TB6564AHQ(THB6064AH)
TOSHIBA BiCD Integrated Circuit
Silicon Monolithic
TB6564AHQ (THB6064AH)
PWM Chopper-Type bipolar
Stepping Motor Driver IC
TB6564AHQ(THB6064AH)
The TB6564AHQ(THB6064AH) is a PWM chopper-type
sinusoidal micro-step bipolar stepping motor driver IC.
It supports 8 kind of excitation modes and forward/reverse mode
and is capable of low-vibration, high-performance drive of
2-phase bipolar type stepping motors using only a clock signal.
Features
•
Single-chip bipolar sinusoidal micro-step stepping motor
driver
•
Uses high withstand voltage BiCD process:
Ron (upper lower) = 0.4 Ω (typ.)
•
Forward and reverse rotation control available
•
Selectable phase drive (1/2,1/8,1/10, 1/16, 1/20, 1/32, 1/40, 1/64 step)
•
Output withstand voltage: VDSS = 50 V
•
Output current: IOUT = 4.5 A (absolute maximum ratings, peak, within 100ms)
•
Packages: HZIP25-P-1.27
•
Output monitor pins (DOWN / ALERT)
•
Equipped with reset and enable pins
•
Built-in thermal shutdown(TSD) and over-current detection(ISD) circuit
Weight:
HZIP25-P-1.27: 9.86 g (typ.)
IOUT = 4.0 A (operating range, maximal value)
The TB6564AHQ(THB6064AH) is a Sn-Ag plated product including Pb.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
These ICs are highly sensitive to electrostatic discharge. When handling them, ensure that the environment is
protected against electrostatic discharge. Ensure also that the ambient temperature and relative humidity are
maintained at reasonable level.
ESD(Electro-Static Discharge) ： HBM±1500V, MM±150V (design target value)
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TB6564AHQ(THB6064AH)
Block Diagram
VDD
DOWN
ALERT
VMA
24
25
1
20
OUT1A
M1
M2
7
16
OSC1
8
DOWN
Pre
-detect
-drive
H-Bridge
driver A
14
M3
9
CW/CCW
22
OUT2A
CLK
TSD / ISD
15
NFA
Input
circuit
CLK
21
RESET
19
ENABLE
18
Current selector
circuit A
System CLK
VMB
6
OUT1B
12
Pre
DCY1
H-Bridge
driver B
-drive
3
10
DCY2
OUT2B
4
Current selector
circuit B
OSC2
23
OSC2
11
NFB
1/3
5
2
17
13
SGND
PGNDA
PGNDB
Vref
2
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2011-03-01
TB6564AHQ(THB6064AH)
Pin Functions
Pin No.
I/O
Symbol
Functional Description
Remark
1
Output
ALERT
TSD / ISD monitor pin
2
⎯
SGND
Signal ground
3
Input
DCY1
Mixed decay ratio setting pin
Built-in pull-down resistor
4
Input
DCY2
Mixed decay ratio setting pin
Built-in pull-down resistor
5
Input
Vref
Voltage input for 100% current level
6
Input
VMB
Power supply
7
Input
M1
Excitation mode setting input pin
Built-in pull-down resistor
8
Input
M2
Excitation mode setting input pin
Built-in pull-down resistor
Excitation mode setting input pin
Built-in pull-down resistor
9
Input
M3
10
Output
OUT2B
11
⎯
NFB
12
Output
OUT1B
B channel output 1
13
⎯
PGNDB
Power ground
14
Output
OUT2A
A channel output 2
15
⎯
NFA
16
Output
OUT1A
A channel output 1
17
⎯
PGNDA
Power ground
18
Input
ENABLE
Enable signal input pin
19
Input
RESET
20
Input
VMA
Power supply
21
Input
CLK
CLK pulse input pin
22
Input
CW/CCW
23
⎯
OSC2
24
input
VDD
25
Output
DOWN
B channel output 2
B channel output current detection pin
Connect external resistor
B channel output current detection pin
Connect external resistor
H: Enable, L: all output off
Built-in pull-down resistor
Reset signal input pin
Built-in pull-down resistor
Built-in pull-down resistor
L: Forward, H: reverse
Forward/reverse control pin
Built-in pull-down resistor
Resistor connection pin for chopping frequency setting
Connect external resistor
Control side power pin
CLK frequency monitor pin
Input pins
(M1, M2, M3, CLK, CW/CCW,
DCY1, DCY2, ENABLE and
RESET)
Output pins
(DOWN and ALERT)
VDD
100 kΩ
100 Ω
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TB6564AHQ(THB6064AH)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
VDD
6
VMA/B
50
Unit
Power supply voltage
Output current
Drain current (ALERT, DOWN)
V
IO (PEAK)
I ALERT
4.5(Note 1)
A/phase
1
mA
5.5
V
I DOWN
Input voltage
VIN
Power dissipation
PD
5 (Note 2)
W
43 (Note 3)
Operating temperature
Topr
−30 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 1: T = 100ms
Note 2: Ta = 25°C, No heat sink.
Note 3: Ta = 25°C, with infinite heat sink.
Operating Range (Ta = −30 to 85°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
VDD
⎯
4.5
5.0
5.5
VMA/B
VMA/B ≧ VDD
4.5
⎯
42
IOUT
⎯
⎯
⎯
4
VIN
⎯
0
⎯
5.5
Vref(*)
⎯
0.5
⎯
3.0
Clock frequency(**)
fCLK
⎯
⎯
⎯
200
kHz
Chopping frequency
fchop
(design target value)
15
40
65
kHz
OSC frequency
fOSC2
2.6
4.0
5.4
MHz
Power supply voltage
Output current
Input voltage
Unit
V
A
V
（*） Do not apply 3.5V or over to the Vref terminal.
(**) IC can not be damaged within 200kHz. However, the customer can accept that a motor does not always rotate at
high frequency of CLK.
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TB6564AHQ(THB6064AH)
Electrical Characteristics (Ta = 25°C, VDD = 5V, VM = 24V)
Control circuit
Characteristic
Symbol
High
Input voltage
Test Condition
VIN (H)
Low
M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, DCY1, DCY2
VIN (L)
Input hysteresis voltage
VH
Typ.
Max
2.0
⎯
VDD
−0.2
⎯
0.8
⎯
400
⎯
Unit
V
mV
IIN (H)
M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, DCY1, DCY2
VIN = 5.0 V
⎯
55
80
IIN (L)
VIN = 0 V
⎯
⎯
1
IDD1
Output open,
RESET: H, ENABLE: H
M1:L, M2:L, M3:L (1/2-step mode)
⎯
3
7
IDD2
RESET: L, ENABLE: H
⎯
2
7
IDD3
RESET: L, ENABLE: L
⎯
2
7
IM1
RESET: H/L, ENABLE: L
⎯
0.5
⎯
IM2
RESET: H/L, ENABLE: H
⎯
1
⎯
Vref=3.0V
⎯
⎯
1
μA
Maximum current : 100%
⎯
3
⎯
⎯
2.3
⎯
⎯
μs
IOL = 1 mA
⎯
⎯
0.5
V
TSD
(Design target value)
⎯
170
⎯
°C
TSDhys
(Design target value)
⎯
40
⎯
°C
Input current
VDD supply current
VM supply current
Vref input
circuit
Min
Input current
IIN(ref)
Divider ratio
Vref/VNF
tCLKH
Minimum CLK pulse width
μA
mA
mA
tCLKL
VOL DOWN
Output residual voltage
VOL ALERT
TSD operation temperature(Note)
TSD hysteresis
(Note)
Oscillation frequency
fosc1
using built-in capacitor and resistor
50
100
200
kHz
Oscillation frequency
fosc2
ROSC = 51kΩ
2.6
4.0
5.4
MHz
using built-in capacitor and resistor
1.0
2.0
4.0
Hz
Oscillation
circuit for
CLK monitor
Detection CLK
frequency
fdetect
Note: Pre-shipment testing is not performed.
Output Block
Characteristic
Symbol
Test Condition
RonH + RonL IOUT = 4 A
Output ON resistor
Output transistor switching
characteristics
tr
tf
Upper side
ILH
Lower side
ILL
Output leakage current
RL = 2 Ω, VNF = 0 V,
CL = 15 pF
VM = 50 V
5
Min
Typ.
Max
Unit
⎯
0.4
0.6
Ω
⎯
1.5
⎯
⎯
0.5
⎯
⎯
―
5
⎯
―
5
V1.0
μs
μA
2011-03-01
TB6564AHQ(THB6064AH)
Description of Functions
1. Excitation Settings
The excitation mode can be selected from the following eight modes using the M1, M2 and M3 inputs. (The
default is 1/2 excitation using the internal pull-down.)
Please be sure to set up ‘Low’ or ‘High’ always at M1, M2 and M3 terminals.
Although M1、M2 and M3 terminals have built-in pull-down resistors, please do not keep M1、M2 and M3
terminals open. New excitation mode starts from the initial mode when M1, M2, or M3 inputs are shifted
during motor operation. (Specifications of the TB6564HQ are the same as the TB6564AHQ about it.)
Input
M1
M2
M3
Mode
(Excitation)
L
L
L
1/2
L
L
H
1/8
L
H
L
1/10
L
H
H
1/16
H
L
L
1/20
H
L
H
1/32
H
H
L
1/40
H
H
H
1/64
2. Function
When the ENABLE signal goes Low level, it sets an OFF on the output. The output changes to the Initial
mode shown in the table below when the RESET signal goes Low level. In this mode, the status of the CLK
and CW/CCW pins are irrelevant.
Input
CLK
Output Mode
CW/CCW
RESET
ENABLE
L
H
H
CW
H
H
H
CCW
X
X
L
H
Initial mode
X
X
X
L
Z
X: Don’t care
3. Initial Mode
When RESET is used, the phase currents are as follows.
Excitation Mode
A Phase Current
B Phase Current
1/2 step
100%
0%
1/8 step
100%
0%
1/10 step
100%
0%
1/16 step
100%
0%
1/20 step
100%
0%
1/32 step
100%
0%
1/40 step
100%
0%
1/64 step
100%
0%
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TB6564AHQ(THB6064AH)
4. 100% current Settings (Current Value)
100% current value is determined by Vref inputted from external part and the external resistance for
detecting output current.
Vref is doubled 1/3 inside IC, and compared with VRS.
Io(100%) = Vref x 1/3 x 1/Rs
The average current is lower than the calculated value because this IC has the method of peak current
detection.
5. OSC1 and OSC2
(1)OSC1：
Triangle wave is generated internally by CR oscillation with the capacitor and the resistor in the IC.
fosc1 = 100 kHz
(2)OSC2：
Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC2 terminal.
Rosc2: 24kΩ ≦ Rosc2 ≦ 180kΩ
Relation of external resistor and frequency (fchop) is as follows;
Values of the table below are design target values.
Rosc2(kΩ)
180
51
24
fchop(kHz)
15
40
65
6. Decay Mode Settings
It takes approximately five OSC cycles for discharging a current in PWM mode. The 20% fast decay mode is
created by inducing decay during the last cycle in Fast Decay mode; the 40% fast Decay mode is created by
inducing decay during the last two cycles in Fast Decay mode; the 60% fast Decay mode is created by
inducing decay during the last three cycles in Fast Decay mode; the 80% fast Decay mode is created by
inducing decay during the last four cycles in Fast Decay mode.
Since the DCY1 and DCY2 pins have internal pull-down resistors, the 20% fast decay mode is selected
when DCY1 and DCY2 are undriven.
Dcy2
Dcy1
Current Decay Setting
L
L
20% Fast Decay
L
H
40% Fast Decay
H
L
60% Fast Decay
H
H
80% Fast Decay
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TB6564AHQ(THB6064AH)
7. Current Waveforms and Mixed Decay Mode Settings
The period of PWM operation is equal to five periods of OSCM. OSCM is equal to 1/20 of OSC2. The current
decay rate of the Decay mode operation can be determined by the DCY1 and DCY2 inputs for
constant-current control.
The “NF” refers to the point at which the output current reaches its predefined current level.
The smaller the MDT value, the smaller the current ripple amplitude. However, the current decay rate
decreases.
fchop
OSCM
Internal
Waveform
Predefined Current Level
NF
20%
fast
Decay
Mode
MDT
Charge mode → NF: Predefined current level → Slow mode →
Mixed decay timing → Fast mode → Current monitoring → (When
predefined current level > Output current) Charge mode
Predefined Current Level
NF
40%
fast
Decay
Mode
MDT
Charge mode → NF: Predefined current level → Slow mode →
Mixed decay timing → Fast mode → Current monitoring → (When
predefined current level > Output current) Charge mode
Predefined Current Level
60%
fast
Decay
Mode
NF
MDT
Charge mode → NF: Predefined current level → Slow mode →
Mixed decay timing → Fast mode → Current monitoring → (When
predefined current level > Output current) Charge mode
Predefined Current Level
80%
fast
Decay
Mode
NF
MDT
Charge mode → NF: Predefined current level → Slow mode →
Mixed decay timing → Fast mode → Current monitoring → (When
predefined current level > Output current) Charge mode
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TB6564AHQ(THB6064AH)
8. Current Control Modes (Effects of Decay Modes)
•
Increasing the current (sine wave)
Slow
Slow
Predefined
Current Level
Fast
Slow
Predefined
Current Level
•
Charge
Slow
Fast
Charge
Charge
Fast
Charge
Fast
Decreasing the current with a high decay rate (The current decay rate in Mixed Decay mode is the ratio
between the time in Fast-Decay mode (discharge time after MDT) and the remainder of the period.)
Slow
Slow
Predefined
Current Level
Since the current decays quickly, it can be
decreased to the predefined value in a short time.
Charge
Charge
Fast
Fast
Slow
Slow
Predefined
Current Level
Fast
•
Charge
Fast
Decreasing the current with a low decay rate (The current decay rate in Mixed Decay mode is the ratio
between the time in Fast-Decay mode (discharge time after MDT) and the remainder of the period.)
Since the current decays slowly, decreasing the current
to the predefined value takes a long time (or the current
cannot be properly decreased to the predefined value).
Slow
Slow
Predefined
Current Level
Fast
Charge
Fast
Charge
Slow
Fast
Slow
Fast
Predefined
Current Level
Note:
During Mixed Decay and Fast Decay modes, if the predefined current level is less than the output
current at the RNF (current monitoring point), the Charge mode in the next chopping cycle will
disappear (though the current control mode is briefly switched to Charge mode in actual operations for
current sensing) and the current is controlled in Slow and Fast Decay modes (mode switching from Slow
Decay mode to Fast Decay mode at the MDT point).
The above figures are rough illustration of the output current. In actual current waveforms, transient
response curves can be observed.
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TB6564AHQ(THB6064AH)
9. Current Waveforms in Mixed Decay Mode
fchop
fchop
OSCM
Internal
Waveform
Predefined
Current Level
IOUT
Predefined
Current Level
NF
NF
20%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING) Points
•
When the NF points come after Mixed Decay Timing points
Switches to Fast mode after Charge mode
fchop
Predefined
Current Level
fchop
IOUT
NF
MDT (MIXED DECAY TIMMING) Points
NF
Predefined
設定電流値
Current Level
20%
Fast
DECAY
MODE
•
CLK Signal Input
When the output current value > predefined current level in Mixed Decay mode
fchop
Predefined
設定電流値
Current Level
fchop
fchop
NF
IOUT
NF
Predefined
Current Level
20%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING) Points
CLK Signal Input
Switches to Charge mode briefly
*: Even if the output current rises above the predefined current at the RNF point, the current control mode is
briefly switched to Charge mode for current sensing.
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TB6564AHQ(THB6064AH)
13.Thermal Shut-Down circuit
The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 170°C (typ.),
the output power MOSFETs are turned off.
The output power MOSFETs are turned on automatically.
The IC has 40°C of temperature hysteresis.
TSD = 170°C (target spec)
(Note)
ΔTSD = 40°C (target spec)
(Note)
170°C (typ.)
130°C (typ.)
Junction temperature
TSD
H
ALERT output
L
Note:
Pre-shipment testing is not performed.
14. ISD (Over current detection)
Current that flow through output power MOSFETs are monitored individually. If over-current is detected in at
least one of all output power MOSFETs, all output power MOSFETs are turned off then this status is kept until
ENABLE signal is input. Target value in design is 6A and dispersion of ±1.5A should be considered.
ISD = 6A (typ.) ±1.5A
(Note)
6.0A (typ.)
Output power MOSFET
drain current
Insensitive
Period
(4us(typ.))
Output :off
Output :on
H
ALERT output
L
ENABLE input
H
0.15ms(min.)
L
Note:
11
Pre-shipment testing is not performed.
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
15. Low voltage detection (UVLO) circuit
（１）VDD ：
Outputs are shutoff by operating at 3.9V (Typ.) of VDD or less.
It has a hysteresis of 0.1V(Typ.) and recover to output when VDD reaches 4.0V(Typ.).
（２）VM ：
Outputs are shutoff by operating at 3.9V (Typ.) of VM or less.
It has a hysteresis of 0.1V(Typ.) and recover to output when VDD reaches 4.0V(Typ.).
・The state of internal IC when the ULVO circuit is driving
The states of the internal IC, outputs, and the IC after recovery correspond to both the enable mode and the
initial mode.
When VDD or VM falls to around 3.9V and UVLO operates, output turns off.
It recovers automatically from the initial state when both VDD and VM rise to around 4.0V or more.
16. ALERT output
ALERT pin outputs the state of TSD and ISD. When TSD or ISD circuit is under detection, ALERT pin state
changes from high impedance to low.
VALERT = 0.5V (max.) at 1mA
TSD
ISD
Under TSD detection
Under TSD detection
Normal
Under TSD detection
Under TSD detection
Normal
Normal
Normal
ALERT pin
Low
Open-drain connection
Z
17. DOWN
When IC detects CLK frequency less than 2.0Hz, output of DOWN pin turns to LOW.
Pin State
DOWN
Low
fCLK ≦ 2.0Hz
Z
fCLK ＞ 2.0Hz
fdetect = 1.0Hz(min.) ～ 4.0Hz(max.)
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TB6564AHQ(THB6064AH)
Relationship between Enable, RESET and Output (OUT)
Ex-1: ENABLE 1/2-step mode(M1: L, M2: L, M3: L)
CW
CLK
ENABLE
RESET
(%)
100
71
IA
0
−71
−100
t0
t1
t2
t3
OFF
t7
t8
t9
t10
t11
t12
The ENABLE signal at Low level disables only the output signals. Internal logic functions proceed in
accordance with input clock signals and without regard to the ENABLE signal. Therefore output current is
initiated by the timing of the internal logic circuit after release of disable mode.
Ex-2: RESET 1/2-step mode (M1: L, M2: L, M3: L)
CW
CLK
ENABLE
RESET
(%)
100
71
IA
0
−71
−100
t0
t1
t2
t3
t2
t3
t4
t5
t6
t7
t8
When the RESET signal goes Low level, output goes Initial state (Initial state: A Channel output current is
100%).
Once the RESET signal returns to High level, output continues from the next state after Initial from the next
raise in the Clock signal.
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TB6564AHQ(THB6064AH)
Sequences of output waveform IA/IB at each excitation mode
1/2-step Excitation Mode (M1: L, M2: L, M3: L, CW Mode)
CLK
(%)
100
71
IA
0
−71
−100
(%)
100
71
0
IB
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
t8
1/2-step Excitation Mode (M1: L, M2: L, M3: L, CCW Mode)
CLK
(%)
100
71
IA
0
−71
−100
(%)
100
71
IB
0
−71
−100
t0
t1
t2
t3
t4
t5
t6
t7
14
t8
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)
CLK
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−92
−98
−100
(%)
100
98
92
83
71
56
20
IB
0
−20
−38
−56
−71
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
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TB6564AHQ(THB6064AH)
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)
CLK
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−92
−98
−100
(%)
100
98
92
83
71
56
20
IB
0
−20
−38
−56
−71
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
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TB6564AHQ(THB6064AH)
1/10-step Excitation Mode (M1: L, M2: H, M3: L, CW Mode)
CLK
[%]
100
80
IA
60
IB
40
20
0
-20
-40
-60
-80
-100
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17
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TB6564AHQ(THB6064AH)
1/10-step Excitation Mode (M1: L, M2: H, M3: L, CCW Mode)
CLK
[%]
100
80
IA
60
IB
40
20
0
-20
-40
-60
-80
-100
t0････････････････････････････････････････････････････････････････････････････････････････････････････t40
18
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/16-step Excitation Mode (M1: L, M2: H, M3: H, CW Mode)
CLK
[%]
100
98
96
92
88
83
77
71
63
IA
56
47
IB
38
29
20
10
0
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64
19
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/16-step Excitation Mode (M1: L, M2: H, M3: H, CCW Mode)
CLK
[%]
100
98
96
92
88
83
77
71
63
IA
56
47
IB
38
29
20
10
0
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64
20
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/20-step Excitation Mode (M1: H, M2: L, M3: L, CW Mode)
CLK
[%]
100
IA
80
60
IB
40
20
0
-20
-40
-60
-80
-100
t0･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t80
21
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/20-step Excitation Mode (M1: H, M2: L, M3: L, CCW Mode)
CLK
[%]
100
IA
80
60
IB
40
20
0
-20
-40
-60
-80
-100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t80
22
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/32-step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)
Enlarged
below
･････
CLK
[%]
100
80
60
40
IA
IB
20
0
－20
－40
－60
－80
－100
t0･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t128
Enlarged
CLK
Current level[%]
23
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/32-step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)
Enlarged
below
･････
CLK
[%]
100
80
IA
60
40
IB
20
0
－20
－40
－60
－80
－100
t0･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t128
Enlarged
CLK
Current level[%]
24
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/40-step Excitation Mode (M1: H, M2: H, M3: L, CW Mode)
CLK
Enlarged
below
･･･････････････････････････････････････････････････････････････････････････････････････････････････････････
100
80
60
IA
40
IB
20
0
-20
-40
-60
-80
-100
t0･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t160
Enlarged
CLK
Current level[%]
25
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/40-step Excitation Mode (M1: H, M2: H, M3: L, CCW Mode)
CLK
Enlarged
below
･･･････････････････････････････････････････････････････････････････････････････････････････････････････････
100
80
IA
60
IB
40
20
0
-20
-40
-60
-80
-100
t0･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t160
Enlarged
CLK
Current level[%]
26
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/64-step Excitation Mode (M1: H, M2: H, M3: H, CW Mode)
Enlarged below
････････････････････････････････････････････････････････････････････････････････････････････････････････････
CLK
100
[%]
80
IA
60
IB
40
20
0
-20
-40
-60
-80
-100
t0･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t256
Enlarged
CLK
Current level[%]
27
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
1/64-step Excitation Mode (M1: H, M2: H, M3: H, CCW Mode)
CLK
100
Enlarged below
････････････････････････････････････････････････････････････････････････････････････････････････････････････
[%]
80
IA
60
IB
40
20
0
-20
-40
-60
-80
-100
t0･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t256
Enlarged
CLK
Current level[%]
28
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
Current level
C u rre n t le ve l ( 1 / 6 4 , 1 / 3 2 , 1 / 1 6 , 1 / 8 , 1 / 2 )
1/64,
1/32,1/16,
1/8,1/2
θ64
θ63
θ62
θ61
θ60
θ59
θ58
θ57
θ56
θ55
θ54
θ53
θ52
θ51
θ50
θ49
θ48
θ47
θ46
θ45
θ44
θ43
θ42
θ41
θ40
θ39
θ38
θ37
θ36
θ35
θ34
θ33
Min.
Typ.
Max.
--96.0
95.9
95.7
95.5
95.2
94.9
94.5
94.1
93.6
93.0
92.4
91.7
91.0
90.2
89.3
88.4
87.4
86.4
85.3
84.2
83.0
81.8
80.5
79.1
77.8
76.3
74.8
73.3
71.7
70.1
68.4
100.0
100.0
99.9
99.7
99.5
99.2
98.9
98.5
98.1
97.6
97.0
96.4
95.7
95.0
94.2
93.3
92.4
91.4
90.4
89.3
88.2
87.0
85.8
84.5
83.1
81.8
80.3
78.8
77.3
75.7
74.1
72.4
--100.0
100.0
100.0
100.0
100.0
100.0
100.0
100.0
100.0
100.0
100.0
99.7
99.0
98.2
97.3
96.4
95.4
94.4
93.3
92.2
91.0
89.8
88.5
87.1
85.8
84.3
82.8
81.3
79.7
78.1
76.4
Unit
％
29
1/64,
1/32,1/16,
1/8,1/2
θ32
θ31
θ30
θ29
θ28
θ27
θ26
θ25
θ24
θ23
θ22
θ21
θ20
θ19
θ18
θ17
θ16
θ15
θ14
θ13
θ12
θ11
θ10
θ9
θ8
θ7
θ6
θ5
θ4
θ3
θ2
θ1
θ0
Min.
Typ.
Max.
Unit
66.7
65.0
63.2
61.3
59.4
57.5
55.6
53.6
51.6
49.5
47.4
45.3
43.1
41.0
38.8
36.5
34.3
32.0
29.7
27.4
25.0
22.7
20.3
17.9
15.5
13.1
10.7
8.2
5.8
3.4
0.9
0.0
---
70.7
69.0
67.2
65.3
63.4
61.5
59.6
57.6
55.6
53.5
51.4
49.3
47.1
45.0
42.8
40.5
38.3
36.0
33.7
31.4
29.0
26.7
24.3
21.9
19.5
17.1
14.7
12.2
9.8
7.4
4.9
2.5
0.0
74.7
73.0
71.2
69.3
67.4
65.5
63.6
61.6
59.6
57.5
55.4
53.3
51.1
49.0
46.8
44.5
42.3
40.0
37.7
35.4
33.0
30.7
28.3
25.9
23.5
21.1
18.7
16.2
13.8
11.4
8.9
6.5
---
％
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
Current lev el ( 1/40, 1/20, 1/10 )
1/40,
1/20,
1/10
θ40
θ39
θ38
θ37
θ36
θ35
θ34
θ33
θ32
θ31
θ30
θ29
θ28
θ27
θ26
θ25
θ24
θ23
θ22
θ21
θ20
θ19
θ18
θ17
θ16
θ15
θ14
θ13
θ12
θ11
θ10
θ9
θ8
θ7
θ6
θ5
θ4
θ3
θ2
θ1
θ0
Min.
Typ.
Max.
Unit
--95.9
95.7
95.3
94.8
94.1
93.2
92.2
91.1
89.8
88.4
86.8
85.1
83.2
81.3
79.1
76.9
74.5
72.0
69.4
66.7
63.9
60.9
57.9
54.8
51.6
48.2
44.9
41.4
37.9
34.3
30.6
26.9
23.1
19.3
15.5
11.6
7.8
3.8
0.0
---
100.0
99.9
99.7
99.3
98.8
98.1
97.2
96.2
95.1
93.8
92.4
90.8
89.1
87.2
85.3
83.1
80.9
78.5
76.0
73.4
70.7
67.9
64.9
61.9
58.8
55.6
52.2
48.9
45.4
41.9
38.3
34.6
30.9
27.1
23.3
19.5
15.6
11.8
7.8
3.9
0.0
--100.0
100.0
100.0
100.0
100.0
100.0
100.0
99.1
97.8
96.4
94.8
93.1
91.2
89.3
87.1
84.9
82.5
80.0
77.4
74.7
71.9
68.9
65.9
62.8
59.6
56.2
52.9
49.4
45.9
42.3
38.6
34.9
31.1
27.3
23.5
19.6
15.8
11.8
7.9
---
％
30
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
Current Draw-out Path when ENABLE is Input in Mid Operation
When all the output transistors are forced OFF during Slow mode, the coil energy is drawn out in the
following modes:
Note: Parasitic diodes are indicated on the designed lines. However, these are not normally used in Mixed
Decay mode.
VM
VM
U1
ON
Note
OUT1
Load
U2
U1
OFF
OFF
OUT2
ON
ON
L1
L2
L1
RNF
Note
OUT1
OFF
VM
Load
OUT2
U2
U1
OFF
OFF
ENABLE is input
L2
ON
Charge Mode
OFF
Note
OUT1
Load
OUT2
L1
L2
OFF
OFF
RNF
PGND
U2
RNF
PGND
PGND
Slow Mode
Force OFF Mode
As shown in the figure above, an output transistor has parasitic diodes.
Normally, when the energy of the coil is drawn out, each transistor is turned ON and the power flows in the
opposite-to-normal direction; as a result, the parasitic diode is not used. However, when all the output
transistors are forced OFF, the coil energy is drawn out via the parasitic diode.
31
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
Output Stage Transistor Operation Mode
VM
VM
U1
ON
Note
OUT1
Load
U2
U1
OFF
OFF
Note
OUT2
OUT1
OFF
ON
ON
L1
L2
L1
VM
Load
U2
U1
OFF
OFF
OUT2
ON
L2
ON
OFF
RNF
PGND
Charge Mode
OUT2
Load
L1
RNF
PGND
ON
Note
OUT1
L2
RNF
U2
PGND
Slow Mode
Fast Mode
Output Stage Transistor Operation Functions
CLK
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: The above chart shows an example of when the current flows as indicated by the arrows in the above figures.
If the current flows in the opposite direction, refer to the following chart:
CLK
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
Upon transitions of above-mentioned functions, a dead time of about 300 ns (Design target value) is inserted
respectively.
32
V1.0
2011-03-01
TB6564AHQ(THB6064AH)
Measurement Waveform
tCLK
tCLK
CLK
tCLKL
Figure 1 Timing Waveforms and Names
VM
90%
90%
Vout（1A、2B、1B、2B）
10%
10%
GND
tr
tf
Figure 2 Timing Waveforms and Names
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Power Dissipation
TB6564AHQ （THB6064AH）
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1. How to Turn on the Power
We would like to recommend a way to turn on the power as shown below. However, if you do not do what we
mentioned, IC can not break.
Turn on VDD. When the voltage has stabilized, turn on VMA/B.
In addition, set the Control Input pins to Low when inputting the power.
(All the Control Input pins are pulled down internally.)
Once the power is on, the CLK signal is received and excitation advances when RESET goes high and
excitation is output when ENABLE goes high. If only RESET goes high, excitation won't be output and only
the internal counter will advance. Likewise, if only ENABLE goes high, excitation won't advance even if
the CLK signal is input and it will remain in the initial state.
The following is an example:
CLK
RESET
ENABLE
OUT
H
L
H
L
H
Z
L
Output
Internal current Setting
Output current setting
Z
Internal current setting: Invariable
Output OFF
Internal current setting: Variable
2. Power Dissipation
The IC power dissipation is determined by the following equation:
P = VDD × IDD + IOUT × IOUT
x Ron × 2 drivers
The higher the ambient temperature, the smaller the power dissipation.
Check the PD-Ta curve, and be sure to design the heat dissipation with a sufficient margin.
3. Heat Sink Fin Processing
The IC fin (rear) is electrically connected to the rear of the chip. If current flows to the fin, the IC will
malfunction. If there is any possibility of a voltage being generated between the IC GND and the fin, either
ground the fin or insulate it.
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Application example
To Vref
VDD
1
25
0.1μF
47μF
24V
10kΩ
DOWN
24
Fuse
5V
VMA
ALERT
20
OUT1A
7
M1
8
M2
22
CW/CCW
21
CLK
DOWN
Pre
-detect
-drive
H-Bridge
driver A
10mH
14
OUT2A
9
M3
MCU
16
OSC1
CLK
NFA
15
TSD/ISD
0.2Ω
Input
circuit
Current selector
circuit A
VMB
System CLK
RESET
OUT1B
18
12
Pre
ENABLE
0.1μF
24V
10
DCY1
OUT2B
4
DCY2
NFB
Current selector
circuit B
OSC2
OSC2
11
0.2Ω
2/5
51kΩ
5
10kΩ
Vref
5V
2
17
13
SGND
PGNDA
PGNDB
18kΩ
3.3kΩ
To DOWN
Note: Capacitors for the power supply lines should be connected as close to the IC as possible.
Usage Considerations
A large current might abruptly flow through the IC in case of a short-circuit across its outputs, a
short-circuit to power supply or a short-circuit to ground, leading to a damage of the IC. Also, the IC or
peripheral parts may be permanently damaged or emit smoke or fire resulting in injury especially if a
power supply pin (VDD, VMA and VMB) or an output pin (OUT1A, OUT2A, OUT1B and OUT2B) is
short-circuited to adjacent or any other pins. These possibilities should be fully considered in the design of
the output, VDD, VM, and ground lines.
A fuse should be connected to the power supply line.
(As for above notes, a possibility that the TB6564AHQ is damaged by large current is the same as the
TB6564HQ because specifications of the TB6564HQ are the same as the TB6564AHQ about it.)
36
47μF
H-Bridge
driver B
-drive
3
23
Fuse
6
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
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Package Dimensions
Weight: 9.86 g (typ.)
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to
the information in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA.
Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without
alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail.
Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for
their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of
Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before
customers use the Product, create designs including the Product, or incorporate the Product into their own
applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,
including without limitation, this document, the specifications, the data sheets and application notes for Product and
the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions
for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of
their own product design or applications, including but not limited to (a) determining the appropriateness of the use of
this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA
ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment,
measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly
stated in this document. Product is neither intended nor warranted for use in equipment or systems that require
extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human
life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes,
without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment,
equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to
control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by
TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from
the use of Product. No license to any intellectual property right is granted by this document, whether express or
implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND
CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1)
ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL,
SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS,
LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND
ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR
INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including
without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological
weapons or missile technology products (mass destruction weapons). Product and related software and technology
may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the
inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no
liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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