TLP152(TPL,E

TLP152 Photocouplers GaAℓAs Infrared LED & Photo IC TLP152 1. Applications • Plasma Display Panels (PDPs) • Industrial Inverters • MOSFET Gate Drivers • IGBT Gate Drivers 2. General The TLP152 is a photocoupler in an SO6 package that consists of a GaAℓAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. The photodetector IC chip has an internal shield to provide a high common-mode transient immunity of ±20 kV/µs and thus superior noise immunity between the input and output pins. The TLP152 has a totem-pole output that can both sink and source current. It is suitable for directly driving a small IGBT or power MOSFET. 3. Features (1) Buffer logic type (totem pole output) (2) Output peak current: ±2.5 A (max) (3) Operating temperature: -40 to 100  (4) Supply current: 3.0 mA (max) (5) Supply voltage: 10 to 30 V (6) Threshold input current: 7.5 mA (max) (7) Propagation delay time: tpHL = 190 ns (max), tpLH = 170 ns (max) (8) Common-mode transient immunity: ±20 kV/µs (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1) : EN62368-1 (Pending) (Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory Note 1: When a VDE approved type is needed, please designate the Option (V4) (V4). Start of commercial production ©2016-2017 Toshiba Electronic Devices & Storage Corporation 1 2012-06 2017-12-19 Rev.6.0 TLP152 4. Packaging and Pin Assignment 1: Anode 3: Cathode 4: GND 5: VO 6: VCC 11-4L1S 5. Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. 6. Principle of Operation 6.1. Truth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. Mechanical Parameters Characteristics Size Unit Creepage distances 5.0 (min) mm Clearance distances 5.0 (min) Internal isolation thickness 0.4 (min) ©2016-2017 Toshiba Electronic Devices & Storage Corporation 2 2017-12-19 Rev.6.0 TLP152 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Note IF Peak transient input forward current IFPT Input reverse voltage VR Input power dissipation (Note 1) PD Detector Peak high-level output current Peak low-level output current Rating Unit 20 mA 1 A 5 V 40 mW (Ta = -40 to 100 ) IOPH (Note 2) -2.5 A (Ta = -40 to 100 ) IOPL (Note 2) +2.5 Output voltage VO Supply voltage VCC 35 Output power dissipation PO 260 mW ∆PO/∆Ta -2.0 mW/ Topr -40 to 100  Output power dissipation derating (Ta ≥ 85 ) Common Operating temperature Storage temperature Tstg Lead soldering temperature Isolation voltage 35 V -55 to 125 (10 s) Tsol (Note 3) 260 (AC, 60 s, R.H. ≤ 60 %) BVS (Note 4) 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: Exponential waveform. Pulse width ≤ 0.2 µs, f ≤ 15 kHz, VCC = 20 V, Ta = -40 to 100  Exponential waveform. Pulse width ≤ 0.08 µs, f ≤ 25 kHz, VCC = 15 V, Ta = -40 to 100  Note 3: ≥ 2 mm below seating plane. Note 4: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Input on-state current IF(ON) (Note 1) 10 Input off-state voltage VF(OFF) 0 Peak high-level output current IOPH  Peak low-level output current IOPL   Operating frequency f (Note 2) Max Unit  15 mA  0.8 V  -2.0 A  +2.0  250 kHz Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Exponential waveform. IOPH ≥ -0.65 A (≤ 80 ns), IOPL ≤ 0.65 A (≤ 80 ns), Ta = 100 , VCC = 20 V ©2016-2017 Toshiba Electronic Devices & Storage Corporation 3 2017-12-19 Rev.6.0 TLP152 9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 100 ) Characteristics Symbol Input forward voltage Input forward voltage temperature coefficient Min Typ. Max  IF = 10 mA, Ta = 25  1.40 1.57 1.80 V  IF = 10 mA  -1.8  mV/ IR  VR = 5 V, Ta = 25    10 µA  V = 0 V, f = 1 MHz, Ta = 25   45  pF IF = 10 mA, VCC = 15 V, V6-5 = 4 V  -2.2 -1.0 A IF = 10 mA, VCC = 15 V, V6-5 = 10 V  -3.4 -2.0 IF = 0 mA, VCC = 15 V, V5-4 = 2 V 1.0 2.4  IF = 0 mA, VCC = 15 V, V5-4 = 10 V 2.0 3.5  Ct IOPH (Note 1) IOPL (Note 1) Fig. 12.1.1 Fig. 12.1.2 High-level output voltage VOH Fig. 12.1.3 IF = 10 mA, VCC = 10 V, IO = -100 mA 6.0 8.5  Low-level output voltage VOL Fig. 12.1.4 VF = 0.8 V, VCC = 10 V, IO = 100 mA  0.1 1.0 High-level supply current ICCH Fig. 12.1.5 IF = 10 mA, VCC = 10 to 30 V, VO = Open  1.9 3.0 Low-level supply current ICCL Fig. 12.1.6 IF = 0 mA, VCC = 10 to 30 V, VO = Open  1.8 3.0 Threshold input current (L/H) IFLH  VCC = 15 V, VO > 1 V  1.5 7.5 Threshold input voltage (H/L) VFHL  VCC = 15 V, VO < 1 V 0.8 1.47  VCC   10  30 VUVLO+  IF = 5 mA, VO > 2.5 V 7.8 8.7 9.7 IF = 5 mA, VO < 2.5 V 7.5 8.4 9.4 IF = 5 mA, VO > 2.5 V  0.3  Supply voltage UVLO threshold voltage VUVLOUVLO hysteresis Unit VF Input capacitance Peak low-level output current Test Condition ∆VF/∆Ta Input reverse current Peak high-level output current Test Circuit Note UVLOHYS  V mA V Note: Note: All typical values are at Ta = 25 . This device is designed for low power consumption, making it more sensitive to ESD than its predecessors. Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems. Note 1: IO application time ≤ 50 µs, single pulse. 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note Test Conditions Min Typ. Max Unit  0.35  pF 1014  Ω 3750   Vrms AC, 1 s in oil  10000  DC, 60 s in oil  10000  (Note 1) VS = 0 V, f = 1 MHz (Note 1) VS = 500 V, R.H. ≤ 60 % (Note 1) AC, 60 s 1× 1012 Vdc Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. ©2016-2017 Toshiba Electronic Devices & Storage Corporation 4 2017-12-19 Rev.6.0 TLP152 11. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 100 ) Characteristics Symbol Note Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Propagation delay time (L/H) Test Circuit Min Typ. Max Unit IF = 0 → 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF, Ta = 25  60 95 145 ns (Note 1) IF = 10 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF, Ta = 25  60 110 165 tpLH (Note 1) IF = 0 → 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF 50 95 170 Propagation delay time (H/L) tpHL (Note 1) IF = 10 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF 50 110 190 Propagation delay skew (device to device) tpsk (Note 1) (Note 4) IF = 0 ←→ 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF -85  85 |tpHL-tpLH| (Note 1) IF = 0 ←→ 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF  15 50 Pulse width distortion Fig. 12.1.7 Test Condition Rise time tr (Note 1) IF = 0 → 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF  18  Fall time tf (Note 1) IF = 10 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF  22  Common-mode transient immunity at output high CMH (Note 2) VCM = 1000 Vp-p, IF = 10 mA, VCC = 30 V, Ta = 25, VO(min) = 26 V ±20   Common-mode transient immunity at output low CML (Note 3) VCM = 1000 Vp-p, IF = 0 mA, VCC = 30 V, Ta = 25, VO(max) = 1 V ±20   Fig. 12.1.8 kV/µs Note: All typical values are at Ta = 25 . Note 1: Input signal (f = 125 kHz, duty = 50 %, tr = tf = 5 ns or less). CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 26 V). Note 3: CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 1 V). Note 4: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). ©2016-2017 Toshiba Electronic Devices & Storage Corporation 5 2017-12-19 Rev.6.0 TLP152 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 IOPH Test Circuit Fig. 12.1.2 IOPL Test Circuit Fig. 12.1.3 VOH Test Circuit Fig. 12.1.4 VOL Test Circuit Fig. 12.1.5 ICCH Test Circuit Fig. 12.1.6 ICCL Test Circuit Fig. 12.1.7 Switching Time Test Circuit and Waveform Fig. 12.1.8 Common-Mode Transient Immunity Test Circuit and Waveform ©2016-2017 Toshiba Electronic Devices & Storage Corporation 6 2017-12-19 Rev.6.0 TLP152 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2016-2017 Toshiba Electronic Devices & Storage Corporation 7 2017-12-19 Rev.6.0 TLP152 14. Land Pattern Dimensions (for reference only) Unit: mm 15. Marking ©2016-2017 Toshiba Electronic Devices & Storage Corporation 8 2017-12-19 Rev.6.0 TLP152 16. Specifications for Embossed-Tape Packing 16.1. Applicable Package Package Name Product Type SO6 Mini flat coupler 16.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP152(TPL,E(T Part number: TLP152 Tape type: TPL [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Thailand): T Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 16.3. Tape Dimensions Specification Tape Type Division Packing Amount (A unit per reel) TPL L direction 3000 TPR R direction 3000 16.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Device Orientation ©2016-2017 Toshiba Electronic Devices & Storage Corporation 9 2017-12-19 Rev.6.0 TLP152 16.3.2. Empty Cavities Characteristics Criterion Occurrences of 2 or more successive empty cavities Remarks 0 device Single empty cavity Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 16.3.3. Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover tape of 30 mm or longer. 16.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Tape Dimensions (unit: mm, tolerance: ±0.1) Symbol Dimension Remark A 4.0  B 7.6  D 5.5 Center line of embossed cavity and sprocket hole E 1.75 Distance between tape edge and sprocket hole center F 8.0 Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes G 4.0 Cumulative error +0.1/-0.3 (max) per 10 sprocket holes K0 2.6 Internal space ©2016-2017 Toshiba Electronic Devices & Storage Corporation 10 2017-12-19 Rev.6.0 TLP152 16.3.5. Reel Specification Material: Plastic (for protection against static electricity) Table Reel Dimensions (unit: mm) Symbol Dimension A φ330 ± 2.0 B φ80 ± 1.0 C φ13 ± 0.5 E 2.0 ± 0.5 ©2016-2017 Toshiba Electronic Devices & Storage Corporation U 4.0 ± 0.5 W1 13.5 ± 0.5 W2 17.5 ± 1.0 11 2017-12-19 Rev.6.0 TLP152 16.3.6. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: φ330 mm 16.3.7. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. 16.4. Ordering Information When placing an order, please specify the part number, tape type and quantity as shown in the following example. Example) TLP152(TPL,E(T 3000 pcs Part number: TLP152 Tape type: TPL (8-mm pitch) [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Thailand): T Quantity (must be a multiple of 3000): 3000 pcs Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. ©2016-2017 Toshiba Electronic Devices & Storage Corporation 12 2017-12-19 Rev.6.0 TLP152 Package Dimensions Unit: mm Weight: 0.08 g (typ.) Package Name(s) TOSHIBA: 11-4L1S ©2016-2017 Toshiba Electronic Devices & Storage Corporation 13 2017-12-19 Rev.6.0 TLP152 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. ©2016-2017 Toshiba Electronic Devices & Storage Corporation 14 2017-12-19 Rev.6.0