TCR2LN series
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCR2LN series
Ultra low quiescent current
200 mA CMOS Low Dropout Regulator in ultra small package
The TCR2LN series are CMOS general purpose single output voltage
regulators with an on/off control input, featuring ultra low quiescent bias
current and low dropout voltage.
These voltage regulators are available in fixed output voltages between 0.8
V and 3.6 V and capable of driving up to 200 mA. They feature overcurrent
protection and auto-discharge option.
The TCR2LN series is offered in the ultra small plastic mold package
SDFN4/SDFN4E (0.8 mm x 0.8 mm x 0.38 mm) and has a low dropout
voltage of 250 mV (2.5 V output, IOUT = 150 mA). As small ceramic input and
output capacitors 0.1 μF can be used with the TCR2LN series, these
devices are ideal for portable applications that require high-density board
assembly such as cellular phones.
SDFN4/SDFN4E
Weight : 0.6 mg ( typ.)
Features
Low quiescent bias current (IB = 2 μA (max) at IOUT = 0 mA, Tj = -40 to 85 °C)
Low dropout voltage
VDO = 250 mV (typ.) at 2.5 V-output, IOUT = 150 mA
Wide range output voltage line up (VOUT = 0.8 to 3.6 V)
High VOUT accuracy ±1.0 % (1.8 V ≤ VOUT)
Overcurrent protection
Auto-discharge
Pull down connection between CONTROL and GND
Ceramic capacitors can be used (CIN = 0.1 μF, COUT = 0.1 μF)
Ultra small package SDFN4 (0.8 mm x 0.8 mm x 0.38 mm)
Start of commercial production
2014-08
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TCR2LN series
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output voltage
VOUT
-0.3 to VIN + 0.3
V
Output current
IOUT
200
mA
Power dissipation
PD
300
Operating temperature range
Topr
−40 to 85
°C
Tj
150
°C
Tstg
−55 to 150
°C
Junction temperature
Storage temperature range
(Note1)
mW
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the
operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
Note1:
Rating at mounting on a board
Glass epoxy (FR4) board dimension: 40 mm x 40 mm (both sides of board),t = 1.6 mm
Metal pattern ratio: a surface approximately 50 %, the reverse side approximately 50 %
Through hole hall: diameter 0.5 mm x 24
Pin Assignment (top view)
VIN
CONTROL
4
3
*
1
2
VOUT
GND
*Center electrode should be connected to GND or Open
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TCR2LN series
List of Products Number, Output voltage and Marking
Output Auto discharge type
Product No.
Output voltage(V)
Marking
Product No.
Output voltage(V)
Marking
TCR2LN08
0.8
L8
TCR2LN19
1.9
LF
TCR2LN085
0.85
KS
TCR2LN20
2.0
LG
TCR2LN09
0.9
L9
TCR2LN21
2.1
LH
TCR2LN095
0.95
KT
TCR2LN25
2.5
LM
TCR2LN10
1.0
LJ
TCR2LN27
2.7
LO
TCR2LN105
1.05
LU
TCR2LN28
2.8
LP
TCR2LN11
1.1
L2
TCR2LN285
2.85
L7
TCR2LN115
1.15
LC
TCR2LN30
3.0
LS
TCR2LN12
1.2
L3
TCR2LN31
3.1
LT
TCR2LN13
1.3
L4
TCR2LN32
3.2
LV
TCR2LN15
1.5
LA
TCR2LN33
3.3
LW
TCR2LN18
1.8
LE
TCR2LN36
3.6
LZ
* Please contact local Toshiba representative if you are interested in product that output voltage is not in the list.
Top Marking
Example: TCR2LN33 (3.3 V output)
L
W
Lot NO
INDEX
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TCR2LN series
Electrical Characteristics
(Unless otherwise specified,
VIN = VOUT+1 V (VOUT > 1.5 V), VIN = 2.5 V (VOUT ≤ 1.5 V), IOUT = 50 mA, CIN = 0.1 μF, COUT = 0.1 μF)
Tj = 25°C
Characteristics
Symbol
Output voltage
Input voltage
Tj = -40 to 85°C
Test Condition
Unit
Min
Typ.
Max
Min
Max
VOUT < 1.8 V
-18
―
+18
―
―
mV
1.8V ≤ VOUT
-1.0
―
+1.0
―
―
%
VOUT
IOUT = 50 mA
(Note 2)
VIN
IOUT = 1 mA
1.5
―
5.5
1.5
5.5
V
Line regulation
Reg・line
VOUT + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 1 mA
―
1
15
―
―
mV
Load regulation
Reg・load
1 mA ≤ IOUT ≤ 150 mA
―
15
30
―
―
mV
IOUT = 0 mA
―
1.0
―
―
2.0
μA
―
0.1
―
―
1.0
μA
―
0.1
―
―
―
μA
VOUT = 1.8 V
―
350
―
―
600
mV
VOUT = 3.0 V
―
200
―
―
280
mV
―
75
―
―
―
ppm/°C
Quiescent current
IB
Stand-by current
IB (OFF)
(Note 3)
VCT = 0 V
―
Control pull down current
ICT
Dropout voltage
VDO
IOUT = 150 mA
Temperature coefficient
TCVO
−40°C ≤ Topr ≤ 85°C
Control voltage (ON)
VCT (ON)
―
1.0
―
5.5
1.0
5.5
V
Control voltage (OFF)
VCT (OFF)
―
0
―
0.4
0
0.4
V
RSD
―
―
20
―
―
―
Ω
Discharge on resistance
Note 2:
Note 3:
Stable state with fixed IOUT condition
Except Control pull down current
Dropout voltage
(IOUT = 150 mA, CIN = 0.1 μF, COUT = 0.1 μF, Tj = 25°C)
Output voltages
Symbol
Min
Typ.
Max(Note 4)
0.8 V ≤ VOUT < 0.9 V
―
1000
1560
0.9 V ≤ VOUT < 1.0 V
―
―
―
―
920
1460
840
1380
760
1280
680
1230
600
1110
450
840
350
600
300
540
250
360
200
280
1.0 V ≤ VOUT < 1.1 V
1.1 V ≤ VOUT < 1.2 V
1.2 V ≤ VOUT < 1.3 V
1.3 V ≤ VOUT < 1.6 V
VDO
1.6 V ≤ VOUT < 1.8 V
1.8 V ≤ VOUT < 2.0 V
2.0 V ≤ VOUT < 2.5 V
2.5 V ≤ VOUT < 3.0 V
3.0 V ≤ VOUT ≤ 3.6 V
Note 4:
―
―
―
―
―
―
Unit
mV
Tj = -40 to 85°C
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TCR2LN series
Application Note
1.
Example of Application Circuit
CONTROL
GND
VOUT
VIN
0.1 μF
0.1 μF
CONTROL
voltage
Output
voltage
HIGH
ON
LOW
OFF
OPEN
OFF
The figure above shows the example of configuration for using a Low dropout regulator. Insert a capacitor at VOUT and
VIN pins for stable input/output operation. (Ceramic capacitors can be used.)
2. Power Dissipation
Board mounted power dissipation ratings are available in the Absolute Maximum Ratings table.
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy(FR4)
Board dimension: 40 mm x 40 mm (both sides of board),t = 1.6 mm
Metal pattern ratio: a surface approximately 50 %, the reverse side approximately 50 %
Through hole: diameter 0.5 mm x 24
Power dissipation PD
(mW)
400
300
200
100
0
−40
0
40
80
120
Ambient temperature Ta (°C)
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TCR2LN series
Attention in Use
●
Output Capacitors
Ceramic capacitors can be used for these devices. However, because of the type of the capacitors, there might be
unexpected thermal features. Please consider application condition for selecting capacitors. And Toshiba recommends the
ESR of ceramic capacitor is under 10 Ω.
●
Mounting
The long distance between IC and output capacitor might affect phase compensation by impedance in wire and inductor. For
stable power supply, output capacitor need to mount near IC as much as possible. Also V IN and GND pattern need to be
large and make the wire impedance small as possible.
●
Permissible Loss
Please have enough design patterns for expected maximum permissible loss. And under consideration of ambient
temperature, input voltage, output current etc., we recommend proper dissipation ratings for maximum permissible loss; in
general maximum dissipation rating is 70 to 80 %.
●
Overcurrent Protection
Overcurrent protection is designed in these products, but this does not assure for the suppression of uprising device
operation. If output pins and GND pins are shorted out, these products might break down.
In use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above
mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any
condition. Furthermore, Toshiba recommends inserting failsafe system into the design.
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TCR2LN series
Representative Typical Characteristics
1) Output voltage vs. Input voltage
VOUT = 1.8 V
VOUT = 0.8 V
CIN = 0.1 μF, COUT = 0.1 μF
Output voltage VOUT (V)
Output voltage VOUT (V)
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 1mA
IOUT = 100mA
IOUT = 1mA
IOUT = 100mA
IOUT = 150mA
IOUT = 150mA
Input voltage
VIN
Input voltage
(V)
VIN
(V)
VOUT = 3.6 V
Output voltage VOUT (V)
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 1mA
IOUT = 100mA
IOUT = 150mA
Input voltage
(V)
Quiescent current vs. Input voltage
VOUT = 1.8 V
CIN = 0.1 μF, COUT = 0.1 μF
CIN = 0.1 μF, COUT = 0.1 μF
(μA)
VOUT = 0.8 V
IOUT = 0 mA
Quiescent current IB
IOUT = 0 mA
Quiescent current IB
(μA)
2)
VIN
Input voltage
VIN
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Toshiba Electronic Devices & Storage Corporation
Input voltage
(V)
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VIN
(V)
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TCR2LN series
VOUT = 3.6 V
IOUT = 0 mA
Quiescent current IB
(μA)
CIN = 0.1 μF, COUT = 0.1 μF
Input voltage
(V)
Output voltage vs. Output current
VOUT = 1.8 V
VIN = 2.5 V,
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 0.1 μF
CIN = 0.1 μF, COUT = 0.1 μF
Output voltage VOUT (V)
VOUT = 0.8 V
Output voltage
VOUT (V)
3)
VIN
Output current IOUT (mA)
Output current IOUT (mA)
VOUT = 3.6 V
Output voltage VOUT (V)
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
Output current IOUT (mA)
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TCR2LN series
4)
Output voltage vs. Ambient temperature
VOUT = 1.8 V
VIN = 2.5 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 50 mA
Output voltage VOUT (V)
Output voltage VOUT (V)
VOUT = 0.8 V
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 50 mA
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Output voltage VOUT (V)
VOUT = 3.6 V
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 50 mA
Ambient temperature Ta (°C)
5)
Dropout voltage vs. Output current
VOUT = 1.8 V
CIN = 0.1 μF, COUT = 0.1 μF
CIN = 0.1 μF, COUT = 0.1 μF
Dropout voltage VDO (mV)
Dropout voltage VIN - VOUT (mV)
VOUT = 0.8 V
Output Current
Output current IOUT (mA)
IOUT (mA)
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TCR2LN series
VOUT = 3.6 V
Dropout voltage VDO (mV)
CIN = 0.1 μF, COUT = 0.1 μF
Output current IOUT (mA)
6)
Quiescent current vs. Ambient temperature
VOUT = 1.8 V
(μA)
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 0 mA
Quiescent current IB
VIN = 2.5 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 0 mA
Quiescent current IB
(μA)
VOUT = 0.8 V
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
IOUT = 0 mA
Quiescent current IB
(μA)
VOUT = 3.6 V
Ambient temperature Ta (°C)
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TCR2LN series
7)
Ripple rejection ratio vs. Frequency
(dB)
VOUT = 1.8 V
VIN = 2.8 V,
CIN = none, COUT = 0.1 μF
IOUT = 10 mA
Ripple rejection ratio
VIN = 2.5 V,
CIN = none, COUT = 0.1 μF
IOUT = 10 mA
Ripple rejection ratio
(dB)
VOUT = 0.8 V
Frequency f (Hz)
Frequency f (Hz)
VIN = 4.6 V,
CIN = none, COUT = 0.1 μF
IOUT = 10 mA
Ripple rejection ratio
(dB)
VOUT = 3.6 V
Frequency f (Hz)
8)
Output voltage vs. Output current
VOUT = 1.8 V
Output voltage VOUT (V)
Output voltage VOUT (V)
VOUT = 0.8 V
Output current IOUT (mA)
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Output current IOUT (mA)
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TCR2LN series
Output voltage VOUT (V)
VOUT = 3.6 V
Output current
9)
IOUT (mA)
Control Transient vs. Response
1.0
0
IOUT = 1 mA
1.0
0.5
0
IOUT = 150 mA
Time
2.0
VCT (V)
VIN = 2.5 V,
CIN = 0.1 μF, COUT = 0.1 μF
Control voltage
2.0
VOUT = 1.8 V
Output voltage
VOUT (V)
Output voltage
VOUT (V)
Control voltage
VCT (V)
VOUT = 0.8 V
t (100 μs/div)
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 0.1 μF
1.0
0
IOUT = 1 mA
2.0
1.0
0
IOUT = 150 mA
Time t (100 μs/div)
Output voltage
VOUT (V)
Control voltage
VCT (V)
VOUT = 3.6 V
2.0
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
1.0
0
IOUT = 1 mA
4.0
2.0
0
IOUT = 150 mA
Time
t (100 μs/div)
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TCR2LN series
10)
Load Transient Response
VOUT = 1.8 V
(IOUT = 50 mA ⇔ 100 mA)
50
IOUT (mA)
100
Output current
VIN = 2.5 V,
CIN = 0.1 μF, COUT = 0.1 μF
150
1.3
0.8
0.3
Time
VOUT (V)
Output voltage
VOUT (V)
Output voltage
Output current
IOUT (mA)
VOUT = 0.8 V
(IOUT = 50 mA ⇔ 100 mA)
100
50
2.3
1.8
1.3
t (100 μs/div)
Time
50
4.1
3.6
3.1
VOUT (V)
100
IOUT (mA)
Output current
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
Time
10
0
1.3
0.8
0.3
Time t (100 μs/div)
VOUT = 3.6 V
(IOUT = 1 mA ⇔ 10 mA)
2.3
1.8
1.3
Time
IOUT (mA)
VIN = 4.6 V,
CIN = 0.1 μF, COUT = 0.1 μF
20
10
0
4.1
3.6
3.1
Time
t (100 μs/div)
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Toshiba Electronic Devices & Storage Corporation
VOUT (V)
0
Output current
10
Output voltage
IOUT (mA)
VOUT (V)
Output voltage
Output current
VOUT = 1.8 V
(IOUT = 1 mA ⇔ 10 mA)
20
VIN = 2.5 V,
CIN = 0.1 μF, COUT = 0.1 μF
20
t (100 μs/div)
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 0.1 μF
t (100 μs/div)
VOUT = 0.8 V
(IOUT = 1 mA ⇔ 10 mA)
Output voltage
VOUT (V)
Output voltage
IOUT (mA)
Output current
VOUT = 3.6 V
(IOUT = 50 mA ⇔ 100 mA)
150
= 2.8
VINV=IN 2.8
V, V,
= 0.1
COUT
= 0.1
IN 0.1
CINC=
μF,μF,
COUT
= 0.1
μFμF
150
13
t (100 μs/div)
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TCR2LN series
Package Dimensions
SDFN4
Unit: mm
0.04 mm (typ.) unevenness exists along the edges of the back electrode to increase shear after soldering.
Weight : 0.6 mg ( typ.)
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TCR2LN series
Package Dimensions
SDFN4E
Unit: mm
Weight : 0.6 mg ( typ.)
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TCR2LN series
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property,
including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their
own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in
the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.
Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and
(c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS'
PRODUCT DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF
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specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities,
equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships
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limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
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