TLP104(TPL,E

TLP104 TOSHIBA PHOTOCOUPLER GaAℓAs LED & PHOTO-IC TLP104 IPM (Intelligent Power Module) Industrial Inverter Operate at high ambient temperatures up to 125°C Unit: mm 6 Inverter logic type (Open collector output)  Package type:  Guaranteed performance over temperature:  Power supply voltage: -0.5 to 30 V  Threshold Input Current: IFHL = 5.0 mA (max)  Propagation delay time (tpHL/tpLH): 4 4.55 3 1 +0.25 7.0 ± 0.4 0.4 SO6 0.15 3.7 -0.15 0.1 2.1 ± 0.1  5 +0.25 -0.15 The Toshiba TLP104 consists of GaAℓAs infrared light emitting diodes and integrated high gain, high-speed photodetectors. The TLP104 is housed in the SO6 package. The output stage is an open collector type. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±15 kV/μs. TLP104 guarantees minimum and maximum of propagation delay time, switching speed dispersion, and high common mode transient immunity. Therefore TLP104 is suitable for isolation interface between IPM (Intelligent Power Module) in motor control application. 0.5 min 1.27 -40 to 125℃ 2.54 JEDEC ― JEITA ― TOSHIBA 11-4L1 Weight: 0.08 g（typ.） tpHL = 400ns (max) tpLH = 550ns (max)  Switching Time Dispersion(|tpHL-tpLH|): 400ns (max)  Common mode transient immunity : ±15kV/μs (min)  Isolation voltage : 3750Vrms (min)  UL approved : UL1577, File No.E67349  c-UL approved :CSA Component Acceptance Service Pin Configuration (Top View) 1 VCC 6 1:ANODE 3:CATHODE 4:GND 5:VO(Output) 6:VCC 5 GND 3 No. 5A, File No.E67349 SHIELD 4 Schematic Truth Table ICC Input H L LED ON OFF Output L H IF IO 1＋ VO 3－ SHIELD 5.0 mm (min) Clearance distance 5.0 mm (min) Insulation thickness 0.4 mm (min) VCC 5 Construction Mechanical Ratings Creepage distance 6 GND 4 Start of commercial production 1 2009/10 2014-09-01 TLP104 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit IF 25 mA ∆IF /°C -0.67 mA/°C IFP 50 mA ∆IFP /°C -1.34 mA/°C VR 5 V Forward Current LED Forward Current Derating (Ta ≥ 110°C) Pulse Forward Current (Note 1) Pulse Forward Current Derating (Ta ≥ 110°C) Reverse Voltage Detector Output Current (Ta ≤ 125℃) IO 8 mA Output Voltage VO -0.5 to 30 V Supply Voltage VCC -0.5 to 30 V Output Power Dissipation Output Power Dissipation Derating (Ta ≥ 110°C) PO 80 mW ∆PO /°C -2.0 mW/°C Topr -40 to 125 °C Tstg -55 to 125 °C Tsol 260 °C BVs 3750 Vrms Operating Temperature Range Storage Temperature Range Lead Soldering Temperature (10 s) Isolation Voltage (AC,1 minute, R.H.≤ 60%,Ta=25°C) (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width ≤ 10μs, duty=10%. Note 2: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Input Current , High Level IFHL 7.5 - 15 mA Input Voltage , Low Level VFLH 0 - 0.8 V Supply Voltage* VCC 4.5 - 30 V Operating Temperature Topr -40 - 125 °C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2 2014-09-01 TLP104 Electrical Characteristics (Unless otherwise specified, Ta = −40 to 125°C, VCC =4.5 to 30V) Symbol Test Circuit VF ⎯ IF = 10 mA, Ta=25°C ∆VF / ∆Ta ⎯ Reverse current IR Capacitance between terminals Min Typ. Max Unit 1.45 1.61 1.85 V IF = 10 mA ― -1.8 ― mV /°C ⎯ VR = 5 V, Ta=25°C ― ― 10 μA CT ⎯ V = 0V, f = 1 MHz ― 60 ― pF High level output current IOH １ VF = 0.8 V, VO < VCC ― ― 50 μA Low level output voltage VOL 2 IF = 10 mA, IO = 2.4mA ― 0.2 0.6 V Low level supply current ICCL 3 IF = 10 mA ― ― 1.3 mA High level supply current ICCH 4 IF = 0 mA ― ― 1.3 mA IO ⎯ IF = 10 mA, VO = 0.6V 4.0 ― ― mA Input current logic LOW output IFHL ⎯ IO = 0.75mA, VO < 0.8 V ― 1.0 5 mA Input voltage logic HIGH output VFLH ⎯ IO = 0.75mA, VO > 2.0 V 0.8 ― ― V Characteristic Detector LED Forward voltage Forward voltage temperature coefficient Output current Test Condition *All typical values are at Ta=25°C, VCC=5 V unless otherwise specified Isolation Characteristics (Ta = 25°C) Characteristic Symbol Test Conditions Min Typ. Max Unit 0.8 ― pF ― Ω Capacitance input to output CS VS = 0V, f = 1 MHz (Note 2) ― Isolation resistance RS R.H. ≤ 60%, VS = 500 V (Note 2) 1×10 AC,1 minute Isolation voltage BVS 12 10 14 3750 ― ― AC,1 second, in oil ― 10000 ― DC,1 minute, in oil ― 10000 ― 3 Vrms Vdc 2014-09-01 TLP104 Switching Characteristics (Unless otherwise specified, Ta = −40 to 125°C, VCC=15V) Characteristic Symbol Propagation delay time (H→L) tpHL Propagation delay time (L→H) tpLH Test Circuit Test Condition Min Typ. Max CL=100pF 30 150 400 CL=10pF ― 90 ― CL=100pF 150 350 550 CL=10pF ― 100 ― ― ― 400 -50 ― 450 VCM = 1500 Vp−p, IF = 0 mA RL = 20 kΩ, Ta=25°C 15 ― ― kV/μs VCM = 1500 Vp−p, IF = 10 mA RL = 20 kΩ, Ta=25°C −15 ― ― kV/μs IF = 10 mA, 5 Switching Time Dispersion between ON and OFF RL = 20kΩ (Note 4) |tpHL−tpLH| Unit ns CL=100pF Propagation Delay Skew Common mode transient immunity at high output level Common mode transient Immunity at low output level tpLH−tpHL CMH 6 CML *All typical values are at Ta=25°C Note 3: A ceramic capacitor (0.1 μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 4: f = 10kHz, duty=10%, input current tr = tf = 5ns Note 5: Propagation delay skew is defined as the propagation delay time of the largest or smallest tpLH minus the largest or smallest tpHL of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc.). TEST CIRCUIT 1: IOH TEST CIRCUIT 2: VOL 0.1μF 0.1μF IOH VF A SHIELD IF VO VCC SHIELD TEST CIRCUIT 3: ICCL IF VOL IO ↑ V VCC TEST CIRCUIT 4: ICCH ICCL ICCH A A 0.1 μF 0.1 μF VCC SHIELD VCC SHIELD 4 2014-09-01 TLP104 Test Circuit 5: tpHL, tpLH, |tpHL-tpLH| IF=10mA(P.G) (f=10kHz , duty=10%, tr=tf=5ns) IF 50% P.G. VCC CL SHIELD tpLH VO VO IF Monitor 15pF* tpHL RL=20kΩ 0.1μF VTHHL=1.5 V VOL RIN=100Ω VTHLH=2.0 V *: probe and stray capacitance. P.G.: Pulse generator Test Circuit 6: CMH, CML 90% IF SW A VCM RL=20kΩ → 10% 0.1 μF B tf tr VO ・SW B : IF = 0 mA VCC CMH 11V VO 1.0 V CML ・SW A : IF = 10 mA ＋ VCM 1500 V － CMH＝ 5 1200(V) tr(μs) CML＝- 1200(V) tf(μs) 2014-09-01 TLP104 IF- VF IFHL- Ta 10 Input current logic LOW output I FHL (mA) I n p u t f o r w a r d c u r r e n t I F (mA) 100 Ta=125˚C 100˚C 75˚C 50˚C 25˚C 0˚C -20˚C -40˚C 1 0.1 1 1.2 1.4 1.6 1.8 2 2.2 5 4 Vcc = 15 V Io = 0.75 mA Vo < 0.8 V 3 2 1 0 -40 -20 I n p u t f o r w a r d v o l t a g e V F (V) 0 20 H i g h l e v e l s u p p l y c u r r e n t I CCH (mA) L o w l e v e l s u p p l y c u r r e n t I CCL (mA) 1.2 1 0.8 0.6 0.4 Vcc = 30 V IF = 10 mA 0 0 20 40 60 1.4 1.2 1 0.8 0.6 0.4 0.2 Vcc = 30 V 0 80 100 120 140 -40 -20 A m b i e n t t e m p e r a t u r e Ta (℃) 0 H i g h l e v e l o u t p u t c u r r e n t I OH (μA) L o w l e v e l o u t p u t v o l t a g e V OL (V) 0.4 0.3 0.2 0.1 0 -40 -20 0 20 40 60 40 60 80 100 120 140 IOH - Ta IF = 10 mA Vcc = 15 V Io = 2.4 mA 0.5 20 A m b i e n t t e m p e r a t u r e Ta (℃) VOL - Ta 0.6 80 100 120 140 ICCH - Ta 1.4 -40 -20 60 A m b i e n t t e m p e r a t u r e Ta (℃) ICCL- Ta 0.2 40 80 100 120 140 2 VF = 0.8 V Vcc = 30 V Vo = 30 V 1.6 1.2 0.8 0.4 0 -40 -20 A m b i e n t t e m p e r a t u r e Ta (℃) 0 20 40 60 80 100 120 140 A m b i e n t t e m p e r a t u r e Ta (℃) *: The above graphs show typical characteristics. 6 2014-09-01 TLP104 tPHL/tPLH/|tPLH-tPHL| - CL t P H L / t P L H / | t P L H - t P H L | - Ta 500 IF = 10 mA, Vcc = 15 V RL = 20kΩ 1600 Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) 2000 tPLH 1200 |tPLH -tPHL| 800 400 tPHL 0 0 IF = 10 mA, Vcc = 15 V CL = 100 pF, RL = 20kΩ 400 tPLH 300 |tPLH –tPHL| 200 tPHL 100 0 -40 -20 100 200 300 400 500 600 700 tPHL/tPLH/|tPLH-tPHL| - IF 1400 Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) tPHL/tPLH/|tPLH-tPHL| - VCC Vcc = 15 V, CL = 100 pF, RL = 20kΩ 400 tPLH 300 |tPLH –tPHL| 200 tPHL 100 0 0 5 10 15 1000 800 600 400 -200 0 Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) Propagation delay time、Switching Time Dispersion between ON and OFF tPHL, tPLH, |tPLH-tPHL| (ns) 500 600 |tPLH -tPHL| 200 tPHL 0 20 30 40 10 15 20 25 30 tPHL/tPLH/|tPLH-tPHL| - RL tPLH 10 5 Supply voltage V CC (V) IF = 10 mA, Vcc = 15 V CL = 100 pF 0 tPHL 0 tPHL/tPLH/|tPLH-tPHL| - RL 400 tPLH |tPLH –tPHL| 200 20 800 IF = 10 mA, CL = 100 pF, RL = 20kΩ 1200 I n p u t f o r w a r d c u r r e n t I F (mA) 1000 20 40 60 80 100 120 140 Ambient temperature Ta (℃) L o r d c a p a c i t a n c e CL (pF) 500 0 IF = 10 mA, Vcc = 5 V CL = 10 pF 400 tPLH 300 200 |tPLH -tPHL| 100 tPHL 0 0 50 L o r d r e s i s t a n c e R L (kΩ) 5 10 15 20 L o r d r e s i s t a n c e R L (kΩ) *: The above graphs show typical characteristics. 7 2014-09-01 TLP104 PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering 1) When Using Soldering Reflow  An example of a temperature profile when Sn-Pb eutectic solder is used: (℃) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.  An example of a temperature profile when lead(Pb)-free solder is used: (℃) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.  Reflow soldering must be performed once or twice.  The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Apply preheating of 150 ℃ for 60 to 120 seconds.  Mounting condition of 260 ℃ or less within 10 seconds is recommended.  Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Complete soldering within 10 seconds for lead temperature not exceeding 260 ℃ or within 3 seconds not exceeding 350 ℃.  Heating by soldering iron must be only once per 1 lead 8 2014-09-01 TLP104 (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 ℃ to 35 ℃, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 9 2014-09-01 TLP104 Specification for Embossed–Tape Packing (TPL)(TPR) for SO6 Coupler 1. Applicable Package Package Product Type SO6 Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP104 (TPL) Tape type Device name 3. Tape Dimensions 3.1 Specification Classification Are as Shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 Device Orientation 10 2014-09-01 TLP104 3.3 Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. +0.1 φ1.5 −0 G A K0 12.0 ± 0.3 B D E 0.3 ± 0.05 F φ1.6 ± 0.1 2.95 ± 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 4.0 ― B 7.6 ― D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 2.6 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 11 2014-09-01 TLP104 3.6 Reel A C U B (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. E W1 W2 Figure 3 Reel Form Table 4 Reel Dimensions Unit: mm Symbol Dimension A Φ380 ±2 B Φ80 ±1 C Φ13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP104 (TPL) 3000 pcs Quantity (must be a multiple of 3000) Tape type Device name 12 2014-09-01 TLP104 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 13 2014-09-01