TCR4DG series
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCR4DG series
420 mA CMOS Low Drop-Out Regulator with inrush current protection circuit
The TCR4DG series are CMOS general-purpose single-output
voltage regulators with an on/off control input, featuring low dropout
voltage, low output noise voltage and low inrush current.
These voltage regulators are available in fixed output voltages
between 1.0 V and 4.5 V and capable of driving up to 420 mA.
They feature over-current protection, over-temperature protection,
Inrush current protection circuit and Auto-discharge function.
The TCR4DG series are offered in the ultra small plastic mold
WCSP4E
package WCSP4E (0.645 mm x 0.645 mm; t 0.43 mm (max)). It has
a low dropout voltage of 193 mV (3.3 V output, IOUT = 420 mA) with
Weight: 0.34 mg ( typ.)
low output noise voltage of 38 μVrms (2.5 V output) and a load
transient response of only ⊿VOUT = ±115 mV ( IOUT = 1 mA ⇔ 420 mA, COUT =1.0 μF).
As small ceramic input and output capacitors can be used with the TCR4DG series, these devices are ideal for portable
applications that require high-density board assembly such as cellular phones.
Features
•
Low Drop-Out voltage
VDO = 193 mV (typ.) at 3.3 V-output, IOUT = 420 mA
•
Low output noise voltage
VNO = 38 μVrms (typ.) at 2.5 V-output, IOUT = 10 mA, 10 Hz ≤ f ≤ 100 kHz
•
Fast load transient response (⊿VOUT = ±115 mV (typ.) at IOUT = 1 ⇔ 420 mA, COUT =1.0 μF )
•
High ripple rejection ( R.R = 70 dB (typ.) at 2.5 V-output, IOUT = 10 mA, f = 1 kHz )
•
Over-current protection
•
Over-temperature protection
•
Inrush current protection circuit
•
Auto-discharge function
•
Pull down connection between CONTROL and GND
•
Ceramic capacitors can be used ( CIN = 1.0μF, COUT =1.0 μF )
•
Ultra small package WCSP4E (0.645 mm x 0.645 mm ; t 0.43 mm (max))
Start of commercial production
2017-04
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TCR4DG series
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output current
IOUT
420
mA
Power dissipation
PD
800
Operation temperature range
Topr
-40 to 85
°C
Tj
150
°C
Tstg
-55 to 150
°C
Junction temperature
Storage temperature range
(Note1)
mW
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note1:
Rating at mounting on a board
Board material: Glass epoxy(FR4)
Board dimension: 40 mm x 40 mm (both sides of board), t = 1.6 mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5 mm x 24
Pin Assignment (Top view)
1
2
1
2
A
VIN
VOUT
B
CONTROL
GND
A
B
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TCR4DG series
List of Products Number, Output voltage and Marking
Output voltage
Marking
Output voltage
Product No.
Marking
Product No.
(V)(typ.)
(V)(typ.)
TCR4DG10
1.0
A
TCR4DG25
2.5
T
TCR4DG105
1.05
B
TCR4DG27
2.7
U
TCR4DG11
1.1
C
TCR4DG275
2.75
V
TCR4DG115
1.15
D
TCR4DG28
2.8
W
TCR4DG12
1.2
E
TCR4DG285
2.85
X
TCR4DG125
1.25
F
TCR4DG29
2.9
Y
TCR4DG13
1.3
H
TCR4DG30
3.0
0
TCR4DG135
1.35
J
TCR4DG31
3.1
1
TCR4DG15
1.5
K
TCR4DG32
3.2
2
TCR4DG175
1.75
L
TCR4DG325
3.25
3
TCR4DG18
1.8
M
TCR4DG33
3.3
4
TCR4DG185
1.85
N
TCR4DG35
3.5
5
TCR4DG19
1.9
P
TCR4DG36
3.6
6
TCR4DG23
2.3
R
TCR4DG42
4.2
7
TCR4DG245
2.45
S
TCR4DG45
4.5
8
Note: Please ask your local retailer about the devices with other output voltages.
Top Marking (top view)
Example: TCR4DG10 (1.0 V output)
VOUT
VIN
A
CONTROL GND
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TCR4DG series
Electrical Characteristics
(Unless otherwise specified, VIN = VOUT + 1 V, IOUT = 50 mA, CIN = 1.0 μF, COUT = 1.0 μF, Tj = 25°C)
Characteristics
Output voltage accuracy
Input voltage
Symbol
Test Condition
VOUT
IOUT = 50 mA
VIN
IOUT = 1 mA
(Note 2)
Min
Typ.
Max
Unit
VOUT < 1.8 V
-18
―
+18
mV
1.8 V ≤ VOUT
-1.0
―
+1.0
%
VOUT + VDO
―
5.5
V
(Note 3)
Line regulation
Reg・line
VOUT + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 1 mA
―
1
15
mV
Load regulation
Reg・load
1 mA ≤ IOUT ≤ 420 mA
―
6
35
mV
VOUT = 1.0 V
―
65
―
VOUT = 1.8 V
―
65
―
VOUT = 2.5 V
―
68
―
VOUT = 4.5 V
―
78
125
Quiescent current
IB
IOUT = 0 mA
Stand-by current
IB (OFF)
Drop-out voltage
VDO
VCT = 0 V
IOUT = 420 mA
Temperature coefficient
TCVO
-40°C ≤ Topr ≤ 85°C
Output noise voltage
VNO
VIN = VOUT + 1 V, IOUT = 10 mA,
10 Hz ≤ f ≤ 100 kHz, Ta = 25°C
Ripple rejection ratio
R.R.
VIN = VOUT + 1 V, IOUT = 10 mA,
f = 1 kHz, VRipple = 500 mVp-p,
Ta = 25°C
(Note 4)
(Note 5)
μA
―
0.1
1
μA
―
193
263
mV
―
75
―
ppm/°C
―
38
―
μVrms
―
70
―
dB
―
±115
―
mV
(Note 5)
IOUT = 1 ⇔ 420 mA, COUT = 1.0 μF
Load transient response
⊿VOUT
Control voltage (ON)
VCT (ON)
―
1.0
―
5.5
V
Control voltage (OFF)
VCT (OFF)
―
0
―
0.4
V
Note 2: Stable state with fixed IOUT condition.
Note 3: Please refer to Dropout Voltage table (Page 4), and use it within the limits of absolute maximum rating Topr and Tj.
Note 4: The 3.3 V output product. Dropout voltage is the voltage difference between the VIN and VOUT at which VOUT drops to 2%
below its nominal value.
Note 5: The 2.5 V output product.
Drop-out voltage
(IOUT = 420 mA, CIN = 1.0 μF, COUT = 1.0 μF, Tj = 25°C)
Output voltages
Min
Typ.
Max
1.0 V, 1.05 V
―
767
991
1.1 V, 1.15V
―
711
851
1.2 V, 1.25V
―
627
781
1.3 V
―
571
711
1.35 V
―
515
683
1.4 V
―
487
669
―
431
571
1.8 V ≤ VOUT < 2.1 V
―
319
473
2.1 V ≤ VOUT < 2.5 V
―
277
403
2.5 V ≤ VOUT < 2.8 V
―
235
347
2.8 V ≤ VOUT < 3.2 V
―
221
291
3.2 V ≤ VOUT < 3.6 V
―
193
263
3.6 V ≤ VOUT ≤ 4.5 V
―
151
221
1.5 V ≤ VOUT < 1.8 V
Symbol
VDO
4
Unit
mV
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TCR4DG series
Application Note
1.
Recommended Application Circuit
VOUT
VIN
1.0 μF
1.0 μF
CONTROL
GND
CONTROL
voltage
Output
voltage
HIGH
ON
LOW
OFF
OPEN
OFF
The figure above shows the recommended configuration for using a Low-Dropout regulator. Insert a capacitor at
VOUT and VIN pins for stable input/output operation. (Ceramic capacitors can be used).
2. Power Dissipation
Board-mounted power dissipation ratings for TCR4DG series are available in the Absolute Maximum Ratings table.
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy(FR4)
Board dimension: 40mm x 40mm (both sides of board), t= 1.6mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole hall: diameter 0.5mm x 24
Power dissipation PD
(mW)
1000
800
600
400
200
0
-40
0
40
80
120
Ambient temperature Ta (°C)
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TCR4DG series
Attention in Use
●
Output Capacitors
Ceramic capacitors can be used for these devices. However, because of the type of the capacitors, there might be
unexpected thermal features. Please consider application condition for selecting capacitors. And Toshiba recommend
the ESR of ceramic capacitor is under 10 Ω.
●
Mounting
The long distance between IC and output capacitor might affect phase assurance by impedance in wire and inductor.
For stable power supply, output capacitor need to mount near IC as much as possible. Also VIN and GND pattern
need to be large and make the wire impedance small as possible.
●
Permissible Loss
Please have enough design patterns for expected maximum permissible loss. And under consideration of
surrounding temperature, input voltage, and output current etc, we recommend proper dissipation ratings for
maximum permissible loss; in general maximum dissipation rating is 70 to 80 percent.
●
Over current Protection and Thermal shut down function
Over current protection and Thermal shut down function are designed in these products, but these are not designed
to constantly ensure the suppression of the device within operation limits. Depending on the condition during actual
usage, it could affect the electrical characteristic specification and reliability. Also note that if output pins and GND
pins are not completely shorted out, these products might be break down.
When using these products, please read through and understand the concept of dissipation for absolute maximum
ratings from the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute
maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design.
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TCR4DG series
Representative Typical Characteristics
Quiescent Current vs. Input Voltage
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
150
100
50
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
350
300
250
200
150
100
50
0
0
0
1
2
3
4
Input voltage VIN
0
5
(V)
1
Quiescent current IB (μA)
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
350
300
250
200
150
100
50
0
0
1
2
3
4
Input voltage VIN
2
3
4
Input voltage VIN
VOUT=2.5V
400
Quiescent current IB (μA)
VOUT=1.8V
400
Quiescent current IB (μA)
Quiescent current IB (μA)
VOUT=1.0V
200
5
(V)
VOUT=3.0V
400
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
350
300
250
200
150
100
50
0
5
0
(V)
1
2
3
4
Input voltage VIN
5
(V)
Quiescent Current vs. Ambient Temperature
150
Quiescent current IB (μA)
Quiescent current IB (μA)
VOUT=3.0V
VOUT=1.0V
150
100
50
VIN = 2.0 V
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
0
-50
0
50
100
50
VIN = 4.0 V
CIN = 1 μF, COUT = 1 μF
IOUT = 0 mA
0
100
-50
0
50
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
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TCR4DG series
Ripple Rejection Ratio vs. Frequency
VOUT=1.0V
(dB)
90
80
70
60
50
40
30
20
VIN = 2.0 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1 μF
IOUT = 10 mA, Ta = 25°C
10
VOUT=1.8V
100
Ripple rejection
Ripple rejection
(dB)
100
90
80
70
60
50
40
30
20
VIN = 2.8 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1 μF
IOUT = 10 mA, Ta = 25°C
10
0
0
10
100
1000
10000
100000
10
VOUT=2.5V
80
60
50
40
30
20
10
100000
VOUT=3.0V
(dB)
70
10000
100
90
Ripple rejection
(dB)
Ripple rejection
100
1000
Frequency f (Hz)
Frequency f (Hz)
90
100
70
1000
50
40
30
10
0
100
60
20
VIN = 3.5 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1 μF
IOUT = 10 mA, Ta = 25°C
10
80
10000
VIN = 4.0 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1 μF
IOUT = 10 mA, Ta = 25°C
0
100000
10
Frequency f (Hz)
100
1000
10000
100000
Frequency f (Hz)
Output Voltage vs. Output Current
VOUT=1.8V
VOUT=1.0V
Pulse width = 1 ms
VOUT (V)
5.5V
Output voltage
Output voltage
VOUT (V)
Pulse width = 1 ms
VIN=2.0V
5.5V
VIN=2.8V
Output current IOUT (mA)
Output current IOUT (mA)
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TCR4DG series
VOUT=3.0V
VOUT=2.5V
Pulse width = 1 ms
Output voltage
Output voltage
VOUT (V)
VOUT (V)
Pulse width = 1 ms
5.5V
5.5V
VIN=4.0V
VIN=3.5V
Output current IOUT (mA)
Output current IOUT (mA)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TCR4DG series
Package Dimensions
WCSP4E
Unit: mm
Weight: 0.34 mg ( typ.)
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TCR4DG series
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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