IOUT = 1mA ⇔ 150mA)
1.3
Output voltage
⊿VOUT (V)
Output voltage
⊿VOUT (V)
Output current
IOUT (mA)
VOUT=1.2V
(IOUT = 1mA ⇔ 150mA)
1.2
1.1
Time t (100 μs/div)
200
VIN = 4.0 V,
CIN = 0.47 μF, COUT = 1 μF
100
0
3.1
3.0
2.9
Time t (100 μs/div)
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TCR2DG series
Package Dimensions
WCSP4
Unit : mm
0.05
Weight : 0.7 mg ( typ.)
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TCR2DG series
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
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including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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